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In thi h t I this chapter, we will treat conduction e in metal as free charges that can be accelerated by an applied electric field, by which the electrical and thermal conduction in a solid will be studied.
Electrical conduction involves the motion of charges in a material under the Influence of an applied electric field. By applying Newtons 2nd law to e motion & using a concept of mean free time between e collisions with lattice vibrations, crystal defects, impurities, etc., we will derive the fundamental equations that govern electrical conduction in solids. Thermal conduction,i.e., the conduction of thermal E from higher to lower temperature regions in a metal, involves the conduction e carrying the energy. Therefore, the relationship b t Th f th l ti hi between th electrical conductivity and th the l t i l d ti it d thermal l conductivity will be reviewed in this textbook.
CONTENTS
Electrical Conductivity of Metals: 2.1 Classical theory : The DRUDE model 2.2 Temperature dependence of resistivity 2.3 MATTHIESSENs and NORDHEIMs Rules. 2.4 Resistivity of mixtures and porous materials 2.5 The H ll Eff t d H ll D i 2 5 Th Hall Effect and Hall Devices Thermal Conductivity: 2.6 Thermal conduction Electrical Conductivity of Nonmetals: 2.7 Electrical conductivity of nonmetals Additional Issues: 2.9 Thin metal films 2.10 Interconnects in microelectronics 2.11 Electromigration and Blacks equations
q J= At
In this system, electrons drift with an average velocity vdx in the x-direction, called the drift velocity. (Here Ex is the electric field.)
Drift velocity is defined as the average velocity of electrons in the x direction at time t, denote by vdx(t)
vdx =
1 [v x1 + v x 2 + v x 3 + ... + v xN ] N
vxi : x direction velocity of the ith electrons N : # of conduction electrons in the metal
[2.1]
Jx =
q enAvdx t = At At
[2.2]
: In time t, the total charge q crossing the area A is enAx, where x=vdxt and n is assumed to be the # of e per unit volume in the conductor (n=N/V). : time dependent current density is useful since the average velocity at one time is not the same as at another time, due to the change of Ex
J x (t ) = envdx (t )
E x = E x (t )
(a)
A conduction e in the electron gas moves about randomly in a metal (with a mean speed u) being frequently and randomly scattered by thermal vibrations of the atoms. In the absence of an applied field there is no net drift in any direction.
(b) In the presence of an applied field, Ex, there is a net drift along the x-direction. This net drift along the force of the field is superimposed on the random motion of the electron. After many scattering events the electron has been displaced by a net distance, x, from its initial position toward the positive terminal
However, this is only for the ith electron. We need the average velocity vdx for all such electrons along x as the following eqn.
vdx =
1 eEx [v x1 + v x 2 + v x 3 + ... + v xN ] = (t ti ) N me
(t-ti) : average free time for N electrons between collision (~ = mean free time or mean scattering time)
Fig 2.3 Velocity gained in the x direction at time t from the electric field ( Ex) for three different electrons. There will be N electrons to consider in the metal.
e vd = Ex dx me
[2.3]
Equation 2.3 shows that the drift velocity increases linearly with the applied field. The constant of proportionality e / me has been g p p y given a special name and symbol, called drift p y , mobility d , which is defined as
vdx = d E x e me
[2.4]
where d =
[2.5]
, which is often called the relaxation time, is directly related to the microscopic , y p processes that cause the scattering of the electrons in the metal; that is, lattice vibration, crystal imperfections, and impurities.
J x = en d E x
= E x [2.6]
Therefore, the current density is proportional to the electric field and the conductivity term is given by
= en d
[2.7]
Then, lets find out temperature dependence of conductivity (or resistivity) of a metal p p y( y) by considering the mean time .
The mean time between collisions has further significance. Its 1/ represents the mean frequency of collisions or scattering events; that is 1/ is the mean probability per unit time that the electron will be scattered. Therefore, during a small time interval t , the probability of scattering will be t / .
Ns (Su ) = 1
volume
1 a
1 SuN s
[2.11]
When the conduction electrons are only scattered by thermal vibrations of the metal ion, then in the mobility expression d = e m refers to the mean y p e time between scattering events by this process.
Ns : concentration of scattering centers S : cross-sectional area u : mean speed a : amplitude of the vibrations lit d f th ib ti
1 1 Ma 2 w2 (average kinetic energy of the oscillations ) kT 4 2 because ibrations Thus So S a 2 T . This makes sense beca se raising the T increases atomic vibrations. Th s
1 1 C Since the mean time between scattering events is inversely or = 2 p p , a 2 T T proportional to the area a that scatters the e, eC (to show a relation with T) substituting for in d = e / me results in d = meT mT 1 1 So, the resistivity of a metal T = = = 2e T = AT [2.12] T en d e nC
2.3 MATTHIESSENs and NORDHEIMs Rules. p y 2.3.1 Matthiessens rule and the temperature coefficient of resistivity
: The theory of conduction that considers scattering from lattice vibrations only works well with pure metal and it fails for metallic alloys. Their resistivities are weakly T-dependent, and so, different type of scattering mechanism is required for metallic alloys. Lets consider a metal alloy that has randomly distributed impurity atoms. We have two mean free times between collision. T : scattering from thermal vibration only
Two different types of scattering processes involving scattering from impurities alone and thermal vibrations alone.
Then, since drift mobility depends on effective scattering time, effective drift mobility is given by
1 1 1 = + ud u L u I
[2.14]
1 / enud
[2.15]
This summation rule of resistivities from different scattering mechanisms is called Matthiessen s rule Matthiessens rule. Furthermore, in a general from, effective resistivity can be given by
= T + R
( R : residual resistivit y ) : scattering E of impurities , dislocatio ns , in ternal atom , vacancies , gain boundaries , etc
AT + B
[2.17]
0 =
1 0 T T =T0
[2.18]
If the resistivity follows the behavior like in Eqn. 2 17 then Eqn. 2.18 l d t i E 2.17, th E 2 18 leads to
= 0 [1 + 0 (T T0 )]
where a0 is constant over a temperature range T0 to T,
[2.19]
= o
&
T = T To
2000 1000
Iron Monel-400 Inconel-825 NiCr Heating Wire NiC H i Wi Tungsten
T
10
Resistiv vity(n m)
Resistivity (n m) n
(n m)
0.1 0.01
3.5
3 2.5 2 1.5 1
100 Platinum
Nickel Copper Silver
Tin
0.001
T5
0.0001
= R
0.5 0 5 = R 0 0 20 40 100
60
T (K)
80 100 10000
1000
10 100
1000
10000
Temperature(K)
Temperature (K)
The resistivity of various metals as a function of temperature above 0 C. Tin melts at 505 K whereas nickel and iron go through a magnetic to non-magnetic (Curie) transformations at about 627 K and 1043 K g ( ) respectively. The theoretical behavior ( ~ T) is shown for reference. [Data selectively extracted from various sources including sections in Metals Handbook, 10th Edition, Volumes 2 and 3 (ASM, Metals Park, Ohio, 1991)]
The resistivity of copper from lowest to highest temperatures (near melting temperature, 1358 K) on a log-log plot. Above about 100 K, T, whereas at low temperatures, T 5 and at the lowest temperatures approaches the residual resistivity R . The inset shows the vs. T behavior below 100 K on a linear plot ( R is too small on this scale).
= T + I
[2.15]
This means that as alloy concentration increases, resistivity increases and becomes less temperature dependent as I, overwhelms T, leading to o << 1/273.
How does the concentration of solute atoms affect on I ? Nordheims rule for solid solutions: an important semiempirical Eqn that can be used to Eqn. predict the resistivity of an alloy, which relates the impurity resistivity to the atomic fraction X of solute atoms in a solid solution, as follows:
S L+
SOLID SOLUTION
20
100% Cu
40 60 at.% Ni
80
100 100% Ni
(a)
600
Resist tivity (n m)
I = CX (1 X )
[2.21]
Cu-Ni Alloys
C (Nordheims coefficient): represents effectiveness of the solute atom in increasing the resistivity.
consistent
40 60 at.% Ni 80 100 100% Ni
(a) Phase diagram of the Cu-Ni alloy system. Above the liquidus line only the liquid phase exists. In the L + S region, the liquid (L) and solid (S) phases coexist whereas below the solidus line, only the solid phase (a %Nordheims rule assumes that the solid solution has the solid solution) exists. (b) The resistivity of the Cu-Ni alloy as a function ) ( ) y y solute atoms randomly distributed in the lattice, and these of Ni content (at.%) at room temperature. [Data extracted from Metals random distributions of impurities cause the e to become Handbook-10th Edition, Vols 2 and 3, ASM, Metals Park, Ohio, 1991 and Constitution of Binary Alloys, M. Hansen and K. Anderko, McGraw-Hill, scattered as they whiz around the crystal. New York, 1958]
Nordheim rule is useful for predicting the resistivities of dil t alloys, particularly i i ti iti f dilute ll ti l l in the low-concentration region.
0 20 100% Cu
(b)
= matrix + CX (1 X )
[2.22]
where matrix = T + R i the resistivity of the matrix d to scattering h is h i i i f h i due i from thermal vibrations and from other defect, absence of alloying elements.
Exception: at some concentrations of certain binary alloys, alloys Cu and Au atoms are not randomly mixed but occupy regular sites, which decrease the resistivity. -----------160 140
Resisti ivity (n m)
Quenched
Electrical resistivity vs. composition at room temperature in Cu-Au alloys. The quenched sample (dashed curve) is obtained by quenching the liquid and has the Cu and Au atoms randomly mixed. The resistivity obeys the Nordheim rule. On the other h d when the i i i b h dh i l h h hand, h h quenched sample is annealed or the liquid slowly cooled (solid curve), certain compositions (Cu3Au and CuAu) result in an ordered crystalline structure in which Cu and Au atoms are positioned in an ordered fashion in the crystal and the scattering effect is reduced.
SKIP
Reff
:L t Let
L L = + A A
L eff A
L : total lengh of the phase layer L : total lengh of the phase layer A : cross sec tion area
phase h
Reff =
eff = +
u sin g = L / L
= L / L
SKIP
2) conductivity mixture rule (parallel rule of mixture) conductivity-mixture For y-direction, since the layers are in parallel, the effective conductivity is given by conductivitymixture rule.
Effective resistivity:
eff = +
: electrical conductivity ,
1 1 + d 2 eff = c (1 d )
( d
> 10 c )
eff = c
Consider a mixture that consist of a continuous Effective conductivity: y conducting cond cting phase with a cond cti it c that has ith conductivity c dispersed spheres of another phase of conductivity d = and of volume fraction + 2
c
(1 d ) (1 + 2 d )
( d < 0.1 c )
d c d + 2 c
SKIP
at T1, X<X1 : the alloy will consist of ( (Cu-rich phase) p ) X1<X<X2 : the alloy will consist of (
+L
+L
phase only
100%A
X1
X (% B)
X 2 100%B
is Cu rich(X1), is Ag rich(X2))
Res sistivity
, randomly mixed
A
0 X1 Composition X (% B)
X 2 100%B
The relative amounts of each phase are determined by the well-known lever rule.
(a) The phase diagram for a binary, eutectic forming alloy. (b) The resistivity vs composition for the binary alloy.
This means that we can determine the volume fractions of as the alloy composition is changed from X1 to X2.
and , and