FIRE ALARM

A Minor Project Submitted in partial fulfillment of the requirement for the award of Degree of Bachelor of Engineering in Electronics & Communication Submitted to

RAJIV GANDHI PROUDYOGIKI VISHWAVIDHYALAYA BHOPAL (M.P.) Submitted By

Under the supervision of Prof.

Department of Electronics and Communication Engineering

Technocrats Institute of Technology, Bhopal Technocrats Institute of Technology, Bhopal

Electronics and Communication Engineering

CERTIFICATE

This is to certify that the work embodies in this Minor Project entitled Fire Alarm being submitted by Varun Shrivastava (0111EC091113) in partial fulfillment of the requirement for the award of Bachelor of Engineering in Electronics & Communication to Rajiv Gandhi Proudyogiki Vishwavidyalaya, Bhopal (M.P.) during the academic year 2012 is a record of bonafide piece of work, carried out by him under my supervision and guidance in the Department of Electronics & Communication Engineering, Technocrats Institute of Technology, Bhopal.

Approved and supervised by

Prof. Vikas Gupta HOD (ECE) TIT,Bhopal

Prof. Roop Singh Guide Asst. Prof. (ECE) TIT,Bhopal

Technocrats Institute of Technology, Bhopal

Electronics and Communication Engineering

DECLARATION
This is to certify that the project entitled Fire Alarm being submitted by 1 Varun Shrivastava 2 Swapnil Khaparde 3 Vikash Kumar 4 Vikram Jyoti Das 5 Sheetal Garg

In partial fulfillment of the requirement for the award of Bachelor of Engineering in Electronics & Communication to Rajiv Gandhi Proudyogiki Vishwavidyalaya, Bhopal (M.P.) during the academic year 2012 is a record of bonafide piece of work, carried out /developed in the institute itself. This is the original work and has not been carried at side the institute and not purchase readymade from other agencies. Students Name 1 Varun Shrivastava 2 Swapnil Khaparde 3 Vikash Kumar 4 Vikram Jyoti Das 5 Sheetal Garg
Above facts verified :

Roll Nos. 0111ec091113 0111ec091109 0111ec091114 0111ec091116

Signature

Sign Prof Ashish Singh Project Incharge

Sign Prof Roop Singh Guide (ECE)

ACKNOWLEDGEMENT

Indeed it is a matter of great felicity and privilege for me to take an opportunity to work under the guidance of Prof. Roop Singh, Asst. Professor, Electronics & Communication Engineering, TIT, Bhopal who constantly supported and encouraged at every step of dissertation. I would like to express my thanks to Dr. C.L. Saxena, Director TIT, Bhopal, for his highly supportive attitude. I would also like to acknowledge Dr. S. C. Shrivastava, Director P.G. Courses, TIT, Bhopal for his great cooperation and support. I acknowledge my gratitude and regards to Prof. Vikas Gupta who were kind enough to share the precious time as well as for the keen interest and continuous support extended. I am thankful to all the faculty members of Department of Electronics & Communication Engineering, TIT, Bhopal, who helped me in one or other way during the course of my study. And finally all glory to my Parents, Brother without their grace this work was merely a dream.

Place: TIT, Bhopal. Date: 22/04/2012

Varun Shrivastava Enroll. No.0111EC091113

CONTENTS

ABSTRACT List of Figure List of Table

i iii v

CHAPTER 1-INTRODUCTION
1.1 Principle of working

1-10

CHAPTER 2-Construction and working of project

2.1 Circuit block diagram 2.2 Circuit diagram 2.3 Component description

11-30

CHAPTER 3- Programming/ component description

3.1 Printed circuit board 3.2 Layout design 3.3 etching process 3.4 component assembly 3.5 soldering 3.6 PCB Layout 3.7 Testing and Verification

31-60

CHAPTER 4- Result and conclusion

4.1 conclusion 4.2 Application

61-65

CHAPTER 5- Bibliography

ABSTRACT

Heres a Fire Alarm that informs you regarding any fire accident in its vicinity.

It has an IC NE555, wired as an astable multivibrator oscillating in audio frequency band.

There is also a thermistor which acts as a sensor, in the fire alarm.

The circuit also has an 8 ohms, 1 watt speaker for the notification of the fire.

CHAPTER -1
Principle of Working

In this fire alarm circuit, a thermistor works as the heat sensor. When temperature increases, its resistance decreases, and vice versa. At normal temperature, the resistance of the thermistor (TH1) is approximately 10 kilo-ohms, which reduces to a few ohms as the temperature increases beyond 100C. The circuit uses readily available components and can be easily constructed on any general-purpose PCB.

Timer IC NE555 (IC1) is wired as an astable multivibrator oscillating in audio frequency band. Switching transistors T1 and T2 drive multivibrator NE555 (IC1). The output of IC1 is connected to npn transistor T3, which drives the loudspeaker (LS1) to generate sound. The frequency of IC1 depends on the values of resistors R5 and R6 and capacitor C2.

When thermistor TH1 becomes hot, it provides a low-resistance path to extend positive voltage to the base of transistor T1 via diode D1 and resistor R2. Capacitor C1 charges up to the positive voltage and increases the on time of alarm. The higher the value of capacitor C1, the higher the forward voltage applied to the base of transistor T1 (BC548).

Since the collector of transistor T1 is connected to the base of transistor T2, transistor T2 provides positive voltage to reset pin 4 of IC1 (NE555). Resistor R4 is used such that IC1 remains inactive in the absence of positive voltage. Diode D1 stops discharging of capacitor C1 when the thermistor connected to the positive supply cools down and provides a high-resistance (10-kilo-ohm) path. It also stops the conduction of T1. To prevent the thermistor from melting, wrap it up in mica tape.

The circuit works off a 6V-12V regulated power supply. LED1 is used to indicate that power to the circuit is switched on.

CHAPTER-2
Circuit Block Diagram

Circuit Diagram

Component Description
About NE555 Timer

The 555 Timer IC is an integrated circuit (chip) implementing a variety of timer and multivibrator applications. The IC was designed by Hans R. Camenzind in 1970 and brought to market in 1971 by Signetics (later acquired by Philips).

The original name was the SE555 (metal can)/NE555 (plastic DIP) and the part was described as "The IC Time Machine".

It has been claimed that the 555 gets its name from the three 5 k resistors used in typical early implementations, but Hans Camenzind has stated that the number was arbitrary.

The part is still in wide use, thanks to its ease of use, low price and good stability. As of 2003, it is estimated that 1 billion units are manufactured every year.

IC NE555 Operating Modes

Monostable mode- In this mode, the 555 functions as a "one-shot". Applications include timers, missing pulse detection, bouncefree switches, touch switches, frequency divider, capacitance measurement, pulse-width modulation (PWM) etc.

Astable Free running mode: the 555 can operate as an oscillator. Uses include LED and lamp flashers, pulse generation, logic clocks, tone generation, security alarms, pulse position modulation, etc.

Bistable mode or Schmitt trigger- The 555 can operate as a flip-flop, if the DIS pin is not connected and no capacitor is used. Uses include bouncefree latched switches, etc.

Pin Name Purpose

GND

Ground, low level (0 V)

TRIG

OUT rises, and interval starts, when this input falls below 1/3 VCC.

OUT

This output is driven to +VCC or GND.

RESET A timing interval may be interrupted by driving this input to GND.

CTRL

"Control" access to the internal voltage divider (by default, 2/3 VCC).

THR

The interval ends when the voltage at THR is greater than at CTRL.

DIS

Open collector output; may discharge a capacitor between intervals.

V+, VCC Positive supply voltage is usually between 3 and 15 V.

Fig 1. IC NE555 in Astable Multivibrator Mode

Thermistor

A thermistor is a type of resistor whose resistance varies significantly with temperature, more so than in standard resistors. The word is aportmanteau of thermal and resistor. Thermistors are widely used as inrush current limiters, temperature sensors, self-resetting overcurrent protectors, and self-regulating heating elements.

Thermistors differ from resistance temperature detectors (RTD) in that the material used in a thermistor is generally a ceramic or polymer, while RTDs use pure metals. The temperature response is also different; RTDs are useful over larger temperature ranges, while thermistors typically achieve a higher precision within a limited temperature range, typically 90 C to 130 C.[1]

Basic Operation of Thermistor

Assuming, as a first-order approximation, that the relationship between resistance and temperature is linear, then:

Where, = change in resistance = change in temperature = first-order temperature coefficient of resistance

Thermistors can be classified into two types, depending on the sign of . If

is positive, the

resistance increases with increasing temperature, and the device is called a positive temperature coefficient (PTC) thermistor, or posistor. If is negative, the resistance decreases with

increasing temperature, and the device is called a negative temperature coefficient (NTC) thermistor. Resistors that are not thermistors are designed to have a as close to zero as

possible, so that their resistance remains nearly constant over a wide temperature range.

Thermistor symbol

ABOUT LS1 SPEAKER

A speaker is an electro acoustic transducer that produces sound in response to an electrical audio signal input.

To adequately reproduce a wide range of frequencies, most loudspeaker systems employ more than one driver, particularly for higher sound pressure level or maximum accuracy.

A loudspeaker system with n separate frequency bands is described as "n-way speakers": a two-way system will have a woofer and a tweeter; a three-way system employs a woofer, a mid-range, and a tweeter.

The most common type of driver uses a light weight diaphragm, or cone, connected to a rigid basket, or frame, via a flexible suspension that constrains a coil of fine wire to move axially through a cylindrical magnetic gap.

ABOUT CAPACITORS

Capacitors are components that are used to store an electrical charge and are used in timer circuits.

A capacitor may be used with a resistor to produce a timer. Sometimes capacitors are used to smooth a current in a circuit as they can prevent false triggering of other components such as relays.

When power is supplied to a circuit that includes a capacitor - the capacitor charges up. When power is turned off the capacitor discharges its electrical charge slowly.

ABOUT RESISTORS

Resistors determine the flow of current in an electrical circuit.

Where there is high resistance in a circuit the flow of current is small, where the resistance is low the flow of current is large.

Resistors are used for regulating current and they resist the current flow and the extent to which they do this is measured in ohms (). Resistors are found in almost every electronic circuit.

The most common type of resistor consists of a small ceramic (clay) tube covered partially by a conducting carbon film. The composition of the carbon determines how much current can pass through.

About Transistors
A transistor is a semiconductor device used to amplify and switch electronic signals and power. It is composed of a semiconductor material with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals changes the current flowing through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.

The transistor is the fundamental building block of modern electronic devices, and is ubiquitous in modern electronic systems. Following its development in the early 1950s the transistor revolutionized the field of electronics, and paved the way for smaller and cheaper radios, calculators, and computers, among other things.

Transistor as an amplifier

Amplifier circuit, common-emitter configuration.

The common-emitter amplifier is designed so that a small change in voltage (Vin) changes the small current through the base of the transistor; the transistor's current amplification combined with the properties of the circuit mean that small swings in Vin produce large changes in Vout. .

CHAPTER-3

ABOUT PCB LAYOUT

The connections on the PCB should be identical to the circuit diagram, but while the circuit diagram is arranged to be readable, the PCB layout is arranged to be functional, so there is rarely any visible correlation between the circuit diagram and the layout.

PCB layout can be performed manually (using CAD) or in combination with an Autorouter. The best results are usually still achieved using atleast some manual routing - simply because the design engineer has a far better judgement of how to arrange circuitry.

Different methods of PCB construction-

Conventional A rigid PCB (usually of thickness 1.6mm), with wire-leaded components mounted on only one side of the PCB, with all the leads through holes, soldered and clipped. Conventional circuitry is generally easier to debug and repair than Surface mount. Surface Mount Technology (SMT) or devices (SMD) A PCB with tag-leaded components soldered flush to PCB pads. Holes are still needed on the PCB, but not where the component leads are attached. Surface mount circuitry is generally smaller than conventional. Surface mount is generally more suited to automated assembly than conventional.

Surface mount & conventional mix In practice, most boards are a mix of surface mount and conventional components. This can have its disadvantages as the two technologies require different methods of insertion and soldering. Double sided Laminate A bare PCB laminate having tracks on both sides, normally with PTH holes connecting circuitry on the two sides together. Double sided Component Assembly Mounting components on both sides of the PCB. Normally only surface mount circuitry would be mounted on both sides of a PCB, but some conventional components (such as LEDs) may be mounted on the reverse of a PCB to suit the enclosure design. Multi-layer A PCB Laminate may be manufactured with more than two layers of copper tracks by using a sandwich construction. The cost of the laminate reflects the number of layers. The extra layers may be used to route more complicated circuitry, and/or distribute the power supply more effectively. Gold plated Certain areas on a PCB may be gold plated for use as contact pads or as a ROHS-compliant board finish. If a thicker gold plating is required (for instance a quality 50um contact) an electrolytic process is needed. Normally this is limited to pads on the edge of a PCB, as an electrolytic plating bar must be attached to the pads, and then removed part way through the PCB manufacturing process. Gold plating normally needs a nickel underplate or the Gold quickly disappears through migration effects into the underlying copper.

Immersion Silver plating A ROHS-compliant board finish that is a cost effective alternative to Gold ROHS Compliance Simple definition: Getting rid of the Lead in PCBs and components which poisons groundwater when it leaches out of discarded boards put in landfill waste dumps. Actually, lead is not the only substance covered, but it is the main one. Frankly it would also help if people stopped throwing away so much electronics, and that would be helped if boards were made to last. Flexible PCB A technique used extensively with membrane keyboards, combination connector/circuit boards, and circuit boards to fit in awkward shapes - e.g. cameras. Chip On Board (COB) Where the IC die is attached direct to a PCB, and bond out wires from the IC connect directly to PCB lands. The chip is then covered with a black blob of epoxy. A technique used mostly with very high volume, cost sensitive applications, e.g. musical greeting cards. Phenolic PCB As distinct from Fibreglass, Phenolic is a cheaper PCB laminate material. Daughterboard A circuit board mounted to another circuit board - such as a plug in card.

ABOUT PCB DESIGN

Printed circuit board (PCB) is a component made of one or more layers of insulating material with electrical conductors.

The insulator is typically made on the base of fiber reinforced resins, ceramics, plastic, or some other dielectric materials. During manufacturing, the portions of conductors that are not needed are etched off, leaving printed circuits that connect electronic components.

The width of the circuit conductors should be chosen based on maximum temperature rise at the rated current and an acceptable impedance. The spacing between the PC traces is determined by peak working voltage, the coating, location of the circuit, and the product application.

Depending on the application and product end use, other standards may also apply. For example, for mains-powered or battery-powered information technology equipment, the creepage and clearance requirements of IEC/UL 60950-1 shall take precedence over IPC.

Auto placement may be done for most parts of control circuits, but power, ground and high di/dt circuits should be routed by hand.

ABOUT ETCHING PROCESS

Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away. The simplest method, used for small-scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates. As more copper is consumed from the boards, the etchant becomes saturated and less effective; different etchants have different capacities for copper, with some as high as 150 grams of copper per litre of solution. In commercial use, etchants can be regenerated to restore their activity, and the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of used etchant, which is corrosive and toxic due to its metal content. The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent traces when closely spaced. Overhang can be removed by wire-brushing the board after etching.

ABOUT SOLDERING TECHNIQUE

Soldering is the only permanent way to fix components to a circuit. However, soldering requires a lot of practice as it is easy to destroy many hours preparation and design work by poor soldering. If you follow the guidelines below you have a good chance of success.

1. Use a soldering iron in good condition. Inspect the tip to make sure that it is not past good operation. If it looks in bad condition it will not help you solder a good joint. The shape of the tip may vary from one soldering iron to the next but generally they should look clean and not burnt.

2. A PCB eraser is used to remove any film from the tracks. This must be done carefully because the film will prevent good soldering of the components to the PCB. The tracks can be

checked using a magnifying glass. If there are gaps in the tracks, sometimes they can be repaired using wire but usually a new PCB has to be etched.

3. Place the PCB, with its components in position, in the bull clip. This will steady the PCB when you try to use the soldering iron.

4. The heated soldering iron should then be placed in contact with the track and the component and allowed to heat them up. Once they are heated the solder can be applied. The solder should flow through and around the component and the track

5. Having completed soldering the circuit the extended legs on the components need to be trimmed using wire clippers. The circuit is now ready for testing.

PCB LAYOUT

Testing and Verification

The Fire alarm has been tested by bringing a flamed matchstick close to the thermistor. The thermistor detected the heat and lowered its resistance. The current then amplified by the set of transistors was then applied to the port 4. Then the square wave output of the NE555 timer from the port 3 is amplified by the transistor SLB100B, and then applied to the speaker, which emits a sound which acts as a notification for the users of the fire.

Since the fire alarm detected the change in temperature and alarmed the user nearby regarding the danger, hence the fire alarm has been verified for usage in any kind of surrounding requiring fire detection.

CHAPTER-4
Conclusion

The fire alarm has been verified and can be suitably used in different locations whether domestic or commercial. The alarm successfully detects the rise in temperature and creates a sound to notify the people in its vicinity.