Soldering Surface Mount Components Point To Point

Method
Procedure
Add liquid flux to corner pads
Place component in position and hold it steady
Secure corner leads as previously shown
Each leg is soldered individually
Note the small tip size
Soldering iron tip may rest at junction of component lead
and pad or on top of the lead
Apply additional solder as needed
Clean, if required and inspect.

Soldering Surface Mount Chip Components Point To Point Method

Procedure
Add liquid flux to one pad and prefill with solder
Clean the area
Add liquid flux to both pads
Place component in position and hold steady with
wooden stick or tweezers
Place soldering iron tip at junction between prefilled
pad and component lead
Flow solder until component drops down and is
soldered in position
Apply additional solder as needed and remove the tip
Wait a moment for solder to solidify before soldering
other side of component
Clean, if required and inspect