CLEANING OF SILICON WAFERS

Hydrofluoric Acid HF

DI Water

Trichloroethylene C2HCl3

Heat TCE at 300C

DI Water

Methanol CH3OH DI Water

Heat Methanol at 300C

Acetone (CH3)2CO

DI Water

Clean Si Wafer

SPIN COATING PROCESS

PREPARE SOLUTION FOR DEPOSITION BEFORE STARTING SPIN COATING

ON POWER OF CONTROL UNIT ON POWER OF VACCUME PUMP CHECK VACCUME IN METER <400+ mmHg PRESS K2 TO SELECT RECIPE SELECT PROPER RECIPE FROM K1, K2, K3, K4. DISPLAY WILL SHOW YOU YOUR RECIPE NUMBER TO RUN PROGRAMME PRESS K5 TO ESCAPE & RUN CYCLE PRESS K5 SYSTEM WILL CHECK ITSELF PRESS FS TO RUN THE CYCLE PRESS K3 FOR ANOTHER RUN OR PRESS K4 FOR EXIT

To change glass substrate use vacuum release switch.

PLEASE CLEAN SPIN COATING UNIT AFTER YOUR DEPOSITION

Viscometer
On Main Power Supply On Viscometer Viscometer Will Initialize Itself Remove Spindle & Press Any Key Viscometer Get Autozeroing Replace Spindle & Press Any Key Select Speed By Using Up And Down Key Set Speed Using Button Set Speed On Motor Using On/Off Motor Button Note Down Stable Reading of Viscosity & Torque Repeat This Process If Required

Stop Motor Using On/Off Motor Button Off Power Supply