LML Working Group Overview

Pierre-Louis Bossart Intel June 16, 2010

MIPI Interfaces in a Mobile Platform

This picture is only an illustrative example for several ways of integration with the purpose of demonstrating MIPI diversity on interfaces
D-PHY based M-PHY based SLIMbus SPMI/RFFE UniPort : UniProTM + D-PHY or M-PHY UniPro based IF technology are: UFS, CSI-3, DSI-2, GBT, UniPort (*) Transferred to IEEE (**) Liaison with JEDEC

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Scope of SLIMbusSM in a Mobile System

Low bandwidth peripherals (<28 Mbps) Audio, Data, Control
Audio Codec Application Host Processor Your excellent product Microphone Amplifier / Speaker Sensor

Bluetooth FM Radio A-GPS Audio Processor SLIMbus

3 Copyright 2010 MIPI Alliance. All rights reserved.

2 wires, Multidrop topology

LML WG Mission and Objectives

Define and maintain Low-speed Multipoint Link interfaces LML addresses very low power, low cost peripherals, while being extensible to mid-speed devices Scalable and flexible interface to evolve with For future market needs and demands The Industry Reduce fragmentation and consolidate multiple interface functionalities (control+data)

4 Copyright 2010 MIPI Alliance. All rights reserved.

Specification Overview
Low-pin count alternative to combination of existing interfaces (I2C, I2S, PCM, SPI, UART)
Audio, data and bus & device control on a single bus Reduced pin count for lower overall product cost

Support for many high quality audio channels Multiple, concurrent sample rates on a single bus Efficient, host-less, peer-to-peer communication Standardized Message set Use of digital audio clocks or system/RF clocks Dynamic reconfiguration for system optimization
5 Copyright 2010 MIPI Alliance. All rights reserved.

SLIMbus History and Roadmap

SLIMbus 1.02 End 2010
2nd SLIMbus Interop Event Q4 2010

Requirements analysis Topology definition Technical choices

First SLIMbus Interop Event Sept 2009 SLIMbus 1.01 July 2008

Optimisation Speed Power Device Class specifications

LML WG June 2005 LML IG Sept 2004 April 2004

6

SLIMbus 1.00 March 2007

Today

Copyright 2010 MIPI Alliance. All rights reserved.

Working Group Chair and Participant Companies

Working Group Officers Pierre Bossart (chair), Hannes Hadl (vice chair) Working Group Support Rob Johnson (spec editor), Jim Rippie (program management) Work Methodology: Weekly conference calls Meet quarterly during MIPI Face-to-Face meetings Companies who contributed to SLIMbus:
Analog Devices , austriamicrosystems, Ericsson, Freescale, Infineon, Intel, LnK, Marvell, Motorola, National Semiconductor, Nokia, NXP, RF Micro Devices, Sonion, Sony Ericsson, STMicroelectronics, Synopsys, TI, Toshiba, Wolfson

Some companies who recently joined:

Qualcomm, Broadcom, Cambridge Silicon Radio, Knowles, Samsung, UNH-IOL
7 Copyright 2010 MIPI Alliance. All rights reserved.