Académique Documents
Professionnel Documents
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Level:
2005
2013
Future
Traffic
Signaling
Smartphone
Signaling Storm
MBB will keep increasing
Feature Phone
2009
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Smartphone % +++
Apps +++
2015
100% Smartphone
Everything is connected
Page 3
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 44
Page
BSC6910 Highlights
BSC6910
Tbps level switching platform for GSM and
Tbps level switching platform for GSM and
UMTS
UMTS
3x User Plane (PS Traffic Model)
3x User Plane (PS Traffic Model)
5x Control Plane (Smartphone Traffic Model)
5x Control Plane (Smartphone Traffic Model)
1 for All Processing Board
1 for All Processing Board
RNC in Pool, smooth evolution
RNC in Pool, smooth evolution
RNC in Pool Redundancy, 10s disaster recovery
RNC in Pool Redundancy, 10s disaster recovery
BSC Node Redundancy , 15 mins disaster
BSC Node Redundancy , 15 mins disaster
recovery
recovery
[kun]
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 5
C
C
LL
K
K
Common
MPU
MPU
GPU
GPU
I/F
I/F
Switching
Switching
Specific
For 6910 only
for 6900/6910
Add
Switching
your text
board
in here
Click
SCUb
to add Text
Common
AddCP/UP
your text
processing
in here board
Click
EGPUa
to add Text
Clock
Add Generation
your text inboards
here
Click
GCUa,
to add
GCGa
Text
10GE interface
Add your
transmission
text in hereboard
Click
EXOUa
to add Text
IP Add
transmission
your text boards
in here
Click
FG2c,
to add
GOUc
Text
O&M
Add interface
your text board
in here
Click
EOMUa
to add Text
ATM
Add
transmission
your text in
boards
here
Click
UOIc,
to add
AOUc
Text
Nastar
Add your
support
text in
board
here
Click
ESAUa
to add Text
TDM Add
/ IP Transmission
your text in here
board
Click
POUc
to add Text
Network
Add your
intelligence
text in here
board
Click
ENIUa
to add Text
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 66
Page
BSC
APP
RNC
APP
X86
X86
BSC
RNC
MBS
C
eCo
MBS
CAPP
eCo
APP
Virtualization
OS
X86
Othe
rAPP
X86
X86
X86
X86
X86
X86
X86
Visualization
X86
X86
X86
X86
X86
X86
X86
X86
X86
X86
X86
X86
X86
X86
Hardware
X86
X86
X86
X86
Page 7
BSC6910
O&M
O&M
Clock
Clock
Interface
Interface
GSM CP
GSM UP
EGPU
Board
Categories
-50%
Spare
Parts
-50%
O&M Job
-30%
Reduc
ed
UMTS CP
UMTS UP
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 8
UMTS Specification
1x
EGPUa
3.2x
1x
XPUb
>500%
>250%
DPUf
SPUb
EGPUa
TRX : 1000
3
PDCH
x:
3000
BHCA: 2200K
ERL:
6250
DPUe
EGPUa
DPUg
Throughput: 2Gbps
PUa: Evolved General Processing Unit REV:a . BHCA base on Huawei Traffic model.
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Board level
UP
Board
Process
level
Load
EGPU
Board
UP UP UP
EGPUa
Board
EGPU
Board
UP 20%
UP 10%
UP 50%
CP CP CP
CP
Board
EGPU
Board
CP 50%
Check
point
Adjustment Time
point
Initial
deployment
CP 80%
CP 90%
Adjustment 1 Adjustment 2
Iub interface
GE port
IuCS interface
IuPS interface
Iur interface
Iur-g interface
GE Port
10GE port
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
O
O
O
&
O&
&
&M
M
M
M
C
C
C
C ll
ll oo
oo cc
cc kk
kk
M
M
M
P
MP
P
PU
U
U
U
Active &
Standby
II
N
N
TT
FF
II
N
N
TT
FF
II
N
N
TT
FF
G
G
P
P
U
U
G
G
P
P
U
U
G
G
P
P
U
U
EGPU
C
C
P
P
C
C
P
P
C
C
P
P
Pool
Pool
Backup
Backup
Backup
EGPU
C
C
P
P
C
C
P
P
C
C
P
P
CP
Backup process
Resource Pooling & Process A/S ensures no service impact in case of single board failure.
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 12
Page
12
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 13
Reliability
Of IP
Networking
Rack 0
Load balance
& Efficiency
In the use of
transmission
resources
IP1
NodeB
Rack 1
IP2
IP Network
Rack 2
NodeB
IP3
Serviceabilit
y
Of IP RAN and
RNC
NodeB
BSC
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 14
UE
CN
Iu CS
BSC6900
RNC Pool
Iub
NodeB
MSC SERVER
BSC6910
RNC
BSC6900
Iur-p
BSC69
00
NodeB
MGW
RNC
NodeB
Iu PS
SGSN
OSS
BTS
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 15
Page
15
NodeB
MBTS
Iub
RNC
Benefit
NodeB
MSC SERVER
Iur-p
NodeB
New RNC
SGSN
Primary
Standby
Page 16
3*BSC6900 +1*BSC6910
Iur-p
Iur-p
Specification
Hardware saving by 3+1
Iur-p
RNC 1
RNC 2
RNC 3
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 17
RNC 1
Specification
RNC 2
Iur-p
Iur-p
RNC 3
Iur-p
RNC 4
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
RNC 5
RNC 6
Page 18
RNC 2
RNC 1
Iur-p
Specification
RNC products should be BSC6910
RNC capacities should be the
same
Available for SRAN8.0 or later
Load sharing function can work
together
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 19
Iur-p
Iur-p
Specification
Iur-p
RNC 4
RNC 1
RNC 2
RNC 3
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 20
Iub
BSC
Benefit
BTS
BTS
MSC SERVER
Backup BSC
SGSN
Primary
Standby
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 21
Specification
BSC products should be the same
The transmission should be all IP
Available for SRAN8.0 or later
BSC 1
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
BSC 2
Page 22
Specification
Software versions should be the
same
Iur-p
MBSC 1
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
MBSC 2
Page 23
BSC6910 selected by
months
60+
operators within
GA+12
(as of 2014.6)
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 24 24
Page
Past
Traffic
Now
RN
C
#1
NodeBs
NodeBs
Signaling
Smartphone
penetration
Page 25
Page
25
BSC6910
Max Capacity
+200%
Swappin
g
Board Type
-65%
Place
Requirement
-50%
Power
consumption
-40%
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 26
Huge Capacity
Biggest
Biggest Operational
Operational BSC
BSC on
on Network
Network
TRX
More
then
6000
per
TRX More then 6000 per BSC
BSC
BSC6910
Node Redundancy
Higher Level for Reliability to support Huge
BSC6910
Higher Reliability
One Cabinet
Less Space than before
Page
Page 27
27
Reliability
RNC
RNC in
in POOL
POOL Node
Node Redundancy
Redundancy &
& BSC
BSC Node
Node
Redundancy.
Redundancy.
Active
Active
Active
Active
Active
Active
Active
Active
Redundancy
Redundancy
Redundancy
Redundancy
Redundancy
Redundancy
Redundancy
Redundancy
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Efficiency
Page 28
Page
28
60%
50%
40%
CPU usage
30%
20%
10%
0%
Challenge: High traffic lead to high CPU usage of SPU boards when special events like
Celebrations and peak hours
HUAWEI TECHNOLOGIES CO., LTD.
Page 29
80.0%
BSC6900
Busy hour
signaling
Tolerancecan do
BSC6910
load sharing for
max 3*BSC6900 by
Iur-P interface for
Signaling(CP) in
busy hour
70.0%
BSC690
0
BSC69
00
60.0%
55.8%
50.0%
- 10%
45.4%
40.0%
30.0%
20.0%
10.0%
0.0%
NodeB
NodeB
NodeB
Benefit: CPU usage low down by using a BSC6910 by RNC in POOL Load Sharing
HUAWEI TECHNOLOGIES CO., LTD.
Page 30
High CP
specification
for signaling storm
Reliability
250
200
100
0
130
120
40
64
14
Industr
y
CP Pool
UP Pool
Transmission Pool
RNC Redundancy
II
N
N
T
T
F
F
II
N
N
T
T
F
F
Pool
Capacity beyond
industry
G
G
P
P
U
U
G
G
P
P
U
U
G
G
P
P
U
U
Pool
Smooth
Efficiency
II
N
N
T
T
F
F
RNC in Pool
P
o
o
l
1
BSC691
0 P
P
o
o
o
o
l
l
2BSC69003
Smooth Evolution:
BSC6900 and BSC 6910
in Pool
Burst Load Sharing to
BSC6910
Smooth Expansion w/o
RNC ID Adjustment
Ready for Cloud
Evolution
Page 31
BSC6910
BSC6910
Primary
Standby
BSC6910
BSC6900
FAQ
1. License can not be
transferred from
BSC6900 to BSC6910
adjustment.
adjustment.
Larger Capacity : 3~6x CP & UP
EGPUa 10GE
Smarter: Automatic NodeB rehoming
2. BSC6910s Power
Distributions are
different from
BSC6900s .
3. New NBI depends
on new cooperation
from OSS system.
3
5
Page 35
BSC6910
8*Cables
8*Cables
Capacity
RTN1(+)
NEG1(-)
BSC6900
8*Cables
8*Cables
BSC6910 Vs BSC6900
RTN1(+)
NEG1(-)
8*Cables
8*Cables
4000W each
Subrack
VS
5100W each
cabinet
RTN1(+)
NEG1(-)
1.
3X Power Cables
2.
4000W each
Subrack
VS
1700W each subrack
8*Cables
8*Cables
Page 36
Performance
difference
Alarm difference
BSC6910
BSC6900
New Platform : New generation boards EGPUa &
New Platform : New generation boards EGPUa &
Parameter
difference
Hardware &
Capacity
difference
Changed Parameters
number 20%
EXPUa.
EXPUa.
New Features : CP&UP dynamic sharing & RNC in
POOL
O&M Optimization : Automatic NodeB rehoming &
Larger
Capacity
: 3~6X
HUAWEI
TECHNOLOGIES
CO., LTD.
Capacity enhancement
Unchanged Parameters
number 80%
Page 37
Page 37
Thank you
Thank you
www.huawei.com
NIU
Board
Non-P2P
Time
P2P
Non-P2P
Time
4
5.8
1.2
1.1
30%
Page 39
10%
RNC in Pool
200
130
120
Industry
64
100
20
Huawei
BSC6910
14
0
Throughput(G)
BHCA(kk)
Superior Performance
Built-on Proven BSC6900s Experience
First-in-class Terabit-switching
Platform
Best-in-class 120 Gbps Iub & 64M
BHCA
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
NodeB
Erlang(k)
BSC6900
Single Platform For GU
BSC6900
Board Pooling
Optimization
BSC6910
New Platform For MBB
G&U
Future
UMTS
GSM
Before
24 Gbps
3720K BHCA
Service awareness
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
2013Q2
2012Q2
40 Gbps
5300K BHCA
Interface board
pooling
Control plane load
sharing
BSC6910
8*Cables
8*Cables
RTN1(+)
NEG1(-)
BSC6900
8*Cables
8*Cables
BSC6910 Vs BSC6900
1.
RTN1(+)
NEG1(-)
8*Cables
8*Cables
RTN1(+)
NEG1(-)
8*Cables
8*Cables
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
3X Power Cables
Page 42
Performance
difference
Alarm difference
BSC6910
BSC6900
UMTS:
40 Gbps
5,300K BHCA
3060 NodeB/5100 Cell
GSM:
8,192TRX/45,000Erl
11,000K BHCA
2048 BTS/2048 Cell
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
UMTS:
120 Gbps
64,000K BHCA
10,000 NodeB/20,000 Cell
GSM:
24,000TRX/150,000Erl
52,000K BHCA
8,000 BTS/8,000 Cell
Page 43
Page
43
Parameter
difference
Hardware &
Capacity
difference