Académique Documents
Professionnel Documents
Culture Documents
www.sensorsportal.com
Editors-in-Chief: professor Sergey Y. Yurish,
Phone: +34 696067716, fax: +34 93 4011989, e-mail: editor@sensorsportal.com
ISSN 1726-5479
Editors for Western Europe Meijer, Gerard C.M., Delft University of Technology, The Netherlands Ferrari, Vittorio, Universit di Brescia, Italy Editor South America Costa-Felix, Rodrigo, Inmetro, Brazil Editor for Eastern Europe Sachenko, Anatoly, Ternopil State Economic University, Ukraine
Editors for North America Datskos, Panos G., Oak Ridge National Laboratory, USA Fabien, J. Josse, Marquette University, USA Katz, Evgeny, Clarkson University, USA Editor for Asia Ohyama, Shinji, Tokyo Institute of Technology, Japan Editor for Asia-Pacific Mukhopadhyay, Subhas, Massey University, New Zealand
Kim, Min Young, Kyungpook National University, Korea South Ko, Sang Choon, Electronics and Telecommunications Research Institute, Korea South Kockar, Hakan, Balikesir University, Turkey Kotulska, Malgorzata, Wroclaw University of Technology, Poland Kratz, Henrik, Uppsala University, Sweden Kumar, Arun, University of South Florida, USA Kumar, Subodh, National Physical Laboratory, India Kung, Chih-Hsien, Chang-Jung Christian University, Taiwan Lacnjevac, Caslav, University of Belgrade, Serbia Lay-Ekuakille, Aime, University of Lecce, Italy Lee, Jang Myung, Pusan National University, Korea South Lee, Jun Su, Amkor Technology, Inc. South Korea Lei, Hua, National Starch and Chemical Company, USA Li, Genxi, Nanjing University, China Li, Hui, Shanghai Jiaotong University, China Li, Xian-Fang, Central South University, China Liang, Yuanchang, University of Washington, USA Liawruangrath, Saisunee, Chiang Mai University, Thailand Liew, Kim Meow, City University of Hong Kong, Hong Kong Lin, Hermann, National Kaohsiung University, Taiwan Lin, Paul, Cleveland State University, USA Linderholm, Pontus, EPFL - Microsystems Laboratory, Switzerland Liu, Aihua, University of Oklahoma, USA Liu Changgeng, Louisiana State University, USA Liu, Cheng-Hsien, National Tsing Hua University, Taiwan Liu, Songqin, Southeast University, China Lodeiro, Carlos, Universidade NOVA de Lisboa, Portugal Lorenzo, Maria Encarnacio, Universidad Autonoma de Madrid, Spain Lukaszewicz, Jerzy Pawel, Nicholas Copernicus University, Poland Ma, Zhanfang, Northeast Normal University, China Majstorovic, Vidosav, University of Belgrade, Serbia Marquez, Alfredo, Centro de Investigacion en Materiales Avanzados, Mexico Matay, Ladislav, Slovak Academy of Sciences, Slovakia Mathur, Prafull, National Physical Laboratory, India Maurya, D.K., Institute of Materials Research and Engineering, Singapore Mekid, Samir, University of Manchester, UK Melnyk, Ivan, Photon Control Inc., Canada Mendes, Paulo, University of Minho, Portugal Mennell, Julie, Northumbria University, UK Mi, Bin, Boston Scientific Corporation, USA Minas, Graca, University of Minho, Portugal Moghavvemi, Mahmoud, University of Malaya, Malaysia Mohammadi, Mohammad-Reza, University of Cambridge, UK Molina Flores, Esteban, Benemrita Universidad Autnoma de Puebla, Mexico Moradi, Majid, University of Kerman, Iran Morello, Rosario, University "Mediterranea" of Reggio Calabria, Italy Mounir, Ben Ali, University of Sousse, Tunisia Mulla, Imtiaz Sirajuddin, National Chemical Laboratory, Pune, India Neelamegam, Periasamy, Sastra Deemed University, India Neshkova, Milka, Bulgarian Academy of Sciences, Bulgaria Oberhammer, Joachim, Royal Institute of Technology, Sweden Ould Lahoucine, Cherif, University of Guelma, Algeria Pamidighanta, Sayanu, Bharat Electronics Limited (BEL), India Pan, Jisheng, Institute of Materials Research & Engineering, Singapore Park, Joon-Shik, Korea Electronics Technology Institute, Korea South Penza, Michele, ENEA C.R., Italy Pereira, Jose Miguel, Instituto Politecnico de Setebal, Portugal Petsev, Dimiter, University of New Mexico, USA Pogacnik, Lea, University of Ljubljana, Slovenia Post, Michael, National Research Council, Canada Prance, Robert, University of Sussex, UK Prasad, Ambika, Gulbarga University, India Prateepasen, Asa, Kingmoungut's University of Technology, Thailand Pullini, Daniele, Centro Ricerche FIAT, Italy Pumera, Martin, National Institute for Materials Science, Japan Radhakrishnan, S. National Chemical Laboratory, Pune, India Rajanna, K., Indian Institute of Science, India Ramadan, Qasem, Institute of Microelectronics, Singapore Rao, Basuthkar, Tata Inst. of Fundamental Research, India Raoof, Kosai, Joseph Fourier University of Grenoble, France Reig, Candid, University of Valencia, Spain Restivo, Maria Teresa, University of Porto, Portugal Robert, Michel, University Henri Poincare, France Rezazadeh, Ghader, Urmia University, Iran Royo, Santiago, Universitat Politecnica de Catalunya, Spain Rodriguez, Angel, Universidad Politecnica de Cataluna, Spain Rothberg, Steve, Loughborough University, UK Sadana, Ajit, University of Mississippi, USA Sadeghian Marnani, Hamed, TU Delft, The Netherlands
Sandacci, Serghei, Sensor Technology Ltd., UK Saxena, Vibha, Bhbha Atomic Research Centre, Mumbai, India Schneider, John K., Ultra-Scan Corporation, USA Seif, Selemani, Alabama A & M University, USA Seifter, Achim, Los Alamos National Laboratory, USA Sengupta, Deepak, Advance Bio-Photonics, India Shearwood, Christopher, Nanyang Technological University, Singapore Shin, Kyuho, Samsung Advanced Institute of Technology, Korea Shmaliy, Yuriy, Kharkiv National Univ. of Radio Electronics, Ukraine Silva Girao, Pedro, Technical University of Lisbon, Portugal Singh, V. R., National Physical Laboratory, India Slomovitz, Daniel, UTE, Uruguay Smith, Martin, Open University, UK Soleymanpour, Ahmad, Damghan Basic Science University, Iran Somani, Prakash R., Centre for Materials for Electronics Technol., India Srinivas, Talabattula, Indian Institute of Science, Bangalore, India Srivastava, Arvind K., Northwestern University, USA Stefan-van Staden, Raluca-Ioana, University of Pretoria, South Africa Sumriddetchka, Sarun, National Electronics and Computer Technology Center, Thailand Sun, Chengliang, Polytechnic University, Hong-Kong Sun, Dongming, Jilin University, China Sun, Junhua, Beijing University of Aeronautics and Astronautics, China Sun, Zhiqiang, Central South University, China Suri, C. Raman, Institute of Microbial Technology, India Sysoev, Victor, Saratov State Technical University, Russia Szewczyk, Roman, Industrial Research Inst. for Automation and Measurement, Poland Tan, Ooi Kiang, Nanyang Technological University, Singapore, Tang, Dianping, Southwest University, China Tang, Jaw-Luen, National Chung Cheng University, Taiwan Teker, Kasif, Frostburg State University, USA Thumbavanam Pad, Kartik, Carnegie Mellon University, USA Tian, Gui Yun, University of Newcastle, UK Tsiantos, Vassilios, Technological Educational Institute of Kaval, Greece Tsigara, Anna, National Hellenic Research Foundation, Greece Twomey, Karen, University College Cork, Ireland Valente, Antonio, University, Vila Real, - U.T.A.D., Portugal Vaseashta, Ashok, Marshall University, USA Vazquez, Carmen, Carlos III University in Madrid, Spain Vieira, Manuela, Instituto Superior de Engenharia de Lisboa, Portugal Vigna, Benedetto, STMicroelectronics, Italy Vrba, Radimir, Brno University of Technology, Czech Republic Wandelt, Barbara, Technical University of Lodz, Poland Wang, Jiangping, Xi'an Shiyou University, China Wang, Kedong, Beihang University, China Wang, Liang, Advanced Micro Devices, USA Wang, Mi, University of Leeds, UK Wang, Shinn-Fwu, Ching Yun University, Taiwan Wang, Wei-Chih, University of Washington, USA Wang, Wensheng, University of Pennsylvania, USA Watson, Steven, Center for NanoSpace Technologies Inc., USA Weiping, Yan, Dalian University of Technology, China Wells, Stephen, Southern Company Services, USA Wolkenberg, Andrzej, Institute of Electron Technology, Poland Woods, R. Clive, Louisiana State University, USA Wu, DerHo, National Pingtung Univ. of Science and Technology, Taiwan Wu, Zhaoyang, Hunan University, China Xiu Tao, Ge, Chuzhou University, China Xu, Lisheng, The Chinese University of Hong Kong, Hong Kong Xu, Tao, University of California, Irvine, USA Yang, Dongfang, National Research Council, Canada Yang, Wuqiang, The University of Manchester, UK Yang, Xiaoling, University of Georgia, Athens, GA, USA Yaping Dan, Harvard University, USA Ymeti, Aurel, University of Twente, Netherland Yong Zhao, Northeastern University, China Yu, Haihu, Wuhan University of Technology, China Yuan, Yong, Massey University, New Zealand Yufera Garcia, Alberto, Seville University, Spain Zagnoni, Michele, University of Southampton, UK Zamani, Cyrus, Universitat de Barcelona, Spain Zeni, Luigi, Second University of Naples, Italy Zhang, Minglong, Shanghai University, China Zhang, Qintao, University of California at Berkeley, USA Zhang, Weiping, Shanghai Jiao Tong University, China Zhang, Wenming, Shanghai Jiao Tong University, China Zhang, Xueji, World Precision Instruments, Inc., USA Zhong, Haoxiang, Henan Normal University, China Zhu, Qing, Fujifilm Dimatix, Inc., USA Zorzano, Luis, Universidad de La Rioja, Spain Zourob, Mohammed, University of Cambridge, UK
Sensors & Transducers Journal (ISSN 1726-5479) is a peer review international journal published monthly online by International Frequency Sensor Association (IFSA). Available in electronic and on CD. Copyright 2009 by International Frequency Sensor Association. All rights reserved.
Contents
Volume 107 Issue 8 August 2009
www.sensorsportal.com
ISSN 1726-5479
Research Articles
Precise Frequency and Period Measurements for Slow Slew Rate Signals Based on the Modified Method of the Dependent Count Sergey Y. Yurish .. Electronic Nose Technology and its Applications Esmaeil Mahmoudi ............................................................................................................................. Electronic Nose Study of Powdered Garlic Rosa E. Baby, Mara M. Sance, Mnica Bauz, Valeria M. Messina, Alvaro R. Gmez, Jos L. Burba, Noem E. Walse de Reca......................................................................................... Effects of Radiation on Silicon Pressure Sensor Jaspreet Singh, M. M. Nayak, K. Nagachenchaiah, K. Rajanna ........................................................ Design of a PC Based Pressure Indicator Using Inductive Pick-up type Transducer and Bourdon Tube Sensor S. C. Bera, N. Mandal, R. Sarkar and S. Maity .................................................................................. Problem of Piezoelectric Sensitivity of 13-type Composites Vitaly Yu. Topolov and Anatoly E. Panich. ......................................................................................... Development of a Surface Micromachined On-Chip Flat Disk Micropump M. I. Kilani, A. T. Al-Halhouli, P. C. Galambos, Y. S. Haik, A. Al-Salaymeh and S. ttgenbach ....... Humidity Sensing Behavior of Polyaniline / Strontium Arsenate Composites Machappa T., M. Sasikala, Koppalkar R. Anilkumar, M. V. N. Ambika Prasad ................................. Oxygen Sensing Properties of the WO3 Thick Films R. S. Khadayate, S. K. Disawal and P. P. Patil .................................................................................. Optimization of Firing Temperature of PbO-doped SnO2 Sensor for Detection of Acetone, Methanol, Propanol J. K. Srivastava, Preeti Pandey, V. N. Mishra and R. Dwivedi........................................................... Sol gel Synthesis of Tungsten Oxide Thin Film in Presence of Surfactant for NO2 Detection Vibha Srivastava, A. K. Srivastava, K. N. Sood, Kiran Jain ............................................................... Epinephrine Biosensor Using Tyrosinase Immobilized Eggshell Membrane Sanket Tembe, Sudha Kulkarni, Meena Karve, S. F. DSouza.......................................................... Finite Element Analyses of a Flat Spring for use in an Electromagnetic Microgenerator Nibras Awaja, Dinesh Sood, Thurai Vinay ......................................................................................... Design and Development of a Step Climbing Wheeled Robot Srijan Bhattacharya, Sagarika Pal, Subrata Chattopadhyay..............................................................
17
26
35
42
52
64
77
86
92
99
111
119
133
Enhancement of Heat Exchanger Control using Improved PID Controller Gopalakrishna G., Sivakumaran N. and *Sivashanmugam P. ........................................................... Speech Disability Threshold Determination by Graphical and DSP Techniques Anandthirtha. B. Gudi and H. C. Nagaraj ........................................................................................... Smart Wireless Sensors Integrated in Clothing: an Electrocardiography System in a Shirt Powered Using Human Body Heat Vladimir Leonov, Tom Torfs, Chris Van Hoof and Ruud J. M. Vullers ...............................................
144
157
165
Authors are encouraged to submit article in MS Word (doc) and Acrobat (pdf) formats by e-mail: editor@sensorsportal.com Please visit journals webpage with preparation instructions: http://www.sensorsportal.com/HTML/DIGEST/Submition.htm
International Frequency Sensor Association (IFSA).
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
Abstract: This paper represents a study on design aspects of flat spring, which is the active component of electromagnetic microgenerator, through comprehensive finite element analyses. The electromagnetic microgenerator performs as a transducer that converts ambient vibrational energy to electrical power. A Model of flat spring is developed and used in the finite element analyses study utilizing ANSYS software. The structural analysis has been carried out to analyze different flat spring designs and evaluate the flat spring characteristics to provide an optimum spring model. Maximum static deflection was found to be 13.43 m is under the gravitational force. Furthermore, free vibration characteristics of the selected spring are presented to determine the resonance frequency. Natural frequency of 18.56 Hz was obtained. The simulation results show that the electromagnetic microgenerator can generate 14.5 nW at an input frequency of 3 kHz. Copyright 2009 IFSA. Keywords: Micro power generator, Micro spring design, and Mechanical vibration.
1. Introduction
Over the past few years, there has been a huge reduction in size and power consumption of MEMS [Micro Electro Mechanical Systems] devices like transducers and sensors. These devices are usually designed to run on batteries but the replacement of batteries is not practical. The limited lifespan of batteries may induce a costly maintenance, in the case of contaminated areas for instance. Moreover, batteries dying without warning cause serious problems in safety monitoring applications. That led to a surge of research in the area of energy harvesting. Since mechanical vibrations exist in most systems, many researches focused on vibration-driven generators. The main design concept of the vibration
119
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
based generator utilizes the free vibration available in the environment to produce movement and convert this movement of a suspended mass into electrical power. The mechanical to electrical power converter based on an electromagnetic induction or piezoelectric material or an electrostatic material [1-23]. The electromagnetic induction is well suite for the mechanical to electrical energy conversion and it is the focus of this paper. Silicon micro beam mass structures are mechanical structures where linear elastic theory is generally applicable. However, to use them as a functional systems against a set design of specifications is extremely complicated exercise due to their small sizes and the difficulties of using traditional mechanical performance and diagnostic methods [24]. Finite Element-Analysis (FEA) CAD systems with sophisticated mechanical modeling capabilities allow designers to quantitatively predict the effects of process variations, and the optimize device performance. Thus, it has been a widely used tool in the design and modeling of mechanical structures. There are several commercially available software packages such as ANSYS, NASTRAN, COSMOS, and ABAQUS. A number of groups have reported the application of FEA for modeling the static and dynamic characteristics of microstructures [25-32]. This paper presents details of the mechanical analyses performed on the flat spring. The basic theory of the static modeling of the flat spring were studied and presented. The design objectives and specifications of the flat spring to be used in the electromagnetic micro generator were discussed. The key design parameters such as static deflection, spring constant, resonant frequency, and dynamic range were investigated. A linear analytical model is developed for the flat spring with different beam configurations. A series of structural and vibration analyses were carried out using ANSYS to evaluate the flat spring characteristics.
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
The deflection and the linear movement of the spring could be increased by employing a cantilever spring. The spring must have a maximum deflection within the generator size to make the magnet moves as close as possible to the coil to increase the induced flux. The spring should be designed so that the resonant frequency of the device matches the vibration frequency of the source.
5. Spring Modeling
5.1. Basic Theory of the Mechanical Spring Design The static deflection of the flat spring D is given by the basic expression of undamped spring-mass system:
D = F /k,
(1)
where D is the static deflection of the spring, F is the applied force and k is the spring constant. The deflection of the cantilever beam for the case of a concentrated force F applied at the free end of the beam as shown in Fig. 2 is given by Equation (2): D= Fl 3 , 3EI (2)
where l is the length of the beam, I is the second moment of area of the cross section of the beam, and E is Young Modulus of the material of the beam.
121
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
Fig. 2. Basic diagram of the deflection of cantilever beam with concentrated force F applied at the free end of the beam and Moment M applied at the free end of the beam.
For a four beams spring, the spring constant, k can be approximated by [33]: k= 4 Eb 3 w , l3 (3)
where b, w and l are the thickness, width and mean length of the spring beam and E is the modulus of elasticity of the spring material. By substituting the spring constant equation (3) in equation (1) which is the static deflection equation of one beam gives the static deflection for the four beams mass springs.
D = Fl 3 / 4 Eb 3 w
(4)
As shown in Equation (4), the spring static deflection is proportional to l and inversely proportional to b and w. Therefore, the thickness, width and length of the beams are the most dominant factors to determine the deflection. In order to get large deflection, the beams have to be longer and thinner. The thickness of the beam was chosen to be 10 m as it is limited by the etching process. The beam width was chosen to be 200 m in order to satisfy the requirement of etching mask design.
5.2. Initial Structural Design of the Flat Spring Fig. 3 shows the flat spring with a center platform and four beams or cantilevers, the spring cantilevers are fixed from one end and free from the other end where they are connected to the platform. The permanent magnet mass is on the platform. The initial outer dimensions of the springs were chosen to be 2600 m 2600 m with 100 m gap between the beams and 200 m between the beams and the rectangular platform. The platform dimension is fixed to be 1000 m 1000 m, which is enough to accommodate an 800 m 800 m 1200 m permanent magnet. The beam mean length is varying from 3800 m to 4300 m according to the beams configuration. Fig. 4 shows the four spring shapes which were selected for more study and investigation using the finite elements analysis software ANSYS. In Fig. 4.a and b the springs have a platform and four L-shaped beams while, Fig. 4.c and d the springs have a platform with four meander shaped beams. The idea behind changing the beams configuration is to get longer beam in a limited area.
122
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
5.3. Material Selection Large mass deflection and high resonance frequency of the flat spring are the goals of designing the spring and it is highly dependent on the material properties. In comparing different materials a few fundamental material properties are important like Youngs modulus (E) which decides the stiffness of the spring. To achieve this, different materials have been considered. Their relevant properties are summarized in Table 1 [35], [36]. SU-8, Gallium Arsenide (GaAs) and copper (Cu) have lower youngs modulus than silicon that make the spring able to give larger deflection with the same applied force. However, these materials have very low yield strength in comparison to the silicon yield strength. GaAs is an expensive material and requires a very difficult fabrication processes and SU-8 has the problem of removal after fabrication. Therefore, silicon was chosen as the preferred material for the spring as it has good mechanical properties such as high yield strength and low mechanical losses. At room temperature and under applied load, silicon can only be elastically deformed. Moreover silicon is relatively inexpensive material and has available standard processes of fabrication [35], [37].
123
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
5.4. Spring Model Definition in ANSYS The aim of using the finite-element method is to gain a deeper understanding of flat spring mechanical characteristics. To achieve this aim, a 2D finite-element model was prepared using the same specification as described in section IV All finite-element simulations performed were conducted using two different analyses firstly, structural analysis; this technique is used to determine the displacement and the deflection of a structure under the gravitational force. Secondly, frequency analysis, that is used to determine the vibration modes under the free vibration. Fig. 5 shows ANSYS model where the model is solved to find the simulation results of the maximum static deflection of the four springs. Fig. 5 also illustrates a 3D structural descriptions prepared in ANSYS. It has a cantilever beam configuration with a platform in the middle. A rectangular magnet is attached to that platform.
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
displacement on the ends of the model is constrained to be zero. The gravitational force due to the magnet weight is represented by a pressure (8.979E-5 MPa) in the Z-direction. Fig. 6 shows the simulation results of the spring static deflection. The spring deflection is represented by a deformed area of each spring in the z-direction and it is clearly shown from the side view of each spring. Fig. 6.a and b represent the deflection of the springs with L_shaped (as shown in Fig 4.a, b) beam configuration, while Fig. 6.c and d represent the deflection of the springs with meander shaped beams (as shown in Fig 4.c, d). It is clearly observed that changing the beams configuration from L_shaped to meander has a great effect on the beam length and then on the output deflection. Therefore Fig. 6.a represents the spring with longer beam length and maximum deflection. From Table 2 the spring with large beam length which is L_shaped2 (as shown in Fig. 4.b) has the maximum deflection over the other springs. The deflection is found to mach up with theory shown in equation (4).
(a)
(b) Fig. 6 (a, b). ANSYS results of the static deflection of the flat spring: a) L-shaped1, b) L-shaped2.
125
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
1
DISPLACEMENT STEP=1 SUB =1 TIME=1 DMX =2.903 DEC 13 2005 11:43:18
Y Z
(c)
1
DISPLACEMENT STEP=1 SUB =1 TIME=1 DMX =7.333 DEC 5 2005 15:29:40
Y Z
(d) Fig. 6 (c, d). ANSYS results of the static deflection of the flat spring: c) meander1 d) meander 2.
Table 2. ANSYS results of maximum deflection in z-direction (D). Sprig shape Deflection(m) L-Shaped1 11.66 L-Shaped2 13.43 Meander1 5.11 Meander2 7.34
The same initial model of the four springs (as shown in Fig. 3) is then used to do structural static analysis. Table 1 showed different materials selected which are the most common materials used for mechanical structures in MEMS. These materials like [Silicon, Gallium Arsenide, Copper and SU-8] applied to all spring shapes. Each material has a Youngs Modulus (E) which has a great effect on the spring constant of the spring and then on the spring stiffness. Structural static analysis has been used to find out the most influential parameters on the spring deflection. Fig. 7 shows the ANSYS simulation results of the spring deflection in Z-direction by using different youngs modulus (E) of materials. It
126
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
can be seen that the spring with L_shaped beams has the maximum deflection among other types of springs.
900 Spring deflection in Z-dirction (micrometer) 800 700 600 500 400 300 200 100 0 Si GaAs Co Su8 Material type L_shape1 L_shape2 Meander1 Meander2
Fig. 8 shows the simulation results of static analysis of the four shapes of the flat springs by varying the length, width, thickness of the beam and the gaps between the beams. The analysis output is the maximum deflection in Z-direction of the flat spring under the gravitational force. It is clearly observed from Fig. 8.a that using springs with different beam length varied from 2600 m to 3000 m gives a great increase in the spring deflection. Fig. 8.b shows the deflection of the four springs, by increasing the thickness of the spring beam the deflection start to drop as it reached the value of less than 2 m with beam thickness of 25 m. Fig. 8.c presents the deflection of the springs by selecting springs beam widths start from 100 to 250. The deflection of the spring has the highest value at 32 m when the beam width is 100 m. Fig. 8.d shows that the deflection of the spring reached its highest value when the gap between the beams is the minimum. Fig. 7 and Fig. 8 are with a great agreement with the equations of spring constant and deflection 3 and 4. Therefore, youngs modulus, the thickness, length and the width of the beams are the most dominant factors to determine the deflection. Fig. 6, 7and 8 results conclude that the largest mass displacement could be obtained from L-Shaped2 spring (as shown in Fig. 4.b) which is 13.43m. That is because L-Shaped2 has the longest beam length among the other springs due to the way its beam folding. Based on the work of Williams et. al. [1], the amount of the power generated is proportional to the square of the peak mass displacement. Therefore, L-Shaped2 was chosen to study the vibration behaviour of this spring.
6.2. Vibration Analysis ANSYS Modal Analysis was used to study the free vibration characteristics of the flat spring and to select the desired mode of vibration. This analysis aimed to know the resonance situation of the spring where the electric power generation will be the maximum [3]. The studied model is L_ shaped2 (as shown in Fig. 4.b) spring with beam length (2600 m), beam width (200 m), and thickness (10 m). The resonant frequencies of the beam structured are calculated using Block Lanczos method, which is used as a mode extraction method to solve the eigen values.
127
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
25 20 15 10 5 0 2600 2800 2900 3000 Beam length (micrometer) L_shape1 L_shape2 Meander1 Meander2
14 S prin g d eflectio n in Z _directio n (m icro m eter) 12 10 8 6 4 2 0 10 15 20 25 Beam thickness(micrometer) L_shape1 L_shape2 Meander1 Meander2
(a)
S p rin g d eflectio n in Z _d irectio n (m icro m eter)
(b)
16 14 12 10 8 6 4 2 0 50 100 150 Gaps between the beams(micrometer) L_shape1 L_shape2 Meander1 Meander2
35 Spring deflection in Z_direction(m icrometer) 30 25 20 15 10 5 0 100 150 200 250 Beam width(micrometer) L_shape1 L_shape2 Meander1 Meander2
(c)
(d)
Fig. 8 ANSYS simulation results of spring deflection in Z_direction versus: (a) Beam length, (b) beam thickness (c) beam width (d) Gaps between beams.
The ANSYS calculation results in Fig. 9 show that the motion of the spring mass system (represented by the flat spring and the magnet) has three different resonant vibrations. Fig. 9.a shows the first resonance mode where the spring and the mass move in vertical direction while in Fig. 9.b, c it was observed that the spring mass system rotate and has second and third mode where the movement of the spring mass system is in horizontal direction. Table 3 shows the values of spring natural frequencies for the first three modes. It is clearly shown that the value of spring natural frequency in mode1 is less than its values in mode2 and mode3. The vibration results come with a great agreement with what was reported by Ching et al. [9], if a spring is designed to have movements in horizontal direction with rotation, rather than in vertical direction relative to the coil, the generator will have more movements and then it produces more power. This can be explained by Faradays law of induction which indicates that the voltage output should be proportional to the rate of changing magnetic of flux.
Table 3. ANSYS results of L-Shaped2 modal analysis. No. of modes Mode1 Mode2 Mode3 Natural frequency (Hz) 13.98 17.79 18.56 128
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
(a)
(b)
(c) Fig. 9. Simulation results of modal analysis of the L-shaped spring: (a) first mode shape, (b) second mode shape, (c) third mode shape.
129
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
7. Power Generation
Estimated output power has been calculated using the resonance frequencies of the L-Shaped2 spring. The power generating equation is given by Williams et. al. [3] Fig. 10 shows the output power generation as a function of resonance frequencies of the selected spring. The spring resonance frequency of L-Shaped2 is applied to equation (5) at input vibration frequency of 3 kHz with amplitude of 5 m. The spring mass system is assumed to be under damped so the damping ratio is assumed to be 0.3. It was observed that the output power in the first mode is less than the output power in the second and third modes. It shows clearly that the electromagnetic microgenerator will produce more power when the input vibration matches the spring resonance frequencies in the horizontal direction.
mY02 Paverage =
3 3 3 n
(5)
2 2 2 1 2 + 2 n n
Fig. 10. Calculated output power for the three different resonant frequency modes.
The out put power can be optimized by: 1) Increase the mass size within the device size. 2) Adjust the spring constant to make the generator resonance frequency match the frequency of the vibration source. 3) Select a permanent magnet with high flux density. 4) Increase the number of electrical coil turns and that could be achieved by using narrower tracks.
8. Conclusion
Theoretical static and dynamic considerations were presented to characterize the mechanical behaviour of a flat spring. The spring design objectives and considerations were presented which are suitable for the use in the electromagnetic microgenerator. Finite element analysis was used to determine the deflection and the maximum displacement in Z- direction. Four different designs of a flat spring were modeled and analyzed using ANSYS software. Maximum static deflection of 13.43 m was achieved by using L-shaped2 and under gravitational force. ANSYS Modal analysis was conducted to characterize the vibration behaviour of the spring and to choose the desirable mode of vibration. First three modes of the L-shaped2 spring were shown at the natural frequencies of 13.98 Hz, 17.79 Hz, and 18.56 Hz. By the study of the resonance frequency
130
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
modes of the spring, it is found that under gravitational force the mass can move in a horizontal direction with larger value of resonance frequency than in a vertical direction which gives the generator more movements and then more power production. Electromagnetic microgenerator conversion offers the potential for MEMS and sensors devices to be self-powered in many environments as the low level vibrations occur in many environments including large commercial buildings, automobiles, aircraft, ships, trains, and industrial environments.
References
[1]. C. B. Williams and R. B Yates, Analysis of a micro-electric generator for microsystems, Sens. Actuators, A, Vol. 52, 1996, pp. 8-11. [2]. C. Shearwood and R. B. Yates, Development of an electromagnetic microgenerator, Electronics Letters, Vol. 33, 1997, pp. 1883-1884. [3]. C. B. Williams, C. Shearwood, M. A. Harradine, P. H. Mellor, T. S. Birch, and R. B. Yates, Development of an electromagnetic micro-generator, IEE Proc. - Circuits Devices Syst., 2001, pp. 337-342. [4]. R. Amirtharajah and A. P. Chandrakasan, Self-powered signal processing using vibration-based power generation, Solid-State Circuits, IEEE Journal, Vol. 33, 1998, pp. 687-695. [5]. R. Amirtharajah, Design of low Power VLSI Systems Powered by Ambient Mechanical Vibration, PhD Thesis, Massachusetts Institute of technology, Department of Electrical Engineering, June, 1999. [6]. R. Amirtharajah, S. Meninger, J. O. Mur-Miranda, A. Chandrakasan, J. Lang, Micro power programmable DSP powered using a MEMS-based Vibration-to-Electricity Energy converter, in Proc. of the IEEE International Solid State Circuits Conference, 2000, pp. 362-363. [7]. W. J. Li, Z. Wen, P. K. Wong, G. M. H Chan and P. H. W. Leong, A micromachined vibration-induced power generator for low power sensors of robotic system, in Proc. Of the World Automation Congress: 8th International Symposium on Robotics with Applications, Hawaii, 2000. [8]. M. El-hami, P. Glynne-Jones, N. M. White, M. Hill, S. P. Beeby, E. James, A. D. Brown, and J. N. Ross, Design and fabrication of a new vibration-based electromechanical power generator, Sens. Actuators A, Vol. 92, 2001, pp. 335-342. [9]. N. N. H. Ching, H. Y. Wong, Li W. J., P. H. W. Leong, and Z. Wen, A laser-micromachined multi-modal resonating power transducer for wireless sensing systems, Sensors and Actuators, A, 2002, 3327, pp. 1-6. [10].M. Mizuno, and D. Chetwynd, Investigation of a resonance microgenerator, Journal of Micromechanics and Microengineering, Vol. 13, 2003, pp. 209-216. [11].H. Kulah, and K. Najafi, An electromagnetic micro power generator for low-frequency environmental vibrations, in Proc. of the Micro Electro Mechanical Systems-17th IEEE conf on MEMS, 2004. [12].W. S. Huang, K. E. Tzeng, M. C. Cheng and R. S. Huang, Design and fabrication of a vibrational microgenerator for wearable MEMS, in Proc. of Eurosensors XVII. 2003, Guimaraes, Portugal, 2003. [13].N. Awaja, D. K. Sood, T. Vinay, Modeling and simulation of a flat spring for use in an electromagnetic microgenerator, Smart Structures, Devices, and Systems II, Proceedings of SPIE, Vol. 5649, 2005, pp. 361-372. [14].A. Perez-Rodr, C. Serre, N. Fondevilla, C. Cereceda, J. R. Morante, J. Esteve and J. Montserrat, Design of electromagnetic inertial generators for energy scavenging applications, in Proc. of Eurosensors XIX, 2005, Barcelona, Spain. [15].S. Scherrer, D. G. Plumlee and A. J. Moll, Energy scavenging device in LTCC materials, in Proc. of the IEEE Workshop on Microelectronics and Electron Devices WMED '05, 2005. [16].S. P. Beeby, M. J. Tudor, E. Koukharenko, N. M. White, T. O'Donnell, C. Saha, S. Kulkarni and S. Roy, Micromachined silicon generator for harvesting power from vibration, in Proc. of Transducers 2005, Seoul, Korea. [17].S. Kulkarni, S. Roy, and T. O'Donnell, Vibration based electromagnetic micropower generator on silicon, Journal of Applied Physics, Vol. 99, 511, 2006. [18].P. H. Wang, X. H. DAi, D. M. Fang, and X. L. Zhao, Design, fabrication and performance of new vibration-based electromagnetic micro power generator, Microelectronics Journal, Vol. 38, 2007, pp. 1175-1180. [19].M. Umeda, K. Nakamura, S. Ueha, Energy storage characteristics of a piezo-generator using impact induced vibration, Jpn. J. Applied Physics, Vol. 36, 1997, pp. 3146-3151. 131
Sensors & Transducers Journal, Vol. 107, Issue 8, August 2009, pp. 119-132
[20].P. Glynne-jones, S. P. Beeby, and N. M. White, Towards a piezoelectric vibration-powered microgenerator, IEE proceedings, Vol. 148, 2001. [21].G. K. Ottman, H. F. Hofmann, and G. A. Lesieutre, Optimized piezoelectric energy harvesting circuit using step-down converter in discontinuous conduction mode, IEEE Transactions on power Electronics, 2003. [22].S. Meninger, J. O. Mur-Miranda, R. Amirtharajah, A. P. Chandrakasan and J. H. Lang, Vibration-toElectric Energy Conversion, IEEE Trans. VLSI Syst., Vol. 9, 2001, pp. 64-76. [23].S. Roundy, P. K. Wright, and J. Rabaey, A study of low level vibrations as a power source for wireless sensor nodes, Computer Communications, Vol. 26, 2003, pp. 1131-1144. [24].J. Bryzek, K. Petersen, and W. McCulley, Micromachines on the march, IEEE Spectrum, 1994, pp. 20-31. [25]. T. Tschan and N. D. Rooij, Characterization and modeling of silicon piezoresistive accelerometers fabricated by a bipolar-compatible process, Sensors and Actuators A, Vol. 25-27, 1991, pp. 605-609. [26].Chr. Burrer, J. Esteve, J. A. Plaza, M. Bao, O. Ruiz, and J. Samitier, Fabrication and characterization of twin-mass accelerometer, in Proc. of the 7th International Conference on Solid-state, Sensors and Actuators, 1993. Yokohama, Japan. [27].B. Pures and D. Lapadatu, Extremely miniaturized capacitive movement sensors using new suspension systems, Sensors and Actuators A, Vol. 41-42, 1994, pp. 129-135. [28].C. Shearwood, M. A. Pate, W. Affane, C. R. Whitehouse, J. Woodhead, and M. R. J. Gibbs, Electrostatic and magnetoelastic microactuation of Si3N4 bridges, Tech. Digest Transducer'95, 1995, Stockholm, Sweden. [29].G. Gendron, A review of four PC packages for FE structural analysis, Finite Elements in Analysis and Design, Vol. 28, 1997, pp. 105-114. [30].A. Vujanic, N. Adamovic, M. Jakovljevic, W. Berenner, G. Popovic and H. Detter, Silicon microstructure for precise measurements of mechanical moments, Microelectronics Journal, Vol. 31, 2000, pp. 975-980. [31].S. Park, K. Lee, J. Cho and S. Lee, Electromagnetic vibration transducer using polyimide elastic body for implantable middle ear hearing aid, Sensors and Actuators A, Vol. 97-98, 2002, pp. 201-207. [32].B. Bhushan and G. B. Agrawal, Finite element analysis of nanostructures with roughness and scratches, Ultramicroscopy, Vol. 97, 1-4, 2003, pp. 495-507. [33].A. Wagner and W. Benecke, Microfabricated actuator with moving permanent magnet, In IEEE Micro Electro Mechanical Systems'91, 1991, pp. 27-32.
___________________ 2009 Copyright , International Frequency Sensor Association (IFSA). All rights reserved. (http://www.sensorsportal.com)
132
Topics Covered Contributions are invited on all aspects of research, development and application of the science and technology of sensors, transducers and sensor instrumentations. Topics include, but are not restricted to: Physical, chemical and biosensors; Digital, frequency, period, duty-cycle, time interval, PWM, pulse number output sensors and transducers; Theory, principles, effects, design, standardization and modeling; Smart sensors and systems; Sensor instrumentation; Virtual instruments; Sensors interfaces, buses and networks; Signal processing; Frequency (period, duty-cycle)-to-digital converters, ADC; Technologies and materials; Nanosensors; Microsystems; Applications.
Submission of papers Articles should be written in English. Authors are invited to submit by e-mail editor@sensorsportal.com 8-14 pages article (including abstract, illustrations (color or grayscale), photos and references) in both: MS Word (doc) and Acrobat (pdf) formats. Detailed preparation instructions, paper example and template of manuscript are available from the journals webpage: http://www.sensorsportal.com/HTML/DIGEST/Submition.htm Authors must follow the instructions strictly when submitting their manuscripts.
Advertising Information Advertising orders and enquires may be sent to sales@sensorsportal.com Please download also our media kit: http://www.sensorsportal.com/DOWNLOADS/Media_Kit_2009.pdf