3D IC TECHNOLOGY

ABSTRACT
In todays era the demand of Very Large Scale Integrated Circuit (VLSI) is increased due to the growth of the Electronics industry. The seminar is on the 3D IC Technology and its manufacturing technologies ,benefits and challenges. VLSI has high performance and

high functionality at minimum cost and power dissipation. 3D IC is typically designed by multiple design teams, in multiple geographies, using a variety of design tools. This paper discusses the design of a 3D IC Technology. Three dimensional (3D) stacked integration presents a unique and novel solution to interconnects that promises to simultaneously future integrated circuits. Three

improve performance, while reducing power of

dimensional stacking also permits heterogeneous layers to be integrated, each optimized for their unique functions, making novel integrated circuit applications possible.