NASA

Technical

Memorandum

100782

Adhesion, Properties
1_Sa-_I-1007 (_ASA) 24 _

Friction, and Micromechanical of Ceramics

82) A_EI_,SICI_,-_IC_ICI_ AND CSC.L llC G3/27 N88-17801

Kazuhisa Miyoshi Lewis Research Center Cleveland, Ohio

Prepared

for the Coatings

15th International Conference on Metallurgical sponsored by the American Vacuum Society San Diego, California, April 11-15, 1988

ADHESION,

FRICTION,

AND MICROMECHANICAL PROPERTIES OF CERAMICS

National

Kazuhisa Miyoshi Aeronautics and Space Administration Lewis Research Center 21000 Brookpark Road Cleveland, Ohio 44135 Phone 216-433-6078 Telex NASA CLV 98-5218 FAX 216-433-8000

ABSTRACT The adhesion, both in in monolithic contact with of are force friction, and coating themselves, discussion, separated (adhesion) and micromechanical form, are reviewed. materials, properties The first force part properties Ceramics and metals. of concern discusses to break of of ceramics, examined For in the the

are

other the

harder

simplicity processes
L_ 0 _, C_ I LLJ

tribological two parts. shear

into

the the chemical

pull-off interfacial bonding films friction, The and fracture scratch interfacial addressed.

and the

required

junctions in adhesion

between and friction,

contacting and the

surfaces. effects with of

The role surface respect

contaminant to adhesion and

and temperature are discussed. part

on tribological

response

second

deals of

with ceramics

abrasion in the ceramic solid

of

ceramics. state contact

Elastic, is to

plastic, The

behavior of

discussed. fracture is also

technique

determining bonds of

critical deposited

load

needed

adhesive

on substrates

INTRODUCTION Ceramic materials are being used increasingly sliding engines: cutting or rolling contact. for machine elements in

These elements include componentsof advanced

bearings, seals, gears, and tools used in metal shaping, such as tools and extrusion dies. is limited The successful use of ceramics in these problems than by 1 to 4). Clearly,

applications

more often by tribological

material properties

or processing deficiencies

(refs.

there is a great need for a fundamental understanding of the surface interactions of ceramics with themselves and other materials (ref. 5). the

Various deposition or surface modification atomistic

techniques (especially

deposition processes by which surface films or surface layers of may be formed) have further Manyof these films or layers are There is a great specified

the most diverse composition and structure enhanced interest in ceramic materials.

of materials which do not exist opportunity

in the bulk state.

to choose surfaces or surface layers with clearly (refs. 6 and 7).

strength and surface properties The objective

of this paper is to review the adhesion, friction, of ceramics, the effect

and

micromechanical properties films,

of surface contaminant interactions. be discussed. to those of Both

the effect of temperature, and metal-to-ceramic

monolithic ceramics and thin ceramic coating films will Their tribological metals.

behavior involves manyfeatures similar

Analogies with metals will

be madewhere applicable.

ADHESIONNDFRICTION A Clean and Contaminated Surfaces The surfaces of ceramics usually contain, constituent in addition to the

atoms, adsorbed films of water vapor or hydrocarbons that may

have condensedfrom the environment. layer may or may not be present. of the structure

On oxide-ceramic materials an oxide part

For example, oxygen is an integral

on aluminumoxide and ferrites,

so an oxide surface layer

may not be expected.

Non-oxide ceramics, however, generally contain a Thus, the surfaces of oxides as well

layer of oxide beneath the layer of adsorbent film. silicon carbide and silicon nitride

are covered with silicon 8 and 9).

as a simple adsorbed film of oxygen (refs. In a vacuumenvironment, sputtering

with rare gas ions or heating

surfaces to very high temperatures can remove contaminants that are adsorbed on the surface of ceramics. surfaces of ceramics and metals results Removingadsorbed films from the in very strong interracial If an atomically adhesion clean

when two such solids are brought into contact. silicon

carbide surface is brought into contact with a clean aluminum carbide-to-aluminum

surface, the adhesive bonds formed at the silicon interface are sufficiently

strong that the cohesive bonds in the aluminum to the silicon carbide surface (ref. I0).

are fractured

and transferred

Not only are the adhesion, friction,

and micromechanical properties of (such as

metals and polymers affected by the presence of contaminant films adsorbates and oxides), but also those of ceramic materials,

both in Typical

monolithic and coating form, in contact with themselves or metals. adhesion and friction nitride results from hot-pressed polycrystalline films

silicon

and ion-beam-deposited boron nitride I. The pull-off

in contact with metals

are presented in figure of friction coefficient

force (adhesion) and coefficient The pu11-off force and surfaces are higher than

are strongly affected by adsorbates. of friction for the sputter-cleaned

those for the as-received surfaces.

In other words, the presence of the

adsorbates on the surface of the silicon the boron nitride

nitride

in monolithic form or of

in coating form reduced the adhesion and shear strength

of the contact area. In contrast, oxygen exposures to clean metal and ceramic surfaces did adhesion (ref. ll). Exposing both metal conditions, after

strengthen the metal-to-ceramic

and ceramic surfaces to oxygen under carefully sputtering

controlled

with argon ions or heating in vacuum, results two effects: (I)

in the adsorption The metal oxidizes

of oxygen which produces the following

and forms an oxide surface layer, and (2) the oxide layer increases the shear strength of the contact and the coefficients 13). of friction (refs. II to

In these cases strong oxide-oxide bonding takes place at the thereby raising the shear strength and the coefficient of

interfaces, friction.

Figure 1 also indicates sputter-cleaned componentof

somewhat greater d

that adhesion and friction

forces for

metal-ceramic couples were smaller for metals with a large

electrons detail in in the the next bond. This subject is discussed in

section. Bonding theory values could of be

Chemical Pauling, metals placed (ref. and in 1948, formulated compounds character d-valence are of

a resonating-valence-bond in the which various are for modulus, amount less not numerical transition completely physical

intermetallic bonding the they

on the 14).

elements filled in

Since metals, as

bonds

transition properties magnetic character

responsible shear the the

such

and chemical stability, of surface. and d-bond Nhile

cohesive

energy, The greater possesses,

chemical or

properties. that a metal

percentage is its

active

there have been critics

of this theory,

it appears to be the most plausible of transition 15). metals in contact

explanation of the interfacial

interactions

with ceramics as well as with themselves (ref. Nhen a transition in an atomically

metal is placed in contact with a ceramic material bonds formed between the

clean state, the interfacial

metal and ceramic depend heavily on the character of the bonding in the metal. The data for the sputter-cleaned surfaces presented in figure 1

indicate a decrease in adhesion and friction character, as predicted by Pauling's theory. exhibit

with an increase in d-bond Titanium and zirconium, which

are chemically very active, ceramic. In contrast,

very strong adhesive bonding to the

rhodium and rhenium, which have a very high have relatively low adhesion and friction.

percentage of d-bond character, Today, virtually all

the known elements are used to make ceramic Probably the most widely used class of ceramic Someprecise'experiments on shear

materials and products. materials,

however, is the oxides.

strength of metal-to-sapphire

contact were conducted by Pepper who used an spectroscopy

ultra-high-vacuum apparatus and incorporated Auger electron (ref. 16). His study determined a correlation of the metal-to-sapphire

between the shear

coefficients

contacts and the free energy of For other oxide ceramics such as in sliding contact with and the free 12). These

formation of the lowest metal oxide. nickel-zinc ferrite

and manganese-zinc ferrite correlation

metals, a similar

between coefficient

of friction

energy of formation of the lowest metal oxide is found (ref. correlations interface clearly indicate that the oxide-ceramic-to-metal

bond at the

is primarily

a chemical bond between the metal atoms and the The strength of this

large oxygen anions in the oxide-ceramic surface.

bond was related to the

(refs. 16 and 17).

oxygen-to-metal

bond

strength

in

the

metal

oxides

Temperature An increase promote products wear heated (ref. in surface to in surface temperature reactions. surface

Effects of These a ceramic chemical alter material reactions adhesion, silicon (determined sintered and oxygen, graphite in an argon tends cause friction, carbide surface and is to

chemical on the

appear 8). For

which

can

example, the

when an as-received contaminants as-received carbon

a vacuum,

principal on the are 2).

by x-ray polycrystalline residual silicon graphite, carbide

photoelectron silicon carbide

spectroscopy) surface (fig.

adsorbed

and silicon surface

dioxide

The residual fabrication

on the

was generated

during

atmosphere. to seen present in the 400 C. on the on the of be 600

The adsorbed Above silicon surface to 400 C, carbide decreases At

carbon

contaminants graphite and

disappear silicon of silicon

on heating dioxide dioxide are

primarily surface. rapidly

The amount with the at

increasing

temperature

range can

800 C.

800 C, and are increases

silicon

carbide-Si2p intensity. an increase

and -Cls Above in

peaks

distinguished concentration the silicon

a maximum rapidly with

800 C, temperature, in intensity

the

graphite whereas at the

carbide

concentration The

decreases surface of lO00 for contact in of to the

rapidly silicon 1200 C. sintered

silicon

carbide at

surface. temperatures of in

carbide

graphitizes

predominantly

The coefficient carbide of sliding flat surfaces temperatures which

friction, sliding is low

polycrystalline rider,

silcon as a function of the

with figure can

an iron 3.

indicated below

The coefficient with

friction,

remains

250 C,

be associated

presence of both carbon and graphite contaminants on the as-received specimen. The rapid increase in the coefficient be attributed of friction at 400 C can

to (I) the absence of carbon contaminants, (2) the presence dioxide, (3) increased adhesion, and (4) increased growth in the contact zone. The rapid of the

of increased silicon plastic

flow causing junction

decrease in friction silicon

above 800 C correlates

with the graphitization

carbide surface. Microfracture Under Adhesive Conditions

Adhesive wear occurs after adhesion takes place across an interface between two ceramic surfaces or a ceramic surface and another material. Whenan atomically clean silicon carbide flat surface is brought into carbide rider,
interface strong I0). fracture carbide and generally are generated also, that Tangential pits, and wear The in the or

contact with a clean metal rider or a clean silicon adhesive bonds formed at the silicon
carbide-to-silicon cohesive sliding debris presence the zones sliding. extent, this type bonds motion in and of in carbide silicon interface carbide in the contact defects of the

the
silicon the

carbide-to-metal
are sufficiently (ref. cracks, silicon

may fracture of of

results near the

formation region such

the

surface. impurities dictate during to

intrinsic layers which

as voids, in

microcracks, will pits defects

surficial from

materials debris

contact

fractured

and fracture of wear such

The extent determine of of wear the to

and distribution size occur, the of the

will

a large for

particles first contact

generated. exist. must Also, be less

In order the than

adhesion

must in

fracture the

toughness shear

one of of the

two materials

strength

interfacial

junction.

MICROMECHANICAL PROPERTIES Ceramics, in both monolithic and coating form, behave micromechanically in a ductile fashion up to a certain contact stress when Even at carbide
modest more highly known of a

they are brought into contact with themselves or other solids. room temperature, ceramics such as aluminumoxide and silicon behave elastically
conditions concentrated as brittle ceramic that of and plastically contact; stresses is one of at however (refs. the in low they 18 to most design stresses under

relatively under

rubbing contact

microfracture 25). This

microfracture,

fracture, must

critical for

characteristics structural

be considered

and tribological

applications. Elasticity Ceramics example, is the placed behave elastically nitride with friction in figure relation coordinates coated itself is 4. up to a certain contact pressure. steel in For flat

when boron in contact of

on a 440C on a 440C

bearing

stainless steel pin

stainless It

vacuum, load load p and form: (1)

coefficient

not

constant.

decreases

as the for the

increases range load

as shown

To a first between is

approximation coefficient of

investigated, N on logarithmic

the

friction of

given

by an expression

the

= kN -I/3 The exponent solid-state elastic the shear contact. deformation strength arises from an adhesion of elastic mechanism contact is area. monolithic 5(a). silicon carbide in for can found the surfaces in by the of

The area (ref. of this 26).

be determined to be a function

The friction contact for in figure

elastic

A similar contact with

friction diamond is

characteristic presented

Nhen a silicon

carbide

surface is placed in contact with a diamond under relatively pressure, elastic deformation can occur in both the silicon of tangential motion, sliding

low contact carbide and the occurs at the

diamond. Nith the initiation interface. to plastic (ref. 23).

Under these low load conditions, flow nor cracking of silicon

neither groove formation due is observed

carbide during sliding

Under the foregoing conditions, strength of the elastic is, the relation

friction

is a function of the shear 5(a). That

contact area, as indicated in figure of friction

between coefficient

_ and load

N is that

given by equation (I).

Over the entire

load range, the meancontact The maximum pressure at the

pressure ranges from 1.5xlO3 to 3.5xi03 N/mm 2.

center of the contact area calculated from a Hertzian stress distribution will be 2.3xi03 to 4.9xi03 N/mm. 2 Plasticity Most ceramics, both in monolithic and in coating form, deform in a ductile manner as the contact pressure is further increased. The increase in

in applied contact pressure, however, results friction entirely characteristic different with an applied load.

in a complete reversal

Figure 5(b) reveals an with an

modeof deformation and energy dissipation

estimated maximum Hertzian contact stress ranging from 1.4xlO4 to 3.0xlO 4 N/mm in the contact area. 2 silicon little Plastic deformation occurs in the but there is

carbide, causing permanent grooves during sliding,

or no evidence of very small cracks being generated in the silicon The diamond indents the silicon carbide without suffering any

carbide.

permanent deformation to itself. sliding following solid-state

The frictional

energy dissipated during

contact is due to shearing at the interface

and to plastic

deformation of the silicon The relation

carbide (i.e.,

plowing of silicon of friction

carbide by the diamond). and load

between coefficient

W now takes the form orientation

_ = kN 0.3-0.4

The exponent dependson silicon carbide.

the crystallographic

of the single-crystal

Whena much higher contact pressure is provided, ceramics behave in a brittle fashion (fig. 5(c)). This subject will be discussed in the section

Fracture. Similar nitride contact and friction characteristics 24 and 25). for diamond on boron

films also occur (refs.

At certain ioaas, the sliding

action of the diamond results

in a permanent groove in the boron nitride and nonmetallic substrates. deformed

films deposited on both metallic

Figure 6 presents data obtained about widths of plastically grooves in boron nitride films on 440C stainless steel substrate.

Comparative data for uncoated 440C stainless Whenthe width of resulting plotted against load expressed as portion stainless N = kD n. scratch

steel are also presented. films is

D for the boron nitride coordinates,

N on logarithmic

the data can Oe 6. The

This is Meyer's law, shown in figure

LM for boron nitride

film or portion L'M' for uncoated 440C

steel is considered to be composedof approximately straight slopes of 2.6, 2 5, and 2.2. M'N' for uncoated 440C stainless MN or M'N' The portion MN for

portions of transitional boron nitride film or

steel is a straight

line of slope 2.

The portion

is the range over which

Meyer's law is valid for boron nitride steel. Here the Meyer index n

film and for uncoated 440C stainless Thus,

is constant and has the value 2.

the boron nitride

films on metallic

and nonmetallic substrates behave

I0

plastically

much like metals when they are brought into contact with hard 27). pressure) P during sliding may be

solids such as diamond (ref.

Meancontact pressure (yield

defined by P = N/As; N is the applied load and As contact area given As = _D2/8. The yield

is the projected

Only the front half of the pin is in pressure over the contact area gradually plastic state. The mean

contact with the flat. increases until

deformation passes to a fully plastic state film.

contact pressure at a fully

Pm increases by a factor of 2

with the presence of boron nitride

Whenthe load exceeds a certain critical diamondon the monolithic causes fracture silicon

value, the sliding

action of film

carbide and on the boron nitride

in both specimens. Fracture

Whena much higher contact pressure due to highly concentrated stress in the contact area between the diamond and silicon the sliding as plastic particles carbide is provided,

action produces gross surface and subsurface cracking as well deformation (ref. and large fracture 23). Under such conditions, wear debris The

pits caused by cracking are observed.

area of a fracture deformed groove.

pit is a few times larger than that of the plastically In this case, the coefficient of friction and plastic is also much contacts.

higher (four times or more) than those in elastic (See fig. 5(c).) Although fracture and plastic

deformation in silicon

carbide are responsible for the friction frictional silicon

behavior observed, most of the is due to the fracturing of friction of the

energy dissipated during sliding carbide. Therefore, the coefficient

is commonly

II

influenced by the bulk properties and crystallographic orientation

of the ceramic such as fracture (refs. 28 to 30 and fig. 5(c)).

toughness

For the boron nitride substrates, failure

film deposited on metallic

or nonmetallic

occurs primarily

in the film or at the interface is critically loaded FF,

critical for for the

between film and substrate (or both), when the film (refs. 24 and 25). It is interesting

that in figure 6 the portion where the load

exceeded the

representing the condition of fracture

load, boron the is also roughly film metallic cracks of only film critical expressed by

N = kD n. is for from almost the the

The fractured as wide substrate. contact area as the This

scratch scratch evidence than is will as well. film

nitride uncoated that

on the

substrate used

material are the for

confirms the free

generated film. It

rather

from

surface not nitride the can

suggests the for the

that critical

the

substrate which

responsible the boron

controlling but also load

load of

fracture

extent to

fracture

Furthermore, substrate

required

fracture of

a ceramic width.

on a

be determined Acoustic

by measurements Emission released coating broken film

scratch

and Friction acoustic and/or

Force when the intrinsic between

Investigators cohesive the and film bonds in

detected ceramic are acoustic plastic

emissions the

adhesive created. nature of

bonds

and substrate of that 31, the is,

and a new surface depend

The pattern of the

intensity

emissions flow,

on the or flaking

disturbance; (refs. 6, Figure traces the for

cracking,

fragments

and 32). typical film acoustic deposited is brought emission traces and friction substrate. with a diamond force When pin

7 presents a boron nitride

nitride film

on a nonmetallic into contact

boron

surface

12

under fracture bonds (fig.

a small

load

(which cohesive film and

is

lower bonds

than in the

the

critical nitride

loads film

needed

to

intrinsic between 7(a)). of the

boron

and adhesive is detected with has of boron 25). sliding. to fracture the in film and no passed the nitride

substrate) force trace (fig

no acoustic is 7(b)). slightly After microscopic groove similar film critical adhesive a small is

emission fluctuating the

The friction stick-slip once,

evidence over wear film, the track

behavior scanning that metallic of load the to

diamond

surface

electron

examination in the (ref. with

indicates in

a permanent films boron or under

formed conditions is

much like

However,

no cracking in

nitride the

observed loads

An increase the and near boron the the nitride substrate, plastically evidence Acoustic amounts is of

above

needed

film

and the

interfacial in

bonds of

between cracking trace output to

however, deformed of

results groove.

amount

The acoustic acoustic emission siding flow.

emission signal appears Such cracks

indicates 7(c)). small emission the boron

a fluctuating is in release and 9N is in observed addition of the

(fig.

emission cracking the film load

when the to plastic energy

involve

acoustic propagate in

due to

elastic substrate.

when

nitride at the

The friction by randomly behavior

force

trace behavior, (fig. 7(d)). sliding and boron are

measured but only

characterized of is to film In stick-slip applied plastic and at cases

fluctuating is observed film, surface

occasional

evidence load

When a much higher action produces, in

to flow,

the

boron locally

nitride gross

addition in the

subsurface nitride primarily

fracturing and the

the

interface

between emission (fig.

the

substrate. by

such

acoustic behavior

traces 7(e)),

characterized

chevron-shaped

while

13

friction stick-slip

force is primarily behavior (fig.

characterized by a continuous, marked 7(f)).

The behavior of acoustic emission is related to that of friction force. For example, at point I in figure 7(e) and (f), the point II and will is reached. the diamond rider the rider is is set

comesto rest until

At point II,

into motion and slips, reached. At point II,

continue to moveuntil

point III

acoustic emission is released because the slip at the interface the rider between the boron nitride comesto rest again. between the boron nitride film

action produces fracturing and the substrate. fracture

At point III,

Thus, film

in the film and at the interface

and the substrate is responsible for the observed acoustic emission signal output and friction behavior. measurementsof the critical load required to

Acoustic and friction fracture optical

a ceramic film on a substrate agree well with those detected by and scanning electron microscopy of the scratches. loads needed to fracture the boron

Figure 8 presents data for critical nitride

film and adhesive bonds between the film and substrate as force measurements. The
and strength the greater of the the strength

determined by acoustic emission and friction critical

substrate. of the

load to fracture
The harder substrate, the the

is

related

to

hardness or

metallic the

substrate critical load.

higher

CONCLUDING REMARKS Based and ceramic I. example, on fundamental coating films films, studies the conducted following affect with both monolithic can be made behavior. surface For decrease ceramics

observations their

Surface adsorbed

on ceramics

tribological carbide

carbon

contaminants

on a silicon

14

interfacial

bond strengths and, accordingly,

friction;

whereas oxygen, as a

surface contaminant on metals in sliding increases both adhesion and friction. 2. Heating of silicon graphitization

contact with oxide ceramics,

carbide to high temperatures can result

in the to

of the ceramic surface with the graphite film functioning

reduce adhesion and friction. 3. Nhen ceramics are in contact with metals, surface chemistry is extremely important to friction and wear behavior. In the transition with the

metals, the d-valence-bond character correlates coefficient of friction

directly

for ceramics in both monolithic and coating form. the lower the coefficient of

The higher the percentage of d-bond character, friction is.

4. Ceramics, like metals, will the interfacial

deform elastically

and plastically

in

region between two solids in contact under load. critical

Unlike value,

metals, however, when the contact stress exceeds a certain fracture can occur. Acoustic and friction

measurementsof the critical

load required to fracture those detected by optical

a ceramic film on a substrate agree well with and scanning electron microscopy of the scratches.

15

REFERENCES I. H.E. Sliney, T.P. Jacobson, D. Deadmore, and K. Miyoshi,

Sci. 2. 3. 4. 5. 6. 7. R.N. P. Proc., Rice, Sutor, 7 (1986) Ceram. Ceram. Quinn. Buckley Eng. Eng. Near, and K. 1039-1051. Sci. Sci. 100 Proc., Proc., (1984), 6 (1985), 6 (1985), 399-436. Eng. 381-397. New Directions in Tribology 1-17. Am. Ceram. Soc. Bull. 62 Lubrication, in the 80's, Noyes Sci. Proc., 6 (1985), 919-939. 940-958. 963-964. Ceram. Eng.

T.F.J. D.H. H.E. D.

Miyoshi, I00

Ceram. (1984),

Hintermann, Tabor, in N.R.

Near, Loomis

(ed.),

Materials, Publications, 8. K. Miyoshi,

Near

and Surface Ridge,

Interactions: NJ, 1985, pp.

Park D.H.

Buckley,

and M.

Srinivasan,

(1983), 9. 10. II. 12. 13. T.E. K. S.V. K. K.

494-500. Fischer and H. Tomizawa, Buckley, Phys., Buckley, Near 105, (1985), 29-45. 245-256.

Miyoshi Pepper, Miyoshi Miyoshi,

and D.H. J. Appl.

ASLE Trans. 47 (1976), Ceram. and T. Eng.

22 (1979), 2579-2583. Proc., J.

and D.H. D.H.

4 (1983), Vac. Sci.

674-693. Technol. A., 3

Buckley,

Spalvins,

(1985), 14 15 16 17 18 19 20 21 L. K. S.V. K.H. R.P. R.P. R.P. R.P.

2340-2344. Proc. and D.H. J. Appl. R. Soc. Buckley, Phys., Pepper, Phys., Phys., London Near, A. 196, (1949), 343-362. 253-264.

Pauling, Miyoshi Pepper, Johnson Steijn, Steijn, Steijn, Steijn,

77 (1982), 801-808. Phys.

47 (1976), J. Appl.

and S.V. J. J. Appl. App].

53 (1982),

6634-6637.

32 (1961), 34 (1963), 48-66.

1951-1958. 419-428.

Near,

7 (1964),

ASLE Trans.,

12 (1969),

21-33.

16

22. K.F. DuFrane and W.A. Glaeser, Study of Rolling-Contact

Phenomena in

MagnesiumOxide, NASA Contr. Rept. CR-72295, 1967 (NASALewis Research Center). 23. K. Miyoshi and D.H. Buckley, ASLETrans., 22 (1979) pp. 79-80. 24. K. Miyoshi, D.H. Buckley, S.A. Alterovitz,
Tribology--Friction, Proc. Int. Conf., Lubrication London, 1987, July pp. and Near" 1981,

J.J. Pouch and D.C. Lui, in

Fifty Years On, Vol. II.,

Mechanical

Engineering

Publications, 25. K. Miyoshi,

London, D.H. strength films 1987

621-628, Pouch, S.A. behavior substrates, Center). and pp. Lubrication of Solids Part Alterovitz, of and H.E. Sliney,

Buckley,

J.J.

Mechanical boron nitride

and tribological on non-metallic Research The Friction 1964,

ion-beam NASA Tech.

deposited Memo.

TM-89818, 26. F.P.

(NASA Lewis

Bowden

and D. Tabor, Press, Oxford, of

I__II, Clarendon 27. D. Tabor,

158-185. Press, Oxford, 1951, pp.

The Hardness

Metals,

Clarendon

6-18. 28. H. Isigaki and K. Miyoshi, Proceddings Engineering, Near, Near, I00 of the 6th 1987, International pp. 661-666.

Conference 29. 30. 31. D.H. K. H.E. (eds.), 32. P.A. Buckley Miyoshi

on Production

Osaka, (1984),

and K. Miyoshi, and D.H. in of Buckley, R.K. Hard

333-353. 253-268.

75 (1982), D.J. Plenum J.

Hintermann, Science Steinmann

Viswanadham, Materials, HinteFmann,

Rowcliffe, New York, Sci.

and J. 1983, pp. A._

Gorland 357-394. 3 (1985),

and H.E.

Vac.

Techno].

2394-2400.

17

I.

Ti

0 SPUTTER-CLEANED [] AS-RECEIVED

OZr

.q

Fe O 0 Ni []Ni Dzr r-I Ti Fe []

O W

Re

.2

[]W

ORe

(a) ADHESION OF MONOLITHIC SILICON NITRIDE. 1.2 OTi

1.0

OZr

o ,,= b
.8 Ti

V 0 Fe

Ni

Re

Zr Fe .4 25 []

[] Ni

8Pd [] Re

Rh 0

I
30

I
35

I
40

I
45

I
50

PERCENT d CHARACTER OF METAL BOND (b) FRICTION OF ION-BEAN-DEPOSITED BORON NITRIDE FILM, FIGURE 1. - PULL-OFF FORCE (ADHESION) AND COEFFICIENT OF FRICTION AS A FUNCTION OF THE PERCENTAGE d-BOND CHARACTER OF METALS IN CONTACT WITH CERAMICS IN A VACUUM,

18

ADSORBED CARBON

SiC

CONTAMINANT

PEAK GRAPHITE [PEAK SiC 0

1 si_2_ c

Sii2co 2

i000 -,_
1200 I , I , I , I , I I h I i i i I i I

108

104
(a)

I00

%
2p.

92

292

288
BINDING (b)

284

280
eV

276

540

536
(c)

532

528

524

ENERGY, CARBON Is.

SILICON 2. -

OXYGEN Is. CARBIDE SURFACE

FIGURE

REPRESENTATIVE AT TEMPERATURES

XPS PEAKS INDICATED.

FROM SINTERED

POLYCRYSTALLINE

SILICON

PREHEATED

1.2

1.0

.6

.4
.2

I
0 400 SLIDING FIGURE 3, EFFECT TEMPERATURE,

I
800 C ON COEFFICIENT OF TEMPERATURE

I
1200

OF FRICTION CARBIDE VACUUM.

FOR SINTERED SLIDING

POLYCRYSTALLINE AGAINST AN

SILICON IN

SURFACE

IRON PIN

19

1,2

--

0 SPUTTER-CLEANED [] AS-RECEIVED 1.0 --

,8

--

////

,6

--

//_p

= 0.29 W-1/3

,4

--

[]
,2 --

[]

[]

/ Z_p = 0.]7 W-1/3

I
.05

I
.I0 LOAD, W, N

I
.15

I
.20

FIGURE 4. - COEFFICIENT OF FRICTION AS A FUNCTION OF LOAD FOR BORON NITRIDE FILM DEPOSITED ON HEMISPHERICAL PIN IN CONTACT WITH BORON NITRIDE FILM DEPOSITED ON A FLAT IN VACUUM.

i0

FA
I_THEORETICAL CURVE p = KW-I/3 0 A <lOiO> <1120> I SLIDING J DIRECTION

o/

(a) ELASTIC CONTACT (DIAMOND RADIUS, 0.3 MM).

25 b
2O

b
15

i.o F.8
.4'6 __ 0 <1010 .2

.10

O5

I
.i

I
.2

I
.3

I
.4

I
.5 0 LOAD, W, N .1 .2 .3 .4 .5

(b) PLASTIC CONTACT (DIAMOND RADIUS, 0.02 MM).

(c) SLIDING ACCOMPANIED BY GROSSFRACTURE (CONICAL DIAMOND WITH AN APICAL ANGLE OF 117).

FIGURE 5. - COEFFICIENT OF FRICTION AS A FUNCTION OF LOAD FOR HEMISPHERICAL DIAMOND PINS OF DIFFERENT RADII AND A CONICAL DIAMOND PIN SLIDING ON A SINGLE-CRYSTAL SILICON CARBIDE (0001) SURFACE IN ARGON AT ATMOSPHERIC PRESSURE.

2O

I I
-io oF _,oor. Qut_'X__
501-I

o
.5

(a) NO ACOUSTIC EMISSION CAUSED BY DIAMOND PIN UNDER SMALL LOAD, 3N.

(b) FRICTION FORCE CAUSED BY DIAMOND PIN UNDER SMALL LOAD, 3N.

.4

30 -4020 -4O

.3 _ .2 .1

I0 -- I

oil
_-FRACTURED SCRATCH \ ON BN FILM \ \ 2O \\F

i
z

(c) ACOUSTIC EMISSION CAUSED BY DIAMOND PIN UNDER CRITICAL LOAD, 9N.

(d) FRICTION FORCE CAUSED BY DIAMOND PIN UNDER CRIT 1.2 ICAL LOAD, 9N.

o_

LL- 1.1 1.0 TBN FILM \ \ \ lO 8 .9 CRITICAL LOAD TO FRACTURE \ \M k 80 _ 70 .6 60 .5 50 2.2 \ \ X__ UNCOATED q40 C STAINLESS STEEL 20 10 30 40 III .7

\ \

.8

:1/
II

.4 .3

\\
I
15

.2
,1

I
0
L l

I
I0

i
20

I
25 0 SLIDING TIME, SEC (f) 5 10 15 20 25 FRICTION FORCE CAUSED BY DIAMOND PIN UNDERMUCH HIGHER LOAD, 12N.

i
.02

I
.2

.04 .06 .08 .I AVERAGE WIDTH OF SCRATCH, D, MM

(e) ACOUSTIC EMISSION CAUSED BY DIAMOND PIN UNDER MUCH HIGHER LOAD, 12N.

FIGURE 6. - SCRATCH WIDTH AS A FUNCTION OF LOAD FOR BORON NITRIDE FILM DEPOSITED ON 440 C STAINLESS STEEL IN CONTACT WITH A HEMISPERICAL DIAMOND PIN IN LABORATORY AIR.

FIGURE 7. - TYPICAL ACOUSTIC EMISSION TRACES AND FRICTION TRACES FOR A BORONNITRIDE FILM IN CONTACTWITH A HEMISPHERICAL DIAMONDPIN IN LABORATORYAIR.

21

0 []

SCRATCHHARDNESS VICKERS HARDNESS

TENSILE STRENGTH YIELD STRENGTH

44O C STAINLESS STEEL -J 10

440 C STAINLESS STEEL _

ODTi [] 0 304 STAINLESS STEEL

AO /k 0

Ti 304 STAINLESS STEEL

I
2

I
4

f
6

I
8 o

I
1 TENSILE STRENGTHOF SUBSTRATE, OMAX' GPA

I
2

SCRATCH HARDNESS OF SUBSTRATE, PM, GPA

I
0

_
200

I
400

1
600

I
800

I
o

I
] YIELD STRENGTH OF SUBSTRATE, Y, GPA (b) RELATION OF CRITICAL LOAD TO STRENGTH OF SUBSTRATE.

I
2

VICKERS HARDNESS OF SUBSTRATE, Hv (a) RELATION OF CRITICAL LOAD TO HARDNESS OF SUBSTRATE.

FIGURE 8. - CRITICAL LOAD NEEDED TO FRACTURE BORON NITRIDE FILM AND INTERFACIAL ADHESIVE BONDS BETWEEN FILM AND SUBSTRATE IN SLIDING CONTACT WITH A HEMISPHERICAL DIAMOND PIN IN LABORATORY AIR.

22

National Space

Aeronautics Administration

and

Report

Documentation
Accession No.

Page
3. Recipient's Catalog No.

1. Report

No.

2. Government

NASA TM-I00782
4. Title and Subtitle 5. Report Date

Adhesion, Properties

Friction, and Micromechanical of Ceramics

6. Performing

Organi_:ation

Code

7. Author(s)

8. Performing

Organization

Report No.

Kazuhisa

Miyoshi

E-3954
10. Work Unit No.

506-43-]]
9. Performing Organization Name and Address 11. Contract or Grant No.

National Aeronautics and Space Lewis Research Center Cleveland, Ohio 44135-3191
12. Sponsoring Agency Name and Address

Administration
13. Type of Report and Period Covered

Technical Administration
14. Sponsoring

Memorandum

Nationa! Aeronautics and Space Nashington, D.C. 20546-0001

15. Supplementary Notes

Agency Code

Prepared For the 15th International Conference on Metallurgical sponsored by the American Vacuum Society, San Diego, California, 1988. Invited paper.
16. Abstract

Coatings, April 11-15,

The adhesion, friction, and micromechanical properties of ceramics, both in monolithic and coating form, are reviewed. Ceramics are examined in contact with themselves, other harder materials, and metals. For the simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. The first part discusses the pull-off force (adhesion) and the shear force required to break the interfacial junctlons between contacting surfaces. The role of chemical bonding in adhesion and friction, and the effects of surface contaminant films and temperature on tribologicai response with respect to adhesion and friction are discussed. The second part deals with abrasion of ceramics. Elastic, plastic, and fracture behavior of ceramics in solid state contact is discussed. The scratch technique of determining the critical load needed to fracture interracial adhesive bonds of ceramic deposited on substrates is also addressed.

17. Key Words (Suggested

by Author(s))

18. Distribution

Statement

Ceramic

tri

bology

Unclassified - Unlimited Subject Category 27

19. Security

Classif.

(of this repo_)

20. Security

Ctassif. (of this page)

21. No of pages

22. Price*

Unclassified
NASA FORM 1626 OCT 86
*

Unclassified
For sale by the National Technical Information Service, Springfield, Virginia

24
22161

A02