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Philips Semiconductors
Product specication
PCA82C251
The PCA82C251 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for applications (up to 1 Mbaud) in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
UNIT A Mbaud V V C
ORDERING INFORMATION TYPE NUMBER PCA82C251 PCA82C251T PCA82C251U PACKAGE NAME DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads body width 3.9 mm bare die; 2840 1780 380 m CODE SOT97-1 SOT96-1
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
DRIVER 8 Rs 4 RXD CANL RECEIVER Vref 5 REFERENCE VOLTAGE 6 SLOPE/ STANDBY 7 CANH
PCA82C251
2 GND
MBG613
PINNING SYMBOL TXD GND VCC RXD Vref CANL CANH Rs PIN 1 2 3 4 5 6 7 8 ground supply voltage receive data output reference voltage output LOW-level CAN voltage input/output HIGH-level CAN voltage input/output slope resistor input DESCRIPTION transmit data input
handbook, halfpage
1 2
8 7
PCA82C251
3 4
MBG612
6 5
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
Pin 8 (Rs) allows three different modes of operation to be selected: high-speed, slope control or standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The high-speed mode is selected by connecting pin 8 to ground. The slope control mode allows the use of an unshielded twisted pair or a parallel pair of wires as bus lines. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low current standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slower in standby mode, the first message will be lost at higher bit rates.
CONDITION FORCED AT PIN Rs VRs > 0.75VCC 10 A < IRs < 200 A VRs < 0.3VCC
RESULTING VOLTAGE OR CURRENT AT PIN Rs IRs < 10 A 0.4VCC < VRs < 0.6VCC IRs < 500 A
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. SYMBOL VCC Vn V6 PARAMETER supply voltage DC voltage at pins 1, 4, 5 and 8 DC voltage at pin 6 (CANL) 0 V < VCC < 5.5 V; TXD HIGH or oating 0 V < VCC < 5.5 V; no time limit; note 1 0 V < VCC < 5.5 V; no time limit; note 2 V7 Vtr Tstg Tamb Tvj Vesd DC voltage at pin 7 (CANH) storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage note 3 note 4 note 5 Notes 1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/s for voltages above +30 V. 2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW. 3. In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 4. Classification A: human body model; C = 100 pF; R = 1500 ; V = 2500 V. 5. Classification B: machine model; C = 200 pF; R = 0 ; V = 250 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PCA82C251 PCA82C251T QUALITY SPECIFICATION According to SNW-FQ-611 part E. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 100 160 K/W K/W VALUE UNIT transient voltage on pins 6 and 7 see Fig.8 CONDITIONS MIN. 0.3 0.3 36 36 36 MAX. +7.0 +36 +36 +36 +36 +200 +150 +125 +150 +2500 +250 V V V V V V C C C V V VCC + 0.3 V UNIT
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
CHARACTERISTICS VCC = 4.5 to 5.5 V; Tamb = 40 to + 125 C; RL = 60 ; I8 > 10 A; unless otherwise specied; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 C. SYMBOL Supply I3 supply current dominant; V1 = 1 V; VCC < 5.1 V dominant; V1 = 1 V; VCC < 5.25 V dominant; V1 = 1 V; VCC < 5.5 V recessive; V1 = 4 V; R8 = 47 k standby; note 1 DC bus transmitter VIH VIL IIH IIL V6, 7 ILO V7 V6 V6,7 HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current recessive bus voltage off-state output leakage current CANH output voltage CANL output voltage difference between output voltage at pins 6 and 7 output recessive output dominant V1 = 4 V V1 = 1 V V1 = 4 V; no load 2 V< (V6, V7) < 7 V 5 V< (V6, V7) < 36 V V1 = 1 V; VCC = 4.75 to 5.5 V V1 = 1 V; VCC = 4.5 to 4.75 V V1 = 1 V V1 = 1 V V1 = 1 V; RL = 45 V1 = 4 V; no load Isc7 Isc6 short-circuit CANH current short-circuit CANL current V7 = 5 V V7 = 36 V V6 = 36 V 0.7VCC 0.3 200 100 2.0 2 10 3.0 2.75 0.5 1.5 1.5 500 1.0 0.9 7 V < (V6, V7) < 12 V; not standby mode standby mode standby mode; VCC = 4.5 to 5.10 V Vdiff(hys) differential input hysteresis see Fig.5 1.0 0.97 0.91 100 150 VCC + 0.3 V 0.3VCC +30 600 3.0 +2 +10 4.5 4.5 2.0 3.0 +50 200 200 V A A V mA mA V V V V V mV mA mA mA 78 80 85 10 275 mA mA mA mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC bus receiver [V1 = 4 V; pins 6 and 7 externally driven; 2 V < (V6, V7) < 7 V; unless otherwise specied] Vdiff(r) Vdiff(d) differential input voltage (recessive) differential input voltage (dominant) note 2 +0.5 +0.4 5.0 5.0 5.0 5.0 V V V V V V mV 7 V < (V6, V7) < 12 V; note 2 1.0
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
PARAMETER HIGH-level output voltage (pin 4) LOW-level output voltage (pin 4) CANH, CANL input resistance differential input resistance
CONDITIONS I4 = 100 A I4 = 1 mA I4 = 10 mA
MIN. 0.8VCC 0 0 5 20 40 55 80 80 90 90
TYP.
UNIT
k k
Reference output reference output voltage V8 = 1 V; I5 < 50 A V8 = 4 V; I5 < 5 A R8 = 0 R8 = 0 R8 = 0 R8 = 0 R8 = 0 ; Tamb < +85 C; VCC = 4.5 to 5.1 V R8 = 0 ; VCC = 4.5 to 5.1 V R8 = 0 ; Tamb < +85 C R8 = 0 R8 = 47 k tonRXD SR tWAKE tdRXDL Vstb Islope Vslope Notes 1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC; Tamb < 90 C. 2. This is valid for the receiver in all modes: high-speed, slope control and standby. delay TXD to receiver active CANH, CANL slew rate R8 = 47 k R8 = 47 k 0.45VCC 0.4VCC 0.75VCC 10 0.4VCC 0.55VCC 0.6VCC V V s ns ns ns ns ns ns ns ns ns V/s s s V A V
Timing (RL = 60 ; CL = 100 pF; unless otherwise specied. See Figs 3 and 4) tbit tonTXD toffTXD tonRXD toffRXD minimum bit time delay TXD to bus active delay TXD to bus inactive delay TXD to receiver active delay TXD to receiver inactive 1 50 80 120 150 170 170 190 400 550 20 3 200 0.6VCC
290 440 7
wake-up time from standby see Fig.6 (via pin 8) bus dominant to RXD LOW V8 = 4 V; see Fig.7 input voltage for standby mode slope control mode current slope control mode voltage
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
CANH 60 100 pF
PCA82C251
6 8 Rs
CANL
Vdiff
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
VRXD
MBG616
HIGH
LOW hysteresis
0.5
0.9
Vdiff (V)
Fig.5 Hysteresis.
VCC VRs 0V
VRXD
tWAKE VTXD = 1 V.
MBG617
1.5 V Vdiff 0V
VRXD
MBG618
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
PCA82C251
The waveforms of the applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.
P8xC592 CAN-CONTROLLER
CTX0 CRX0 CRX1 PX,Y Rext TXD RXD Vref Rs VCC PCA82C251 CAN-TRANSCEIVER 100 nF GND
+5 V
CANL 120
MBG620
(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW). (2) If no slope control is desired: Rext = 0.
2000 Jan 13
10
Philips Semiconductors
Product specication
PCA82C251
COORDINATES(1) SYMBOL TXD GND VCC RXD Vref CANL CANH Rs Note 1. All coordinates (m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). PAD x 1 2 3 4 5 6 7 8 196 1080 1567 2644 2644 1490 748 200 y 137 137 137 137 1644 1644 1644 1610
CANH
1.78 mm
PCA82C251U
1 TXD x 0
2 GND
3 VCC
0 y
RXD
Vref 5 4
CANL
Rs
2.84 mm
MGL944
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11
Philips Semiconductors
Product specication
PCA82C251
SOT97-1
D seating plane
ME
A2
A1
c Z e b1 w M (e 1) b2 5 MH
b 8
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
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12
Philips Semiconductors
Product specication
PCA82C251
SOT96-1
A X
c y HE v M A
Z 8 5
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
8 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
2000 Jan 13
13
Philips Semiconductors
Product specication
PCA82C251
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 14
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C251
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING suitable suitable suitable suitable suitable suitable
2000 Jan 13
15
Philips Semiconductors
Product specication
PCA82C251
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
2000 Jan 13
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Philips Semiconductors
Product specication
PCA82C251
2000 Jan 13
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Philips Semiconductors
Product specication
PCA82C251
2000 Jan 13
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Philips Semiconductors
Product specication
PCA82C251
2000 Jan 13
19
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
285002/03/pp20
Jan 13