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XDM

Intelligent MSPP for Metro and


Cellular Networks
System Specifications
=

XDM System Specifications


June 2004
2 nd Edition

Copyright by ECI Telecom Ltd., 2003-2004. All rights reserved worldwide.


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XDM System Specifications

Contents

Table of Contents
1. Overview ........................................................................................................... 1-1
1.1

XDM Intelligent, Scalable, Optical Networking Platforms ............... 1-1

1.2

Unparalleled Capabilities..................................................................... 1-2

1.3

XDM Platforms .................................................................................... 1-4

2. Physical Description........................................................................................ 2-1


2.1

2.2

XDM Shelf Configurations ................................................................. 2-1


2.1.1

XDM-100 Shelf Layout ........................................................... 2-2

2.1.2

XDM-200 Shelf Layout ........................................................... 2-6

2.1.3

XDM-400 Shelf Layout ........................................................... 2-7

2.1.4

XDM-500 Shelf Layout ........................................................... 2-8

2.1.5

XDM-1000 Shelf Layout ......................................................... 2-9

2.1.6

XDM-2000 Shelf Layout ....................................................... 2-10

2.1.7

Rack Layouts and Expansion Shelves ................................. 2-11

XDM-100 Card and Module Layout ................................................... 2-19


2.2.1

Basic XDM-100 Shelf ........................................................... 2-19

2.2.2

Expanded XDM-100 Shelf with I/O Protection...................... 2-20

2.2.3

Nonredundant XDM-100 Shelf ............................................. 2-20

2.2.4

Hybrid XDM-100 Shelf Configuration (XDM-100H) .............. 2-20

2.3

XDM-200 Cards and Modules Layout ............................................... 2-22

2.4

MXC and ECU Cards ........................................................................ 2-24


2.4.1

MXC...................................................................................... 2-24

2.4.2

ECU ...................................................................................... 2-25

2.5

XDM-400 Card Layout....................................................................... 2-26

2.6

XDM-500 Card Layout....................................................................... 2-27

2.7

XDM-1000 Card Layout..................................................................... 2-28

2.8

XDM-2000 Card Layout..................................................................... 2-30

2.9

XDM Control, Matrix and I/O Cards................................................... 2-31


2.9.1

HLXC .................................................................................... 2-31

2.9.2

XIO ....................................................................................... 2-31

2.9.3

xMCP.................................................................................... 2-32

2.9.4

MECP ................................................................................... 2-32

2.9.5

ECB or xECB4...................................................................... 2-32

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XDM System Specifications

3. XDM-100 Specifications .................................................................................. 3-1


3.1

Cross-Connect Specifications ............................................................. 3-1


3.1.1

Cross-Connect Levels ............................................................ 3-1

3.1.2

Cross-Connect Capacity......................................................... 3-1

3.2

Traffic Protection ................................................................................. 3-1

3.3

Redundancy ........................................................................................ 3-1

3.4

Synchronization................................................................................... 3-2

3.5

Jitter and Wander ................................................................................ 3-2

3.6

I/O Interfaces....................................................................................... 3-2

3.7

3.8

3.9

3.6.1

2 Mbps (E1) ............................................................................ 3-2

3.6.2

34 Mbps (E3) .......................................................................... 3-2

3.6.3

45 Mbps (DS-3) ...................................................................... 3-2

3.6.4

52 Mbps (SONET/STS-1)....................................................... 3-3

3.6.5

STM-1 Electrical ..................................................................... 3-3

3.6.6

STM-1/OC-3 Optical ............................................................... 3-3

3.6.7

STM-4/OC-12 Optical ............................................................. 3-3

3.6.8

STM-16/OC-48 Optical ........................................................... 3-3

Management ....................................................................................... 3-4


3.7.1

Management and Alarm Interfaces ........................................ 3-4

3.7.2

Alarms and Performance........................................................ 3-4

SDH/SONET Interfaces....................................................................... 3-5


3.8.1

SDH/SONET STM-1/OC-3 I/O Module


(155.52 Mbps 4.6 ppm) ........................................................ 3-5

3.8.2

SDH/SONET STM-4/OC-12 I/O Module


(622 Mbps 4.6 ppm) ............................................................. 3-6

3.8.3

SDH/SONET STM-16/OC-48 I/O Module


(2488.32 Mbps 4.6 ppm) ...................................................... 3-7

3.8.4

2.5 Gbps Optical CWDM SFP Transceivers for


XDM-100H.............................................................................. 3-8

Data Interfaces .................................................................................... 3-9


3.9.1

Client Transceivers for EISM Cards ....................................... 3-9

3.10 EISM Specifications ............................................................................ 3-9


3.11 Physical Specifications...................................................................... 3-10
3.11.1 Dimensions (H x W x D) ....................................................... 3-10
3.11.2 Weight .................................................................................. 3-10
3.11.3 Power ................................................................................... 3-10
3.11.4 Environmental Conditions..................................................... 3-11

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3.11.5 EMC...................................................................................... 3-11


3.11.6 Safety ................................................................................... 3-11
3.11.7 Laser Safety ......................................................................... 3-11
3.11.8 NEBS Compliance................................................................ 3-12
3.11.9 Reliability .............................................................................. 3-12
4. XDM-200 Specifications .................................................................................. 4-1
4.1

Traffic Protection ................................................................................. 4-1

4.2

Redundancy ........................................................................................ 4-1

4.3

Jitter and Wander ................................................................................ 4-1

4.4

Management ....................................................................................... 4-1

4.5

4.6

4.4.1

Management and Alarm Interfaces ........................................ 4-2

4.4.2

Alarm and Performance.......................................................... 4-2

I/O Interfaces....................................................................................... 4-2


4.5.1

2.5 Gbps Optical SFP Transceivers for


Transponders/Combiners ....................................................... 4-2

4.5.2

GbE/FC/FICON Optical SFP Transceivers


forTransponders/Combiners................................................... 4-3

4.5.3

Mux/Demux Modules .............................................................. 4-3

4.5.4

OADM Modules ...................................................................... 4-3

4.5.5

Splitter/Coupler Modules ........................................................ 4-4

4.5.6

CWDM Frequencies and Wavelengths as per G.694.2.......... 4-4

Physical Specifications........................................................................ 4-4


4.6.1

Dimensions (H x W x D) ......................................................... 4-4

4.6.2

Weight .................................................................................... 4-5

4.6.3

Power ..................................................................................... 4-5

4.6.4

Environmental Conditions....................................................... 4-5

4.6.5

EMC........................................................................................ 4-5

4.6.6

Safety ..................................................................................... 4-6

4.6.7

Laser Safety ........................................................................... 4-6

4.6.8

NEBS Compliance.................................................................. 4-6

4.6.9

Reliability ................................................................................ 4-6

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XDM System Specifications

5. XDM-400, 500, 1000, and 2000 Specifications ............................................... 5-1


5.1

Electrical, Optical, and Mixed Basecard Data ..................................... 5-1


5.1.1

5.2

5.3

5.4

iv

Electrical Interface Connection Modules ................................ 5-2

SDH/SONET Interfaces....................................................................... 5-4


5.2.1

SDH/SONET STM-1/OC-3 (155.52 Mbps 4.6 ppm)


I/O Cards ................................................................................ 5-4

5.2.2

SDH/SONET STM-4/OC-12 (622 Mbps 4.6 ppm)


I/O Cards ................................................................................ 5-5

5.2.3

SDH/SONET STM-16/OC-48 (2488.32 Mbps 4.6 ppm)


I/O Cards ................................................................................ 5-6

5.2.4

SDH/SONET STM-64/OC-192 (9953.28 Mbps 4.6 ppm)


I/O Cards (7) ............................................................................ 5-7

5.2.5

PDH/Async and SDH/SONET Interface Specifications .......... 5-8

Data Cards ........................................................................................ 5-10


5.3.1

Client Transceivers for DIO and EIS Cards


(and for CMBR25/10 and TRP25_4 Cards).......................... 5-10

5.3.2

DIO Specifications ................................................................ 5-11

5.3.3

EIS Specifications................................................................. 5-11

5.3.4

ATS Specifications ............................................................... 5-11

Optical Components.......................................................................... 5-12


5.4.1

DWDM Mux/Demux Cards and Modules.............................. 5-12

5.4.2

OADM Cards and Modules................................................... 5-15

5.4.3

Transponders ....................................................................... 5-19

5.4.4

Optical Amplifiers.................................................................. 5-27

5.4.5

Optical Auxiliary Cards and Modules.................................... 5-29

5.4.6

DCF/DCM Units.................................................................... 5-30

5.4.7

Auxiliary Cards and Miscellaneous Accessory Modules ...... 5-30

5.4.8

Other Optical Cards.............................................................. 5-31

5.5

Frequencies and Wavelengths.......................................................... 5-32

5.6

Physical Specifications...................................................................... 5-33


5.6.1

Dimensions (H x W x D) ....................................................... 5-33

5.6.2

Weight .................................................................................. 5-33

5.6.3

Power ................................................................................... 5-34

5.6.4

Environmental Conditions..................................................... 5-34

5.6.5

EMC...................................................................................... 5-35

5.6.6

Safety ................................................................................... 5-35

5.6.7

Laser Safety ......................................................................... 5-35

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5.7

5.8

Contents

5.6.8

NEBS Compliance................................................................ 5-35

5.6.9

Reliability .............................................................................. 5-35

Management Specifications .............................................................. 5-36


5.7.1

Management and Alarm Interfaces ...................................... 5-36

5.7.2

Alarms and Performance...................................................... 5-36

Other Specifications .......................................................................... 5-36


5.8.1

Cross-Connect Levels .......................................................... 5-36

5.8.2

Cross-Connect Capacity....................................................... 5-36

5.8.3

Traffic Protection .................................................................. 5-37

5.8.4

Redundancy ......................................................................... 5-37

5.8.5

Synchronization .................................................................... 5-37

5.8.6

Jitter and Wander ................................................................. 5-37

A. Reference Documents ....................................................................................A-1


B. Glossary ...........................................................................................................B-2
Index....................................................................................................................... I-1

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Contents

List of Figures
Figure 1-1: Multiservice metropolitan optical network.................................. 1-4
Figure 1-2: XDM shelves ............................................................................. 1-6
Figure 2-1: Basic XDM-100 shelf................................................................. 2-2
Figure 2-2: XDM-100 with TPU (I/O protection)........................................... 2-3
Figure 2-3: XDM-100 nonredundant configuration ...................................... 2-4
Figure 2-4: XDM-100H with one TPU/OCU shelf ........................................ 2-5
Figure 2-5: XDM-200 shelf........................................................................... 2-6
Figure 2-6: XDM-400 shelf open view ......................................................... 2-7
Figure 2-7: XDM-500 shelf open view ......................................................... 2-8
Figure 2-8: XDM-1000 standard shelf open view ........................................ 2-9
Figure 2-9: XDM-2000 open view .............................................................. 2-10
Figure 2-10: Three XDM-100 or XDM-200 shelves in a
2600 mm ECI Telecoms recommended ETSI rack .......................... 2-12
Figure 2-11: Three XDM-400 shelves in a 2600 mm rack ......................... 2-13
Figure 2-12: XDM-1000 and XDM-500 shelves in a 2600 mm rack .......... 2-15
Figure 2-13: Two XDM-500 shelves installed in a 2200 mm rack ............. 2-16
Figure 2-14: Two XDM-2000 shelves installed in a 2200 mm rack ........... 2-17
Figure 2-15: Two XDM-1000 shelves installed in a 2600 mm rack ........... 2-18
Figure 2-16: XDM-100 slot allocation ........................................................ 2-19
Figure 2-17: XDM-200 system card and module layout ............................ 2-22
Figure 2-18: XDM-400 typical card layout ................................................. 2-26
Figure 2-19: XDM-500 standard card layout.............................................. 2-27
Figure 2-20: XDM-1000 standard card layout............................................ 2-29
Figure 2-21: XDM-2000 standard card layout............................................ 2-30

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XDM System Specifications

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1
Overview
1.1 XDM Intelligent, Scalable, Optical
Networking Platforms
The telecommunications landscape is becoming more and more competitive.
Carriers and operators are demanding networking equipment that can do more for
less money. Today's networking equipment must be flexible, upgradeable, and
highly intelligent. It must be able to successfully integrate with equipment produced
by other manufacturers according to accepted industry standards. Above all, today's
networking equipment must be scalable, easy to operate and maintain, and cost
effective.
At ECI Telecom's Optical Networks Division, we specifically addressed these issues
when we designed the XDM platforms. The XDM offers carriers unprecedented
capacity, cost-savings and ease of integration, placing it at the forefront of the
optical networking revolution.
The XDM offers a series of outstanding advantages, including:
Data-awareness the XDM facilitates migration from voice-oriented to

data-oriented networks, combining the cost-effectiveness and universality of


Ethernet with the Quality of Service (QoS), scalability, and resilience of
SDH/SONET.
Optical DWDM capabilities the XDM implements low-cost all-optical

networks by offering sublambda grooming of multiple low-rate services


(including SDH/SONET, IP, ATM, and GbE) onto a single wavelength.
Versatility and interoperability the XDM coexists in perfect harmony with

equipment from other vendors by enabling the free flow of management


information between network elements. Its management software facilitates
smooth integration with other high-level management systems.

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1-1

Overview

XDM System Specifications

Readiness for future architectures thanks to its inherently modular,

"build-as-you-grow" architecture, the XDM gives carriers the ability to


meet all of tomorrow's networking environments, be they ring, star, or mesh.
The innovative design of the XDM meets all the requirements of modern
transmission networks in a single shelf, consolidating key networking technologies
in a modular infrastructure to create the world's most accommodating and scalable
single-shelf platform. XDM operators can choose to use only the features required
based on current demands, and add functions and services as requirements grow.
This results in flexible and scalable platforms that provide dynamic multiservice
provisioning while reducing both capital expenditures (CAPEX) and operating
expenses (OPEX).

1.2 Unparalleled Capabilities


Typical metro networks span distances anywhere from 10 km to 300 km, serving
large bandwidth-hungry areas. Equipment serving these networks must therefore be
able to interconnect a wide range of protocols, from business customers in the access
layer to service providers in the backbone.
As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly
integrates multiple network types, traffic types and technologies, including:
SDH/SONET

Bitrates ranging from E1/T1 all the way up to STM-64/OC-192

Large, nonblocking matrix for full connectivity

Variety of port densities that can fit into any network layer from the
network termination unit all the way up to the central office

Optical

1-2

High density of lambdas (40 to 80) in the C band

Ability to add/drop any lambda at any site

Ability to provide metro solutions without amplification

Long-haul solutions up to 1500 km

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XDM System Specifications

Overview

Data

Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet


services, from 10BaseT all the way up to GbE

Ability to route data over SDH/SONET or DWDM

Additional cards can be added as needed, to reduce cost and protect


against over-expansion

Cellular

Aggregates ATM traffic to make the most of existing bandwidth

Unifies 2G and 3G networks

As a digital cross-connect, the XDM offers VC-12 granularity (STS-1 for SONET)
within a 60 Gbps fabric. Several cross-connect types are available, including
broadband, wideband and integrated broadband/wideband, all of which comply with
applicable standards.
The XDM does all of this while maintaining high levels of performance and
reliability. Moreover, the inherent DWDM capabilities of the XDM provide
operators with an intelligent infrastructure offering virtually unlimited expansion
paths.
The multilayer, multiservice functionality of the XDM enables you to:
Migrate from today's ring topologies to mesh architectures, segment by

segment
Add and activate bandwidth as requirements change
Provide on-demand services across multiple network layers

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1-3

Overview

XDM System Specifications

Up to 80-channel (STM-64/OC-192)
regional optical backbone

OADM
Ethernet

STM-16/64, OC-48/192

DWDM
10 Gbps
ADM

ATM

A
D
M

A
D
M
DXC 4/4/3/1
DCS 3/3

STM-1/4, OC-3/12

N x STM-16/64, OC-48/192
Optical metropolitan ring/mesh

A
D
M

A
D
M

D
W
D
M

D
W
D
M

SDH/SONET ADM
DWDM OADM

PDH

ATM

Ethernet

SDH/
SONET

E1, E3/DS3, STS-1, Ethernet, ATM


STM-1/OC-3(c); STM-4(c)/OC-12(c)
STM-16(c)/OC-48(c);STM-64(c)/OC-192(c)

Figure 1-1: Multiservice metropolitan optical network

1.3 XDM Platforms


The XDM family of integrated optical platforms consolidates key networking
technologies in a modular infrastructure that integrates all the transport functions of
a complete Point of Presence (POP) in a single-shelf-sized element. Cards can be
interchanged between the various platforms, ensuring a flexible, build-as-you-grow
architecture for transporting all types of traffic, including voice, ATM, IP and data.
These technical specifications address the following XDM shelf configurations:

XDM -100 Miniature MSPP for Metro-access and Cellular Networks

an intelligent, integrated system that offers operators a cost-effective, flexible


approach to maximizing bandwidth utilization while delivering both enhanced
data services and traditional voice services.

1-4

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Overview

XDM -200 Compact CWDM Platform for Metro-access Networks a

cost-effective, standalone, carrier-class CWDM solution for metro-access and


campus networks.

XDM -400 Compact MSPP for Metro-Edge or Long-Haul

Applications an innovative product optimized for optical metro-access and


cellular applications. When equipped with high-power, long-haul optical
devices, it provides an excellent solution for regional applications spanning
distances of up to 1500 km.

XDM -500 Data-Aware Access Gateway designed for medium interface

capacities and street-cabinet installations, the XDM-500 is a compact optical


platform optimized for the metro edge. It provides traditional broadband
services and highly advanced data services like adaptive-rate Gigabit
Ethernet, sophisticated Layer 2 Ethernet, POS, and lambda. It can be used
either as a simple ADM, or as an edge multi-ADM/TM shared between
several rings, providing distributed cross-connectivity and concentration of
low-rate services.

XDM -1000 Multiservice Metro Optical Platform designed for

high-capacity central exchange applications, the XDM-1000 is optimized for


the metro core and features unprecedented port densities.
As a digital cross-connect, the XDM-1000 forms a fully protected mesh core.
As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-1000 provides connectivity between central office legacy switches
over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native
Fast Ethernet, Gigabit Ethernet or POS, while efficiently grooming traffic
from edge rings.

XDM -2000 Multifunctional Intelligent Optical Switch designed for the


metro and metro-regional core, the XDM-2000 is optimized for pure DWDM
and hybrid optical applications. This is a highly dense DWDM platform that
provides intelligent sublambda grooming and optimum wavelength
utilization.
As the most flexible optical switch on the market today, the XDM-2000
transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and
integrates the most advanced optical units with a variety of interfaces and a
sophisticated, high-capacity matrix in one small, low-cost package.
For additional information about the XDM-100, XDM-200, and XDM-400 shelves,
please refer to their respective general descriptions.

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1-5

Overview

XDM System Specifications

Figure 1-2: XDM shelves

1-6

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2
Physical Description
2.1 XDM Shelf Configurations
The XDM platforms detailed in this document are provided in the following shelf
configurations:
XDM-100 Miniature MSPP (Multi Service Provisioning Platform)
optimized for metro-access and cellular networks
XDM-200 Miniature CWDM Platform designed for metro-access
networks
XDM-400 Compact MSPP optimized for optical metro-access and
cellular applications
XDM-500 Data-Aware Access Gateway a compact shelf designed for
medium interface capacities and outdoor installations
XDM-1000 Multiservice Metro Optical Switch a standard shelf
designed for high-capacity central exchange applications
XDM-2000 Multifunctional Intelligent Optical Switch designed for
pure DWDM applications
The basic cards of the XDM-100 are also used in the XDM-200. In addition, optical
modules of the XDM-200 are also used with the hybrid configuration of the
XDM-100 (XDM-100H).
To facilitate operation and maintenance, the XDM-500 and XDM-1000 shelves
support exactly the same card types and modules. The shelves differ only in physical
size and in the number of I/O slots supported 12 for the XDM-1000 and
XDM-2000 shelves, six for the XDM-500 shelf, and five for the XDM-400 shelf.

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2-1

Physical Description

XDM System Specifications

2.1.1 XDM-100 Shelf Layout


The XDM-100 is available in four configurations:
Basic XDM-100 shelf
XDM-100 with I/O protection
Nonredundant XDM-100
Hybrid XDM-100H
Basic XDM-100 shelf
The basic XDM-100 shelf is housed in a 231 mm deep, 443 mm wide, and 200 mm
high equipment cage. The lower part of the shelf consists of the card cage and
accommodates the MXC (Main Cross-connect and Control) cards (main and
protection) and the ECU (External Connection Unit). The upper part of the shelf
consists of the module cage and houses up to eight I/O modules. Various types of
interface modules supporting PDH, SDH, and data services are available. The FCU
fan control unit at the right side of the shelf provides cooling air to the system.
All electrical connections are located directly in the tributary modules; therefore, the
XDM-100 does not need additional electrical interface connections.
To support system redundancy, each MXC card contains an integrated xINF (XDM
Input Filter) unit with connectors for two input power sources.
PIM345_3

AC

AC
FL

IN 1-21

FL

MON

MON

IN 1-21

TR

FL

MON

TR

OUT 1-21

PIM2_21

OUT 1-21

PIM2_21

PIM345_3

AC

TR
MON

AC
FL
OUT1
MON

IN1

MON

OUT2

IN2

MON

OUT3

TR

IN3

MON

OUT1
MON

IN1

OUT2

MON

IN2

OUT3

MON

IN3

MON

XDM -100
R

PIM345_3

AC
MON

MON
OUT 1-21

MXC-100

FL

TR
OUT 1-21

PIM2_21

-+

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

POWER IN B

OUT1
MON

WARNING !!!
POWER IN A

-+

AC

FL
OUT2
MON

IN2

OUT3

TR

IN3

MON

OUT1

AC

FL
CLK
ON

IN1 OUT2

-+

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

POWER IN A

-+

FAIL

TMU

IN2

OUT3

MON

ON

MON

IN

OUT

ON

MON

IN3 OUT4

ON

FL

IN1 OUT2

F-CHANNEL

T3_1/T4_1

CLASS 1 LASER PRODUCT


HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM

IN2

OUT3

IN3 OUT4

FCU

IN4

FL

TR

CLK
ON

TR

MON

MON

ON

SAM15_1

MON

ON

MON

ON

MON

ON

ACTIVE

MON

FAIL

SAM1_4/0

MAIN

FAIL

TMU

ADB

NVM

NVM

ECU
DEBUG

IN4

MON

NVM

OUT1

AC

RESET

ALARMS

IN3

MON

ADB

NVM

POWER IN B

USB

OUT3

SAM1_4/0

MAIN

AC

ACT

IN2

MON

LASER KLASSE 1

ON

RESET

MXC-100

OUT2

TR

MON

MON

SAM15_1

WARNING !!!

IN1

MON

FL

TR

ACT

OUT1
MON

IN

OUT

AC

IN1

MON

T3_2/T4_2

MNG

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1
LASER LED ACO
MON
ACTIVE TEST

WAR

MON

PIM2_21

AC

MIN

IN 1-21

TR

MAJ

FL

CRT

MON

FAIL

IN 1-21

TR

ACT

FL

PIM345_3

MON

AC

Figure 2-1: Basic XDM-100 shelf

2-2

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Physical Description

XDM-100 with I/O protection


A Tributary Protection Unit (TPU) is mounted on top of the XDM-100 basic shelf to
provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic
shelf height, allowing the XDM-100 to remain compact in size. It has five slots, four
allocated for Tributary Protection Modules (TPMs) and one for a Tributary Control
(TC) module.
Each TPM is connected to both operating and protection I/O modules in the shelf, in
a 1:1 or 1:3 configuration. If a failure is detected in one of the operating I/O
modules, the TC switches the traffic from the active to the protection I/O module.
OUT1
DDF #1

DDF #2

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

OUT1

IN1

OUT2

IN2

FL

AC

PIM2_21 #1

AC

FL

IN 1-21

MON

IN 1-21

TR

FL

MON

TR

OUT 1-21

OUT 1-21

PIM2_21

PIM345_3

AC

TR
MON

PIM2_21

TPMH_1

PIM345_3

FL

MON

ACTIVE

TC

PROT

TPMH_1

AC

AC

IN4

MAIN

FL

PROT
PIM2_21 #3

TPM2_3

OUT4

PROTECT

MAIN

FL

PIM2_21 #2

IN3

FAIL

PROTECT

PIM2_21 PROTECT

OUT3

DDF #3

AC

AC
FL
OUT1
MON

IN1

MON

OUT2

IN2

MON

OUT3

TR

IN3

MON

OUT1
MON

IN1

OUT2

MON

IN2

OUT3

MON

IN3

MON

XDM -100
R

PIM345_3

AC
MON

MON
OUT 1-21

MXC-100

FL

TR
OUT 1-21

PIM2_21

-+

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

POWER IN B

OUT1
MON

WARNING !!!
POWER IN A

-+

AC

FL
OUT2
MON

IN2

OUT3

TR

IN3

MON

OUT1

AC

FL
CLK
ON

-+

IN1 OUT2

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

POWER IN A

-+

IN2

OUT3

MON

FAIL

OUT

TMU

NVM

IN

ON

MON

ON

MON

IN3 OUT4

ON

F-CHANNEL

T3_1/T4_1

CLASS 1 LASER PRODUCT


HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM

IN1 OUT2

IN2

OUT3

IN3 OUT4

FCU

IN4

FL

TR

CLK
ON

TR

MON

MON

ON

SAM15_1

MON

ON

MON

ON

MON

ON

ACTIVE

MON

FAIL

SAM1_4/0

MAIN

FAIL

TMU

ADB

NVM

NVM

ECU
DEBUG

IN4

MON

NVM

OUT1

AC

FL

RESET

ALARMS

IN3

MON

ADB

POWER IN B

USB

OUT3

SAM1_4/0

MAIN

AC

ACT

IN2

MON

LASER KLASSE 1

ON

SAM15_1

WARNING !!!

OUT2

TR

MON

MON

RESET

MXC-100

IN1

MON

FL

TR

ACT

OUT1
MON

IN

OUT

AC

IN1

MON

T3_2/T4_2

MNG

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1
LASER LED ACO
MON
ACTIVE TEST

WAR

MON

PIM2_21

AC

MIN

IN 1-21

TR

MAJ

FL

CRT

MON

FAIL

IN 1-21

TR

ACT

FL

PIM345_3

MON

AC

Figure 2-2: XDM-100 with TPU (I/O protection)

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

2-3

Physical Description

XDM System Specifications

Nonredundant XDM-100
The XDM-100 nonredundant configuration has the same physical dimensions as the
basic shelf. It differs only by the single MXC-100 card that it has in slot MXC A,
compared with a couple of cards in the basic shelf. Slot MXC B of the nonredundant
configuration accommodates a bridging unit, MXC-BR. No redundancy is provided
for the MXC-100 functions in this configuration.
AC

AC

FL

MON

IN 1-21

FL

TR

MON

OUT 1-21

TR

MON

MON
OUT 1-21

PIM2_21

IN 1-21

PIM2_21

XDM -100
R

PIM345_3

AC
FL

MON

IN 1-21

AC

TR

FL

MON

TR

OUT 1-21

PIM2_21

MON

IN1

OUT1
MON

-+

MXC-100

POWER IN A

-+
POWER IN B

OUT2
MON

IN2

OUT3
MON

IN3

OUT1

AC

WARNING !!!
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

IN1 OUT2

IN2

IN3 OUT4

OUT3

IN4

AC

OUT1

IN1 OUT2

IN2

FL

FL

LASER KLASSE 1

TR

TR

ON

MON

ON

MON

ON

MON

ON

MON

SAM4_2

MON

ON

MON

ON

CLASS 1 LASER PRODUCT


HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM

MON

SAM1_4/0
ACT

MAIN

FAIL

TMU

ADB

NVM

RESET

NVM

FCU

MXC-BRIDGE
ACTIVE

FAIL

T3_1/T4_1

T3_2/T4_2

MNG

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1
LASER LED ACO
MON
ACTIVE TEST

CRT

MAJ

WAR

F-CHANNEL

MIN

DEBUG

FAIL

ALARMS

MON

ECU
USB

ACT

CONNECTED

Figure 2-3: XDM-100 nonredundant configuration

2-4

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Physical Description

Hybrid XDM-100H
The XDM-100H combines the SDH/SONET and data capabilities of the XDM-100
with the optical CWDM capabilities of the XDM-200. This is provided by the
software cost option incorporated within the NVM card in each of the MXC-100
cards.
The XDM-100H consists of the XDM-100 basic shelf, and if required, one or two
TPU/OCU shelves. The I/O module cage can accept any mix of the XDM-100 I/O
modules and XDM-200 CWDM I/O modules.
The TPU/OCU shelf is identical in its physical dimensions and number of slots
(five) to the TPU shelf. Four of the slots can house any mix of TPMs and CWDM
optical networking modules (mux/demux, OADM, and splitter/coupler); the fifth
slot always accommodates a TC module.
1511 1531

MUX
LINE OSC
IN OUT DROP1 DROP2

ADD1 ADD2

1511 1531

DEMUX

AC

1571

OSC LINE
IN OUT

1571

OSC LINE
OUT IN

DDF #1

1551

DDF #2

ACTIVE

DDF #3

AC

FL

FAIL

TC

PIM2_21 PROTECT

AC

FL

PIM2_21 #1

FL

TR

TR

MO_COADM2AB

PIM2_21 #2

MO_CMD4C

SIM1_4E

CTRP25_2S
AC

1551

OSC LINE
IN OUT

CLIENT1/LINE1
LINE 1
OUT1
IN1 OUT2
IN2

AC

CLIENT2/LINE2
LINE 2
IN3 OUT4
OUT3
IN4

PIM2_21 #3

TPM2_3

AC
FL

AC

FL

TR

MON

IN 1-21

FL

TR

FL
OUT1

TR

IN1

OUT2

IN2

OUT3

IN3

OUT4

MON

IN 1-21

TR

MON

IN4

MON

OUT 1-21

PIM2_21

OUT 1-21

PIM2_21

XDM -100
R

SIM4_2

AC

-+

WARNING !!!
POWER IN A

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

-+
POWER IN B

MON
OUT 1-21

OUT1

AC

IN1 OUT2

IN2

AC
FL

LASER KLASSE 1

TR

TR
MON

ON

MON

ON

-+

MON

SAM16_1

SAM4_2

WARNING !!!
POWER IN A

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

-+
POWER IN B

MAIN

FAIL

TMU

ADB

NVM

OUT1

AC

IN1 OUT2

NVM

FCU

AC

IN2

FL

FL

TR

TR
MON

ON

MON

ON

MON
ON

MON

ACTIVE

MON

MAIN

FAIL

TMU

ADB

NVM

RESET

NVM

ECU

USB

ALARMS

DEBUG

F-CHANNEL

T3_1/T4_1

FAIL

SAM16_1

SAM4_2
ACT

CLASS 1 LASER PRODUCT


HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM

MON
ON

MON

RESET

MXC-100

OUT 1-21

PIM2_21

FL

ACT

MON

IN 1-21

TR

PIM2_21

MXC-100

FL

MON

TR

TR

MON

IN 1-21

TR

FL

FL

AC

FL

IN2

T3_2/T4_2

MNG

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1 LASER LED ACO


MON ACTIVE TEST

CRT

IN1 OUT2

MAJ

OUT1

WAR

AC

MIN

CLIENT2/LINE2
LINE 2
IN3 OUT4
IN4
OUT3

MON

CLIENT1/LINE1
LINE 1
IN1 OUT2
IN2
OUT1

FAIL

AC

ACT

CTRP25_2S

Figure 2-4: XDM-100H with one TPU/OCU shelf

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

2-5

Physical Description

XDM System Specifications

2.1.2 XDM-200 Shelf Layout


The compact XDM-200 is housed in a 300 mm deep, 450 mm wide, and 275 mm
high equipment cage. The lower part of the basic shelf accommodates the MXC card
and the ECU (External Connection Unit). To support system redundancy, the MXC
card contains an integrated xINF unit with connectors for two input power sources.
However, redundancy for communication and control and all other functions
provided by the MXC is not supported. The upper part of the shelf consists of the
module section, and houses up to eight I/O (transponder and combiner) modules.
The xFCU fan control unit at the right side of the shelf provides cooling air to the
system.
Various types of transponder modules with a variety of client data and SDH/SONET
interfaces are available for the module section. A combiner module supporting GbE,
FC, and FICON data services is also available.
The upper part of the XDM-200 consists of the OCU (Optical CWDM Unit), which
accommodates optical networking modules including mux/demux, OADM, and
splitter/coupler modules.
1511 1531 1551 1571

OSC LINE
IN OUT

MUX

1511 1531 1551 1571

OSC LINE
IN OUT

DEMUX 1511 1531 1551 1571

OSC LINE
OUT IN

DEMUX 1511 1531 1551 1571

OSC LINE
OUT IN

MUX

MUX

MUX
1511 1531 1551 1571

OSC LINE
IN OUT

DEMUX
1511 1531 1551 1571

OSC LINE
OUT IN

1511 1531 1551 1571

ACTIVE
FAIL
LINE OSC
IN OUT DROP1 DROP2

DEMUX
1511 1531 1551 1571

AC
FL

AC

AC

FL

FL

TR

TR

TR

MO_CMD4SL

MO_CMD4SL

CTRP25_2C

CLIENT1/LINE1
IN OUT
AC OUT

LINE1

IN

CLIENT2/LINE2
IN OUT
OUT

LINE2

CLIENT1/LINE1
IN OUT
AC OUT

LINE1

IN

CLIENT2/LINE2
IN OUT
OUT

LINE2

FL

TR

TR

ON

ON

LASER ON

FL
TR

CLIENT1
LINE1
IN OUT
IN
AC OUT

FL

TR
ON

TC

AC

CRPT25_2C
IN

FL

LASER ON

OSC LINE
IN OUT

MO_COADM2AB

CTRP25_2C
IN

ADD1 ADD2

ON

ON

ON

CRPT25_2C

CLIENT1
LINE1
IN OUT
IN
AC OUT

CLIENT2
LINE2
IN OUT
IN
OUT

CLIENT2
LINE2
IN OUT
IN
OUT

FL
TR

LASER ON

ON

ON

ON

LASER ON

ON

ON

ON

XDM -200
R

CRPT25_2C

LINE1
CLIENT1
IN OUT
IN
AC OUT

CRPT25_2C

LINE2
CLIENT2
OUT
IN OUT
IN

LINE1
CLIENT1
IN OUT
IN
AC OUT

CTRP25_2C

CRPT25_2C

LINE2
CLIENT2
OUT
IN OUT
IN

LINE1
CLIENT1
IN OUT
IN
AC OUT

LINE1
CLIENT1/LINE1
IN OUT
IN
AC OUT

LINE2
CLIENT2
OUT
IN OUT
IN

FL

FL

FL

FL

TR

TR

TR

TR

LASER ON

ON

ON

ON

LASER ON

ON

ON

-+

MXC

ON

LASER ON

AC

WARNING !!!

WEST

OUT

ON

ON

IN

OUT

EAST

LASER ON

ON

ON

LINE2
CLIENT2/LINE2
OUT
IN OUT
IN

ON

ON

IN

FL
TR

POWER IN A

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

-+
POWER IN B

LASER KLASSE 1

CLASS 1 LASER PRODUCT


HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM

ON

LASER ON

OSC1_2
MAIN

ACT

FAIL

TMU

ADB

NVM

RESET

FCU

F-CHANNEL

T3_1/T4_1

MAJ

CRT

WAR

MIN

DEBUG

FAIL

T3_2/T4_2

MNG

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1
LASER LED ACO
MON
ACTIVE TEST

MON

ALARMS

FAIL

ECU
5

USB

ACT

ACTIVE

Figure 2-5: XDM-200 shelf

2-6

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Physical Description

2.1.3 XDM-400 Shelf Layout

IN8
OUT8

OUT16
IN15

IN7
OUT7

OUT15
IN14

IN6
OUT6

OUT14
IN13

IN5
OUT5

OUT13

OUT4

IN12
OUT12

OUT3
IN2
OUT2
IN1
OUT1

IN3

OUT11
IN10
OUT10
IN9
OUT9

IN11

IN4

IN16

The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and 500
mm high equipment cage. It consists of a single-row cage housing I/O, matrix,
processor, and common cards in the middle and right side of the shelf. The electrical
interface connection modules are housed in two slots on the left side of the shelf.
The shelf also contains two xINF4 (XDM-400 Input Filter) units and an xFCU4
(XDM-400 Fan Control Unit) that consists of five separate fans to support system
redundancy.

Figure 2-6: XDM-400 shelf open view

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

2-7

Physical Description

XDM System Specifications

2.1.4 XDM-500 Shelf Layout


The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage, as illustrated in Figure 2-7. The shelf consists of a
single-row cage housing the I/O, matrix, processor, and common cards in two slot
areas on either side of the shelf. The electrical interface connection modules and
DWDM/OADM modules are housed in the central slot area. The shelf also includes
two xINF units and three xFCU units.

ACTIVE

FAIL

FAIL

ACTIVE

ACTIVE

ACTIVE

ACTIVE

FAIL

FAIL

FAIL

xFCU

xFCU

xFCU

Figure 2-7: XDM-500 shelf open view

2-8

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Physical Description

2.1.5 XDM-1000 Shelf Layout


The standard XDM-1000 is located in a 285 mm deep, 450 mm wide and 1100 mm
high shelf with a module cage and a card cage section, as illustrated in Figure 2-8.
The cards cage houses the I/O, matrix, processor, and common cards. The modules
cage houses the electrical interface connection modules and DWDM/OADM
modules. The shelf also includes two xINFs and three xFCU.

FAIL

ACTIVE

ICBL

XINF

PW1

FAIL

ACTIVE

ALARM

ICBR

XINF2

PW2

xRAP

REF-IN

REF-OUT

OW. NET SEL

Figure 2-8: XDM-1000 standard shelf open view

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

2-9

Physical Description

XDM System Specifications

2.1.6 XDM-2000 Shelf Layout


The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm high
equipment cage. The shelf consists of a single-row cage that houses optical cards
(transponders, mux/demux, optical amplifiers), and xMCP and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular
XDM-1000 shelf in the same rack.

OW. NET SEL

ACTIVE

ACTIVE

ACTIVE

FAIL

FAIL

FAIL

xFCU

xFCU

xFCU

Figure 2-9: XDM-2000 open view

2-10

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Physical Description

2.1.7 Rack Layouts and Expansion Shelves


The various XDM shelves can be installed both in standard or ECI-recommended
ETSI racks, and in 19 and 23 racks.
The ETSI rack offered by ECI Telecom is specially designed for installation of
telecommunication equipment and a large variety of equipment accessories. To
facilitate cable routing, the rack has removable rear and side panels, which enable
tidy leading and efficient maintenance of all rack cables. Two plastic conduits on the
racks front rails support routing of up to 200 optical fibers. It also has open top and
bottom frames to facilitate easy routing of cables from suspension floors and/or
ceiling ladders. The front door can be mounted for right or left opening.
The XDM-100 or XDM-200 can be installed in either 2200 mm or 2600 mm ETSI
racks, as well as in 19 and 23 racks. Figure 2-10 shows the layout of three shelves
in ECI Telecoms 2600 mm ETSI rack.

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

2-11

Physical Description

XDM System Specifications

POWER ON

CRITICAL

MAJOR

MINOR

WARNING

xRAP-100
xRAP-100

SOURCE A

SOURCE B

(FST)
Fiber Storage Tray

Fiber guide
Cable guide
OUT1
DDF #1

DDF #2

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

OUT1

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

ACTIVE

DDF #3

FAIL

AC

FL

PRO TECT

PIM2_21 PROTECT

AC

PIM2_21 #1

FL

IN 1-21

MON

IN 1-21

PIM345_3

AC

TR

AC

FL

MON
OUT 1-21

TPMH_1

PIM345_3

FL

MON

TR

PROT

TPMH_1

PIM2_21 #3

TPM2_3

AC

FL

FL

TR

OUT 1-21

PIM2_21

MAIN

FL

PROT
PIM2_21 #2

AC

MON

PIM2_21

TC

P ROTECT

AC

MAIN

OUT1
MON

IN1

OUT2

MON

IN2

MON

OUT3

TR

IN3

OUT1

MON

MON

IN1

OUT2

IN1

OUT2

MON

IN2

OUT3

IN2

OUT3

MON

IN3

MON

XDM -100
R

PIM345_3

AC

TR

FL

MON
OUT 1-21

FL

TR

OUT 1-21

PIM2_21

-+

MXC-100

AC

POWER IN A

-+
POWER IN B

AC

OUT

IN1

OUT1

MON

WARNING !!!

OUT2

MON

IN2

MON

OUT3

TR

IN3

MON

CLK
ON

WARNING !!!
POWER IN A

-+

FAIL

TMU

MON

ON

MON

ON

MON

ON

NVM

AC

IN2

IN1 OUT2

OUT1

IN3 OUT4

OUT3

CLK
ON

FCU

TR

MON

MON

ON

MON

ON

MON

ON

MON

ON

T3_1/T4_1

ACTIVE

MON

FAIL

SAM1_4/0

MAIN

FAIL

TMU

T3_2/T4_2

MNG

XDM-100 with TPU

ADB

NVM

NVM

MAIN

MNG

PROT

MODULE

C RT

ECU
F-CHANNEL

IN4

FL

TR

RESET

DEBUG

CLASS 1 LASER PRODUCT


HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
EXPOSURE TO THE BEAM

MON

ADB

NVM

IN

OUT

FL

SAM15_1
ACT

ALARMS

IN4

LASER KL AS SE 1
ON

POWER IN B

USB

IN3

MON

IN3 OUT4

SAM1_4/0

MAIN

AC

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

OUT3

TR

MON

MON

RESET

-+

MXC-100

MON

IN2

FL

SAM15_1
ACT

MON

IN1 OUT2

OUT1

AC

TR

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

OUT1

MON

IN

FL

STM 1 LASER LED ACO


MON
ACTIVE TEST

CHANNEL

W AR

MON

PIM2_21

PIM345_3

AC

MIN

TR

MON

IN 1-21

MA J

FL

MON

FAIL

IN 1-21

ACT

FL

MON

AC

(FST)
Fiber Storage Tray

Fiber guide
Cable guide
OUT1
DDF #1

DDF #2

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

OUT1

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

ACTIVE

DDF #3

FAIL

AC

FL

PRO TECT

PIM2_21 PROTECT

AC

PIM2_21 #1

PIM2_21 #2

TPM2_3

FL

IN 1-21

MON

IN 1-21

PIM345_3

AC

TR

AC

FL

MON
OUT 1-21

TPMH_1

TPMH_1

PIM345_3

FL

MON

TR

PROT

PIM2_21 #3

AC

AC

MON

FL

TR

OUT1

OUT 1-21

PIM2_21

MAIN

FL

PROT

PIM2_21

TC

P ROTECT

AC

MAIN

FL

MON

IN1

OUT2

MON

IN2

MON

OUT3

TR

IN3

OUT1

MON

MON

IN1

OUT2

MON

IN2

OUT3

MON

IN3

MON

XDM -100
R

PIM345_3

AC
MON

PIM345_3

AC

AC

TR

FL

FL

TR

TR

OUT 1-21

POWER IN A

-+
POWER IN B

OUT1

MON

WARNING !!!

AC

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

TR

IN1

OUT2

MON

IN2

MON

OUT3

IN3

MON

AC

MON

ON

MON

ON

IN2

FAIL

OUT

TMU

IN2

IN1 OUT2

IN3 OUT4

OUT3

FCU

IN4

TR

MON

MON

ON

MON

ON

MON

ON

MON

ON

T3_1/T4_1

ACTIVE

MON

FAIL

SAM1_4/0
FAIL

TMU

T3_2/T4_2

MNG

XDM-100 with TPU

ADB

NVM

NVM

MAIN

MNG

PROT

MODULE

CR T

ECU

F-CHANNEL

CLASS 1 LASER PRODUCT


HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
EXPOSURE TO THE BEAM

NVM

OUT1

AC

CLK
ON

MAIN

RESET

DEBUG

IN4

MON

FL

TR

ACT

ALARMS

IN3

MON

ON

ADB

NVM

IN

FL

SAM15_1

POWER IN B

USB

OUT3

IN3 OUT4

MON

SAM1_4/0

MAIN

AC

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

OUT3

LASER KL AS SE 1
ON

SAM15_1

WARNING !!!
POWER IN A

-+

OUT2

MON

IN2

TR

MON

MON

RESET

-+

MXC-100

IN1

MON

IN1 OUT2

OUT1

FL
CLK
ON

ACT

OUT1

MON

IN

OUT

FL

STM 1
LASER LED ACO
MON
ACTIVE TEST

CHANNEL

W AR

PIM2_21

-+

MXC-100

MIN

OUT 1-21

PIM2_21

IN 1-21

MA J

FL

MON

IN 1-21

AC T

MON

TR

FA IL

FL

MON

AC

MON

(FST)
Fiber Storage Tray

Fiber guide
Cable guide
OUT1
DDF #1

DDF #2

IN1

OUT2

IN2

OUT3

IN3

OUT4

IN4

OUT1

IN1

OUT2

IN2

FL

PIM2_21 PROTECT

AC

PIM2_21 #1

IN 1-21

MON

IN 1-21

TPMH_1

PIM345_3

AC

TR

AC

FL

MON
OUT 1-21

FL

TR

OUT 1-21

PIM2_21

ACTIVE

TC

PROT

TPMH_1

PIM345_3

FL

MON

TR

IN4

MAIN

FL

PROT
PIM2_21 #3

TPM2_3

AC

FL

OUT4

P ROTECT

AC

MAIN

FL

PIM2_21 #2

AC

MON

IN3

FAIL

PRO TECT

PIM2_21

OUT3

DDF #3

AC

OUT1
MON

IN1

MON

OUT2

IN2

MON

OUT3

TR

IN3

MON

OUT1
MON

IN1

OUT2

IN1

OUT2

MON

IN2

OUT3

IN2

OUT3

MON

IN3

MON

XDM -100
R

PIM345_3

AC

FL

MON

FL

TR

OUT 1-21

PIM2_21

-+
POWER IN A

-+
POWER IN B

OUT1

MON

WARNING !!!
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

AC

OUT

IN1

MON

OUT2

MON

IN2

OUT3

TR

IN3

MON

OUT1

AC

MON

IN1 OUT2

TR

CLK
ON

-+

WARNING !!!
POWER IN A

-+

REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION

MON

ON

MON

MAIN

AC

ON

MON

ON

FAIL

OUT

TMU

DEBUG

F-CHANNEL

T3_1/T4_1

CLASS 1 LASER PRODUCT


HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
EXPOSURE TO THE BEAM

MON

ADB

NVM

IN

NVM

AC

FL

OUT1

IN1 OUT2

IN2

OUT3

IN3 OUT4

IN4

FCU

FL

TR

CLK
ON

TR

MON

MON

ON

SAM15_1

MON

ON

MON

ON

MON

ON

ACTIVE

MON

SAM1_4/0

MAIN

FAIL

TMU

T3_2/T4_2

MNG

FAIL

XDM-100 with TPU

ADB

NVM

NVM

ECU

ALARMS

IN4

LASER KL AS SE 1
ON

RESET

USB

IN3

MON

IN3 OUT4

SAM1_4/0

POWER IN B
ACT

OUT3

TR

MON

MON

RESET

MXC-100

MON

IN2

FL

SAM15_1
ACT

OUT1

MON

IN

FL

MAIN

MNG

PROT

MODULE

CHANNEL

STM 1
LASER LED ACO
MON
ACTIVE TEST

WA R

OUT 1-21

MXC-100

AC

MIN

IN 1-21

TR

MON

PIM2_21

PIM345_3

AC

CR T

TR

MON

MAJ

FL

A CT

IN 1-21

MON

FAIL

FL

MON

AC

Figure 2-10: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI Telecoms


recommended ETSI rack

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XDM System Specifications

Physical Description

The XDM-400 can be installed in either 2200 mm or 2600 mm ETSI racks, as well
as in 19 and 23 racks.

POWER ON CRITICAL

SHELF 1

SHELF 2

WARNING

IN8

IN16
OUT16

OUT8
IN7

IN15
OUT15

OUT7
IN6

IN14
OUT14

OUT6
IN5

IN13
OUT13

OUT5
IN4

IN12
OUT12

OUT4
IN3

IN11
OUT11

OUT3
IN2

IN10
OUT10

OUT2
IN1

IN9
OUT9

OUT1
IN8

IN16
OUT16

OUT8
IN7

IN15
OUT15

OUT7
IN6

IN14
OUT14

OUT6
IN5

IN13
OUT13

OUT5
IN4

IN12
OUT12

OUT4
IN3

IN11
OUT11

OUT3
IN2
OUT2
IN1
OUT1

IN10
OUT10
IN9
OUT9

IN8

IN16
OUT16

OUT8
IN7

IN15
OUT15

OUT7
IN6

IN14
OUT14

OUT6
IN5

IN13

Cable guide

OUT5

OUT13

SHELF 1

SOURCE B

IN4

IN12

SHELF 2

OUT4

OUT12
IN11
OUT11

OUT2
IN1
OUT1

IN10
OUT10
IN9
OUT9

XDM-400
shelf

MINOR

IN3

XDM-400
shelf

xRAP

SOURCE A

OUT3

XDM-400
shelf

MAJOR

IN2

xRAP

Figure 2-11: Three XDM-400 shelves in a 2600 mm rack

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Physical Description

XDM System Specifications

The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two
XDM-1000 shelves can be installed in a 2600 mm rack, whereas a 2200 mm rack
can accommodate only a single XDM-1000 shelf.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a
2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf can be
installed in a 2600 mm rack.
The installation of XDM-500, XDM-1000 and XDM-2000 in 19 or 23 racks is
supported as well.
In addition, a 600 mm deep rack can house XDM shelves in a back-to-back
configuration, thus doubling the capacity of the rack.
Several racks can be combined to expand the I/O interface capacity of a single XDM
shelf. In this configuration, the XDM shelf containing the matrix core is considered
the master shelf. The other units are used as expansion shelves, providing a capacity
of over 22,000 E1 or 1,152 DS-3 ports in a complete XDM 384 STM-1/OC-3
equivalent system.

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XDM System Specifications

Physical Description

Figure 2-12: XDM-1000 and XDM-500 shelves in a 2600 mm rack

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Physical Description

XDM System Specifications

Figure 2-13: Two XDM-500 shelves installed in a 2200 mm rack

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XDM System Specifications

Physical Description

Rear
extendable
installation
rail
Fiber spooler

POWER ON CRITICAL

xRAP

MAJOR

MINOR

WARNING

SHELF 1

SHELF 2

SHELF 2

xRAP

SOURCE A

SHELF 1

SOURCE B

XDM-2000
shelf
ACTIVE

ACTIVE

FAIL

ACTIVE

FAIL

xFCU

FAIL

xFCU

xFCU

Heat buffer

XDM-2000
shelf

ACTIVE

ACTIVE

FAIL

FAIL

xFCU

ACTIVE

FAIL

xFCU

xFCU

Figure 2-14: Two XDM-2000 shelves installed in a 2200 mm rack

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Physical Description

XDM System Specifications

Rear
extendable
installation
rail

Fiber spooler

xRAP

POWER ON CRITICAL

MAJOR

MINOR

WARNING

SHELF 1

SHELF 2

SOURCE A

xRAP

SHELF 2

SHELF 1

SOURCE B

xRAP holder

XDM-1000 shelf

Heat buffer

Cable guide

XDM-1000 shelf

Figure 2-15: Two XDM-1000 shelves installed in a 2600 mm rack

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XDM System Specifications

Physical Description

2.2 XDM-100 Card and Module Layout


2.2.1 Basic XDM-100 Shelf
The basic XDM-100 cage contains slots for I/O interface modules, and dedicated
slots for the MXC cards and the ECU. The cages design and mechanical practice
conform to international mechanical standards and specifications.
The modules and cards are distributed as follows:
Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules.
Two (2) slots, A and B respectively, allocated for the MXC cards (main and
protection). Each MXC card has two slots (A1 and A2 and B1 and B2) to
accommodate SDH aggregate modules.
One (1) slot allocated for the ECU card.
The ECU is located beneath the MXC cards. Its front panel features several interface
connectors for management, external timing, alarms, orderwire and overhead (future
release). It also includes alarm severity colored LED indicators and selectors plus a
display for selecting specific modules and ports for monitoring purposes.
I1

I2

I3

I4

I5

I6

I7

I8

MXC-A

MXC-B

A1

A2

B1

B2

FCU

ECU
Figure 2-16: XDM-100 slot allocation

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Physical Description

XDM System Specifications

2.2.2 Expanded XDM-100 Shelf with I/O Protection


A TPU (Tributary Protection Unit) shelf can be mounted on top of the XDM-100
basic shelf to add protection of electrical I/O modules.
The TPU is a single-shelf cage with slots for the TPMs (Tributary Protection
Modules) and TC (Tributary Control) or TCF (Tributary Control and Fan) modules.
The modules are distributed as follows:
Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules
are supported)
One (1) slot allocated for the TC or TCF module
Each TPM is connected to the operating and protection modules of the XDM-100
shelf respectively. If a failure is detected in one of the operating I/O modules, the
XDM-100 control system sends control signals to the appropriate TPM relays to
switch traffic from the operating I/O module to the protection module. Several types
of TPMs for 1:1 or 1:3 protection schemes are supported.
The TC or TCF is connected to the DC and control buses of the MXC cards via the
TPU backplane. It controls the switching of traffic from the main to protection I/O
module by relays in the corresponding TPM. In addition, the TCF has four fans that
provide cooling air to the modules installed in the TPU (optional).

2.2.3 Nonredundant XDM-100 Shelf


The XDM-100 is also available in a nonredundant configuration. This shelf is
equipped with only one MXC card. The second position of the MXC houses an
MXC-BG card that bridges the buses of the second slot to the I/O modules.
Redundancy for power supply, timing and synchronization, cross-connect, and all
other MXC functions is not supported in this configuration. However, since the
MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic protection
mechanisms are supported.

2.2.4 Hybrid XDM-100 Shelf Configuration


(XDM-100H)
The XDM-100H platform is based on the XDM-100 basic shelf, with a-software
cost option that supports installation of any mix of the XDM-100 I/O modules with
optical I/O modules in the module cage. In addition, one or two TPU/OCU shelves
can be mounted on top of the basic shelf to support any mix of TPM and CWDM
optical networking modules.

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XDM System Specifications

Physical Description

The XDM-100H consists of the following units:


Basic XDM-100 shelf that includes the ECU (External Connection Unit,
ECU or ECU-F), two MXC-100 cards, the I/O module cage with eight slots,
and the FCU (Fan Control Unit). Each MXC-100 card houses an NVM
module, which contains the licensed option software.
The eight slots of the I/O module cage support installation of XDM-100 I/O
modules, as well as CWDM I/O modules (transponders and combiners).
TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf,
contains five slots: four for supporting any mix of mux/demux, OADM,
splitter/coupler, and TPM modules and one for a Tributary Control (TC)
module. One or two TPU/OCUs can be mounted on the XDM-100 basic
shelf.

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Physical Description

XDM System Specifications

2.3 XDM-200 Cards and Modules Layout


The XDM-200 platform comprises the following units:
Basic XDM-200 shelf houses the common cards and I/O (transponder and
combiner) modules
OCU (Optical CWDM Unit) shelf located on top of the basic shelf,
accommodates passive optical networking (mux/demux, OADM, and
splitter/coupler) modules and a control module
The basic XDM-200 shelf consists slots for I/O (transponder and combiner)
modules and dedicated slots for the MXC and ECU cards. The XDM-200 design and
mechanical practice conform to international mechanical standards and
specifications. The slots for modules and cards are distributed as follows:
Eight (8) slots optimally allocated for I/O modules
One (1) slot allocated for the MXC card
One (1) slot allocated for the ECU card

OCU
cage

OCM1

OCM2

OCM3

OCM4

I1

I2

I3

I4

I5

I6

I7

I8

A1

MXC-A

TC

A2

FCU

ECU
Figure 2-17: XDM-200 system card and module layout

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XDM System Specifications

Physical Description

The OCU comprises a single section with slots for optical (mux/demux, OADM,
splitter/coupler) and control modules. The modules are distributed as follows:
Four (4) slots allocated for optical modules
One (1) slot allocated for the TC module
The OCU is mounted on the upper part of the XDM-200 shelf. The optical and TC
modules connect to the DC power and control buses via the OCU backplane. All
connectors on the optical networking modules are LC connectors.

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Physical Description

XDM System Specifications

2.4 MXC and ECU Cards


The XDM-100 MXC (Main Cross-Connect and Control) and ECU (External
Connection Unit) cards were designed to facilitate simple installation and
maintenance. They feature:
Electrical interface connectors that are integrated into the I/O modules,
saving the need for separate electrical interface modules
Easy routing of external management interfaces
A monitoring system for acceptance test purposes
Hot insertion of cards and modules to support quick maintenance and repair
activities, without affecting traffic

2.4.1 MXC
The basic and expanded versions of the XDM-100 shelf accommodate two identical
MXC cards. By default, the MXC-A is the main card and MXC-B is the protection
card. Both cards perform the following functions simultaneously in a 1+1 protection
configuration:
Communications and control
Alarm and maintenance
Cross-connect
Timing and synchronization
Distribution of power supply to all modules (xINF function)
Routing and handling of 32 DCC channels
In addition, the MXC accommodates the NVM compact flash memory card and
houses SDH aggregate modules (SAMs).
The additional MXC card provides 1+1 protection to the cross-connect matrix and
full 1:1 protection to all other functions, since the standby MXC has an identical
database to the active MXC.
In case of a hardware failure in the active MXC or its traffic interconnection, the I/O
interface modules switch to the protection MXC within 50 ms. Similarly, in case of
a hardware failure in the TiMing Unit (TMU) of the operational MXC card, the
backup TMU takes over the timing control with no disruption in traffic. The
operational MXC card is configured by eNM LightSoft, ECI Telecoms Optical
Network Divisions multidimensional network manager.

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XDM System Specifications

Physical Description

2.4.2 ECU
The ECU connects management, alarms, overhead access, and orderwire interfaces
to the active MXC card. This card also provides the physical connections for these
interfaces.
Two types of ECU cards are available for the XDM-100: ECU-F and ECU (reduced
cost).
The ECU-F supports the following management and alarm interfaces and functions:
Ethernet interface to eNM LightSoft and EMS-XDM (XDM Element
Management System)
Ethernet hub for multiple NE connections
Serial (RS-232) interface for craft terminal
USB interface (future option)
Synchronization inputs and outputs (T3/T4)
Alarm severity outputs (Critical, Major, Minor, Warning)
External alarm outputs and inputs
Alarm Cut Off (ACO)
Operation and alarm LEDs
Selection and display of traffic interfaces for monitoring purposes
Monitor interface for STM-1 ports
Laser activation during ALS, for maintenance purposes
Multiplexer reset
Holdup capacitors
Lamp test activation
The ECU (reduced cost) card supports all functions provided by the ECU-F except
for Ethernet expansion to hub, monitoring points, holdup capacitors, and alarms
in/out.

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Physical Description

XDM System Specifications

2.5 XDM-400 Card Layout


The XDM-400 shelf consists of a single cage containing slots for five I/O cards, and
dedicated slots for the XIO (matrix-I/O), processor and common cards in the middle
and right side of the shelf. The electrical interface connection modules are housed in
two slots on the left side of the shelf. The XDM-400s cage design and mechanical
practice conform to international mechanical standards and specifications. The cards
are distributed as follows:
Five (5) slots (IS1 to IS5) optimally allocated for I/O cards
Two (2) slots (MS1 and MS2) allocated for electrical interface connection
modules
Two (2) slots (X1 and X2) allocated for XIO-192 (matrix-I/O) cards
Two (2) slots (C1 and C2) allocated for xMCP cards
An external connection module, the MECP, is located above the xMCP cards. It
connects the management, overhead access (OHA), and orderwire (OW) interfaces
to the active xMCP.

ACTIVE FAIL
xFCU4

Figure 2-18: XDM-400 typical card layout

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XDM System Specifications

Physical Description

2.6 XDM-500 Card Layout


The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four
connection modules, and dedicated slots for the matrix, processor and common
cards. The XDM-500 cage design and mechanical practice conform to international
mechanical standards and specifications. The cards are distributed as follows:
Six (6) slots (IC1 to IC6) flexibly allocated to I/O cards and/or transponders
(depending on the configuration)
Four (4) slots (#2-#5) allocated to electric interface connection modules or
DWDM/OADM modules
Two (2) slots (X1 and X2) allocated to the HLXC or XIO matrix cards
Two (2) slots (C1 and C2) allocated to the xMCP cards
An external connection module, the MECP, is located above the xMCP cards for
connecting the management, overhead access (OHA), and orderwire (OW)
interfaces to the active xMCP card.

Figure 2-19: XDM-500 standard card layout

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Physical Description

XDM System Specifications

2.7 XDM-1000 Card Layout


The XDM-1000 standard shelf consists of a modules cage housing the connection
modules, a cards cage housing the I/O and common cards, input filters, and fan
control units. The XDM-1000 standard card layout is illustrated in Figure 2-20 and
is allocated as follows:
Modules cage
Eleven (11) slots (M-IO1 to M-IO11) allocated to electric interface
connection modules or DWDM/OADM, optical booster, optical preamp
modules
Two xINFs (Input Power Filters)
Cards cage
Twelve (12) slots (IO1 to IO12) flexibly allocated to I/O cards and/or
transponders (depending on the configuration)
Two (2) slots (X1 and X2) allocated to the HLXC matrix cards
Two (2) slots (C1 and C2) allocated to the xMCP cards
An external connection module, the MECP, is located in the cards cage of the
XDM-1000 shelf above the xMCP cards. It is used to connect the management,
overhead access (OHA), and orderwire (OW) interfaces to the active xMCP card.
The modules cage contains 11 double-slot connection modules. Electrical I/O cards
installed in the cards cage interface with the XDM-1000 shelf via interface
connection modules installed in the modules cage. The modules are extractable, thus
allowing a flexible assignment of physical I/O ports.
Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do
not require connection modules in the modules cage. The free modules cage slots in
optical systems can therefore be allocated to DWDM or OADM multiplexing and
amplification modules.

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XDM System Specifications

Physical Description

Figure 2-20: XDM-1000 standard card layout

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Physical Description

XDM System Specifications

2.8 XDM-2000 Card Layout


The XDM-2000 shelf consists of a single cage whose slots can be allocated as
follows:
Twelve (12) slots allocated to transponders and other optical modules
Two (2) slots allocated for mux/demux or matrix cards (depending on the
system configuration)
Two (2) slots allocated to the xMCP cards
The external connection module, the MECP, is located in the upper section of the
cage.
The cage design and mechanical practice of the XDM-2000 conform to international
mechanical standards and specifications.

Figure 2-21: XDM-2000 standard card layout

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XDM System Specifications

Physical Description

2.9 XDM Control, Matrix and I/O Cards


XDM shelves have been designed to facilitate simple installation and easy
maintenance. They incorporate the following layout features:
The connection modules in the modules cage (XDM-1000 shelf) are located
as close as possible to the I/O cards in the cards cage
The HLXC-L, HLXC-R, and XIO matrix cards are located near the sidewall
of the shelf to facilitate the routing of the traffic buses to the I/O cards
The xMCP control cards are located such that they simplify the identification
of any control problem issues
The MECP unit is located above the xMCP cards to facilitate the routing of
the external management interfaces

2.9.1 HLXC
The XDM platform (XDM-500, XDM-1000, and XDM-2000) contains two identical
Hi-Lo Cross-connect Matrix (HLXC) cards. Both cards perform the cross-connect
and node synchronization functions simultaneously in a 1+1 protection
configuration. In case of a hardware failure in the operational HLXC or its traffic
interconnections, the I/O interface cards switch to the backup HLXC within 50 ms.
Similarly, in case of a hardware failure in the TMU of the operational HLXC, the
backup TMU takes over the timing control with no traffic disruption. The
operational HLXC is determined by the eNM LightSoft network manager.

2.9.2 XIO
The XDM can optionally contain two identical Cross-Connect Input/Output (XIO)
cards (for the XDM-400 the XIO is the only dedicated matrix card). XIO cards
consist of a matrix unit and SDH/SONET interfaces on the same basecard. Like the
HLXC that it replaces, XIO cards perform the cross-connect and node
synchronization functions simultaneously in a 1+1 protection configuration. Upon
detection of a hardware failure in the XIO or its traffic interconnections, I/O
interface cards can switch to the backup XIO card within 50 ms. If required the
backup TMU can take over timing control from the operational XIO with no traffic
disruption. As an I/O card, the XIO supports 1 x STM-16/OC-48 interface,
4 x STM-1/OC-3 interfaces, or 1 x STM-4/OC-12 interface. The XIO card includes
several optical transceiver options to meet various optical performance
requirements.

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Physical Description

XDM System Specifications

2.9.3 xMCP
The Main Control Processor (xMCP) card performs the communications, control,
alarm, and maintenance functions for the XDM. An additional xMCP card may
optionally provide full capability 1:1 protection since the standby xMCP has an
identical database to the active xMCP. Upon a failure of the active xMCP, the
standby xMCP card becomes the active control unit.
The xMCP is also responsible for communicating with external network elements
and management stations. It communicates with other SDH/SONET NEs via the
DCC channel embedded in each SIO link. In addition, the xMCP provides multiple
access to all overhead bytes in all incoming SDH/SONET lines. It provides 64 Kbps
and N x 64 Kbps trail capability for transporting management data, external DCC
channels or for external DCN purposes.

2.9.4 MECP
The Main Equipment Control Panel (MECP) connects the management, overhead
access (OHA), and orderwire (OW) interfaces to the active xMCP card. The
physical management connections are provided by the External Connection Board
(ECB) located above the MECP.
The MECP supports standard OW as well as a special voice channel over the DCC
when using VoIP and a special router. This feature enables external calls from
outside the network to a particular site. In addition, the MECP generates system
alarms and activates indicators, for example, software downloads, restarts,
configurations, and so on.
In pure optical networks and inline amplifier sites, one of two special MECP
versions is supplied to support the optical supervisory channel operating at 1510 nm
or 1310 nm.

2.9.5 ECB or xECB4


The External Connection Board (ECB) provides the physical interface between the
XDM and external management and clock devices. This card is also available in a
special version, xECB4, for the XDM-400.

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XDM-100 Specifications
3.1 Cross-Connect Specifications
3.1.1 Cross-Connect Levels
Cross-connect levels........................................................ VC-4nc, VC-4, VC-3, VC-2, VC-12
SONET cross-connect levels............................................................................. STS-nc, STS-1

3.1.2 Cross-Connect Capacity


SDH switch core options..........192* x STM-1/OC-3 with cross-connect capability of 4/3/2/1
SONET switch core options.......................................................................... 192 x OC-3, 3/33
* 128 used for redundant XDM-100 configuration; additional 64 used for non-redundant XDM-100
configuration for SNCP purposes.

3.2 Traffic Protection


Applicable specifications ................ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP I/N LO, HO ............................................................................................... within 30 ms
UPSR.................................................................................................................... within 30 ms
MSP/APS 1+1 ...................................................................................................... within 50 ms
MS-SPRing/BLSR .............................................................................................. within 50 ms

3.3 Redundancy
Control and synchronization systems................................................................ 1+1 duplicated
Switching matrix, power system, internal buses, external buses ...................... 1+1 duplicated
I/O electrical modules protection ........................................................................... 1:1 and 1:3
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XDM System Specifications

3.4 Synchronization
There are four timing references available from SDH/SONET/PDH/Async multiple timing
sources:

From any 2 MHz/2 Mbps/SONET 1.5 Mbps PDH/Async tributary interface

From any SDH/SONET line

External 2 MHz/2 Mbps/SONET 1.5 Mbps timing outputs (2 per shelf)

G.813 internal clock

Synchronization Status Marker (SSM) support is provided as well.

3.5 Jitter and Wander


Applicable specifications ......................................................................... ITU-T G.823, G.825

3.6 I/O Interfaces


3.6.1 2 Mbps (E1)
Physical level ............................................................................................. G.703, Paragraph 6
Frame options............................................................................................................ Unframed
Line code.........................................................................................................................HDB3
Line impedance ....................................................................120 balanced/75 unbalanced

3.6.2 34 Mbps (E3)


Physical level ............................................................................................. G.703, Paragraph 8
Frame .............................................................................................................................. G.751
Line code.........................................................................................................................HDB3
Line impedance .............................................................................................. 75 unbalanced

3.6.3 45 Mbps (DS-3)


Physical level ............................................................................................. G.703, Paragraph 5
Frame ................................................................................................ Unframed, ANSI T1.107
Line code.......................................................................................................................... B3ZS
Line impedance .............................................................................................. 75 unbalanced

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XDM-100 Specifications

3.6.4 52 Mbps (SONET/STS-1)


Physical level ................................................................................................... GR-253-CORE
Frame .............................................................................................................................. G.253
Line code............................................................................................................................CMI
Line impedance .............................................................................................. 75 unbalanced

3.6.5 STM-1 Electrical


Physical level ........................................................................................... G.703, Paragraph 12
Bitrate.................................................................................................... 155.52 Mbps 20 ppm
Frame .............................................................................................................................. G.707
Line code............................................................................................................................CMI

3.6.6 STM-1/OC-3 Optical


Physical level .................................................................................................... G.957, Table 2
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate................................................................................................... 155.52 Mbps 4.6 ppm
Transmission range .............................................................................................I3, S3, L3, L5

3.6.7 STM-4/OC-12 Optical


Physical level .................................................................................................... G.957, Table 3
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate........................................................................................................ 622 Mbps 4.6 ppm
Transmission range .............................................................................................I3, S3, L3, L5

3.6.8 STM-16/OC-48 Optical


Physical level .................................................................................................... G.957, Table 4
Wavelength ................................................................................................ 1310 nm, 1550 nm
Bitrate................................................................................................. 2488.32 Mbps 4.6 ppm
Transmission range ............................................ I3, S3, L3, L5, CDWM (G.694.2 and G.695)

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XDM-100 Specifications

XDM System Specifications

3.7 Management
Applicable specifications ........................................................G.784, G.774, M.3010, M.3100
eNM LightSoft (ECI Telecom's Optical Networks Division's Network Manager) server and
client for managing all ECI Telecom equipment ................................ on SUN workstation(s)
EMS-XDM (XDM element manager) ....................................................on SUN workstation
eCraft local craft terminal ............................................................................................... on PC
EMS-XDM and eNM LightSoft can work on the same SUN workstation.

3.7.1 Management and Alarm Interfaces


CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to eNM LightSoft or
other TMN; RS-232 to eCraft; OverHead Access (OHA); Orderwire; Rack Alarm Panel.

3.7.2 Alarms and Performance


Performance concept............................................................................................G.821, G.826
Alarm concept ................................................................................................................. G.783
Alarm types ................... LED indicators, dry contacts, audible alarms (per subrack), external
..................................................................................................... alarm inputs and outputs
Alarm classes ........................................................................ Critical, Major, Minor, Warning

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XDM-100 Specifications

3.8 SDH/SONET Interfaces


3.8.1 SDH/SONET STM-1/OC-3 I/O Module
(155.52 Mbps 4.6 ppm)
SFP TRANSCEIVER NAME
APPLICATION CODE

(1)

Operating wavelength (nm)

OTR1_S3

OTR1_L3

OTR1_L5

S-1.1

L-1.1

L-1.2

1261-1360

1263-1360

1480-1580

OTR1_I3

1270-1380

TRANSMITTER

Source type

MLM

SLM

SLM

MLM

7.7

Min. side mode suppression ratio


(dB)

30

30

Min. mean launched power (dBm)

-15

-5

-5

-19

Max. mean launched power (dBm)

-8

-14

Min. extinction ratio (dB)

8.2

10

10

10

Min. sensitivity (BER of 1*10-12)


EOL (dBm)

-28

-34

-34

-30

Min. overload (dBm)

-8

-10

-10

Max. receiver reflectance (dB)

-25

96

Min. optical return loss of cable


(dB)

-20

Max. discrete reflectance (dB)

-25

Max. optical path penalty (dB)

Max. RMS width (nm)

RECEIVER

OPTICAL PATH BETWEEN S & R

Max. dispersion [ps/nm]

(1)

Application code is in reference to ITU-T Recommendation G.691.

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XDM-100 Specifications

XDM System Specifications

3.8.2 SDH/SONET STM-4/OC-12 I/O Module


(622 Mbps 4.6 ppm)
SFP TRANSCEIVER NAME

OTR4_S3

OTR4_L3

OTR4_L5

S-4.1

L-4.1

L-4.2

1293-1334/
1274-1356

1280-1335

1480-1580

1270-1380

Source type

MLM

SLM

SLM

MLM

Max. RMS width (nm)

4/2.5

Max. -20 dB width (nm)

<1

Min. side mode suppression ratio


(dB)

30

30

Min. mean launched power (dBm)

-15

-3

-3

-19

Max. mean launched power (dBm)

-8

+2

+2

-14

Min. extinction ratio (dB)

8.2

10

10

10

Min. sensitivity (BER of 1*10-12)


EOL (dBm)

-28

-28

-28

-31

Min. overload (dBm)

-8

-8

-8

Max. receiver reflectance (dB)

-14

-27

46/74

Min. optical return loss of cable


(dB)

20

24

Max. discrete reflectance (dB)

-25

-27

Max. optical path penalty (dB)

APPLICATION CODE

(1)

Operating wavelength (nm)

OTR4_I3

TRANSMITTER

RECEIVER

OPTICAL PATH BETWEEN S & R

Max. dispersion [ps/nm]

(1)

Application code is in reference to ITU-T Recommendation G.691.

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XDM-100 Specifications

3.8.3 SDH/SONET STM-16/OC-48 I/O Module


(2488.32 Mbps 4.6 ppm)
SFP TRANSCEIVER NAME

OTR16_S3

OTR16_L3

OTR16_L5

OTR16_I3

S-16.1

L-16.1

L-16.2

I-16

1260-1360

1280-1335

1500-1580

1260-1360

SLM

SLM

SLM

SLM

Max. -20 dB width (nm)

<1

Max. RMS width (nm)

Min. side mode suppression (dB)

30

30

30

Min. mean launched power (dBm)

-5

-2

-2

-10

Max. mean launched power (dBm)

+3

+3

-3

8.2

8.2

8.2

8.2

-18

-27

-28

-16

-9

-9

-27

-27

-27

-27

TBD

Min. optical return loss of cable


(dB)

-24

-24

-24

-24

Max. discrete reflectance (dB)

-27

-27

-27

-27

Max. optical path penalty (dB)

<1

APPLICATION CODE

(1)

Operating wavelength (nm)


TRANSMITTER

Source type

Min. extinction ratio (dB)


RECEIVER

Min. sensitivity (BER of 1*10-12)


EOL (dBm)
Min. overload (dBm)
Max. receiver reflectance (dB)
OPTICAL PATH BETWEEN S & R

Max. dispersion [ps/nm]

(1) Application code is in reference to ITU-T Recommendation G.691.

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XDM-100 Specifications

XDM System Specifications

3.8.4 2.5 Gbps Optical CWDM SFP Transceivers for


XDM-100H
OTC25_1PSxx(1)

OTC25_1Alxx(1)

SLM

SLM

1470-1610

1470-1610

Spacing (nm)

20

20

Minimum side mode suppression ratio (dB)

30

30

Mean launched power (min.) (dBm)

Mean launched power (max.) (dBm)

+5

+5

Min. extinction ratio (dB)

8.2

8.2

-21.5 (-23 GbE)

-28 (-32 GbE)

<3

<3

Source type
Operating output wavelength (nm)

Sensitivity (BER of 1*10-12) (dBm)


OCH switching time (msec)
(1)

xx designates the transceivers wavelength in nm.

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XDM-100 Specifications

3.9 Data Interfaces


3.9.1 Client Transceivers for EISM Cards
OMGE_1SX/
OTGBE-SX

OMGE_1LX/
OTGBE-LX

DOM16_I3/
OTR16-I3

GbE/FC/FICON
short-reach laser,
850 nm,
multimode

GbE/FC/FICON
long-reach laser,
1310 nm, single
mode

2.5 Gbps
long-reach laser,
1310 nm, single
mode

1250

1250

2544

Max.

-3

-3

-10

Min.

-9.5

-11

-3

8.2

8 B/10 B

8 B/10 B

--

Min.

-20

-22

-20

Typical

-21

-25.5

-23

Typical Rx LOS level (dBm)

-24

-29

-25

Connector

LC

LC

LC

550 m
(50/62.5 m
MMF)

10 km
(9 m SMF)

10 km
(9 m SMF)

Transmitter type

Data rate (nominal) (MBaud)


Average launch power
(dBm)

Min. transmitter extinction ratio


(dB)
Data format
Average receiver
sensitivity (dBm)

Fiber lengths

3.10 EISM Specifications


Interfaces ................... 10/100BaseT, 100BaseFX, 1000BaseSX, 1000BaseLX, 1000BaseZX
Switch capacity ...........................................................................................................6.4 Gbps
MAC address memory ..................................................................................................... 3,500
Protection ............................ IOP 1:1 for both Ethernet over SDH ports and optical user ports
Standards compliance....................... IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
.......................................................... IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
.....................................................................................................G.707, G.783, G.7041 (GFP)

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XDM-100 Specifications

XDM System Specifications

3.11 Physical Specifications


3.11.1 Dimensions (H x W x D)
SIM-1/4/16, PIM-2/345............................................35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
SAM-4/16.................................................................32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
TPM-xx_1/TPM-xx_3..............................................72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TCF ..........................................................................84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC.....................................................................52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
XDM-100 ...........................................................200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in)
TPU shelf .............................................................75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
xRAP rack alarm panel (optional)....................100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ..............133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
Racks...................................... 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
.................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

3.11.2 Weight
XDM-100 shelf ............................................................................................. 7.6 kg (16.76 lbs)
XDM-100 fully populated........................................................................... 20.2 kg (44.53 lbs)

3.11.3 Power
Applicable specifications ....................................................... ETSI 300 132-2; FTZ 19 PFL 1
Input voltage ........................................................................................... -40 V dc to -75 V dc
Nominal power source ......................................................................................-48 V or -60 V
Power Consumption ........................................................... Typical 350 W, maximum 550 W

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XDM-100 Specifications

3.11.4 Environmental Conditions


Operation
Applicable specification................................................................. ETS 300 019-1-3 Class 3.2
Temperature range ............................................................................................-5 oC to +55 oC
Relative humidity .................................................................................................... 5% to 90%
NOTE: Extended temperature range of -5 oC to +65 oC is
supported for specific outdoor configurations.

Storage (packed)
Applicable specification................................................................ ETS 300 019-1-1 Class 1.2
Temperature range ..........................................................................................-25 oC to +55 oC
Relative humidity ................................................................................................ 10% to 100%

Handling and Transportation


Applicable specification................................................................ ETS 300 019-1-2 Class 2.3
Temperature range ......................................................................................... -40 oC to +70 oC
Relative humidity ..................................................................................................... up to 95%

3.11.5 EMC
Applicable specifications ..............................................................................EN 300 386/2000
Applicable directive ...................................................................... EMC directive 89/336 EEC

3.11.6 Safety
Applicable specifications .................................................................................EN 60950/2000
Applicable CE directive .................................................................. LVD directive 73/23/EEC

3.11.7 Laser Safety


Applicable specification....................................................................................EN 60825-1&2

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XDM-100 Specifications

XDM System Specifications

3.11.8 NEBS Compliance


The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).

3.11.9 Reliability
Life
Expected lifetime of the XDM platforms.....................................................................15 years

Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network............................................................................... better than 99.999%

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XDM-200 Specifications
4.1 Traffic Protection
OCH 1+1 optical protection ................................................................................ within 50 ms

4.2 Redundancy
Control and synchronization systems............................................................... 1+1 duplicated
Power system, internal buses, external buses................................................... 1+1 duplicated

4.3 Jitter and Wander


Applicable specifications ........................................................................ITU-T G.823, G.825

4.4 Management
Applicable specifications ...................................................... G.784, G.774, M.3010, M.3100
eNM Lightsoft (ECI Telecoms network manager)
server + client for managing all ECI Telecom equipment .................on SUN workstation(s)
EMS-XDM (XDM element manager) .................................................... on SUN workstation
eCraft local craft terminal ..............................................................................................on PC
EMS-XDM and eNM Lightsoft can work on the same SUN workstation.

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XDM-200 Specifications

XDM System Specifications

4.4.1 Management and Alarm Interfaces


CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to TMN; RS-232 to
eCraft; OverHead Access (OHA); Orderwire; Rack Alarm Panel.

4.4.2 Alarm and Performance


Performance concept.............................................................................. G.821, G.826, G.828
Alarm concept .................................................................................................... G.783, G.798
Alarm types ............................... LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes ...................................................................... Critical, Major, Minor, Warning

4.5 I/O Interfaces


4.5.1 2.5 Gbps Optical SFP Transceivers for
Transponders/Combiners
OTC25_1PSxx(1)

OTC25_1Alxx(1)

OTR16_I3

OTR16_S3

SLM

SLM

SLM

SLM

1466-1615

1466-1615

1285-1330

1285-1330

Spacing (nm)

20

20

NA

NA

Minimum side
mode suppression
ratio (dB)

30

30

30

30

Mean launched
power (min.) (dBm)

-9.5

-5

Mean launched
power (max.)
(dBm)

+5

+5

-3

Min. extinction
ratio (dB)

8.2

8.2

8.2

8.2

-21.5

-28

-18

-18

(-23 GbE)

(-32 GbE)

(-22 GbE)

(-22 GbE)

<3

<3

<3

<3

Source type
Operating output
wavelength (nm)

Sensitivity (BER of
1*10-12) (dBm)
OCH switching
time (msec)
(1)

xx designates the transceivers wavelength in nm

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XDM System Specifications

XDM-200 Specifications

4.5.2 GbE/FC/FICON Optical SFP Transceivers


forTransponders/Combiners
OT_GbE_SX

OT_GbE_LX

GbE/FC/FICON short reach


laser, 850 nm, multimode

GbE/FC/FICON long reach


laser, 1310 nm, single mode

1250

1250

Max.

-3

-3

Min.

-9.5

-11

8 B/10 B

8 B/10 B

Min.

-20

-22

Typical

-21

-25.5

Typical Rx LOS level (dBm)

-24

-29

Connector

LC

LC

550 m (50/62.5 m MMF)

10 km (9 m SMF)

Transmitter type
Data rate (nominal) (Mbaud)
Mean launch power
(dB.m)

Min. transmitter extinction ratio


(dB)
Data format
Average receiver
sensitivity (dBm)

Fiber lengths

4.5.3 Mux/Demux Modules


MO-CMD4C

MO_CMD8

MO_CMD4C-E

MO_CMD4SL

Insertion loss Mux +


Demux(dB)(1)

< 4.2

< 5.5

< 4.9

< 7.3

Return loss (dB)

< 40

< 40

< 40

< 40

Directivity (dB)

< 45

< 45

< 45

< 45

(1)

Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2 dB.

4.5.4 OADM Modules


Insertion loss (1)
Module type

Through

Drop

Add

MO_COADM1AB_xx

(2)

< 3.9dB

< 2.6dB

< 2.2dB

MO_COADM2AB_xx

(3)

< 4.4dB

< 3.2dB

< 3.2dB

(1)

Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2 dB.
xx designates the channel dropped by the OADM.
(3)
xx designates the group of two channels dropped by the OADM.
(2)

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XDM-200 Specifications

XDM System Specifications

4.5.5 Splitter/Coupler Modules


Module type

Insertion loss

MO_4CP4SPMM50

4 dB

MO_4CP4SPMM62

4 dB

MO_4CP4SPSM

4 dB

4.5.6 CWDM Frequencies and Wavelengths as per


G.694.2
Nominal Central Wavelengths (nm)
for spacing of 20 nm

4-channel system

8-channel system

1471

1491

1511

1531

1551

1571

1591

1611

4.6 Physical Specifications


4.6.1 Dimensions (H x W x D)
Transponders and combiners.................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
OSC ....................................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
Mux/demux; OADM1/2; splitters/couplers ........... 72 x 97 x 213 mm (2.83 x 3.82 x 8.38 in)
TC control module ................................................. 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC................................................................... 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
XDM-200 (basic shelf and OCU shelf).......... 275 x 443 x 231 mm (10.82 x 17.44 x 9.09 in)
xRAP rack alarm panel (optional).................. 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ............ 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
Racks.....................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)

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XDM System Specifications

XDM-200 Specifications

4.6.2 Weight
XDM-200 (basic shelf and OCU shelf)......................................................12.1 kg (26.68 lbs)
XDM-200 fully populated..........................................................................24.3 kg (53.58 lbs)

4.6.3 Power
Applicable specifications ......................................................... ETSI 300 132-2; FTZ 19FS1
Input voltage ..........................................................................................-40 V dc to -75 V dc
Nominal power source ............................................................... -60 V or -48 V BTNR 2511
Power consumption ........................................................... Typical 350 W, maximum 550 W

4.6.4 Environmental Conditions


Operation
Applicable specification............................................................... ETS 300 019-1-3 Class 3.2
Temperature range .......................................................................................... -5 oC to +45 oC
Relative humidity ................................................................................................... 5% to 90%

Storage (packed)
Applicable specification.............................................................. ETS 300 019-1-1 Class 1.2
Temperature range ........................................................................................ -25 oC to +55 oC
Relative humidity .............................................................................................. 10% to 100%

Handling and transportation


Applicable specification.............................................................. ETS 300 019-1-2 Class 2.3
Temperature range ....................................................................................... -40 oC to +70 oC
Relative humidity ................................................................................................... up to 95%

4.6.5 EMC
Applicable specifications ............................................................................ EN 300 386/2000
Applicable directive .....................................................................EMC directive 89/336 EEC

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XDM-200 Specifications

XDM System Specifications

4.6.6 Safety
Applicable specifications ............................................................................... EN 60950/2000
Applicable CE directive ................................................................. LVD directive 73/23/EEC

4.6.7 Laser Safety


Applicable specification.................................................................................. EN 60825-1&2

4.6.8 NEBS Compliance


The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).

4.6.9 Reliability
Life
Expected lifetime of the XDM platforms................................................................... 15 years

Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network..............................................................................better than 99.999%

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5
XDM-400, 500, 1000, and 2000
Specifications
5.1 Electrical, Optical, and Mixed Basecard
Data
Card

Ports/Bitrate

Electrical

PIO2_84

84 x E1 (2 Mbps) PDH/Async basecard for balanced and


unbalanced interfaces

PIO2_21

21 x E1 (2 Mbps) PDH/Async basecard for balanced and


unbalanced interfaces

PIO345/PIO345M(1)

16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces

Optical

SIO16/SIO16M(1)
SIO64/SIO64M/MF

2 x STM-16/OC-48 (2.488 Gbps) interface


(1) (2)

XIO

1 x STM-64/OC-192 (10 Gbps) interface


1 x STM-16/OC-48 (2.488 Gbps) + 1 x STM-4/OC-12 or
4 x STM-1/OC-3 interfaces

Mixed

SIO1&4/SIO1&4M(1)

Supports various electrical (e) and/or optical (o) interfaces as


follows:

16 x STM-1o/OC-3/OC-3c

16 x STM-1e/STS-3e

4 x STM-4/OC-12

(1)

The suffix M denotes SONET support as well as SDH MS-SPRing support. The MF suffix denotes FEC 7%
support for SONET and MS-SPRing support for SDH.

(2)

SIO64 cards are not supported for XDM-400.

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ECI Telecom Ltd. Proprietary

5-1

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

NOTE: For full interface support per card and shelf, please
contact ECI Telecoms Optical Networks Divisions Product
Management or your local ECI Telecom representative.

5.1.1 Electrical Interface Connection Modules


Electrical I/O cards are assigned an interface connection module. This module
serves as the I/O card electrical line transceiver and is connected to the I/O cards via
the XDM backplane. For example, when eleven PIO2_84 I/O cards are installed in
the XDM-1000 cards cage, eleven M2_84xx connection modules should be installed
in the modules cage. In this case, if hardware protection is required, one PIO2_84
I/O card can be configured as the protection card, and the corresponding protection
connection module M2_84P I/O is installed in the appropriate slot of the XDM-1000
modules cage.
I/O slot 12 is always configured as a pure optical slot without a modules cage
module.
Connection Module Data for Electrical I/O Cards
I/O card

SIO1&4

Bitrate Mbps

155

I/O ports

16

Module

M1_16BT
M1_16DIN
M1_16P (2)

M1_8BT

16

M345_16BT
M345_16DI
M345_16P (2)

SDH/SONET
electrical
SDH/SONET
electrical
PDH/Async
PDH/Async
PDH/Async

M345_8BT
M345_8DI
M345_8BN
M2_84B

PDH/Async
PDH/Async
PDH/Async
PDH

M2_84U

PDH

M2_84P(1) (2)

PDH

M1_8DIN
PIO345

PIO2_84

5-2

34/45/52

2.048

Interface type

SDH/SONET
electrical
SDH/SONET
electrical
-

84

ECI Telecom Ltd. Proprietary

Function/Description

Connection module
Connection module
Connection module with
protection
Connection module
Connection module
Connection module
Connection module
Connection module with
protection
Connection module
Connection module
Connection module
Balanced (120 )
connection module
Unbalanced (75 )
connection module
Connection module with
protection

417006-2007-013-A01

XDM System Specifications

I/O card

PIO2_21

Bitrate Mbps

2.048

XDM-400, 500, 1000, and 2000 Specifications

I/O ports

21

Module

Interface type

Function/Description

M2_21B

PDH

Balanced (120 )
connection module

M2_21U

PDH

M2_84P(1) (2)

PDH

Unbalanced (75 )
connection module
Connection module with
protection

(1)

Protection module M2_84P can be used to protect PIO2_84 or PIO2_21 cards.

(2)

Protection modules are not supported for XDM-400

I/O Cards Optical Transceiver Modules


Optical I/O cards utilize a slide-in optical transceiver, which is directly plugged into
the I/O cards for signal interfacing.
I/O card

Optical
module

Connector
type

I/O ports per


optical module

Modules
per I/O card

SIO1&4

OM01_4

LC

16 x STM-1/OC-3

OM04_1

SC/LC

4 x STM-4/OC-12

SIO16

OM16_1

SC/LC

2 x STM-16/OC-48

XIO

OM01_4

LC

4 x STM-1/OC-3

OM04_1

SC/LC

1 x STM-4/OC-12

OM16_1

SC/LC

1 x STM-16/OC-48

OM64_1

LC

1 x STM-64/OC-192

SIO64

(1)

Ports per I/O card

(1)

SIO64 is not supported for XDM-400.

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ECI Telecom Ltd. Proprietary

5-3

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.2 SDH/SONET Interfaces


5.2.1 SDH/SONET STM-1/OC-3 (155.52 Mbps
4.6 ppm) I/O Cards
CARD NAME

SIO1_16PI3

(1)

SIO1_16AS3

SIO1_16AL3

SIO1_16AL5

MECP_OSC3

MECP_OSC5

S-1.1

L1.1

L-1.2

L-1.1

L-1.2

1270-1380

1261-1360

1263-1360

1480-1580

1263-1360

1480-1580

MLM

SLM

SLM

SLM

SLM

SLM

7.7

> 30

> 30

> 30

> 30

-19

-15

-5

-5

-5

-14

-8

+2

10

8.2

8.2

10

10

10

-30

-28

-34

-34

-34

-34

-8

-10

-10

-10

-10

-25

-25

96

-20

-20

-25

-25

APPLICATION
(2)
CODE

Operating
wavelength (nm)
TRANSMITTER

Source type
Max. RMS width
(nm)
Max. -20 dB width
(nm)
Min. side mode
suppression ratio
(dB)
Min. mean launched
power (dBm)
Max. mean launched
power (dBm)
Min. extinction ratio
(dB)
RECEIVER

Min. sensitivity
(BER of 1*10-12)
EOL (dBm)
Min. overload
(dBm)
Max. receiver
reflectance (dB)

OPTICAL PATH BETWEEN S AND R

Max. dispersion
(ps/nm)
Min. optical return
loss of cable (dB)
Max. discrete
reflectance (dB)
Max. optical path
penalty (dB)(3)
(1)

MLM transceiver for 2 km with multimode fibers.


Application code is in reference to ITU-T Recommendation G.691.
(3)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity
(EOL) minus max. optical path penalty (dB).
(2)

5-4

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.2.2 SDH/SONET STM-4/OC-12


(622 Mbps 4.6 ppm) I/O Cards
CARD NAME

SIO4_4AS3

SIO4_4AL3

SIO4_4AL5

S-4.1

L-4.1

L-4.2

1270-1380

1293-1334

1280-1335

1480-1580

MLM

SLM

SLM

SLM

Max. RMS width (nm)

Max. -20 dB width (nm)

Min. side mode suppression


ratio (dB)

> 30

> 30

Min. mean launched power


(dBm)

-19

-15

-3

-3

Max. mean launched power


(dBm)

-14

-8

+2

+2

Min. extinction ratio (dB)

10

8.2

10

10

-31

-28

-28

-28

Min. overload (dBm)

-8

-8

-8

Max. receiver reflectance (dB)

-14

-27

Max. dispersion (ps/nm)

Min. optical return loss of


cable (dB)

-20

-24

Max. discrete reflectance (dB)

-25

-27

Max. optical path penalty


(dB)(3)

APPLICATION CODE

SIO4_4PI31

(2)

Operating wavelength (nm)


TRANSMITTER

Source type

RECEIVER

Min. sensitivity (BER of


1*10-12) EOL (dBm)

OPTICAL PATH BETWEEN S AND R

(1)

MLM transceiver for 2 km with multimode fibers.


Application code is in reference to ITU-T Recommendation G.691.
(3)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx
sensitivity (EOL) minus max. optical path penalty (dB).
(2)

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ECI Telecom Ltd. Proprietary

5-5

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.2.3 SDH/SONET STM-16/OC-48


(2488.32 Mbps 4.6 ppm) I/O Cards
SIO16_
1AX5xx

SIO16_
1AV5xx

SIO16_
1AB5xx

SIO16_
(1)
1AX5

SIO16_
1AL5

SIO16_
1AL3

SIO16_
1PS3

X-16.2

V-16.2

U-16.2

X-16.2

15301560

15301565

15301565

15301560

L-16.2

L16.1

S-16.1

I-16

15301565

12601360

12601360

12601360

SLM

SLM

SLM

SLM

SLM

SLM

SLM

SLM

Max. -20 dB width (nm)

Max. RMS width (nm)

30

30

30

30

30

30

30

Min. mean launched


power (dBm)

+5.5

+1

+0

+5.5

+0

-1

-5

-10

Max. mean launched


power (dBm)

+7.5

+3

+2

+7.5

+3

+2.5

-3

Min. extinction ratio


(dB)

8.2

8.2

8.2

8.2

8.2

8.2

8.2

8.2

Photodiode type

APD

APD

APD

APD

APD

APD

PIN

PIN

Min. sensitivity
(BER of 1*10-12)
EOL (dBm)

-28

-28

-28

-28

-28

-28

-18

-16

Min. overload (dBm)

-7

-7

-7

-7

-7

-7

Max. receiver
reflectance (dB)

-27

-27

-27

-27

-27

-27

-27

-27

CARD NAME
APPLICATION CODE

(3)

Operating wavelength
(nm)

SIO16_
(2)
1PI3

TRANSMITTER

Source type

Min. side mode


suppression (dB)

RECEIVER

OPTICAL PATH BETWEEN S AND R

Max. dispersion (ps/nm)

1800

1800

3000 (4)

2160

1800

(5)

(5)

(5)

Min. optical return loss


of cable (dB)

-24

-24

-24

-24

-24

-24

-24

-24

Max. discrete
reflectance (dB)

-27

-27

-27

-27

-27

-27

-27

-27

<2

<2

<2

<3

<2

<2

<2

<1

Max. optical path


penalty (dB)(6)
(1)

Noncolored interface limited to 120 km with a path penalty is 3 dB.


Single-mode interface for 2 km intraoffice applications.
(3)
Application code is in reference to ITU-T Recommendation G.691.
(4)
To reach distances of 150 km, SIO16_1AB5 should be connected to a booster.
(5)
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.
(6)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity
(EOL) minus max. optical path penalty (dB).
(2)

5-6

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.2.4 SDH/SONET STM-64/OC-192


(9953.28 Mbps 4.6 ppm) I/O Cards (7)
SIO64_
1ALSxx

CARD NAME
APPLICATION CODE

(2)

Operating wavelength
(nm)

(3)

L-64.2a

SIO64_
1ASSxx
S-64.2a

(3)

SIO64_
1PSSxx
I-64.2

(3)

SIO64_
1PLSxx
L-64.2b

(3)

SIO64_
(1)
1PSS3
S-64.1

(3)

SIO64_
(1)
1PIS3
I-64.1

(3)

15301565

15301565

15301565

15301565

12851330

12851330

EML

EML

EML

EML

EML

EML

Min. mean launched


power (dBm)

-2

-2

-2

-2

-4

-6

Max. mean launched


power (dBm)

+3

+3

+3

+3

+1

-1

Min. extinction ratio


(dB)

9.0

8.2

8.2

10

Photodiode type

APD

APD

PIN

PIN

PIN

PIN

Min. sensitivity
(BER of 1*10-12) EOL
(dBm)

-19 (4)

-19 (4)

-14

-14

-15

-11

Min. overload (dBm)

-8

-8

-1

-1

-1

-1

Max. optical path


penalty (dB)

<2

<2

<2

<2

<1

<1

Max. receiver
reflectance (dB)

-27

-27

-27

-27

-27

-27

TRANSMITTER

Source type

RECEIVER

OPTICAL PATH BETWEEN S AND R

Max. attenuation range


(dB)

15

15

10

10

10

Min. attenuation range


(dB)

10

10

(6)

800

800

(6)

40

Max. chromatic
dispersion (ps/nm)(5)
(1)

SIO64_1PSS3 is limited to 20 km; SIO64_1PIS3 is limited to 2 km. Both transceivers are single mode.
Application code is in reference to ITU-T Recommendation G.691.
(3)
All SIO-64 optics are also available for DWDM applications as per the standard ITU-T G.692 grid (n = 1-40).
(4
) When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -21 dBm
instead of -19 dBm). For amplified networks, a FEC improvement of over 4 dB is typical.
(5)
Effective optical power budget calculation for a single channel with no amplification: Tx min. power minus
Rx sensitivity (EOL) minus max. optical path penalty (dB).
(6)
The limitation for the long-range STM-64 laser is 60 km. Contact Product Management for longer distances.
(7)
STM-64 I/O cards are not supported for XDM-400.
(2)

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-7

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.2.5 PDH/Async and SDH/SONET Interface


Specifications
2 Mbps
Physical level .............................................................................................. G.703, Paragraph 6
Frame options.......................................................................... Unframed, G.704, I.431 (ISDN)
Line code.......................................................................................................................... HDB3
Line impedance .....................................................................120 balanced/75 unbalanced

34 Mbps
Physical level .............................................................................................. G.703, Paragraph 8
Frame ............................................................................................................................... G.751
Line code.......................................................................................................................... HDB3
Line impedance ............................................................................................... 75 unbalanced

45 Mbps
Physical level .............................................................................................. G.703, Paragraph 5
Frame ............................................................................................................................... G.751
Line code........................................................................................................................... B3ZS
Line impedance ............................................................................................... 75 unbalanced

52 Mpbs (STS-1)
Physical level .....................................................................................................GR-253-CORE
Frame ............................................................................................................................... G.253
Line code.............................................................................................................................CMI
Line impedance ............................................................................................... 75 unbalanced

STM-1 Electrical
Physical level ............................................................................................ G.703, Paragraph 12
Frame ............................................................................................................................... G.707
Line code.............................................................................................................................CMI

5-8

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

STM-1/OC-3 Optical
Physical level ..................................................................................................... G.957, Table 2
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul bitrate ................................................................. 155.52 Mbps 4.6 ppm

STM-4/OC-12 Optical
Physical level ..................................................................................................... G.957, Table 3
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul bitrate ................... 622 Mbps 4.6 ppm

STM-16/OC-48 Optical
Physical level ..................................................................................................... G.957, Table 4
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul,
DWDM (G.692 and G.957) bitrate ..................................................... 2488.32 Mbps 4.6 ppm

STM-64/OC-192 Optical
Physical level ..........................................................................................G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, DWDM (G.692) bitrate ......... 9953.28 Mbps 4.6 ppm

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ECI Telecom Ltd. Proprietary

5-9

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.3 Data Cards


Card

Service interfaces

Data
handling

Network interfaces

Bandwidth per
interface

DIO1_80

8 x Gbps Ethernet

Layer 1

8 x EOS*

(1 to 7) x VC-4(1)

DIO1_40R

4 x Gbps Ethernet

Layer 1

4 x EOS

(1 to 7) x VC-4(2)

DIO1_61(3)

6 x Gbps Ethernet

Layer 1

6 x EOS

(1 to 7) x VC-4(2)

EIS2_8

4 GbE + 4 FE or 8 FE

Layer 2

2 x EOS

(1 to 7) x VC-4

EIS8_8

4 GbE + 4 FE or 8 FE

Layer 2

8 x EOS

(1 to 7) x VC-4

2 x VC-4 + 126 x E1

ATM

2 x VC-4 + 125 x E1

2 x VC-4 + 125 x E1

ATS

(4)

* EoS Ethernet over SDH/SONET.


(1)

Maximum capacity per card: 5 Gbps (32 x VC-4).


Maximum capacity per card: 2.5 Gbps (16 x VC-4).
(3)
DIO1_61 Ethernet ports are mapped directly to low-cost 2.5 Gbps STM-16s/OC-48s transceivers connected to
a DWDM transponder. The allocation of VC-4s to service interfaces is not symmetric.
(4)
ATS resources can be software-allocated to service or network interfaces as required.
(2)

5.3.1 Client Transceivers for DIO and EIS Cards (and


for CMBR25/10 and TRP25_4 Cards)
OMGE_1SX/
OTGBE-SX

OMGE_1LX/
OTGBE-LX

DOM16_I3/
OTR16-I3

GbE/FC/FICON
Short-reach laser,
850 nm,
multimode

GbE/FC/FICON
Long-reach laser,
1310 nm, single
mode

2.5 Gbps Longreach laser,


1310 nm, single
mode

1250

1250

2544

Max.

-3

-3

-10

Min.

-9.5

-11

-3

8.2

8 B/10 B

8 B/10 B

--

Min.

-20

-22

-20

Typical

-21

-25.5

-23

Typical Rx LOS level (dBm)

-24

-29

-25

Connector

LC

LC

LC

550 m
(50/62.5 m
MMF)

10 km
(9 m SMF)

10 km
(9 m SMF)

Transmitter type

Data rate (nominal) (MBaud)


Average launch power
(dBm)

Min. transmitter extinction ratio


(dB)
Data format
Average receiver
sensitivity (dBm)

Fiber lengths

5-10

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.3.2 DIO Specifications


Optical interfaces .....................................................1000BaseSX, 1000BaseLX, 1000BaseZX
Switch capacity ......................................................................................................up to 5 Gbps
Standards compliance.............. IEEE 802.3, 802.3x, jumbo frames, transparent to 802.1d, p, q

5.3.3 EIS Specifications


Electrical interfaces.............................................................................................. 10/100BaseT
Switch capacity ............................................................................................................. 16 Gbps
MAC address memory .................................................................................................... 32,000
Protection ......................................... IOP 1:1 for both Ethernet over SDH ports and user ports
Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
........................................................... IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
G.707, G.783, G.7041 (GFP)

5.3.4 ATS Specifications


Bandwidth ............................................................................................................. 622.08 Mbps
Simultaneous IMA support ....................... 84 IMA groups per card with 1 to 32 E1 links each
ATM service classes .................................................................. CBR, rt-VBR, nrt-VBR, UBR
ATM signaling ............ UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0
IMA...............................................................................................................IMA 1.0, IMA 1.1
OAM .......................................................................................................................ITU-T I.610
Traffic management ........................................................................................... ATMF TM 4.1

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5-11

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.4 Optical Components


The XDM optical layer can service pure optical networks as well as converged
networks that integrate DWDM with data and SDH/SONET services in the same
platform. To take full advantage of the XDM platform, a variety of optical cards and
modules are used for both the modules cage and the cards cage of the various
shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used for the
cross-connect matrix cards).

5.4.1 DWDM Mux/Demux Cards and Modules


DWDM cards (cards cage of XDM-1000 and XDM-2000 shelves)
Card

Width
(Slots)

Function/Description

16/32-channel DWDM mux/demux cards (slots X1, X2)

DW16MDR-SAV

Mux star, demux AWG, 16 red channels

DW16MDRE-SAV

Mux star, demux AWG, 16 red channels, expandable to 32


channels

DW16MDR-SG

Mux star, demux diffraction grating, 16 red channels

DW16MDRE-SG

Mux star, demux diffraction grating, 16 red channels,


expandable to 32 channels

DW16MDB-SAV

Mux star, demux AWG, 16 blue channels

DW16MDB-SG

Mux star, demux diffraction grating, 16 blue channels

DW16MDB-GG

Mux diffraction grating, demux diffraction grating, 16 blue


channels

DW16MDR-GG

Mux diffraction grating, demux diffraction grating, 16 red


channels

DW16MDRE-GG

Mux diffraction grating, demux diffraction grating, 16 red


channels, expandable to 32 channels

DW16VMDR-AG

Mux AWG, demux diffraction grating, 16 red channels

DW16VMDRE-AG

Mux AWG, demux diffraction grating, 16 red channels,


expandable to 32 channels

DW16VMDB-AG

Mux AWG, demux diffraction grating, 16 blue channels

DW40MC-AV

Mux, AWG, 40 channels, C band

DW40MC-G

Mux, diffraction grating, 40 channels, C band

DW40DC-A

Demux, AWG, 40 channels, C band

DW40DC-G

Demux diffraction grating, 40 channels, C band

DW40VMC-AV

Variable mux, AWG, 40 channels, C band

5-12

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

DWDM modules (modules cage of XDM-1000)


Module

Conn.
Type

Width
(Slots)

Function/Description

16/32-channel DWDM mux/demux

MO_DW16MDR-SAV

LC

Mux star, demux AWG, 16 red channels

MO_DW16MDRE-SAV

LC

MO_DW16MDB-SAV

LC

Mux star, demux AWG, 16 red channels,


expandable to 32 channels
Mux star, demux AWG, 16 blue channels

MO_DW16MDR-SG

LC

MO_DW16MDRE-SG

LC

MO_DW16MDB-SG

LC

MO_DW16MDR-ST

LC

MO_DW16MDB-GAV

LC

MO_DW16MDR-GAV

LC

MO_DW16MDRE-GAV

LC

Mux star, demux diffraction grating, 16 red


channels
Mux star, demux diffraction grating, 16 red
channels, expandable to 32 channels
Mux star, demux diffraction grating, 16 blue
channels
Mux star, demux thin-film, 16 red channels
Mux diffraction grating, demux AWG, 16
blue channels
Mux diffraction grating, demux AWG, 16
red channels
Mux diffraction grating, demux AWG, 16
red channels, expandable to 32 channels

40-channel DWDM mux/demux

MO_DW40MC-S

LC

Mux star, 40 channels, C band

MO_DW40MC-AV

LC

Mux AWG, 40 channels, C band

MO_DW40MC-G

LC

Mux diffraction grating, 40 channels, C band

MO_DW40DC-AV

LC

Demux AWG, 40 channels, C band

MO_DW40DC-G

LC

Demux diffraction grating, 40 channels,


C band

Mux specifications
16-channel

32-channel

40-channel

< 14.5 (15.5)*

< 18 (21.3)

< 18.5

< 5 (6)

< 8 (11.7)

< 6 (7.3)

Return loss (dB)

< -40

< -40

< -40

Directivity (dB)

< -60

< -60

< -60

Insertion loss (dB):


Star:
AWG/Diffraction grating:

*Values in parenthesis apply to units assembled in the cards cage of the shelves; values without parenthesis
apply to units assembled in the modules cage of the shelves.

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-13

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

Demux specifications
16-channel

32-channel

40-channel

<8

< 4.5 (4.7)*

< 6 (6.7)

< 6 (7.3)

Return loss (dB)

< -45

< -45

< -45

Directivity (dB)

> 25

> 25

> 25

10

20

20

Insertion loss (dB)*:


Thin-film:
AWG/Diffraction grating:

Power consumption (Watt)

*Values in parenthesis apply to units assembled in the cards cage of the shelves; values without parenthesis
apply to units assembled in the modules cage of the shelves.

5-14

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.4.2 OADM Cards and Modules


OADM cards (cards cage)
Card

Width
(Slots)

Function/Description

XDM-2000

XDM-1000

XDM-500

Optical add/drop multiplexing of


16 grouped red channels, 100
GHz spacing, east/west
configuration
Optical add/drop multiplexing of
16 grouped blue channels, 100
GHz spacing, east/west
configuration

--

--

16-channel OADM for X1, X2 slots


OADM16R

OADM16B

Active OADM basecards for I/O slots


OADM4AB

Basecard for 1-4 active OADM


filter; configuration AB

OADM4AB_SW

Basecard for 1-4 active OADM


filter; configuration AB with 2x2
switch. (Can be installed as
provision for OADM filters.)

OADM4AB_ALS

Basecard for 1-4 active OADM


filter; configuration AB,
including built-in ALS

OADM4AB_SW_ALS

Basecard for 1-4 active OADM


filter; AB configuration with 2x2
switch and built-in ALS. (Can be
installed as provision for
OADM filters.)

OADM4EW

Basecard for 1-4 active OADM


filter; east/west configuration

OADM4EW_SW

Basecard for 1-4 active OADM


filter; east/west configuration
with 2x2 switch. (Can be
installed as provision for
OADM filters.)

OADM4EW_ALS

Basecard for 1-4 active OADM


filter; east/west configuration,
including built-in ALS

OADM4EW_SW_ALS

Basecard for 1-4 active OADM


filter; east/west configuration
with 2x2 switch and built-in
ALS. (Can be installed as
provision for OADM filters.
The card can also be used as ALS
card for nonprotected OADM
sites or with modules cage
muxes/demuxes or amplifiers)

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-15

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

OADM plug-in filters for OADM cards


Module

Function/Description

OM_AD1QABxx

1-channel 100 GHz OADM filter with built-in equalization for AB


configuration

OM_AD4RQABxx

4-channel 100 GHz OADM filter with built-in equalization for AB


configuration, random wavelengths

OM_AD4GQABxx

4-channel 100 GHz OADM filter with built-in equalization for AB


configuration, grouped wavelengths

OM_AD1QEWxx

1-channel 100 GHz OADM filter with built-in equalization for east/west
configuration

OM_AD4RQEWxx

4-channel 100 GHz OADM filter with built-in equalization for east/west
configuration, random wavelengths

OM_AD4GQEWxx

4-channel 100 GHz OADM filter with built-in equalization for east/west
configuration, grouped wavelengths

OADM modules (modules cage)


Module

Conn.
type

Width
(Slots)

Function/
Description

XDM-1000

XDM-500

1-4-channel OADM modules


MO_OADM1ABxx
MO_OADM1EWxx
MO_OADM4GABxx
MO_OADM4GEWxx

LC

Optical add/drop of a single


channel, AB/EW

LC

--

MO_OADM4RABxx
MO_OADM4REWxx

LC

Optical add/drop of
4 grouped channels;
AB/EW
Optical add/drop of 4
random channels; AB/EW

--

Optical add/drop of 8
channels (upgradeable to 16
channels), 200 GHz
spacing, east/west
configuration
Optical add/drop of 8
channels (expansion unit for
16 channels),
200 GHz spacing, east/west
configuration
Optical add/drop of 16
grouped red channels, 100
GHz spacing, east/west
configuration
Optical add/drop of 16
grouped blue channels, 100
GHz spacing, east/west
configuration

--

--

--

--

8/16-channel OADM modules


MO_OADM8TE

LC

MO_OADM8T

LC

MO_OADM16R

LC

MO_OADM16B

LC

5-16

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

OADM specifications
1. 16-channel OADM 100 GHz spacing East/West configuration
OADM16R, OADM16B, MO_OADM16R,
MO_OADM16B

Insertion loss
Through

Drop

Add

Total insertion loss through channels (two


cards) (dB)

< 3 (4.7)*

Total insertion loss for dropped channel (dB)

< 5.5 (5.6)

Minimum insertion loss for added channel (dB)

< 5.5 (6.7)

*Values in parenthesis apply to units assembled in the cards cage of the shelves; values without parenthesis
apply to units assembled in the modules cage of the shelves.

2. Eight-channel OADM 200 GHz spacing (upgradeable to 16 channels)


East/West configuration
MO_OADM8T, MO_OADM8TE

Insertion loss
Through

Drop

Add

Total insertion loss through channels (dB)

< 13.5
(< 15.5)*

Total insertion loss for dropped channel (dB)

< 5.5
(< 7.5)

Minimum insertion loss for added channel (dB)

<8

*Values in parenthesis apply to insertion loss through an upgrade unit.

3. 1/4-channel OADM 100 GHz spacing protected A/B and unprotected


East/West configurations
Module type

MO_OADM1AB (dB)
MO_OADM1EW

(1)

(dB)

MO_OADM4RAB (dB)
MO_OADM4REW

(1)

(dB)

MO_OADM4GAB (dB)
MO_OADM4GEW
(1)

(1)

(dB)

Insertion Loss
Through

Drop

Add

< 2.8

<2

<2

< 1.8

< 2.3

< 2.3

< 5.5

< 5.0

< 4.5

< 4.8

< 5.3

< 4.5

< 2.5

< 5.5

<5

< 1.8

< 4.8

< 4.8

For protected sites using two East/West cards, the through insertion loss should be doubled.

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-17

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

4. One-channel active OADM with equalization 100 GHz spacing protected A/B
configuration
Random OADM module

Basecard type

Through

Drop

Add

OADM4AB (dB)

2.9

2.3

4.7

OADM4AB_SW (dB)

4.5

3.1

5.5

OADM4AB_ALS (dB)

3.9

2.3

5.7

OADM4AB_SW_ALS (dB)

5.5

3.1

6.5

5. Four-channel active OADM with equalization 100 GHz spacing protected


A/B configuration
Random OADM module

Basecard type

Grouped OADM module

Through

Drop

Add

Through

Drop

Add

OADM4AB (dB)

5.1

3.6

3.3

4.6

5.8

OADM4AB_SW (dB)

6.7

4.4

5.8

4.9

5.4

6.6

OADM4AB_ALS (dB)

6.1

3.6

4.3

4.6

6.8

OADM4AB_SW_ALS (dB)

7.7

4.4

6.8

5.9

5.4

7.6

6. One-channel active OADM with equalization 100 GHz spacing unprotected


East/West configuration
Random OADM module

Basecard type

Through

Drop

Add

OADM4EW (dB)

3.1

2.6

4.0

(1)

4.7

3.4

4.8

4.1

2.6

5.0

5.7

3.4

5.8

(1)

OADM4EW_SW (dB)
OADM4EW_ALS

(1)

(dB)

OADM4EW_SW_ALS
(1)

(1)

(dB)

For protected sites using two East/West cards, the through insertion loss should be doubled.

7. Four-channel active OADM with equalization 100 GHz spacing unprotected


East/West configuration
Basecard type

Random OADM module

Grouped OADM module

Through

Drop

Add

Through

Drop

Add

OADM4EW (dB)

4.8

4.3

5.9

2.8

5.1

6.7

OADM4EW_SW (dB)

6.4

5.1

6.7

4.4

5.9

7.5

OADM4EW_ALS (dB)

5.6

4.3

6.9

3.8

5.1

7.7

OADM4EW_SW_ALS (dB)

7.4

5.1

7.7

5.4

5.9

8.5

5-18

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

OADM basecard only (no filters), 2 x 2 switch through


Basecard + 2x2
switches

Basecard + 2x2 +
ALS switches

E/W unprotected or AB

2.6

3.6

E/W protected both base cards with 2x 2 switches

5.2

6.2

Type of OADM site

5.4.3 Transponders
TRP25_2 & TRP10_2 basecards
Card

No. of slots

Function/Description

TRP25_2C

Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to


2.7 Gbps). Provides PM (for SDH, SONET, GbE), OCH/UPSR
1+1 protection, and outband FEC.

TRP25_2CT

Add/Drop bidirectional transponder with tunable laser (add) and


noncolored laser (drop) with 3R (50 Mbps to 2.7 Gbps).
Provides PM (for SDH, SONET, GbE), OCH/UPSR 1+1
protection, and outband FEC.

TRP25_2CTR

Bidirectional regenerator with two tunable lasers with 3R (50


Mbps to 2.7 Gbps). Provides PM (for SDH, SONET, GbE),
OCH/UPSR 1+1 protection, and outband FEC.

TRP10_2

Basecard for two 10 Gbps transponders with outband FEC

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-19

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

Optical transmitters and receivers for TRP25_2 and TRP10_2


Module

Description/Function

2.5 Gbps optical transmitters and receivers for TRP25_2

OMT25_Vxx

2.5 Gbps colored transmitter type V

OMT25_Xxx

2.5 Gbps colored transmitter type X

OMT25_Bxx

2.5 Gbps colored transmitter type B

OMT25_Exx

2.5 Gbps colored transmitter type E

OMT25_S3

2.5 Gbps 1310 nm short-haul transmitter type S3

OMT25_T

Optical module tunable transmitter for C band

OMR25C_A

Type A (APD) continuous receiver

OMR25C_P

Type P (PIN diode) continuous receiver

10 Gbps optical transceivers for TRP10_2

OM10_1PSTxx

Short-haul 10 Gbps colored transceiver, PIN diode receiver, with or without


FEC

OM10_1ASTxx

Short-haul 10 Gbps colored transceiver, APD receiver, with or without FEC

OM10_1PLTxx

Long-haul 10 Gbps colored transceiver, PIN diode receiver, with or without


FEC

OM10_1ALTxx

Long-haul 10 Gbps colored transceiver, APD receiver, with or without FEC

OM10_1PS5

Short-haul 1550 nm 10 Gbps transceiver, PIN diode receiver, with or


without FEC (drop direction)

OM10_1PI3

Intra-office (2 km) 1310 nm 10 Gbps transceiver, PIN diode receiver, with


or without FEC (drop direction)

OM10_1PS3

Short-haul 1310 nm 10 Gbps transceiver, PIN diode receiver

Combiner/TRP25_4 basecards
Card

No. of
slots

CMBR25_2 (CHTR)

Basecard for 2.7 Gbps combiners with outband FEC

CMBR10 (CHTR)

Basecard for 10.7 Gbps combiner with outband FEC

CMBR10_D
(CHTR + OMCD_8)

Basecard and module (OMCD_8) for eight SFP data


(GbE/FC/FICON) modules and 10.7 Gbps line card with
outband FEC

TRP25_4 (CHTR)

Basecard for 2 x 2.7 Gbps transponders with outband FEC

5-20

Function/Description

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

Combiner/TRP25_4 modules and transceivers


Module

Function/Description

CMBR25 modules
OMTX27
OMCD25_2

2.7 Gbps line card with outband FEC


Client card for two SFP data (GbE/FC/FICON) modules + 2.7 Gbps line card with
outband FEC

2.7 Gbps optical cards for TRP25_4


OMTR27

Card for STM-16 SFP transceivers + 2.7 Gbps line transceivers with outband FEC, for
Add/Drop and regenerator applications

2.7 Gbps line transceivers for CMBR25 & TRP25_4


OTX27_AVxx
OTX27_ABxx
OTX27_AXxx
OTX27_AExx
OTX27_PVxx
OTX27_PBxx
OTX27_PXxx
OTX27_PExx
OTX27_AT
OTX27_PT

2.7 Gbps transceiver, colored transmitter type V (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type X (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type E(with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type V (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type X (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type E(with outband FEC) and PIN receiver
Tunable 2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and APD
receiver
Tunable 2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and PIN
receiver

CMBR10 modules
OMS16_4
OMDS_6
OMTX10

Client card for four SFP STM-16 modules


Client card for two STM-16 modules and four SFP data (GbE/FC/FICON) modules
10.7 Gbps line card with outband FEC

10.7 Gbps line transceivers for CMBR10


OTX10_Asxx
OTX10_PSxx
OTX10_Alxx
OTX10_PLxx

10.7 Gbps transceiver, colored transmitter type S (with outband FEC) and APD receiver
10.7 Gbps transceiver, colored transmitter type S (with outband FEC) and PIN receiver
10.7 Gbps transceiver, colored transmitter type L (with outband FEC) and APD receiver
10.7 Gbps transceiver, colored transmitter type L (with outband FEC) and PIN receiver

Client SFP transceivers for CMBR25, CMBR10 & TRP25_4


OTR4_S3
OTR4_L3
OTR4_L5
OTGBE_SX
OTGBE_LX
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5

STM-4/OC-12 transceiver, short-haul 1310 nm


STM-4/OC-12 transceiver, long-haul 1310 nm
STM-4/OC-12 transceiver, long-haul 1550 nm
Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
STM-16/OC-48 transceiver, intra-office 1310 nm
STM-16/OC-48 transceiver, short-haul 1310 nm
STM-16/OC-48 transceiver, long-haul 1310 nm
STM-16/OC-48 transceiver, long-haul 1550 nm

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-21

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

2.5 Gbps optical transmitters/receivers for transponders, and


transceivers for combiners (receiver type P)
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers, as listed below.
OMT25_Vxx
+
OMR25C_P/

OMT25_Bxx
+
OMR25C_P/

OMT25_Xxx
+
OMR25C_P/

OTX27_
PVxx

OTX27_
PBxx

OTX27_
PXxx

SLM

SLM

SLM

SLM

SLM

SLM

1529-1560

1529-1560

1529-1560

1529-1560

1529-1560

1285-1330

<1

<1

<1

<1

<1

<1

Direct

Direct

Direct

Direct

EA(1)

Direct

Spacing (GHz)

100

100

100

100

100

100

Max. dispersion
(ps/nm)

1800
(100 km)

3000
(170 km)

1800
(100 km)

6400

3400
(200 km)

(360 km)

[>18000/100
0 km]

Min. side mode


suppression ratio
(dB)

30

30

30

30

30

30

Min. mean launched


power (dBm)

+1

+0

+5.5

-1

+0.5 [+5.5]

-2

Max. mean launched


power (dBm)

+3

+2

+7.5

+2

+5 [+7]

Min. extinction ratio


(dB)

8.2

8.2

8.2

8.2

10

Sensitivity (BER of
1*10-12) (dBm) (2)

-20

-20

-20

-20

-20

-20

Min. overload (dBm)

OCH switching time


(msec)

<3

<3

<3

<3

<3

<3

Power consumption
(TRP25_2 basecard
with two
transponders) (Watt)

40

40

40

40

40

40

Source type
Operating output
wavelength (nm)
Max. -20 dB width
(nm)
Modulation

OMT25_Exx
+
OMR25C_P/
OTX27Pexx

OMT25_T
+
OMR25C_P/

OMT25_S3
+
OMR25C_P/
OTX27_
PS3

(3)

[OTX27_PT]

(1)

EA: External Absorption.


Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.
(3)
Data in square parenthesis corresponds to [OTX27_PT] transceiver.
(2)

5-22

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

200

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

2.5 Gbps optical transmitters/receivers for transponders, and


transceivers for combiners (receiver type A)
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers, as listed below.
OMT25_Vxx
+
OMR25C_A/

OMT25_Bxx
+
OMR25C_A/

OMT25_Xxx
+
OMR25C_A/

OMT25_Exx
+
OMR25C_A/

OTX27_AVxx

OTX27_ABxx

OTX27_AXxx

OTX27AExx

Source type

SLM

SLM

SLM

SLM

SLM

SLM

Operating
output
wavelength
(nm)

1529-1560

1529-1560

1529-1560

1529-1560

1529-1560

1285-1330

Max. -20 dB
width (nm)

<1

<1

<1

<1

<1

<1

Modulation

Direct

Direct

Direct

Direct

EA(1)

Direct

100

100

100

100

100

100

1800

3000

1800

6400

(100 km)

(170 km)

(100 km)

(360 km)

Min. side
mode
suppression
ratio (dB)

30

30

30

30

30

30

Min. mean
launched
power (dBm)

+1

+0

+5.5

-1

+. 05 [+5.5]

-2

Max. mean
launched
power (dBm)

+3

+2

+7.5

+2

+5 [+7]

Min.
extinction
ratio (dB)

8.2

8.2

8.2

8.2

10

Sensitivity
(BER of
1*10-12)
(dBm) (2)

-30

--30

-30

-30

-30

-30

Min.
overload
(dBm)

-8

-8

-8

-8

-8

-8

OCH
switching
time (msec)

<3

<3

<3

<3

<3

<3

Spacing
(GHz)
Max.
dispersion
(ps/nm)

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

OMT25_T
+
OMR25C_A/
(3)

[OTX27_AT]

OMT25_S3
+
OMR25C_A/
OTX27_AS3

3400
(200 km)

200

[>18000/1000KM]

5-23

XDM-400, 500, 1000, and 2000 Specifications

Power
consumption
(TRP25_2
basecard
with two
transponders)
(Watt)

XDM System Specifications

OMT25_Vxx
+
OMR25C_A/

OMT25_Bxx
+
OMR25C_A/

OMT25_Xxx
+
OMR25C_A/

OMT25_Exx
+
OMR25C_A/

OTX27_AVxx

OTX27_ABxx

OTX27_AXxx

OTX27AExx

OMT25_T
+
OMR25C_A/
(3)

[OTX27_AT]

OMT25_S3
+
OMR25C_A/
OTX27_AS3

40

(1)

EA: External Absorption.


Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.
(3)
Data in square parenthesis refers to [OTX27_AT] transceivers.
(2)

5-24

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

10 Gbps optical transceivers for transponders and combiners


receiver type P
Each TRP10_2 basecard accommodates two optical transceivers.
OM10_1PSxx/S5

OM10_1PLxx

OTX10_PSxx/S5

OTX10_PLxx

SLM

OM10_1PI3

OM10_1PS3

SLM

SLM

SLM

1529-1560

1529-1560

1285-1330

1285-1330

<1

<1

<1

<1

External

External

Direct

Direct

Spacing (GHz)

100

100

Max. dispersion (ps/nm)

800

1600

40

Min. side mode


suppression ratio (dB)

30

30

30

30

Min. mean launched power


(dBm)

-2

-2

-6

-4

Max. mean launched


power (dBm)

+3

+3

-1

+1

8.2

10

8.2

-16(1)

-16(1)

-11

-15

Min. overload (dBm)

-1

-1

-1

-1

OCH switching time


(msec)

<3

<3

<3

<3

Source type
Operating output
wavelength (nm)
Direct max. -20 dB width
(nm)
Modulation

Min. extinction ratio (dB)


-

Sensitivity (BER of 1*10


12
) (dBm)

Power consumption
(TRP10_2 basecard with
two transponders) (Watt)
(1)

60

Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

5-25

XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

10 Gbps optical transceivers for transponders and combiners


receiver type A
Each TRP10_2 basecard accommodates two optical transceivers.
OM10_1ASxx/S5

OM10_1ALxx

OTX10_ASxx/S5

OTX10_ALxx

SLM

SLM

1529-1560

1529-1560

<1

<1

External

External

Spacing (GHz)

100

100

Max. dispersion (ps/nm)

800

1600

Min. side mode suppression ratio


(dB)

30

30

Min. mean launched power (dBm)

-2

-2

Max. mean launched power (dBm)

+3

+3

Min. extinction ratio (dB)

8.2

10

Sensitivity (BER of 1*10 )


(dBm) (1)

-21

-21

Min. overload (dBm)

-8

-8

OCH switching time (msec)

<3

<3

Source type
Operating output wavelength (nm)
Max. -20 dB width (nm)
Modulation

-12

Power consumption TRP10_2


basecard with two transponders)
(Watt)
(1)

60

Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.

2.66 Gbps receivers


Type P

Type A

-20

-30

-8

Max. receiver reflectance (dB)

-27

-27

Min. optical return cable loss (dB)

-24

-24

Max. discrete reflectance (dB)

-27

-27

Max. optical path penalty (dB)

-12

Minimum sensitivity (BER of 1*10 ) (STM-16/OC-48 signal)


(dBm) (1)
Minimum overload (dBm)

(1)

Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.

5-26

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

10.66 Gbps receivers


Type P

Type A

Minimum sensitivity (BER of 1*10 ) (dBm)


(STM-64/OC-192 signal) (dBm) (1)

-16

-21

Minimum overload (dBm)

-1

-8

Max. receiver reflectance (dB)

-27

-27

Min. optical return cable loss (dB)

-24

-24

Max. discrete reflectance (dB)

-27

-27

Max. optical path penalty (dB)

-12

(1)

Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.

5.4.4 Optical Amplifiers


Card/Module

Width
(Slots)

Cards cage
OFA2_BPC
OFA2_BBC
OFA2_BC
OFA2_PC
OFA2_PPC
OFA2_I29I29C

1
1
1
1
1
1

OFA2_I29C
OFA2_I23I23C

1
1

OFA2_I23C
OFA2_I23I29C

1
1

OFA2_BI23C

OFA2_BI29C

OFA_M

Function/Description
One booster and one preamplifier for the C band in a single-slot card
Two boosters for the C band in a single-slot card
One booster for the C band in a single-slot card
One preamplifier for the C band in a single-slot card
Two preamplifiers for the C band in a single-slot card
Two inline amplifiers with a gain of 29 dB for the C band in a single-slot
card
One inline amplifier with a gain of 29 dB for the C band in a single-slot card
Two inline amplifiers with a gain of 23 dB for the C band in a single-slot
card
One inline amplifier with a gain of 23 dB for the C band in a single-slot card
Two inline amplifiers with a gain of 23 dB and 29 dB for the C band in a
single-slot card
One booster and one inline amplifier with a gain of 23 dB for the C band in a
single-slot card
One booster and one inline amplifier with a gain of 29 dB for the C band in a
single-slot card
High-power, dynamic, multistage amplifier for extended long-haul and metro
applications

Modules cage
MO_BAC
1
Optical booster for the C band
MO_PAC
1
Optical preamplifier for the C band
MO_BAS
1
Single-channel optical booster for the C band
MO_PAS
1
Single-channel optical preamplifier for the C band
MO_SFF_OA2
1
Basecard for small-form-factor optical booster modules
Optical modules for MO_SFF_OA2 card
OM_HTx
N/A
High Tx power, single channel, optical amplifier for the C band

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XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

OFAs for Single Channel and DWDM applications


OFA_M*

OFA2_BC/

OFA2_PC/

OFA2_I23C/

OFA2_I29C/

OFA2_BBC
(Booster)

OFA2_BPC

OFA2_I23I23C
(Inline)*

OFA2_I29I29C
(Inline)*

+17

+12

+16

+16

+20

Up to 18

Up to 32

Typ. 21**

Typ. 27**

22-32

1529-1561

1529-1561

1529-1561

1529-1561

1529-1561

Gain flatness (dB)

< 1

< 1

< 1

< 1

< 0.75

Noise figure (dB)

<9

< 5.5

< 6***

< 6***

< 7.5

In/out isolation (dB)

> 40

> 40

> 40

> 40

> 40

Return loss (dB)

< 40

< 40

< 40

< 40

< 40

15

13

13

13

25

MO_BAC/
OFA2_BC

MO_PAC

OFA2_I23C

OFA2_I29C

21

21

21

21

OFA2_
BBC

OFA2_
BPC

OFA2_
I23I23C

OFA2
I29I29C

Max. total power


(dBm)
Gain (dB)
Spectrum (nm)

Power consumption
(Watt)
Power consumption
of two amplifiers
(Watt)

(Preamplifier)

* Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully-functional OADM site.
**The rating does not include the attenuation introduced by the built-in VOA.
*** Does not include the effect introduced by the built-in VOA.

OFAs for single-channel applications

Max. total power


(dBm)
Gain (dB)
Spectrum (nm)

Output power
deviation (dB)

Noise figure (dB)


In/out isolation (dB)
Return loss (dB)

5-28

OM_HTx/HT
aux (Booster)

MO_BAS
(Booster)

MO_PAS
(Pre-amplifier)

+13

+15

+12

Typ. 11

Up to 16
15291561

Up to 30

1529-1561

< 1.5

< 1

< 10
> 40
< 40

< 6.5
> 40
< 40

1529-1561
< 5.5 at Pin -38
dBm
< 2.5 at Pin -26
dBm
< 1.0 at Pin -14
dBm
< 5.5
> 40
< 40

ECI Telecom Ltd. Proprietary

MO_BAC
(Booster)

MO_PAC
(Preamplifier)

+17

+12

Up to 18
1529-1561

Up to 32
1529-1561

< 1

< 1

<9
> 40
< 40

< 5.5
> 40
< 40

417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

OM_HTx/HTau
x (Booster)

MO_BAS
(Booster)

MO_PAS
(Pre-amplifier)

MO_BAC
(Booster)

MO_PAC
(Preamplifier

Power consumption
(Watt)

13

15

13

15

13

Power consumption of
two amplifiers (Watt)

20

N/A

N/A

N/A

N/A

5.4.5 Optical Auxiliary Cards and Modules


Card/Module

Function/Description

Cards cage cards

AUX-2I
AUX-2X

Auxiliary basecard installed in a single I/O slot. Each basecard


accommodates any two of the modules listed below.
Auxiliary basecard installed in either the X1 or X2 slot. Each basecard
accommodates any two of the modules listed below.

Modules

OM_4SP50
OM_2COSC5
OM_2COSC5_RB
OM_2COSC5_SP95
OM_2LCOSC5
OM_2SP95
OM_2RB
OM_2VOA
OM_2COSC3
OM_2COSC3_RB
OM_2COSC3_SP95
OM_HTaux
OM_RHaux

Four 50/50 splitters


2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory
channel
2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory
channel, and 2 x red/blue filters
2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory
channel, and 2 x 95/5 splitters
2 x C/L/T filters (mux + demux) for the 1510 nm supervisory channel,
including provision for the L band
2 x 95/5 splitters
2 x red/blue filters
2 x controlled variable optical attenuators for OADM-V implementation
2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory
channel
2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory
channel, and 2 x red/blue filters
2 x C band/OSC filters (mux + demux) for the 1310 nm supervisory
channel, and 2 x 95/5 splitters
Optical booster with a gain of 15 dB for the C band
Optical preamplifier for the C band

Modules cage modules (single slot)

MO_ACC6CP
MO_ACC6SP50
MO_ACC6SP95
MO_ACC4COSC5
MO_ACC4CLOSC5
MO_ACC4COSC3
MO_ACC4RB

417006-2007-013-A01

Six couplers
Six 50/50 splitters
Six 95/5 splitters
Four C/T filters
Four C/L/T filters
Four supervisory 1310 nm modules
Four red/blue filters

ECI Telecom Ltd. Proprietary

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XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.4.6 DCF/DCM Units


Unit

Function/Description

DCF-40

Dispersion compensation fiber unit for 700 ps/nm

DCF-80

Dispersion compensation fiber unit for 1400 ps/nm

DCF-80-S

Dispersion compensation fiber unit for 1400 ps/nm with filter channel 35

DCF-95

Dispersion compensation fiber unit for 1600 ps/nm

MO_DCM-Lxx

Single-channel dispersion compensation module for 700 ps/nm for channel xx


for modules cage

MO_DCM-Vxx

Single-channel dispersion compensation module for 1400 ps/nm for channel


xx for modules cage

MO_DCM-Xxx

Single-channel dispersion compensation module for 1600 ps/nm for channel


xx for modules cage

5.4.7 Auxiliary Cards and Miscellaneous Accessory


Modules
Module type

Insertion loss (dB)

OM_ACC4SP50/ MO_ACC6SP50

OM_ACC2SP95/ MO_ACC4SP95

0.65

OM_2RB/ MO_ACC4RB

Mux

Red 0.7

Blue 1.2

Demux

Red 1.2

Blue 0.7

OM_2COSC3

Mux/demux

C band 1.2

OSC 1310 nm 1.2

OM_2COSC5

Mux

C band 0.8

OSC 1510 nm 1.2

Demux

C band 1.2

OSC 1510 nm 2.0

OM_2LCOSC5

Mux/demux C band 1.1 L band 1.6 OSC 1510 nm 2.0

DCF_40

DCF_80

DCF_95

10

MO_DCM_L_xx
3.5

MO_DCM_V_xx
MO_DCM_X_xx
MECP_OSC3*
MECP_OSC5*

Transmit power 1310 nm

-5 dBm

Receiver sensitivity 10E-12

-34 dBm

Transmit power 1510 nm


Receiver sensitivity 10E-12

0 dBm
-34 dBm

*See Section 5.2.1 for details.

5-30

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XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.4.8 Other Optical Cards


Card

No. of
slots

Function/Description

OPM

Optical performance monitoring card for four fiber monitoring points

OMSP

Optical MS protection card

OPM card specifications


Wavelength range................................................................................................ 1529-1562 nm
Power range............................................................................................................ -50 to +5 dB
OSNR range ...............................................................................................................0 to 30 dB

OMSP card specifications


Insertion loss through two cards ..................................................................................... < 3 dB
Switching time ................................................................................................................ < 4 ms

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XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.5 Frequencies and Wavelengths


ITU-T
channel
number

21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60

5-32

Sub-band

Blue

Red

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Channel
center
frequency
(THz)

Channel
center
wavelength
(nm)

192.1
192.2
192.3
192.4
192.5
192.6
192.7
192.8
192.9
193.0
193.1
193.2
193.3
193.4
193.5
193.6
193.7
193.8
193.9
194.0
194.1
194.2
194.3
194.4
194.5
194.6
194.7
194.8
194.9
195.0
195.1
195.2
195.3
195.4
195.5
195.6
195.7
195.8
195.9
196.0

1560.61
1559.79
1558.98
1558.17
1557.36
1556.55
1555.75
1554.94
1554.13
1553.33
1552.52
1551.72
1550.92
1550.12
1549.32
1548.51
1547.72
1546.92
1546.12
1545.32
1544.53
1543.73
1542.94
1542.14
1541.35
1540.56
1539.77
1538.98
1538.19
1537.40
1536.61
1535.82
1535.04
1534.25
1533.47
1532.68
1531.90
1531.12
1530.33
1529.55

200 GHz channel


spacing

100 GHz channel spacing

8channel
system

16channel
system

16channel
system

32channel
system

40channel
system

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ECI Telecom Ltd. Proprietary

;
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417006-2007-013-A01

XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.6 Physical Specifications


5.6.1 Dimensions (H x W x D)
MECP......................................................................120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in)
xMCP ....................................................................265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in)
HLXC, XIO, SIO, PIO, DIO, EIS, ATS and cards cage mux/demux, OADM, transponder,
OFA, OPM ............................................................415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in)
Modules cage connection modules (electrical), mux/demux, OADM, OFA
...............................................................................265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in)
XDM-400 shelf ...............................................500 x 450 x 285 mm (19.68 x 17.72 x 11.22 in)
XDM-500 shelf ...............................................725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in)
XDM-1000 shelf ...........................................1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in)
XDM-2000 shelf .............................................775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in)
xRAP rack alarm panel (optional).....................100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ...............133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
XDM-400 heat buffer.......................................44.5 x 412 x 285 mm (1.75 x 16.22 x 11.22 in)
Heat buffer ........................................................125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in)
Racks....................................... 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
......................................................................................2134 x 584 x 305 mm (82 x 23 x 12 in)

5.6.2 Weight
XDM-400 ........................................................................................................ 17 kg (37.48 lbs)
XDM-400 fully populated............................................................................... 35 kg (77.16 lbs)
XDM-500 ........................................................................................................ 20 kg (44.09 lbs)
XDM-500 fully populated............................................................................. 50 kg (110.23 lbs)
XDM-1000 ...................................................................................................... 25 kg (55.12 lbs)
XDM-1000 fully populated........................................................................... 70 kg (154.32 lbs)
XDM-2000 ...................................................................................................... 20 kg (44.09 lbs)
XDM-2000 fully populated........................................................................... 50 kg (110.23 lbs)

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XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.6.3 Power
Power requirements
Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1
Input voltage .........................................................................................-40 V DC to -75 V DC
Nominal power source .................................................................. -60 V or -48 V BTNR 2511

Power consumption
XDM-400 ..............................................................................Typical 500 W, maximum 800 W
XDM-500 ..............................................................................Typical 650 W, maximum 950 W
XDM-1000 ..................................................................... Typical 1000 W, maximum 1800* W
XDM-2000 ........................................................................Typical 1200 W, maximum 1700 W
* Depending on shelf revision.

5.6.4 Environmental Conditions


Operation
Applicable specification................................................................ETS 300 019-1-3 Class 3.1E
Temperature range .............................................................................................-5 oC to +45 oC
Relative humidity ..................................................................................................... 5% to 90%

Storage (packed)
Applicable specification................................................................. ETS 300 019-1-1 Class 1.2
Temperature range ...........................................................................................-25 oC to +55 oC
Relative humidity ................................................................................................. 10% to 100%

Handling and transportation


Applicable specification................................................................. ETS 300 019-1-2 Class 2.3
Temperature range .......................................................................................... -40 oC to +70 oC
Relative humidity ...................................................................................................... up to 95%

5-34

ECI Telecom Ltd. Proprietary

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XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.6.5 EMC
Applicable specifications .... EMC directive 89/336, (including EN 300 386-2: 1997, Class B,
........................................................................................emission and immunity requirements)

5.6.6 Safety
Applicable specifications ...........EN 60950 edition 2 (including A1/1992, A2/1993, A3/1995,
...................................................................................................................A4/1996); EN 41003
CE safety ...........................................................................................LVD directive 73/23/EEC

5.6.7 Laser Safety


Applicable specification................................................... EN 60825-1&2 (including A1/1997)

5.6.8 NEBS Compliance


The XDM platform complies with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 with
Revision 1, February 1999 (Level 3).

5.6.9 Reliability
Life
Expected lifetime of the XDM platforms...................................................................... 15 years

Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network................................................................................ better than 99.999%

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XDM-400, 500, 1000, and 2000 Specifications

XDM System Specifications

5.7 Management Specifications


Applicable specifications .........................................................G.784, G.774, M.3010, M.3100
eNM LightSoft (ECI Telecoms Network Manager) and client for managing
all Optical Networks Division equipment............................................. on SUN workstation(s)
EMS-XDM (XDM element manager) .....................................................on SUN workstation
eCraft Local Craft Terminal ............................................................................................ on PC
Note: EMS-XDM and eNM LightSoft can work on the same SUN workstation.

5.7.1

Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to eNM LightSoft or


other TMN; RS-232 to eCraft; OverHead Access (OHA) and External Alarms; Orderwire;
Rack Alarm Panel.

5.7.2 Alarms and Performance


Performance concept.............................................................................................G.821, G.826
Alarm concept .................................................................................................................. G.783
Alarm types .................................. LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes ..........................................................................Critical, Major, Minor, Warning

5.8 Other Specifications


5.8.1 Cross-Connect Levels
Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12
SONET cross-connect levels.............................................................................. STS-nc, STS-1

5.8.2 Cross-Connect Capacity


SDH switch core options............... 192/384 x STM-1 with cross-connect capability of 4/3/2/1
SONET switch core options............................................................................. 576/1152 STS-1

5-36

ECI Telecom Ltd. Proprietary

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XDM System Specifications

XDM-400, 500, 1000, and 2000 Specifications

5.8.3 Traffic Protection


Applicable specifications .................ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP* I/N LO, HO, UPSR ....................................................................................within 30 ms
MSP/APS 1+1 ........................................................................................................within 50 ms
MS-SPRing/BLSR ................................................................................................within 50 ms
OCH .........................................................................................................................within 5 ms
Optical line protection..............................................................................................within 5 ms

5.8.4 Redundancy
Control and synchronization systems..................................................................1+1 duplicated
Switching matrix, power system, internal buses, external buses ........................1+1 duplicated
I/O electrical modules protection .....................................................................1:N (N=1 to 10)

5.8.5 Synchronization
The XDM supports four timing references, which can be selected from multiple timing
sources, including:

From any PDH/Async tributary interface

From any SDH/SONET line(1)

External 2 MHz and 2 Mbps/1.5 Mbps(1) timing outputs (two T3 ports per shelf)

G.813 internal clock.

(1)

The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate
lines and transmits it over SDH/SONET lines.

5.8.6 Jitter and Wander


Applicable specifications .......................................................................... ITU-T G.823, G.825

SNCP S will be available in a future release of the XDM platforms.

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ECI Telecom Ltd. Proprietary

5-37

XDM-400, 500, 1000, and 2000 Specifications

5-38

ECI Telecom Ltd. Proprietary

XDM System Specifications

417006-2007-013-A01

A
Reference Documents
The primary reference documents for this document are:
1. ANSI T1.105-1991 Digital Hierarchy Optical Interface Rates and Format
Specification SONET.
2. BS ISO/IEC-3309 Information Technology Telecommunications and
Information Exchange between Systems High-Level Data Link Control
(HDLC) Procedures Frame Structure.
3. BS ISO/IEC-9595, Information Technology Open Systems Interconnection
Common Management Information Services.
4. ETSI ETR 114 Functional Architecture of SDH Transport Networks.
5. ETSI ETS 300 119 European Telecommunication Standard for Equipment
Practice.
6. ETSI EN 300 147 Synchronous Digital Hierarchy Multiplexing Structure.
7. ETSI EN 300 386-2 EMC Requirements for Telecom.
8. ETSI EN 300 132-2 D.C. Power Line.
9. ETSI ETS 300 232 Optical Interfaces for Equipment and Systems Relating
to the Synchronous Digital Hierarchy.
10. ETSI EN 300 417 Generic Functional Requirements for Synchronous
Digital Hierarchy Equipment.
11. ETSI ETS 300 462 (Parts 1, 2, 3, 4, 5) Transmission and Multiplexing
(TM) Generic Requirements for Synchronization Networks;
Synchronization Network Architecture; The Control of Jitter and Wander
within Synchronization; Timing Characteristics of Slave Clocks Suitable for
Operation in Synchronous Digital Hierarchy (SDH) Equipment.
12. ETSI ETS 300 746 Transmission and Multiplexing; Synchronous Digital
Hierarchy; Network Protection Schemes; Automatic Protection Switch
(APS) Operation.
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ECI Telecom Ltd. Proprietary

A-1

Reference Documents

XDM System Specifications

13. GR-1089-CORE Electromagnetic Compatibility and Electrical Safety


Generic Criteria for Network Telecommunications Equipment.
14. GR-1209-CORE Generic Requirements for Passive Optical Components.
15. GR-1230-CORE SONET Bidirectional Line-Switched Ring Equipment
Generic Criteria.
16. GR-1312-CORE Generic Requirements for Optical Fiber Amplifiers and
Proprietary Dense Wavelength-Division Multiplexed Systems.
17. GR-1377-CORE SONET OC-192 Transport System Generic Criteria.
18. GR-1400-CORE SONET Dual-Fed Unidirectional Path Switched Ring
(UPSR) Equipment Generic Criteria.
19. GR-253-CORE Synchronous Optical Network (SONET) Transport
Systems: Common Generic Criteria.
20. GR-326-CORE Generic Requirements for Singlemode Optical Connectors
and Jumper Assemblies.
21. GR-3580 NEBS Criteria Levels.
22. GR-383-CORE COMMON LANGUAGE Equipment Codes (CLEI
Codes) Generic Requirements for Bar Code Labels.
23. GR-436-CORE Digital Network Synchronization Plan.
24. GR-485-CORE COMMON LANGUAGE Equipment Codes (CLEI
Codes) Generic Requirements for Processes and Guidelines.
25. GR-499-CORE Transport Systems Generic Requirements (TSGR):
Common Requirements.
26. GR-63-CORE Network Equipment Building System (NEBS)
Requirements: Physical Protection.
27. IEC-68 Environmental Testing
28. IEC 917 Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
29. IEC 60950 Electrical Safety.
30. IEC 60825 Optical Safety.

A-2

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XDM System Specifications

Reference Documents

31. IEEE 802.3 IEEE Standard for Information Technology


Telecommunications and Information Exchange Between Systems Local
and Metropolitan Area Networks Specific Requirements Part 3: Carrier
Sense Multiple Access with Collision Detection (CSMA/CD) Access
Method and Physical Layer Specifications.
32. ISO 9595, ISO 9596 CMISE Specification.
33. ITU-T Recommendation G.650 Definition and Test Methods for the
Relevant Parameters of Single-mode Fibers.
34. ITU-T Recommendation G.651 Characteristics of a 50/125 m Multimode
Graded Index Optical Fiber Cable.
35. ITU-T Recommendation G.652 Characteristics of a Single-mode Optical
Fiber Cable.
36. ITU-T Recommendation G.653 Characteristics of a Dispersion-shifted
Single-mode Optical Fiber Cable.
37. ITU-T Recommendation G.654 Characteristics of a Cut-off Shifted Singlemode Optical Fiber Cable.
38. ITU-T Recommendation G.655 Characteristics of a Non-zero Dispersion
Shifted Single-mode Optical Fiber Cable.
39. ITU-T Recommendation G.661 Definition and Test Methods for the
Relevant Generic Parameters of Optical Amplifier Devices and Subsystems.
40. ITU-T Recommendation G.662 Generic Characteristics of Optical Fiber
Amplifier Devices and Subsystems.
41. ITU-T Recommendation G.663 Application Related Aspects of Optical
Fiber Amplifier Devices and Subsystems.
42. ITU-T Recommendation G.664 Optical Safety Procedures and
Requirements for Optical Transport Systems.
43. ITU-T Recommendation G.671 Transmission Characteristics of Passive
Optical Components.
44. ITU-T Recommendation G.681 Functional Characteristics of Interoffice
and Long-haul Line Systems Using Optical Amplifiers, Including Optical
Multiplexing.
45. ITU-T Recommendation G.691 Optical Interfaces for Single Channel SDH
Systems with Optical Amplifiers and STM-64 Systems (Draft).

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A-3

Reference Documents

XDM System Specifications

46. ITU-T Recommendation G.692 Optical Interfaces for Multi-channel


Systems with Optical Amplifiers.
47. ITU-T Recommendation G.703 Physical/Electrical Characteristics of
Hierarchical Digital Interfaces.
48. ITU-T Recommendation G.704 Synchronous Frame Structures Used at
1544, 6312, 2048, 8448 and 44 736 kbit/s Hierarchical Levels.
49. ITU-T Recommendation G.706 Frame alignment and CRC procedures
relating to basic frame structure defined in Rec G.704.
50. ITU-T Recommendation G.707 Network Node Interface for the
Synchronous Digital Hierarchy.
51. ITU-T Recommendation G.708 Sub STM-0 Network Node Interface for
the Synchronous Digital Hierarchy (SDH).
52. ITU-T Recommendation G.709 Network Node Interface for OTN.
53. ITU-T Recommendation G.772 Protected Monitoring Points provided on
Digital Transmission Systems.
54. ITU-T Recommendation G.774 & G774.n SDH Information Model.
55. ITU-T Recommendation G.783 Characteristics of SDH Equipment
Functional Blocks.
56. ITU-T Recommendation G.784 Synchronous Digital Hierarchy (SDH)
Management.
57. ITU-T Recommendation G.798 Characteristics of OTN Hierarchy
Equipment Functional Blocks.
58. ITU-T Recommendation G.803 Architectures of Transport Networks based
on the Synchronous Digital Hierarchy.
59. ITU-T Recommendation G.805 Generic Functional Architecture of
Transport Networks.
60. ITU-T Recommendation G.811 Timing Characteristics of Primary
Reference Clocks.
61. ITU-T Recommendation G.812 Timing Requirements of Slave Clocks
Suitable for Use as Node Clocks in Synchronization Networks.
62. ITU-T Recommendation G.813 Timing Characteristics of SDH Equipment
Slave Clocks (SEC).

A-4

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XDM System Specifications

Reference Documents

63. ITU-T Recommendation G.823 The Control of Jitter and Wander within
Digital Networks, which are Based on the 2048 kbit/s Hierarchy.
64. ITU-T Recommendation G.825 The Control of Jitter and Wander within
Digital Networks, which are Based on the SDH (Draft).
65. ITU-T Recommendation G.8251 The Control of Jitter and Wander within
the Optical Transport Network (OTN).
66. ITU-T Recommendation G.826 Error Performance Parameters and
Objectives for International, Constant Bit Rate Digital Paths at or above the
Primary Rate.
67. ITU-T Recommendation G.828 Error Performance Parameters and
Objectives for International, Constant Bit Rate Synchronous Digital Paths.
68. ITU-T Recommendation G.829 Error Performance Events for SDH
Multiplex and Regenerator Sections.
69. ITU-T Recommendation G.841 Types and Characteristics of SDH
Network Protection Architectures.
70. ITU-T Recommendation G.842 Inter-working of SDH Protection
Architectures.
71. ITU-T Recommendation G.872 Architecture of Optical Transport
Networks.
72. ITU-T Recommendation G.874 Management Aspects of the Optical
Transport Network Element.
73. ITU-T Recommendation G.875 OTN Management Information Model for
the NE View.
74. ITU-T Recommendation G.957 Optical Interfaces for Equipment and
Systems relating to the Synchronous Digital Hierarchy.
75. ITU-T Recommendation G.958 Digital Line Systems Based on the
Synchronous Digital Hierarchy for Use on Optical Fiber Cables.
76. ITU-T Recommendation G.959.1 Optical Transport Network Physical
Layer Interfaces.
77. ITU-T Recommendation G.975 Forward Error Correction for Submarine
Systems.
78. ITU-T Recommendation M.3010 Principles for a Telecommunications
Management Network.

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A-5

Reference Documents

XDM System Specifications

79. ITU-T Recommendation M.3100 Generic Network Information Model.


80. ITU-T Recommendation Q.821 Alarm Surveillance.
81. ITU-T Recommendation Q.822 Performance Monitoring.
82. ITU-T Recommendations X.217, X.227 ACSE Specification.
83. ITU-T Recommendations X.219, X.229 ROSE Specification.
84. RFC-1493 Definition of Managed Objects for Bridges.
85. RFC-1662 PPP in HDLC-life Framing.
86. RFC-2108 Definitions of Managed Objects for IEEE 802.3 Repeater
Devices using SMIv2.
87. RFC-2615 PPP over SONET/SDH.
88. RFC-2665 Definitions of Managed Objects for the Ethernet-like Interface
Types.
89. RFC-2737 Entity MIB (Version 2).
90. RFC-2819 Remote Network Monitoring Management Information Base.
91. RFC-2823 PPP over Simple Data Link (SDL) using SONET/SDH with
ATM-like Framing.
92. UL- 60950 Electrical Safety.

A-6

ECI Telecom Ltd. Proprietary

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B
Glossary
ACO

Alarm Cut Off

ADM

Add-and-Drop Multiplexer

AIS

Alarm Indication Signal

ALS

Automatic Laser Shutdown

ANSI

American National Standards Institute

APD

Avalanche PhotoDiode

APS

Automatic Protection Switching

ASIC

Application-Specific Integrated Circuit

ASP

Application Service Providers

ATM

Asynchronous Transfer Mode

ATS

ATM Traffic Switch

AU

Administrative Unit

AU-AIS/AIS-P

AU Alarm Indication Signal/STS Alarm Indication Signal

AU-LOP/LOP-P

AU Loss of Pointer/STS Loss of Pointer

AWG

Array Waveguide Grating

BB

Broadband

BB-DXC

Broadband Digital Cross-connect

BBE

Background Block Error

BER

Bit Error Rate

BIT

Built-In Test

BLSR

Bidirectional Line Switched Ring

BSC

Base Station Controller

CI

417006-2007-013-A01

Command, Control, Communication and Computer

ECI Telecom Ltd. Proprietary

B-1

Glossary

XDM System Specifications

CAPEX

CAPital EXpenditure

CATV

Cable TV

C band

The wavelength range between 1530 nm and 1562 nm used in


CWDM and DWDM applications

CES

Circuit Emulation Service (ATM)

CLE

Customer Located Equipment

CLEC

Competitive Local Exchange Carrier

CMN

Customer Managed Network

CMS

Central Monitoring Station

CO

Cable Operator

CoC

Carrier of Carriers

CORBA

Common Object Request Broker Architecture

COTS

Commercial Off-The-Shelf

CPE

Customer Premise Equipment

CSU

Channel Service Unit

CU

Consolidation Unit

CWDM

Coarse Wavelength Division Multiplex

DCC

Digital Communications Channel

DCF

Dispersion Compensating Fiber

DCM

Dispersion Compensation Module

DCN

Data Communication Network

DCS

Digital Cross-connect System

Demux

Demultiplexer

DIO

XDM Data I/O card

DS-3

Digital Signal Level 3 (44.736 Mbps)

DSLAM

Digital Subscriber Line Access Multiplexer

DSU

Data Service Unit

DWDM

Dense Wavelength Division Multiplexing

DXC

Digital Cross-connect

EBER

Excessive Bit Error Rate

ECB

External Connection Board

B-2

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Glossary

eCRAFT

Desktop or laptop PC-based craft terminal

EDFA

Erbium-Doped Fiber Amplifier

eEM

ECI Telecoms Element Manager

EIS

Ethernet Interface Switch

EML

Element Management Layer

EMS

Element Management System

EMS-XDM

XDM Element Management System

eNM LightSoft

ECI Telecoms Network Manager

EOW

Engineering OrderWire

ESCON

Enterprise Systems Connection

ETSI

European Telecommunication Standards Institute

EVPL

Ethernet Virtual Private Line

Fast Ethernet

100BaseT. Ethernet at 100 Mbps

FC

Fiber Channel

FCU

Fan Control Unit

FE

Fast Ethernet

FEC

Forward Error Correction

FICON

Fiber Connection

FN

Functional Node

FR

Frame Relay

FTP

File Transfer Protocol

GbE

Gigabit Ethernet. Ethernet technology that raises transmission


speed to 1 Gbps.

HLXC

High Level/Low Level Cross-connect

HO

High Order

HTML

Hyper Text Markup Language

I/O

Input/Output

ILEC

Independent Local Exchange Carrier

IMA

Inverse Multiplexing over ATM

INF

Input Filter Unit

IP

Internet Protocol

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

B-3

Glossary

XDM System Specifications

ISDN

Integrated Services Digital Networks

ISP

Internet Service Provider

ITU-T

International Telecommunications Union-Telecommunication

LAN

Local Area Network

L band

The wavelength range between 1570 nm and 1610 nm used in


some CWDM and DWDM applications

LCAS

Link Capacity Adjustment Scheme

LEC

Local Exchange Carriers

LO

Low Order

LOD

Loss of Data

LOF

Loss of Frame

LOS

Loss Of Signal

ME

Managed Element

MECP

Main Equipment Control Panel

MLM

Multilongitudinal Mode

MS

Multiplex Section

MSC

Mobile Switching Center

MS-EBER

Multiplex Section-Excessive Bit Error Rate

MSO

MultiService Operator

MSP

Multiplex Section Protection

MSP-L

Linear Multiplex Section Protection

MSPP

MultiService Provisioning Platform

MS-SPRing

Multiplex Section Shared Protection Ring

MTBF

Mean Time Between Failures

MTNM

MultiTechnology Network Management

MTTR

Mean Time To Repair

Mux

Multiplexer

NB

Narrowband

NB-DXC

Narrowband Digital Cross-connect

NE

Network Element

NEL

Network Element Layer

B-4

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Glossary

NIM

Nonintrusive Monitoring

NML

Network Management Layer

NMS

Network Management System

NNI

Network-to-Network Interface

NT

Network Termination

NVM

Non-Volatile Memory

OADM

Optical Add/Drop Multiplexer

OAM&P

Operations, Administration, Maintenance and Provisioning

OC

Optical Carrier, the transmission speeds defined in the


SONET specification

OC-1

Optical Carrier level 1, 51.84 Mbps

OC-12

Optical Carrier level 12, 622.08 Mbps

OC-192

Optical Carrier level 192, 9.953 Gbps

OC-256

Optical Carrier level 256, 13.2192 Gbps

OC-3

Optical Carrier level 3, 155.52 Mbps

OC-48

Optical Carrier level 48, 2.488 Gbps

OCH

Optical CHannel

OCHP

Optical CHannel Protection

OEO

Optical-to-Electrical-to-Optical

OFA

Optical Fiber Amplifier

OHA

OverHead Access

OMP

Optical Multiplex Protection

OMS

Optical Multiplex Section

OMSP

Optical Multiplex Section Protection

OMT

Optical Multiplexing Terminal

ONE

Optical Network Element

OPEX

OPerational EXpenditure

OPM

Optical Performance Monitoring

OSC

Optical Supervisory Channel

OSNR

Optical Signal to Noise Ratio

OSS

Operations Support System

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

B-5

Glossary

XDM System Specifications

OTN

Optical Transport Network

OW

OrderWire channel

PABX

Private Automatic Branch Exchange

PDH

Plesiochronous Digital Hierarchy

PIN

Packet Identification Number

PIO

PDH Input/Output

PM

Performance Monitoring

POP

Point of Presence

POS

Packet Over SDH/SONET

PPC

Power-Per-Channel

PSTN

Public Switched Telephone Networks

PTT

Postal Telegraph and Telephone

QoS

Quality of Service

RDR

Remote Database Replication

RNC

Radio Network Controller

SAN

Storage Area Network

SD

Signal Degradation

SDH

Synchronous Digital Hierarchy

SES

Severed Error Second

SF/SD

Signal Failure/Signal Degradation

SFF

Small-Form-Factor

SIO

SDH Input/Output

SLA

Service Level Agreement

SLM

Single Longitudinal Mode

SNCP

SubNetwork Connection Protection

SNR

Signal-to-Noise Ratio

SOA

Semiconductor Optical Amplifier

SONET

Synchronous Optical Network

SQL

Structured Query Language

SSIM

SDH/SONET Interface Module

B-6

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

Glossary

SSM

Synchronization Status Marker (protocol)

SSP

Storage Service Provider

STM

Synchronous Transfer Mode

STM-1

Synchronous Transport Module 1, 155.52 Mbps

STM-16

Synchronous Transport Module 16, 2488.32 Mbps

STM-4

Synchronous Transport Module 4, 622.08 Mbps

STM-64

Synchronous Transport Module 64, 9953.28 Mbps

SU

Slot Unit

TDM

Time Division Multiplexing

TLS

Transparent LAN Services

TM

Terminal Multiplexer

TMF

TeleManagement Forum

TMN

Telecommunications Management Network

TMU

TiMing Unit

TO

Telecom Operator

TSI

Time Slot Interchange

TU

Tributary Unit

TU-AIS/AIS-V

TU Alarm Indication Signal/VT Alarm Indication Signal

TU-BER

Tributary Bit Error Rate

TU-LOP/LOP-V

TU Loss of Pointer/VT Loss of Pointer

TVCXO

Temperature Compensated Voltage Controlled Crystal


Oscillator

UAS

Unavailable Seconds

UNI

User to Network Interface

UPSR

Unidirectional Path Switched Ring

VC

Virtual Container

VLAN

Virtual Local Area Network

VMUX

Variable Mux

VOA

Variable Optical Attenuator

VOD

Video-On-Demand

VPN

Virtual Private Network

417006-2007-013-A01

ECI Telecom Ltd. Proprietary

B-7

Glossary

XDM System Specifications

WAN

Wide Area Network

WB

Wideband

WB-DXC

Wideband Digital Cross-connect

WDM

Wavelength Division Multiplexing

WTR

Wait-To-Restore

xFCU

XDM Fan Control Unit

xINF

XDM Input Filter Unit

XIO

Cross-connect Input/Output

xMCP

XDM Main Control Processor

xRAP

XDM Rack Alarm Panel

B-8

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

I
Index
A
ADM, 1-5
Alarms and Performance, 5-36
ATM, 1-3, 1-4
C
Cards
ECB, 2-32
ECU, 2-22, 2-25
HLXC, 2-31
MECP, 2-32
MXC, 2-24
XIO, 2-31
xMCP, 2-32
Cross-connect specifications, 3-1
CWDM Platform for Metro-access Networks.
See XDM-200
D
Data interfaces specifications, 3-9
Data-Aware Access Gateway. See XDM-500
DWDM, 1-5
E
ECU card, 2-25
EIS-M
interfaces specifications, 3-9
Expansion Shelves, 2-14
F
Frequencies and Wavelengths, 5-32
I
I/O interfaces specifications, 3-2
J
Jitter and wander specifications, 3-2
L
Long-haul, 1-5

417006-2007-013-A01

M
Management specifications, 3-4
Modules
OCU, 2-23
MSPP, 1-2
MSPP for Metro-Edge or Long-Haul. See
XDM-400
Multifunctional Intelligent Optical Switch.
See XDM-2000
Multiservice Metro Optical Platform. See
XDM-1000
MXC card, 2-24
N
NEBS Compliance, 5-35
O
OADM, 2-22
Optical
CWDM unit, 2-22
P
Platform for Metro-access and Cellular
Networks. See XDM-100
POP, 1-4
Q
QoS, 1-1
R
Rack Layouts, 2-14
Redundancy specifications, 3-1
Reliability, 5-35
S
SDH/SONET interfaces specifications, 3-5
Shelf configurations
non-redundant shelf layout, 2-20

ECI Telecom Ltd. Proprietary

I-1

Index

XDM System Specifications

Shelf Layout
XDM-1000, 2-9
XDM-2000, 2-10
XDM-500, 2-8
Specifications, 3-1
alarm and performance, 4-2
ATS, 5-11
auxiliary cards, 5-30
client transceivers for DIO and EIS cards,
5-10
connection module data for electrical I/O
cards, 5-2
cross-connect, 3-1
cross-connect capacity, 5-36
cross-connect levels, 5-36
data cards, 5-10
data interfaces, 3-9
DCF/DCM units, 5-30
Demux, 5-14
DIO, 5-11
DWDM cards, 5-12
DWDM modules, 5-13
EIS, 5-11
EIS-M interfaces, 3-9
electrical interface connection modules, 5-2
electrical, optical and mixed basecard data,
5-1
EMC, 3-11, 4-5, 5-35
environmental, 4-5, 5-34
environmental conditions, 3-11
I/O cards optical transceiver modules, 5-3
I/O interfaces, 3-2, 4-2
jitter and wander, 3-2, 4-1, 5-37
laser safety, 4-6, 5-35
management, 3-4, 4-1, 5-36
management and alarm interfaces, 4-2
miscellaneous accessory modules, 5-30
Mux, 5-13
NEBS, 3-12
NEBS compliance, 4-6
OADM, 5-17
OADM basecard, 5-19
OADM cards, 5-15
OADM modules, 5-16
OADM plug-in filters, 5-16
OFA for DWDM applications, 5-28
OFA for single-channel applications, 5-28
OMSP card, 5-31
OPM card, 5-31
optical amplifiers, 5-27
optical auxiliary cards and modules, 5-29
optical components, 5-12

I-2

PDH/Async and SDH/SONET interface,


5-8
physical, 3-10, 4-4, 5-33
power, 4-5
redundancy, 3-1, 4-1, 5-37
reliability, 3-12, 4-6
safety, 3-11, 4-6, 5-35
SDH/SONET interfaces, 3-5, 5-4
synchronization, 3-2, 5-37
traffic protection, 3-1, 5-37
transponders, 5-19
T
TM, 1-5
Traffic protection specifications, 3-1
Transponders
10 Gbps optical transceivers and combiners
(receiver type A), 5-26
10 Gbps optical transceivers and combiners
(receiver type P), 5-25
10.66 Gbps receivers, 5-27
2.5 Gbps optical transmitters/receivers,
5-22, 5-23
2.66 Gbps receivers, 5-26
combiner/TRP25_4 basecards, 5-20
combiner/TRP25_4 card modules and
transceivers, 5-21
optical transmitters and receivers, 5-20
transceivers for combiners (receiver type
A), 5-23
transceivers for combiners (receiver type
P), 5-22
TRP25_2 & TRP10_2 transponder
basecards, 5-19
X
XDM
capabilities, 1-2
cellular capabilities, 1-3
control, matrix and I/O cards, 2-31
data capabilities, 1-3
optical capabilities, 1-2
platforms, 1-4
SDH/SONET capabilities, 1-2
shelf configurations, 1-5
XDM-100, 1-4
non-redundant shelf layout, 2-20
specifications, 3-1
XDM-1000, 1-5, 2-1
cards cage, 2-28
modules cage, 2-28
standard card layout, 2-28
XDM-200, 1-5
basic shelf, 2-22

ECI Telecom Ltd. Proprietary

417006-2007-013-A01

XDM System Specifications

cards and modules, 2-22


specifications, 4-1
splitter/coupler module, 2-22
XDM-2000, 1-5, 2-1
standard card layout, 2-30

417006-2007-013-A01

Index

XDM-400
rack layout, 2-13
XDM-500, 1-5, 2-1
standard card layout, 2-27

ECI Telecom Ltd. Proprietary

I-3

Index

I-4

XDM System Specifications

ECI Telecom Ltd. Proprietary

417006-2007-013-A01