Kolej Kemahiran Tinggi MARA

Balik Pulau, Pulau Pinang.

ASSIGNMENT SHEET

COURSE : MANUFACTURING
SESSION : JUL – DEC 2010 SEMESTER : 4
DMV 4242 ADVANCED
CODE/SUBJECT : SHEET NO : 2
MANUFACTURING PROCESSES
NO OF STUDENTS : 13 WEEK : 13
DURATION : 2 WEEKS VENUE :
LECTURER(S) : MUHAMAD SAIDI BIN MAT ALI
4. SURFACE TREATMENT AND COATING
TOPIC : 5. FABRICATION OF MICROELECTRONIC DEVICES
6. HIGH SPEED MACHINING
Instructions:
This is individual assignment.
Answer all questions.

Questions:

1. List five reasons why surface treatment and coating are important in manufacturing
industry.
2. List five common methods of mechanical surface treatment and coating. Briefly explain
one of the methods.
3. What is electroless plating? How it is done?
4. Explain briefly on case hardening and hard facing.
5. Define vapor deposition and its two (2) major processes.
6. Give the definition of integrated circuit (IC) and describe the advantages of the ICs.
7. Define the Czochralski process and dopant.
8. Oxidation refers to the growth of an oxide layer as a result of the reaction of oxygen
with the substrate material. There are three methods of oxidation; dry oxidation, wet
 oxidation and selective oxidation. Explain the three methods.

Stage 1 Stage 2 Stage 3

Figure 1

9. Production of silicon-based integrated circuits consists of 3 stages as shown in Figure1.

Name and explain each stage.
10. Draw the outline of general fabrication sequences for integrated circuits.
11. State the definition of high speed machining (HSM) in term of cutting speed, and DN
ratio.
12. Give five advantages of HSM.
13. List six important factors in HSM.
14. List five requirements of HSM.
15. List three types of non-contact bearing explain briefly each type of non contact bearing.

Two ways to submit your assignment:

1. A hard copy of your answers, typed.
2. An electronic copy sent to www.dmv4242.blogspot.com

Submission date: 19 Nov 2010 before 5 p.m.

It is each person responsibility to ensure a functional copy has been submitted before the due date (i.e., I
am not responsible for inaccessible or corrupt file).