In the name of God the Merciful

Beginning to explain the components parts Almazrburd

First: electricity and power
??What is Alkahrabawaltaar
- :Is the source of energy and are divided into two types
Electricity dynamic: a resulting from generators or DC battery which is output from the battery and - 1
AC DC symbolizes a home AC power
Electricity Astadtkih: It is caused by objects deliverers of electricity and other non-conductive and - 2
composed in the form of shipments accumulate on the surface of this body this lightweight profile
Second: the principles of electronics
Intensity of the current: A symbolizes the unit of measurement amps
Voltage: V Code and the unit of measurement voltage
Capacity: Zip w watt unit of measurement
Frequency: Zip Hz measurement unit Hertz

Occupation
That stores electrical energy and then discharged at certain times depend on the circuit conditions and
purpose of the anti-aliasing power
The unit of measurement
Almkro Farad FARAD
Code C
Figure 1 intensive forms of Figure 2 direction polar Bmana direction installation Maser Board infront of
White Line negative direction is the direction Marsom Burda also White Balloon require intense when
you change the following
Be Almkro Fard and voltage as written on the back of intensive unchanged Aktar said such
1200UF, V6, 7
means Almkro 1200
and 3 mean voltage 6
Required is the same amplitude change how written and foreclosed change in voltage amplitude even if
not Zee TV detection
When damaged appears on its surface to be puffy or leak of liquid under intense Article
Intense sometimes come to us with some faults and discover holidays because it properly and in a state of

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constant damage in Mosvet next to it in that case to be of intense change even if a virtual sound fully
before you extensive damage not in the sense of Anao puffy only must change when doubt it
Diode or consolidated
Occupation unifying power and are not allowed, after they returned

Measurement Aldioat measurement method measured Balbozor means the bell is measured in one
direction the means Nhah measure and second Atkies only one direction
Diagnosis
If measured Maak twice from both directions be corrupted

Occupation
Generating magnetic field
Code L
Henry and measurement Aks bell if given a bell sound that bell does not give shall be corrupted and
taken into account when the change that alters the same number of wire windings
Note insulated wire

Position power installation

Zip zD
Measurement Dayut
Measuring the same measure Aldioat
Resistors

This resistance found in electrical appliances of all kinds and a few When found in Almadhir has Bord
where Balshakl the following
Resistors chebbakia Aleneturk see

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Function block current flow and minimize the effort

R Code
Measurement Ohm
Measurement method resistors Alvioseh symbol 0 zero measurement on the bell sound if given measure
if there is no measure be corrupted as possible ride enabled alternative thin wire does the work of a fuse
Resistance Aleneturk
Resistors Aleneturk kilometers shown to you in the picture is small in size written on the surface of the
resistance capacity
Example
470
The first figure a constant 4
Second number a constant 7
And third the number of zeros means
means 470 470
means 4700 472
.means 47000 etc 473
The size of the resistance
ohms = 1 kbit 1000
kbit = 1 MB 1000
Mosvet Turnzistur

From here be the beginning

See this Alsouralatyh

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Function transistor
enlarge reference 2 - signal generation 3 - linking circuits 4 - Install voltage - 1
Q Code
Method of measuring Mosvet Turnzistur
First put Alavo Digtal to put the bell and the following
kilometers in the image and Akies Baloyr Red positive on the Black Aloyr mode negative
compound once irradiated
Once measured Maak on the compound and is measured on a radiator then Invert Red-Qaida and Asmar
Iqias compound and radioactive supposed to Aigas you and flip the red on the compound and black on
the radiator and the Red irradiated and red on the compound important total measurement six 6 times
measured which once
In the next lines will recall the foregoing summary
Active ingredients
So named because they are components have the ability to zoom effort or Altiarhy 7 4 of them as
components Semiconductor
Semiconductor so named because they are components have the ability to delivery and non-delivery at
the same time as the delivery and the use of semiconductor circuit made from two Silicon si Jermnyum
diode transistor Mosvet transistor Ge four components are diode
Diodes
Code on Burda D symbol technical

Has named items bilateral and common

Duo named because it has two sides first elevator & anoade A
And the other party lakeside cathode K

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The Palmouhd named because it allows BMR trend in the direction of one of the Aland to Alexd without
accustomed trend again

Both sides of the p and N positive and negative Astkhamh used as a key or switch to control the direction
of flow of current is used to convert AC variable to a steady stream
Types of diode
Silicon siD Jermnyum GED treated the same treatment in the composition of the constituency and
measurement and forms the famous
This form fallow in Supply rare if I received the ale Board

This form is located on ale Board

There ale Bord many forms I do not have any pictures of her Lanta know the code to the Burda
D
Radiant LED

This diode is used to send light people say it bulb not this diode radiant no bulb and no one in
the ale Bord all crumbs in measuring one and measurement method to develop Albozor Alon
Rouge positive and black on the robbery given read-only with a reverse sides nothing that gave
.yolkin any part be corrupted

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When the diode is damaged it possible to put greater value for diode I can not put a lower
and the diode and how do you know its value Baldata Chet and Multi Aldata Chet fully
whole theme will be willing to explain pictures of how she had to deal with Aldata Chet and
Asitwant alternatives
diode
Zip Ai Burda ZD and possible in fallow Supply Chinese writes D and Trivt measurement same
Trivt measurement diode and features form glass has no ale Board because he works with volts
working high, there in the fallow Supply and when damage is replaced Bai Znr Every
.place some means any Znr benefit Any Znr place differs from the diode in the technical code
diode sharp lines and artistic and diode diode single line How differentiate between *
symbol differs
There diode Aydaaa
Named Dublin Keeter is a 2 diode in one's body and its shape like Transistor

And Trivt measured measured if an 2 diode means Qais diode diode and there in certain types
.of Maser Board will instruct
Transistor
Hieuaaaa Is the first shift in world Alaketurniat is of more components
Symbol on ale Board Q
Consisting of three parties has the ability to withstand the efforts of and Tirat top of diode
Occupation works as a key or switch to control the direction of current flow
Works Kmekpr (voice * FILE * effort * Stream * signal * frequency * lighting
Consisting of three parties are

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Biz B E Koketr C
Reasons not to use transistor ale Board and used in many electronic fallow Splayusbandzh
Claty
Different parties in terms of the country of manufacture
Effort to reach saturation
Difference in the direction of R. Murrow mainstream
First different parties in terms of the country of manufacture

Effort to reach saturation

In other words if we have a transistor works with 20 volts does not work required of him only
upon the arrival of the full 20 volts means if Link Broken 19 volts and is working with values
.much higher than the voltage we need ale Board

Difference in the direction of current flow

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Trivt measured
Measured on a Albozor
and Beas Measured 6 measurements between all parties given Qratan between Beas and
and Koketr
Cases of damage to the transistor and results
Given read or yolk between all parties this case called it Chort lock given READINGS sound I
was given to read or 2 further de situation called leaking or not read or given anything between
.all the parties in this case called the defect
Mosvet transistor
khasasaaaa Making to Maaljt defects that have emerged on the transistor and carrying efforts_
and higher than transistor currents
Same Zip Code Q
Job same
Consisting of three parties such as the transistor not there is a significant difference in the
internal configuration is considered Mosvet is the latest trend in the world of technology and
many forms

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)163

It consists of three parties SourceForge sorurs Gate gate and drain drain so that the source Jet
:source gate drain the bank or the director or rule him there are two types
Channel positive negative P Channel N
Or other words that Achanl N channel B Achanl P channl
Burda and working on the type that include
The way it works: enter power source and then when he entered the gate Gate closed gate,
whereupon conquest and pass the required amount of power to the director Darien
:Measurable way on Status Albozor
First we make the lock between all the parties to close the channel fully
Secondly measured 4 gives the reading Size oasis between the drain and source

Beware if Ksth Tani Mbachertaaa given yolk you Bamlat measurement first opened the
Channel if Habeat measure Tani Channel understood fully closed

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i.c Regulator
but better than Zeinr A ic integrated circuit are installing voltage like
+ ---- 78
v 5+ ------- 7805
6+ ------ 7806
9+ ------ 7809
negative ------ 79
5 ------- 7905
6 ------ 7906
9 ----- 7909
It must be larger inside from the outside about 2 volts and there are some ic reguirtor four
legged contol Tgmitriqh measurement symbolizes .. ic. ul measured on Maser Board which
connected Bulbor and works and measures the current exterior and interior km written in
.previous Alabart how entry and exit
?I was a lot to call it that Turnzistur I do not Anao AISI Rigertor & But how to distinguish
Be written on the surface of the following numbers
positive 78 -------------------- 7805
And five de abroad means 7805 positive 5 volts and be present in a circle Alpaor Btaa
Alsedrom car Anao takes 12 volts and out of 5
The 7905 ---------------------------- Same minus 5

I.C Allaishat

Definition
IC is a complete circle Aktronah and consists of a group of the Alturnzisturat and no
.signs of it Tlavh but define holidays after reviewing the circuit well
.Soundings does not have his measure is Aldta Chet or Alasilyscop
Occupation: working Allaishat such action micro Bricissour Vaheib Essy and flash BIOS
.also Assauejtalv form and function of Allaishat by the constituency to which it
Look at this in the image, ESA

This difference between the ESA and the jealousy of Allaishat because it has Memory for
.writing and can store data
Ohz forms Allaishat that writes

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)163

This form Allaishat that do not write them and not Memory

Types of IC
That component, which in Bahra dive everyone of them come out with gold and some of
them come out without anything
First IC give rise to a range of electronic components in one body defamatory designed to
something specific tasks and it is possible to be the NEC of all the ingredients except for
reasons of bigness and other
Which are two and we know it in terms of form
First SERVIC MOUNT
This one forms

The second P G A
These two different forms

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)163

We detail each type separately and statement types in purdah and the statement of its
functions and repair systems and treatment and everything, God willing
First SERVIC MOUNT
(It is also divided into two types (linear and digital
First LINER paced
Has to be the arrival of the effort to him to work like any component not there a
difference between the two types must Nczykrh before embarking on explanation, God
willing, and extended that pace does him because in doing his work does not
need to signal sense does not need to Unlike the NEC Aldegtal to be there with
feeding to he needs to signal to do his job and this difference Nstvad that EEC
him remains of the kind Aldegtal though not with him remains of
a numerical kind and this difference Alchristale We all Arefanha and Aydaa will be
explained, God Almighty
Go back to talk about the NEC-paced and kind of species found on the purdah or MB
First IC VOLTEG CONTROL
And abbreviated his VC
And is a NEC digital type does him he There Damaaa next Albroosusr CU
As for his work, his action is to regulate the voltage outgoing hard to Albroosusr In other
words, is responsible for feeding Albroosusr a controlled voltage on ale Board and will
detail in this, God willing, when explaining circles
In its absence is replacement with a group of components
Secondly IC SUPER I.O
Said NEC Any or
Which is responsible for all the entrances and exits on the ale Board except audio and
network because they each and every one of them has a special IC
And Aydaa will detail in explaining God willing circles
He made ITE, WINBOND or ale Bord old P3 type SMSC
Thirdly IC AUDIO
NEC sound
\ Which is responsible for the sound is produced by VIA, RTL or CERATIVE
It is small size Damaa be down Alsuchitat It is possible to come Digital and could be
making the manufacturer of the Achb six

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)163

Then we come to the kinds of digitalis

First Alfrckonssa FORGUANSC
NEC frequency
Is responsible for the transmission and reception of all commands to and from all circles
Almtkalmlh ale Board
Is produced by ICS, RTL or produced by the manufacturer of the growing Sete and here
are some details
AISI Alfrckonssa a circle frequency which is ascribed to raise the blood to the human
brain Any must find Xiae what the body does Dg blood to the brain and distributed to
the rest of the body, a pulse frequency oscillator
Percentage of those ESA heart because of jealousy there is not a rest circles is Ulead
frequencies necessary for the departments Almadhir Board and primitive tasks that
district Andm feel Albordh Balbor because they cushion it bigger and function, a
frequency measured frequency unit of measurement hertz Hz and serve that constituency
in Almadhirbord group bridges North and South Bridge unit RAM Unit Alvija and
Albrcissor The pulse signal emerging from RAM to get to North Bridge and then the
pulse signal emerging from the bridge north to the processor to be the process of
directing naturally produces from that district breakdowns many do not feel Albordh
Balramat and also not feeling Albordh Balvija and also problems Albrcissor different
Anuaha
Alvija GB external folk For example, if you have your office Bord GB written on
Bstbdul AISI Alfrckonssa other of the same kind and have not written on it the name of
the manufacturer Giga House What happens not feeling Albordh Balvija although
exceeded safety codes Altestr
As for a replacement this ESA no alternative jealous and can not be change in the figure
for AISI or even Alchristalh its own and you can see that ESA is corrupted or not the
process of measuring heat on the back of this ESA Most of those types of Allaishat rise
bike heat them but when it rises abnormally be doubt first in ESA and sometimes suffice
Climate Alchristalh only Pfs figure them temporarily to the testing process and the best
solution for the measurement of this ESA
Using Alauslescub to measure the signal and ESA study began chit
Thaniaa IC LAN
NEC Network
which produce RTL or MAREVEL or from the Which is responsible for network
production of the manufacturer of the Achb Sete or produced by Giga House
GIGABYET

Iiiaaa IC BOIS
This NEC we will talk about in circles explained

(
)163

Measuring only NEC Tabaaa can not be measured because as we said a total of
components
Haute Air

1


1


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)163


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(
)163



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(
)163

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(
)163

power processor

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(
)163

 Voltage Regulator:

-1
-2
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(
)163

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-2 )( Ferrite chokes

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(
)163

.....MOSFET...

(
)163

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) 2+ ) (( .

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(
)163


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(
)163

.... .... voltage regulator circuit

12 ) (ATX12V ) (ATX12V
.

-1
-2
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) (ceontrollr Pulse Width
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higher value
cpu )voltage ID (VID) pins
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DC-DC converter
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) (changing the frequency of the PWM signal .
.... )....(PWM controlle

(
)163

(
)163

-1 voltage ID pins
-2 the loopback pins

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2
)

(
)163

 ( ) (coil .

) *( switch
12 .ATX12V


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Voltage Regulator
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)consumable Vcc
.(voltage ). ( 3.3v, 5v, and 12v DC

(
)163

....Voltage Regulator ....

.ICC - Processor current
RLL - Load line impedance: Defined as the ratio of voltage droop/current step. This is
the load line slope. In this document, the load line is referenced at the socket unless
.otherwise stated
TOB - Vcc regulation tolerance band: Defines the voltage regulators 3- voltage
variation across temperature, manufacturing variation, and age factors. Must be ensured
by design through component selection. Defined at processor maximum current and
.maximum VID levels
.VCC - Processor core voltage
VID - Voltage IDentification: A code supplied by the processor that determines the
reference output voltage to be delivered to the processor Vcc lands. At zero amperes and
the tolerance
.band at +3-, VID is the voltage at the processor
(channels)-1
.one switching regulator +two MOSFETs

(
)163

on off

-3
-4

(
)163







1.4 1.7.

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(
)163










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-
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(
)163

-:
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12 .
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(
)163

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Driver
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(
)163

(
)163

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(
)163

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(
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(
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(
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(
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(
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(
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(
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*
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(
)163






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)163




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(
)163









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(
)163

(
)163





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(
)163

(
)163

 .... .... AMD

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(
)163

(
)163

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(
)163

rom

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(
)163

(
)163

 .
..... .....
SLOT

) RDRAM (

(
)163

 DDR3

(
)163

..... .....
SDRAM

DDR1

DDR2

(
)163

(
)163

DDR2-1066
DDR3-800
DDR3-1066
DDR3-1333
DDR3-1600

MHz 533
MHz 400
MHz 533
MHz 666
MHz 800

MB/s 8,533
MB/s 6,400
MB/s 8,500
MB/s 10,666
MB/s 12,800

PC2-8500
PC3-6400
PC3-8500
PC3-10600
PC3-12800

Voltages
DDR3 memories operate at lower voltages compared to DDR2 memories, which in turn operate at lower
voltages compare to DDR memories. This means that DDR3 memories consume less power than DDR2
.memories, which in turn consume less power than DDR memories
Typically DDR memories are fed with 2.5 V, DDR2 memories are fed with 1.8 V and DDR3 memories
are fed with 1.5 V (although modules requiring 1.6 V or 1.65 V are common and chips requiring only
1.35 V may become common in the future). Some memory modules may require higher voltages than
those listed. This happens especially with memories supporting the operation at clock rates higher than
.(the official ones (i.e. memories targeted to overclocking

(
)163

Technology Typical Voltage

DDR
V 2.5
DDR2
V 1.8
DDR3
V 1.5

Memory Module Number of Pins
DDR
184
DDR2
240
DDR3
240

.Figure 7: Difference in edge contacts between DDR and DDR2

(
)163

click to enlarge
.Figure 8: Difference in edge contacts between DDR2 and DDR3
All DDR2 and DDR3 chips use BGA (Ball Grid Array) packaging, while DDR chips almost
always use TSOP (Thin Small-Outline Package) packaging. There are a few DDR chips with
BGA packaging on the market (like the ones from Kingmax), but they are not so common. On
Figure 9 you can see how a TSOP chip on a DDR module looks like while on Figure 10 you
.can see how a BGA chip on a DDR2 looks like

.Figure 9: DDR chips almost always use TSOP packaging

.Figure 10: DDR2 and DDR3 chips use BGA packaging

(
)163



I.C SOFT

-A

-1
-2
-3

-4 /


-B

-3

(
)163

2 +

[
SDRAM
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32
64
128
256
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66
100
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RDRAM

(
)163

 RDRam
3,5

p3 p4

128
256
DDRAM

) (P4 SDRAM )RAM

(BUS

128
256
512
1
BUS
(Mhz/s) 266
(Mhz/s) 333
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DRAM



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C1 - C2 -C3 -C6 -C7 - dd
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(
)163

 :
Transistor Transfer Resistor
..
Capacitors

.. .
) (
Hz

MHz 1000000 ) 1000000 (
bit ..
1 .. 0
0 .. 1
8 )( 1 ..
Byte ) (...
:
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:
1 = 1000
1 = 1000
1 = 1000
1 = 1000
1 = 1000
1 = 1000
1 = 1000
1 = 1000
: ..

:
..

(
)163

 SD-RAM

Single Data Rate Random Access Memory

.

.. .
66 100 133 ...

DD-RAM DDR

:
Error Correction Code
.. ECC

(
)163

(
)163

PC3 = DDR3
3200,4200,6400 ratio ..
: " FSB" 800 800 ..
200 ..
FSB " "quad-pumped .. 800
..
: cpu-z
DDR2 800 800
DDR "... "double-pumped
DDR2 800 1/2 , 400 ..
: cpu-z

bandwidth .. 8
:
ddr2 800 6400 = 8*800 ..
PC2 6400 = 6400/8 800 ..
PC3 14400 = 14400/8 1800 ..
ratio :
:
P4 800 DDR 400 .. dual channel
:

(
)163

FSB will be 4 x 200mhz (quad pumped) x 64 bit data bus = 51200Mbit/sec = 6400MB/sec
=DDR 400 in dual channel = 200mhz x 2 (double pumped) x 2 (dual channel) x 64 bit data bus
51200Mbit/sec = 6400MB/sec
ratio 1:1 ..
bandwidth ..
e6700 1066 bandwidth = 8512 ...
.. 8512 = 8*4*266
ratio 1:1 ddr2 533 dual channel
8512 =8*2*2*266
ddr2 1066 Single Channel
8528 =8*2*533
8528 533/2
266 .. 266.5
ddr2 667 .. dual channel bandwidth
..
= .. 10656
1066 .. 1333
bandwidth 8512 .. 10656
ddr2 800 dual channel bandwidth
..
12800

.. Dual Data Rate Synchronous Dynamic Random Access Memory
. 2
.
. sd-ram

(
)163

2.5 . .

DD-RAMII DDR2

DDR DDR2
DDR2
DDR2 DDR

DDR2 1.8 DDR 2.5

..
DDR PINS 240 PIN DDR
184 ..

DD-RAMIII DDR3

(
)163

 bandwidth 8 DDR2 4 DDR 2 ..

DDR3 %30 . DDR2 1.5
DDR2 1.8 DDR 2.5 ..
..

DDR3 240 PIN .. DDR2
DDR3 NVIDIA & ATI
.. Technologies .. Playstation 3
.. ddr2
* ) 1800mhz ( 2000mhz
* ) .. ( laptop
* .. nm 90
..
* .. DDR2
* dd3 .. ddr2
ddr3 ddr2 % 2 .. %5
:
DDR3 .. ..
DDR3 .. DDR2
..
.. DDR2

RD-RAM

(
)163

 Rambus Dynamic Random Access Memory

.
32 ) ( 16
) ( 800
. 4
. 850 DDR DDR 2
..

.. ...
Dual Channel

,2002 nForce2 , nvidia Intel

865G 865PE 875P .. ..
: ,
..

(
)163

 : ddr2 667 GB/S 5.3 Single Channel

Dual Channel .. GB/S 10.6
64 Single Channel 128 .. Dual Channel
.. Dual Channel .
Dual Channel
.. Single Channel ,
..
Single Channel

Dual Channel

(
)163

 ..Dual Channel :
-1 512*2 .. 1024*2
-2 .. 667MHZ , 800MHZ
-3 ..
..
Dual Channel ..
.. Dual Ram Memory
"
serial number"..
..
.. :

(
)163

 ..
Single Channel

Dual Channel

..
..

(
)163

(
)163

(
)163

(
)163

 %2 %10 Dual
Channel

Error Correction Code

.. ECC
..
:
1 001
2 010
3 011
4 100
3 111 ECC .. 011
110 ..
..
..
)..(Servers

(
)163

(
)163

 DDR2 800 800

DDR "... "double-pumped
DDR2 800 1/2 , 400 ..
: cpu-z

bandwidth .. 8
:
ddr2 800 6400 = 8*800 ..
PC2 6400 = 6400/8 800 ..
PC3 14400 = 14400/8 1800 ..
ratio :
:
P4 800 DDR 400 .. dual channel
:
FSB will be 4 x 200mhz (quad pumped) x 64 bit data bus = 51200Mbit/sec = 6400MB/sec
=DDR 400 in dual channel = 200mhz x 2 (double pumped) x 2 (dual channel) x 64 bit data bus
51200Mbit/sec = 6400MB/sec
ratio 1:1 ..
bandwidth ..
e6700 1066 bandwidth = 8512 ...
.. 8512 = 8*4*266

(
)163

 ratio 1:1 ddr2 533 dual channel

8512 =8*2*2*266
ddr2 1066 Single Channel
8528 =8*2*533
8528 533/2
266 .. 266.5
ddr2 667 .. dual channel bandwidth
..
= .. 10656
1066 .. 1333
bandwidth 8512 .. 10656
ddr2 800 dual channel bandwidth
..
12800
:
: corsair

corsair :
Dominator

(
)163

 ic over-clocking
..
Dominator ...
Dominator DHX .. Dual-path Heat Xchange
..

over-clocking ..
over-clocking AirFlow .. Dominator

..
:

(
)163

--------------------XMS DHX Series

DHX .. Dual-path Heat Xchange
.. Dominator ..
over-clocking .. over-clocking
.. Dominator
XMS3 DHX Series

XMS2 DHX Series

(
)163

--------------------XMS2 Pro Series

..
..
:

--------------------XMS2 Xpert Series

.. corsair
:
, , "" ..
..
:

(
)163

--------------------XMS Series
over-clocking ..
.. corsair
XMS3 Series

XMS2 Series

(
)163

--------------------Value Select Series

corsair over-
clocking ..

.. OCZ Technology

..
..
Flex XLC Series
ddr3 .. ddr2

(
)163

(
)163

 :
ReaperX HPC
Reaper HPC
...
ReaperX HPC .. Reaper HPC

ReaperX HPC

ddr3 .. ddr2
DDR3 Model

DDR2 Model

(
)163

------------------Reaper HPC

.. ddr2 .. ddr3
:

(
)163

Egyeprom Myeprom




-1
)
No ACK Device Command

(
)163


-2

) Read Chip

Buffer

(
)163

DDR_64X8_Spectek_512M_PC400

DDR
64X8 chip 8 chip 64 512
spectek

BUS

512 256
256 chips



)




egyeprom

egyeprom myeprom

(
)163


-1
)
no ack device command

-2

read chip
buffer

ddr_64x8_spectek_512m_pc400

ddr 64x8 chip 8 chip 64
512
spectek bus

512 256
256 chips



)
(

(
)163

 Northbridge

memory address space
I/O address space
interrupts
.
the front-side bus
)(read or write memory

(
)163


:
It uses some pins to transmit the physical memory address it wants to write or read, while other pins send
the value to be written or receive the value being read. An Intel Core 2 QX6600 has 33 pins to transmit the
physical memory address (so there are 233 choices of memory locations) and 64 pins to send or receive
data (so data is transmitted in a 64-bit data path, or 8-byte chunks). This allows the CPU to physically
address 64 gigabytes of memory (233 locations * 8 bytes) although most chipsets only handle up to 8 gigs
.of RAM


) ( northbridge
. amd
Physical memory addresses

(memory-mapped I/O )
: Physical memory addresses
video cards
PCI cards
BIOS

..... .....

(
)163

(
)163

 northbridge

,

,
.

.
) (I/O Management
.
) (Gamers ) (Overclocking

) (Operate Frequency..
) (Heat
) (Heatsink .
, SDRAM DDRAM
,
, DDR DDR2.
South Bridge

(
)163


ICH ). (I/O Controller Hub
). (controlling I/O devices

-1 Parallel and SerialATA ports

2 USB ports -3 On-board audio
-4 On-board LAN
-5 PCI bus
-6 (Real time clock (RTC
7 CMOS memoryOn-board audio
)(audio controller
) . (codec= coder/decoder
On-board LAN
)(phy= physical

-1 )(bios
-2 ) (Super I/O chip
.serial ports, parallel port and floppy disk drive

(
)163




usb.
southbridge

sis ati msi945

(
)163





865 rz
.
.
Super I / O

) ( chipset
.
:
) : ( NORTH BRIDGE
) ( CPU ) ( Ram
) ( PCI express ) ( AGP .
NORTH BRIDGE ) ( SIS AMD VIA
. (memory controller hub (MCH) - integrated memory controller (IMC
:
AMD ATHLON CORE I7 CORE I5
.
. CORE I5
.
HD

3300 790GX HD 4200

785G . AMD
:


.
:

.

.
) ( I/O memory management unit
INTEL AMD FRONT SIDE BUS
AMD . HYPER TRANSPORT

(
)163

 :



:
) : ( SOUTH BRIDGE

USB .

AMD 710
, 740 , 770 ICH7
.
SOUTH BRIDGE )
( SIS VIA AMD . ICH
:
PCI USB

.
:
:
PCI . PCI-X

SMBUS .

) . ( ETHERNET

.USB

(
)163


-:

.
-:


-: ) (
msi .

-1
-2




) (gmch
.
)
.(ich

GMCH
. GMCH. .

(
)163

(
)163

(
)163

(
)163

(
)163

(
)163

(
)163

(
)163

(
)163

 I/O

Super I / O

Super I / O

ps/2

paralle port

3 3
power on /off
.
5 soltek 848 8 .
. pci

(
)163

.
LPC (Low Pin Count) Interface
Hardware Monitor Controller
Fan Speed Controller
Flash-ROM Interface
SmartGuardian Controller
IEEE1284 Parallel Port
Floppy Disk Controller
Game Port
General Purpose I/O Pins 56
Input mode supports switch de-bounce
Output mode supports one set of programmable LED blinking periods
Watch Dog Timer
Times out the system, based on a user-programmable time-out period
Time resolution 1 minute, maximum 255 minutes
Dedicated Infrared pins
Compliant with IrDA 1.4 for VFIR
Single 48MHz Clock Input
Single 3.3V Power Supply
pin LPQF-128

(
)163

(
)163

( timming signal)
.
.

( clock generator)..... .....
lc l;et

clock generator

CPU
FSB
GPU
RAM
southchip
system clock frequency

reset signal

.control signal bus

rest signal
.

a chipset, connected to the CPU, wherein the CPU communicates with a
;peripheral of the computer main board through the chipset
a clock generator, connected to the chipset, providing the chipset with a
system clock frequency for operating the computer main board, wherein the
CPU controls the clock generator through the chipset, and the clock
generator is controlled through a first control signal bus; and
a reset signal generator, connected to the chipset and controlled by the
,CPU through the chipset, which provides the chipset with a reset signal
wherein the reset signal generator is controlled through a second control
signal bus, such that when the clock generator needs to change the system
clock frequency according to a command from the CPU, the reset signal
generator activates the reset signal simultaneously for changing a clock

(
)163

frequency of the peripheral from a current frequency to an intended

frequency with respect to the svstem clock frequency where the intended
frequency can be repeatedly reset until the intended frequency matches in
ratio to the system clock frequency and the reset signal remains
activation until the system clock frequency is completely changed to a new
.setting
The circuit of claim 5, wherein the circuit further comprises a status .6
latch for storing a status parameter set by the CPU as soon as the system
clock frequency is changed, wherein the set status parameter is retrieved
by the chipset from the status latch to determine a ratio of the system
clock frequency to a clock frequency of the peripheral after the computer
.main board is restarted
The circuit of claim 5, wherein the first control signal bus includes an .7
.I2 C bus
The circuit of claim 7, wherein the second control signal bus includes .8
.an I2 C bus
The circuit of claim 8, wherein the chipset comprises an I2 C bus .9
interface that is used by the CPU to control the clock generator and the
.reset signal generator
A method for switching system clock of a computer main board, the .10
:method comprising
;providing a CPU
;providing a clock generator, for generating a system clock frequency
sending out a command from the CPU to the clock generator to change the
;system clock frequency
sending out a reset signal from the clock generator as soon as the clock
generator starts to change the system clock frequency wherein the reset
signal resets a clock frequency of a peripheral from a current frequency
to an intended frequency with respect to the system clock frequency where
the intended frequency can be repeatedly reset until the intended
frequency matches in ratio to the system clock frequency, and
canceling the reset signal by the clock generator as soon as the system
.clock frequency is changed to a new setting
The method of claim 10, wherein the method further comprises providing .11
a status latch for storing a status parameter set by the CPU as soon as
the system clock frequency is changed, wherein the set status parameter is
retrieved by the chipset from the status latch to determine a ratio of the
system clock frequency to a clock frequency of the peripheral after the
.computer main board is restarted
A method for switching system clock of a computer main board, the .12
:method comprising

(
)163

;providing a CPU
;providing a clock generator, for generating a system clock frequency
sending out a command from the CPU to the clock generator to change the
;system clock frequency
sending out a reset signal from a reset signal generator as soon as the
clock generator starts to change the system clock frequency, wherein the
reset signal resets a clock frequency of a peripheral from a current
frequency to an intended frequency with respect to the system clock
frequency where the intended frequency can be repeatedly reset until the
intended frequency matches in ratio to the system clock frequency, and
canceling the reset signal from the reset signal generator as soon as the
.system clock frequency is changed to a new setting
The method of claim 12, wherein the method further comprises providing .13
a status latch for storing a status parameter set by the CPU as soon as
the system clock frequency is changed, wherein the set status parameter is
retrieved by the chipset from the status latch to determine a ratio of the
system clock frequency to a clock frequency of the peripheral after the
computer main board is re



clk

( . ( voltage regulator circuit
( ATX12V) ( ATX12V) 12
.

-1
-2
-3
DC-DC converter
switching-mode
Pulse Width ( ceontrollr)
.Modulation


higher value
voltage ID (VID) pins cpu
( led)
.( binary code)
( controller) DC-DC converter *

(
)163

 voltage regulator
) (changing the frequency of the PWM signal .

(
)163

)(PWM controlle

-1 voltage ID pins
-2 the loopback pins

.
-3) (G pins

2
) ( ) (coil .

(
)163


) ( switch

(
)163


Voltage Regulator
) ( Vcc power
)consumable Vcc
.(voltage
). ( 3.3v, 5v, and 12v DC

.... ....Voltage Regulator

(
)163

.ICC - Processor current

RLL - Load line impedance: Defined as the ratio of voltage droop/current step. This is
the load line slope. In this document, the load line is referenced at the socket unless
.otherwise stated
TOB - Vcc regulation tolerance band: Defines the voltage regulators 3- voltage
variation across temperature, manufacturing variation, and age factors. Must be ensured
by design through component selection. Defined at processor maximum current and
.maximum VID levels
.VCC - Processor core voltage
VID - Voltage IDentification: A code supplied by the processor that determines the
reference output voltage to be delivered to the processor Vcc lands. At zero amperes and
the tolerance
.band at +3-, VID is the voltage at the processor
(channels)-1
.one switching regulator +two MOSFETs
.

(
)163

 on
off

Dual Channal

(
)163





dual channal



dual channal single channal

dual channal ,
.

pc -xxx

pc-xxx = ddr
pc2-xxx = ddr2
pc3-xxx = ddr3
.
.
single channel 3.2Gb/s DUAL CHANNEL

(
)163

 . 6.4Gb/s 64 ) (Single Channel 128 )Dual

(Channel ) FSB ( FSB.
.
, :
256*2 . 512*2 .DDR 400 , , , Dual Ram Memory

dual channel
Dual Channel
:
-1 ) ( ps2 & keyboard & mouse & usb ..
-2 ... Restart
-3 ..
-1 -: PS2
.. 5 PS2 ) ( DC 20 5
....
C-MATRIX IC
ITE .... ITE 7 -5 ....

(
)163

 RESTART
.. -:
...
...
.....
... .. ....

....
...
:
.... .... ... .... -3 :
... .... ... SETUP.. NORMAL ... -:
-1 ..
-2 ... over load
*
-:
...
:
- 1 ..
- 2 ...
- 3 ...
-:
-1 ..
-2 ..
-3 <--- ..
: ::
DDRam - 1 2.5..
SD Ram - 2 3.3..

(
)163

 RD Ram - 3 2.5 ..
DD Ram 2 - 4 2.5 ..
...




2.5
5 5
2.5 ...
20
3.3 2.5 2.5
1.50 4.0

..
-1 ..
-2 ..
-3 ..
-4 3-2
..
-5 R
C - Matrix
-6
...
-:
-1 ____- -:
3
..

...
-: " " Over Load ..
-:
..

...
..
1 ...
-2 ...
-3 " , , " ..
-4 " " Power Regulator ..
-5 .
-6 " "Chipset " " ITE
-7 ..
-: " "Power Regulator " ..... " Chipset

(
)163

 ) (

LGA

LGA

)
VCC VDD
(






A I/O D
VCC

(
)163

(
)163

POST Card
POST Card

BIOS
POST Code. POST Code
POST BIOS 80
.I/O Ports
Compaq BIOS POST 84
300 IBM .

(
)163

 POST Card I/O

POST .
POST Error Codes BIOS
POST Card .
POST Card Expansion Slot ISA .PCI
POST Card ISA PCI
ISA PCI .

OSC Frame
RST
.
RST OSC agp chip
.
OSC Bios
ITE
:
.



C1 - C2 -C3 -C6 -C7 - dd
d1 -d2 -d3 -d4
: 4 C1




-1
-2 I.C
-3
-4
-5 GMCH

FF - C0 - 01- 02 11 (--) - 00
pb FE FC


-1




-1
-2

(
)163





-3

4 8 2

-4

BIOS

FF 00 - -
C0 Pd BIOS

66 20 70 90
FF

FF, -- , pd , C0 , 00

-1 12
-2
-3
-4
-5


C1
I.C Inbut . Outbut

-1
-2 USB ich
-3

"[ 26
[2m

: 12

Usb

(
)163

 .
post

) 6.3v 1500uF
3500uF
4 8, chip
8 (P4


(
1x +



Post Card
post tester RST
OSC Frame
RST

RST OSC agp chip
.
OSC Bios
0.1 ITE SMC

Post card
Post Card ami Phoniex Award
FF
Post RST , OSC


Post card





8

8 L

GD75232

(
)163


P4
short


) (
) (

) - ) P4
pci chip

ddr Sdr

Motherboard ...
.

Motherboard
-:
C0 , C1 )
bank ( 25
-1 .Capacitors
-2 .BIOS
-3 .Voltage regulators
-4 .Battery
-5 .
voltage regulators
.
:
Electrolytic capacitors .
Battery .
Motherboard
Physical check .
:
-1 .
-2
Overheating
.overheating
-3 ICs .IC Sockets
bent legs
.
-4 .
-5 Jumpers CPU
.
.

(
)163



.

.

.

.
:
.A-Open
.ECS
.Shuttle
.MSI
.VIA
.Abit

(
)163


.
POST.
memory test .
Health Alarm ) (hi-low siren
BIOS .
Microprocessor front panel
indicators .
.Boot-up
Setup .
.
.
.complex graphics
Setup
.
Filter Circuits
AC components .
DC ) loads CPU
(AGP .
Filter Circuits

Over-current Protection ATX Power Supply
Voltage Regulators .
parasitic oscillations
over-current overheating Premature
failure .

Coil ATX
. Coil overheating Leakage
.Filter Capacitors
Filter Capacitors
.
Restart .
Processor socket/slot .

BIOS
jumpers BIOS )
BIOS jumper BIOS
(Protected BIOS
.
Beep BIOS
.
BIOS.
BIOS IC DIP 32
.IC Socket
BIOS sticker BIOS

(
)163

) Award Phoenix AMI( BIOS .

BIOS PLCC
. BIOS IC Socket
.
BIOS EEPROM
.Programmer
BIOS
.
notch .BIOS
.
.
BIOS .
BIOS DIP
1
.
-2 .
.
.
.3 .
.4 .
.
BIOS DIP
.1 notch
.
.2
.
-3
.
.

(
)163


BIOS
.1 Hardware ) CPU (
BIOS . BIOS
* bin. .
.2 BIOS .PnP
.3 BIOS
.
.4 BIOS
.BIOS

BIOS
.BIOS
BIOS
BIOS .
-:
.1 .
.2 BIOS
.EEPROM Programmer
.3 .BIOS
BIOS .
Users Manual .
BIOS Pause
.Memory Test BIOS
.BIOS :
i440BX - ITE867 - 2A69KS2IC - 00 - 02/15/2000
:
i440BX - ITE867 - 2A69KS2IC - 00 - 02/15/2000

. 2A69KS2IC
Award BIOS :
1.2A69K Chipset.
S2.2 .
IC.3 .
BIOS AMI BIOS :
zz5123-00111111-101094-AMIS123-P-51-0102
.

(
)163

 Award AMI
.
BIOS
BIOS .
BIOS Sticker
BIOS . BIOS

) BIOS (BIOS
.BIOS
:BIOS
Award, AMI, Phoenix
:BIOS
Intel, Atmel, Winbond, AMD, Macronix
) BIOS (BIOS
.BIOS
:BIOS
Award, AMI, Phoenix
:BIOS
Intel, Atmel, Winbond, AMD, Macronix

(
)163

 BIOS Core Part Number

.
.Core Part Number
Core Part Number.
BIOS EEPROM Programmer
.Hot Flashing
:
.1 .Boot-up Floppy Disk
.2 .Flash Utility
.3 BIOS .
.4 BIOS .
Flash Utility ) BIOS Award
(AMI BIOS
Motherboard BIOS . .
BIOS * bin.
.

Hot Flashing
-1 Motherboard .Clear CMOS
.2 BIOS
. Motherboard
.
.3 .Motherboard
.4 .
.5 DOS BIOS
BIOS notch
.
.6 Flash Utility BIOS
.
.7 BIOS Clear CMOS
BIOS
.1 Disable BIOS Setup Shadow
RAM BIOS.
.2 Chipset Feature Setup BIOS Setup Disable System BIOS
Cacheable .Video BIOS Cacheable
.3 Disable Power Management .BIOS Setup
.4 Jumper BIOS )
.(Enable Reflashing

(
)163

 BIOS .

BIOS
BIOS Autoexec.bat
. .
Autoexec.bat .
*echo off
if exist oldbios.bin goto old
awdflash.exe newbios.bin oldbios.bin /py /sy /cc /cp /cd /sb /r
goto end
ld
awdflash.exe oldbios.bin /py /sn /cc /cp /cd /sb /r
end:
BIOS BIOS
oldbios.bin .

BIOS .oldbios.bin Autoexec.bat
BIOS .
.Display System
Award Flash BIOS
Award Flash v7.70
:
[...[ AWDFLASH [Filename 1] [Filename 2] [key [/key
:
Filename 1: for reflashing
Filename 2: for the previous version of the BIOS
Award Flash
Py Pn/
Yes No BIOS .
BIOS Checksum BIOS
.BIOS
.Py/
Sy Sn/
Yes No BIOS .
.Sy/
Sn/ Autoexec.bat
.Display System
CC/

(
)163

 Clear CMOS .
BIOS
CMOS BIOS
.BIOS
Jumper Clear CMOS
Users Manual .
CP/
Clear ESCD
PnP .ESCD
Startup Problems
PnP .BIOS
ESCD .
CD
Clear DMI Data pool
.
Startup Problems
.BIOS
DMI Data pool .
SB/
BootBlock BIOS
.
BootBlock BIOS Software
.
Jumper BootBlock .
SD/
DMI Data pool .
.
R/
) (Reset .
Tiny/
RAM .
Award Flash BIOS
.
Insufficient Memory .
E/
DOS .
LD/
Clear CMOS :
""Press F1 to continue or DEL to setup
F/
BIOS BIOS
.Award Flash
Award
Flash .
CKS/

(
)163

 Checksum .Hexadecimal
CKSxxxx/
Checksum BIOS xxxxh CKS/
:
""!The program file's part number does not match with your system
Award Flash
Insufficient Memory
System BIOS Cacheable Video BIOS Cacheable
Enabled Shadow .Enabled
drvspace.bin RAM .
.Tiny/
The Program Files Part Number Does Not Match With Your System
BIOS .
BIOS .

Py/ Compatibility Check

BIOS
Unknown Type Flash
:
Flash ROM 12V 5V .
Flash ROM .
Program Chip Failed
Flash ROM .Intel 28F001
Boot Block
.

BIOS
BIOS
) Boot Block ( BIOS
.
Boot Block BIOS
Boot Block
.
Boot Block Reset .
Boot Block :
Award BootBlock BIOS v1.0 Copyright 1998, Award Software, Inc. BIOS ROM checksum
error Detecting floppy drive A media
Display Card ISA
PCI AGP Chipset
BIOS .

(
)163

 ISA Boot
Block . ISA Cirrus Logic CL-
.GD5422
) ( ISA
BIOS
.Display System
Boot Block
.Floppy Drive IDE ISA Floppy Drive
.
Intel Jumper .Flash Recovery
Jumper Recovery Boot Block
.BIOS
Gigabyte Dual BIOS .BIOS

.
Chaintec Dual BIOS .TwinBIOS
Boot Block BIOS
. IC-Flasher .
IC-Flasher :
.
2 BIOS (DIP (PLCC .
2 .10K
.Position Switch-2
IC-Flasher :
BIOS .
Autoexec.bat .
BIOS ) Flash ROM .(Atmel 29C020 DIP 32
:IC-Flasher
Flash ROM U2
.
BIOS IC-Flasher
BIOS
.
BIOS IC-Flasher U1
U3 .
SW1 U1 .
Autoexec.bat .DOS
Award Flash BIOS .
SW1 U2 Award Flash BIOS
BIOS .U2
BIOS U1 IC-Flasher U1
BIOS .
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BIOS U1 .
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Voltage Regulators
Voltage Regulators Power Circuit

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 Section .

Processor Chipset
.
Expansion Slot AGP
.Display Card
Voltage Regulators
Power Supply .
MOSFET Diodes
.Schottky Diodes
MOSFET Schottky
Datasheet .
MOSFET Schottky .
MOSFET 2 3
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MOSFET .
5V+
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Forward Bias Voltage Schottky
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MOSFET Schottky
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MOSFET Schottky
Smoothing Capacitors.
MOSFET Schottky
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MOSFET .

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.
post
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 LAPTOP
MOTHERBOARD CD ROM HARD DISK RAM LCD

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