MetalMUMPs Material Properties (Preliminary) MEMSCAP Inc.

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MetalMUMPs Material Properties Data. For information only. Some measurements taken from other
processes and may not be applicable to MetalMUMPs.

Film Thickness (nm) Residual Stress (MPa) Resistance (ohm/sq) Fracture Young's Poisons
Strength (GPa) Modulus Ratio
(GPa)
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
Isolation 1900 2000 2100 N/A N/A
Oxide
Oxide 1 450 500 550 N/A N/A
Nitride 1 315 350 365 0 90 180 N/A 6.4 245 0.23
Poly 1 630 700 770 N/A 19 22 25 1 1 1
1.21-1.65 158 0.22
Nitride 2 315 350 365 0 90 180 N/A 6.4 245 0.23
Oxide 2 990 1100 1210 N/A N/A
Anchor 32 35 38 N/A -- 7 --
Metal
Plating 495 550 605 N/A N/A
Base
Metal 17000 20000 23000 -- 100 -- -- 8 --
µohm*cm 0.92
Sidewall 1000 2000 3000 N/A N/A
Metal
Trench N/A 25 N/A N/A N/A

1. Sharpe, W. N., Jr., Jackson, K., and Coles, G. "“Young’s Modulus and Fracture Strength of
Three Polysilicons”". Materials Science of Microelectromechanical System (MEMS) Devices III,
MRS Proceedings 657. Boston, pp. Ee 5.5.1-6 (2001)

2. Measurements made by William Sharpe, et al., Johns Hopkins University, 2002. See Figure below.
S u lfa m a te N ickel Test Results
1 Unannealed (0227_8c)
Unannealed (0226_8a)
2 0 0 C (8b _ 2 0 0 )
0.8 200 C (8c_200) 200 C (8a_200)
300 C (8a_300)
300 C (8b_300)
Stress (GPa)

0.6

0.4

N o te: All specim e n s w e r e tested to failure

0.2

0
-200 -100 0 100 200 300 400 500
D isplacem e n t ( m i c r o n s )

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