Scribd Logo
Importer

Bienvenue sur Scribd !

  • Lase and Place

    Transféré par

    U.S. Naval Research Laboratory
    24 vues1 page
    The Naval Research Laboratory has developed a laser-based device-transfer process for placing/embedding on any surface millimeter- to micrometer-size structures, such as semiconductor bare die, surface-mount and optoelectronic devices, sensors, actuators, and microelectro-mechanical systems (MEMS). The NRL Lase and PlaceTM process begins by mounting the components to be transferred on a laser-transparent support using an intermediate sacrificial polymer layer. Upon exposure to pulsed laser light, the sacrificial layer is ablated, and the generated vapor releases a single component and propels it from the support to the desired surface location. The technique is less likely to cause damage to fragile components compared to the mechanical “pick and place” process and has been demonstrated capable of transferring 10-µm thick bare die, which is impossible to achieve with the current mechanical process. Laser direct-write processes can also be used to create a depression, or pocket, in which the component is embedded and to print electrical interconnects to the part after it is in place, thereby combining the work of several tools into one. NRL Technology Transfer Office http://www.nrl.navy.mil/techtransfer/fs.php?fs_id=MAT24 Naval Research Laboratory website http://www.nrl.navy.mil

    Copyright

    © Attribution Non-Commercial (BY-NC)

    Formats disponibles

    PDF, TXT ou lisez en ligne sur Scribd

    Avez-vous trouvé ce document utile ?

    Ce contenu est-il inapproprié ?

    Signaler ce document
    The Naval Research Laboratory has developed a laser-based device-transfer process for placing/embedding on any surface millimeter- to micrometer-size structures, such as semiconductor bare die, surface-mount and optoelectronic devices, sensors, actuators, and microelectro-mechanical systems (MEMS). The NRL Lase and PlaceTM process begins by mounting the components to be transferred on a laser-transparent support using an intermediate sacrificial polymer layer. Upon exposure to pulsed laser light, the sacrificial layer is ablated, and the generated vapor releases a single component and propels it from the support to the desired surface location. The technique is less likely to cause damage to fragile components compared to the mechanical “pick and place” process and has been demonstrated capable of transferring 10-µm thick bare die, which is impossible to achieve with the current mechanical process. Laser direct-write processes can also be used to create a depression, or pocket, in which the component is embedded and to print electrical interconnects to the part after it is in place, thereby combining the work of several tools into one. NRL Technology Transfer Office http://www.nrl.navy.mil/techtransfer/fs.php?fs_id=MAT24 Naval Research Laboratory website http://www.nrl.navy.mil

    Droits d'auteur :

    Attribution Non-Commercial (BY-NC)
    Téléchargez comme PDF, TXT ou lisez en ligne sur Scribd
    Signaler comme contenu inapproprié
    24 vues1 page

    Lase and Place

    Transféré par

    U.S. Naval Research Laboratory
    The Naval Research Laboratory has developed a laser-based device-transfer process for placing/embedding on any surface millimeter- to micrometer-size structures, such as semiconductor bare die, surface-mount and optoelectronic devices, sensors, actuators, and microelectro-mechanical systems (MEMS). The NRL Lase and PlaceTM process begins by mounting the components to be transferred on a laser-transparent support using an intermediate sacrificial polymer layer. Upon exposure to pulsed laser light, the sacrificial layer is ablated, and the generated vapor releases a single component and propels it from the support to the desired surface location. The technique is less likely to cause damage to fragile components compared to the mechanical “pick and place” process and has been demonstrated capable of transferring 10-µm thick bare die, which is impossible to achieve with the current mechanical process. Laser direct-write processes can also be used to create a depression, or pocket, in which the component is embedded and to print electrical interconnects to the part after it is in place, thereby combining the work of several tools into one. NRL Technology Transfer Office http://www.nrl.navy.mil/techtransfer/fs.php?fs_id=MAT24 Naval Research Laboratory website http://www.nrl.navy.mil

    Droits d'auteur :

    Attribution Non-Commercial (BY-NC)
    Téléchargez comme PDF, TXT ou lisez en ligne sur Scribd
    Signaler comme contenu inapproprié
    sur 1

    R

    ES

    EARCH LA B

    AL

    NAVAL RESEARCH LABORATORY


    TECHNOLOGY LICENSING OPPORTUNITY

    R
    AT

    NAV

    ORY

    AS

    HINGTO

    N,

    LASE AND PLACE


    Advantages/Features Fast: potential for placing >100 components/second with accurate lateral position Capable of transferring smaller, thinner, more fragile components Readily places dissimilar devices or structures next to each other for multi-chip module or system-in-a-package applications More flexible configuration; place components in locations not possible with conventional methods, such as non-planar surfaces. Applications Embedded electronics Monolithic Microwave Integrated Circuits (MMICs) and Hybrid Integrated Circuits For more information contact: Rita Manak, Ph.D. Head, Technology Transfer Office 202 767-3083 rita.manak@nrl.navy.mil Identification Number: MAT24 Schematic showing the basic components of the Lase and Place system. Photo on bottom right shows a 4x4 array of LED bare die transferred by this technique.

    The Naval Research Laboratory has developed a laser-based device-transfer process for placing/embedding on any surface millimeter- to micrometer-size structures, such as semiconductor bare die, surface-mount and optoelectronic devices, sensors, actuators, and TM microelectro-mechanical systems (MEMS). The NRL Lase and Place process begins by mounting the components to be transferred on a laser-transparent support using an intermediate sacrificial polymer layer. Upon exposure to pulsed laser light, the sacrificial layer is ablated, and the generated vapor releases a single component and propels it from the support to the desired surface location. The technique is less likely to cause damage to fragile components compared to the mechanical "pick and place" process and has been demonstrated capable of transferring 10-m thick bare die, which is impossible to achieve with the current mechanical process. Laser direct-write processes can also be used to create a depression, or pocket, in which the component is embedded and to print electrical interconnects to the part after it is in place, thereby combining the work of several tools into one.
    References "Manufacturing Microelectronics Using Lase-and-Place ," Photonics Spectra 41 (2007) 70-74. "Assembly and Integration of Thin Bare Die Using Laser Direct-Write," SPIE Proceedings 6458 (2007) 1-10. Available for License: US Patent No. 8,056,222.
    TM

    ES

    EARCH LA

    BO

    AL

    AT

    NAV

    ORY

    technology

    AS

    HING TON,

    Vous aimerez peut-être aussi