CE Analytics

Your Surface Analysis and Materials

Properties Resource

One Complete
Resource to Unlock
Unlimited Potential
In a shrinking universe of
resources, we offer a world CE Analytics
of analytical solutions.
The resource for diagnostics
Qualified analytical resources are solutions, analytical services
becoming harder to find. Yet your
and application expertise
analytical requirements are no less
complex. In-house services you used
to turn to may no longer be available.
And while merchant labs provide the
data, they don't offer the expertise to
analyze and solve your specific
problems. In this environment, it's
reassuring to know that there is one
resource with the experience and
capabilities to solve almost all of
your application challenges. CE
Analytics. While others are cutting
corners, we offer you a resource at the
cutting edge of technology, staffed by
the most experienced engineers and
analysts in their fields. More than data
alone, they give you the insight you
need to turn that data into a viable,
cost-effective solution.

Take a team of highly skilled scientists
and application engineers. Give them
the world’s most advanced analytical
and diagnostic capabilities to perform
expert interpretive analysis. Add high
performance chemicals and materials
specified and approved by the world’s
leading OEMs. Then put these capabilities
in one state-of-the-art-facility. This is CE
Analytics. The industry’s most complete
resource and knowledge base for test,
analysis and technology development.
At CE Analytics, you’ll team with the
industry’s top specialists. They’re ready
to work with you and your customers to
develop the exact and logical solution
to your specific challenge.
CE Analytics has the capabilities to
analyze a wide range of devices,
components and materials including:
• Circuit Assemblies
• Connectors
• Decorative Accessories
• Functional Items
• Leadframes
• Memory Disk Surfaces
• Printed Wiring Boards
• Semiconductor Packages
• Wafers
• Wire
Our functional analysis includes:
• Adhesion Failures
• Assembly & Solder Connection
• Contamination
• Corrosion
• Cosmetic Issues
• Failure Analysis
• Interfacial Reactions/Intermetalic
Compound (IMC) Formation
• Morphology
• Porosity
• Solderability Failures
• Solder Connection Voiding
• Structural Integrity
• Surface Contaminants
• Thickness and Composition of
Coatings
CE Analytics is part of Cookson
Electronics. As a leading supplier of
high performance assembly materials,
semiconductor packaging, specialty
chemicals and coatings used in the
electronics and surface finishing
industries, we have a long history of
achievement in electroplating, material
reliability and diagnostics. Recognizing
the critical need for highly specialized
analytical services, Cookson Electronics
now offers this resource to our global
customers.
OUR COMPLETE SUPPORT
Scientists at CE Analytics are committed
to working with you on an extensive
range of material applications to address
the complex challenges posed by the
electronics and surface finishing industries.
To that end, we offer a unique combination
of resources:
• People with vast experience in
electrochemistry, analytical chemistry,
materials science, process and
application engineering. The CE
Analytics team is highly skilled in the
specific disciplines of plating, reliability
and failure-mode analysis.
• Leading edge assembly and electro-
plating technologies that are both user
friendly and customizable to your
exact needs. All with the hands-on
support of industry recognized, highly
specialized technical personnel.
For surface sensitive analysis on conductive and non-conductive substrates, CE Analytics
relies on two advanced Auger Spectrometers, covering both SIMS (Secondary Ion Mass
Spectroscopy) and XPS (X-Ray Photoelectron Spectroscopy).
• Advanced diagnostic equipment, All of this technology and expertise is
including: contained in one state-of-the-art
research center.
– Scanning Electron Microscopy with
EDS CAPABILITIES BEYOND TESTING
– Optical Microscopy In-depth expertise in product
– Metallographic Sample Preparation development, process engineering,
– Auger Electron Spectroscopy application engineering and technical
SIMS service makes CE Analytics far more
XPS (ESCA) than just a testing facility. Our ability to
– X-ray Diffraction interpret data, not merely provide it,
– X-ray Fluorescence enables you to quickly determine the
– Mechanical Strength Testing direction of your product development,
Coating Adhesion or a solution to a current problem.
Die Shear Force
Tensile Stress/Strain Our team of engineers and scientists
– Wire Bonding Evaluations uses an extensive arsenal of analytical
– Solderability Testing instrumentation. Techniques include:
– FTIR Microscopy
– Ion Chromatography • Elemental Analysis
– Gas Chromatography • Metallography
– AFM/STM • Microscopy
– Acoustic Imaging • Spectroscopy
– Corrosion Testing • Surface Analysis
• Thermal Analysis

A FULL RANGE OF SERVICES
Whether you require a simple elemental
analysis or comprehensive engineering
services, we put our full resources behind
you. We can test to your specifications.
Alternatively, we can evaluate your
requirements and propose a testing
program. Beyond conducting the
analysis, we also provide comprehensive
reports, including interpretation and a
recommended course of action. CE
Analytics stands ready to assist you in
the following areas:
Properties
Characterization
Analysis
We have vast knowledge and experience
in electronics, electroplating and reliability
analysis of plated surfaces. This coupled
with state-of-the-art instrumentation,
provides a unique combination of skills,
experience and capabilities for material
as well as failure-mode analysis.
The scanning electron microscope is used for high
magnification surface morphology examinations
and Energy Dispersive Spectroscopy (EDS)
identification of surface elements.
With the aid of this Fourier-Transform Infrared Microscope (FTIR), CE Analytics engineers
can obtain an infrared spectrum on a substrate or plated article.
Surface Analysis
We have expertise, resources and
instrumentation to analyze surface
films that may interfere with adhesion,
solderability and wirebonding. In addition,
we can determine composition versus
depth of thin films such as oxides and
vapor deposited coatings.
Bulk Analysis
Our capabilities include metallurgical
analysis to examine the structure and
failure of electrodeposited coatings and
X-ray diffraction for stress and orientation
measurements. Our expertise also extends
to hardness, ductility, colorimetrics and
gloss of finishes.
Performance Measurements
We have the systems and scientists to
define performance characteristics for
solderability, wire bonding, wire strength
and corrosion/porosity. Our range of
services also includes the analysis of
tribological properties to determine
the wear characteristics of functional
and electronic coatings.
shared intelligence
Solder Analysis
The movement to lead-free alloys
world-wide will require more frequent
sampling and better monitoring of solder
pots to maintain process standards. CE
Analytics offers expert solder analysis to
help meet today’s needs.
Process & Application
Engineering Services
Putting technology to work is the goal
of our research and development
effort. Through the integration of skilled
scientists, state-of-the-art instrumentation,
world-class scientific laboratories and
information systems we can meet any
technical challenge.
At CE Analytics we understand how
vital confidentiality is to your project.
Our team will work together with you to
evaluate and customize a plan to meet
your objectives and proprietary needs.
www.cooksonelectronics.com

CE Analytics
600 Route 440
Jersey City, New Jersey 07304
Tel: 201-434-6778 ext: 2200
Toll Free: 800-367-5460

©2003 Cookson Electronics