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Feature/Opti

DDR DDR2 DDR2 Advantage


on
Enables better
Package TSOP (66 pins) FBGA only electrical performance
and speed
2.5V 1.8V Reduces memory
Voltage
2.5V I/O 1.8V I/O system power demand
High-density
components enable
Densities 128MB¨C1GB 256MB¨C2GB
large memory
subsystems
1GB and higher DDR2
Internal devices will have 8
4 4 and 8
Banks banks for better
performance
Prefetch Provides reduced core
(MIN WRITE 2 4 speed dependency for
Burst) better yields
200 MHz,
400 MHz,
266 MHz,
Speed (Data 533 MHz, Migration to higher bus
333 MHz,
Pin) and speed
and
667 MHz
400 MHz
Eliminating one-half
clock settings helps
READ speed internal DRAM
CL + AL
Latency logic and improves
2, 2.5, 3 CLK CL = 3, 4, 5
yields
Additive
N/A AL options
Latency Mainly used in server
0, 1, 2, 3, 4
(Posted CAS) applications to
improve command bus
efficiency
WRITE Improves command
1 clock READ latency - 1
Latency bus efficiency
DRAM on-die ODT for both memory
termination (ODT), and controller
Motherboard parallel
Termination optional improves signaling and
to VTT
onmotherboard reduces
termination system cost
Improves system
Differential or timing margin by
Data Strobes Single-ended
single-ended reducing strobe
crosstalk
184-pin DIMM 240-pin DIMM
unbuffered unbuffered
Improved layout and
Modules registered registered
power delivery design
200-pin SODIMM 200-pin SODIMM
172-pin MicroDIMM 214-pin MicroDIMM
Chipset All DTs, NBs, and All DTs, NBs, and All major chipset
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