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Mechanical Data
Case: Terminals: Weight: TO-92, Plastic Package Solderable per MIL-STD-202G, Method 208 0.18 gram
TO-92
* These ratings are limiting values above which the serviceability of any semiconductor device may be
impaired.
Notes
1. These ratings are based on a maximum junction temperature of 150 degrees C. 2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
PD
Derate above 25C Power Dissipation at TC=25C
PD
Derate above 25C
Thermal Resistance Junction to Ambient Air (Note 1) Thermal Resistance Junction to Case Operation and Storage Junction Temperature Range
Note: 1. Measured with the device soldered into a typical printed circuit board.
IEBO
nA
hFE
350 300
*VCE=5V, IC=10mA
IC=10mA, IB=1mA IC=10mA, VCE=5V
VCE(sat) VBE(on)*