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Dual, Low Power, 8-/10-/12-/14-Bit

TxDAC

Digital-to-Analog Converters

AD9714/AD9715/AD9716/AD9717


Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 20082009 Analog Devices, Inc. All rights reserved.
FEATURES
Power dissipation @ 3.3 V, 2 mA output
37 mW @ 10 MSPS
86 mW @ 125 MSPS
Sleep mode: <3 mW @ 3.3 V
Supply voltage: 1.8 V to 3.3 V
SFDR to Nyquist
84 dBc @ 1 MHz output
75 dBc @ 10 MHz output
AD9717 NSD @ 1 MHz output, 125 MSPS, 2 mA: 151 dBc/Hz
Differential current outputs: 1 mA to 4 mA
2 on-chip auxiliary DACs
CMOS inputs with single-port operation
Output common mode: adjustable 0 V to 1.2 V
Small footprint 40-lead LFCSP RoHS-compliant package
APPLICATIONS
Wireless infrastructures
Picocell, femtocell base stations
Medical instrumentation
Ultrasound transducer excitation
Portable instrumentation
Signal generators, arbitrary waveform generators
GENERAL DESCRIPTION
The AD9714/AD9715/AD9716/AD9717 are pin-compatible,
dual, 8-/10-/12-/14-bit, low power digital-to-analog converters
(DACs) that provide a sample rate of 125 MSPS. These TxDAC
converters are optimized for the transmit signal path of commu-
nication systems. All the devices share the same interface, package,
and pinout, providing an upward or downward component
selection path based on performance, resolution, and cost.
The AD9714/AD9715/AD9716/AD9717 offer exceptional ac and
dc performance and support update rates up to 125 MSPS.
The flexible power supply operating range of 1.8 V to 3.3 V and
low power dissipation of the AD9714/AD9715/AD9716/AD9717
make them well-suited for portable and low power applications.
PRODUCT HIGHLIGHTS
1. Low Power.
DACs operate on a single 1.8 V to 3.3 V supply; total power
consumption reduces to 35 mW at 125 MSPS with a 1.8 V
supply. Sleep and power-down modes are provided for low
power idle periods.
2. CMOS Clock Input.
High speed, single-ended CMOS clock input supports a
125 MSPS conversion rate.
3. Easy Interfacing to Other Components.
Adjustable output common mode from 0 V to 1.2 V allows
easy interfacing to other components that accept common-
mode levels greater than 0 V.


AD9714/AD9715/AD9716/AD9717

Rev. A | Page 2 of 80
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 3
Functional Block Diagram .............................................................. 4
Specifications ..................................................................................... 5
DC Specifications ......................................................................... 5
Digital Specifications ................................................................... 7
AC Specifications .......................................................................... 8
Absolute Maximum Ratings ............................................................ 9
Thermal Resistance ...................................................................... 9
ESD Caution .................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 18
Terminology .................................................................................... 31
Theory of Operation ...................................................................... 32
Serial Peripheral Interface (SPI) ................................................... 33
General Operation of the Serial Interface ............................... 33
Instruction Byte .......................................................................... 33
Serial Interface Port Pin Descriptions ..................................... 33
MSB/LSB Transfers..................................................................... 34
Serial Port Operation ................................................................. 34
Pin Mode ..................................................................................... 34
SPI Register Map ............................................................................. 35
SPI Register Descriptions .............................................................. 36
Digital Interface Operation ........................................................... 40
Digital Data Latching and Retimer Block ............................... 41
Estimating the Overall DAC Pipeline Delay........................... 42
Reference Operation .................................................................. 43
Reference Control Amplifier .................................................... 43
DAC Transfer Function ............................................................. 44
Analog Output ............................................................................ 44
Self-Calibration ........................................................................... 45
Coarse Gain Adjustment ........................................................... 46
Using the Internal Termination Resistors ............................... 47
Applications Information .............................................................. 48
Output Configurations .............................................................. 48
Differential Coupling Using a Transformer ............................... 48
Single-Ended Buffered Output Using an Op Amp ................ 48
Differential Buffered Output Using an Op Amp ................... 49
Auxiliary DACs ........................................................................... 49
DAC-to-Modulator Interfacing ................................................ 50
Correcting for Nonideal Performance of Quadrature
Modulators on the IF-to-RF Conversion ................................ 50
I/Q-Channel Gain Matching .................................................... 50
LO Feedthrough Compensation .............................................. 51
Results of Gain and Offset Correction .................................... 51
Modifying the Evaluation Board to Use the ADL5370
On-Board Quadrature Modulator ........................................... 52
Evaluation Board Shematics and Artwork .................................. 53
Schematics ................................................................................... 53
Silkscreens ................................................................................... 61
Bill of Materials ............................................................................... 76
Outline Dimensions ....................................................................... 79
Ordering Guide .......................................................................... 79

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 3 of 80
REVISION HISTORY
3/09Rev. 0 to Rev. A
Changes to Figure 1 ........................................................................... 4
Changed DVDD = 3.3 V to DVDD = 1.8 V,
Table 1 Conditions ............................................................................ 5
Changes to Table 1 ............................................................................ 5
Changed DVDD = 3.3 V to DVDD = 1.8 V,
Table 2 Conditions ............................................................................ 7
Changed DVDD = 3.3 V to DVDD = 1.8 V, and DVDDIO = 1.8 V
to DVDDIO = 3.3 V, Table 3 Conditions ....................................... 8
Changed DVDD = 3.3 V to DVDD = 1.8 V, CVDD = 3.3 V to
CVDD = 1.8 V, Table 4 Conditions ................................................. 8
Changes to Table 5 and Table 6 ....................................................... 9
Changes to Figure 2 and Table 7 ................................................... 10
Changes to Figure 3 and Table 8 ................................................... 12
Changes to Figure 4 and Table 9 ................................................... 14
Changes to Table 10 ........................................................................ 16
Changes to Typical Performance Characteristics Section ......... 18
Changes to Figure 84 and Theory of Operation Section ........... 32
Added Figure 85 to Figure 88; Renumbered Sequentially ......... 34
Changes to Pin Mode Section ........................................................ 35
Changes to Table 13 ........................................................................ 36
Changes to Table 14 ........................................................................ 37
Changes to Digital Interface Operation Section and Figure 89 to
Figure 93 ........................................................................................... 40
Changes to Digital Data Latching and Retimer Block Section,
Figure 94, and Retimer Section ..................................................... 41
Changes to Estimating the Overall DAC Pipeline Delay
Section .............................................................................................. 42
Added Reference Operation Section, Figure 96,
Recommendations When Using an External Reference Section,
and Reference Control Amplifier Section.................................... 43
Added Table 17; Renumbered Sequentially ................................. 43
Added DAC Transfer Function Section and Analog Output
Section .............................................................................................. 44
Changes to Figure 99 and Figure 100 ........................................... 46
Changes to Auxiliary DACs Section and Figure 107.................. 49
Changes to DAC-to-Modulator Interfacing Section and
Figure 108 ......................................................................................... 49
Changes to Figure 108 and Figure 109 ......................................... 50
Added Evaluation Board Schematics and Artwork Section, and
Figure 112 to Figure 134 ................................................................. 53
Added Bill of Materials Section and Table 18 ............................. 76

8/08Revision 0: Initial Version

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 4 of 80
FUNCTIONAL BLOCK DIAGRAM
I DAC
Q DAC
AUX1DAC
AUX2DAC
BAND
GAP
CLOCK
DIST
10k
QR
SET
16k
IR
SET
16k
I
REF
100A
IR
CML
1k TO
250
QR
CML
1k TO
250
500
500
500
500
SPI
INTERFACE
1 INTO 2
INTERLEAVED
DATA
INTERFACE
I DATA
Q DATA
1.8V
LDO
1V
AD9717
0
7
2
6
5
-
0
0
1
RLIN
IOUTN
IOUTP
RLIP
AVDD
AVSS
RLQP
QOUTP
QOUTN
RLQN
DB11
DB10
DB9
DB8
DVDDIO
DVSS
DVDD
DB7
DB6
DB5
D
B
1
2
D
B
1
3

(
M
S
B
)
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S
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W
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A
T
S
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E
T
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O
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A
D
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A
U
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F
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A
D
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Q
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A
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X
Q
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D
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4
D
B
3
D
B
2
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1
D
B
0

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K
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Figure 1.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 5 of 80
SPECIFICATIONS
DC SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 2 mA, maximum sample rate, unless
otherwise noted.
Table 1.
Parameter
AD9714 AD9715 AD9716 AD9717
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
RESOLUTION 8 10 12 14 Bits
ACCURACY, AVDD = DVDDIO =
CVDD = 3.3 V

Differential Nonlinearity (DNL)
Precalibration 0.02 0.08 0.4 1.7 LSB
Postcalibration 0.003 0.01 0.2 1.0 LSB
Integral Nonlinearity (INL)
Precalibration 0.025 0.13 0.4 1.8 LSB
Postcalibration 0.01 0.05 0.3 1.3 LSB
ACCURACY, AVDD = DVDDIO =
CVDD = 1.8 V

Differential Nonlinearity (DNL)
Precalibration 0.02 0.08 0.4 1.2 LSB
Postcalibration 0.005 0.01 0.2 1.0 LSB
Integral Nonlinearity (INL)
Precalibration 0.025 0.12 0.4 1.5 LSB
Postcalibration 0.02 0.05 0.25 1.1 LSB
MAIN DAC OUTPUTS
Offset Error 1 0 +1 1 0 +1 1 0 +1 1 0 +1 mV
Gain Error
Internal Reference 2 +2 2 +2 2 +2 2 +2 % of FSR
Full-Scale Output Current
1

AVDD = 3.3 V 1 2 4 1 2 4 1 2 4 1 2 4 mA
AVDD = 1.8 V 1 2 2.5 1 2 2.5 1 2 2.5 1 2 2.5 mA
Output Compliance Range 0.5 0 +1.2 0.5 0 +1.2 0.5 0 +1.2 0.5 0 +1.2 V
Output Resistance 200 200 200 200 M
Crosstalk, Q DAC to I DAC
fOUT = 30 MHz 97 97 97 97 dB
fOUT = 60 MHz 78 78 78 78 dB
MAIN DAC TEMPERATURE DRIFT
Offset 0 0 0 0 ppm/C
Gain 40 40 40 40 ppm/C
Reference Voltage 25 25 25 25 ppm/C
AUXDAC OUTPUTS
Resolution 10 10 10 10 Bits
Full-Scale Output Current
(Current Sourcing Mode)
125 125 125 125 A
Voltage Output Mode VSS VDD VSS VDD VSS VDD VSS VDD V
Output Compliance Range
(Sourcing 1 mA)
VSS VDD
0.25
VSS VDD
0.25
VSS VDD
0.25
VSS VDD
0.25
V
Output Compliance Range
(Sinking 1 mA)
VSS +
0.25
VDD VSS +
0.25
VDD VSS +
0.25
VDD VSS +
0.25
VDD V
Output Resistance in Current
Output Mode, AVSS to 1 V
1 1 1 1 M
AUX DAC Monotonicity
Guaranteed
10 10 10 10 Bits
REFERENCE OUTPUT
Internal Reference Voltage 0.98 1.025 1.08 0.98 1.025 1.08 0.98 1.025 1.08 0.98 1.025 1.08 V
Output Resistance 10 10 10 10 k
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 6 of 80
Parameter
AD9714 AD9715 AD9716 AD9717
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
REFERENCE INPUT
Voltage Compliance
AVDD = 3.3 V 0.1 1.25 0.1 1.25 0.1 1.25 0.1 1.25 V
AVDD = 1.8 V 0.1 1.0 0.1 1.0 0.1 1.0 0.1 1.0 V
Input Resistance External
Reference Mode
1 1 1 1 M
DAC MATCHING
Gain Matching 1 +1 1 +1 1 +1 1 +1 % FSR
ANALOG SUPPLY VOLTAGES
AVDD 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
CVDD 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
DIGITAL SUPPLY VOLTAGES
DVDD 1.7 1.9 1.7 1.9 1.7 1.9 1.7 1.9 V
DVDDIO 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
POWER CONSUMPTION, AVDD =
DVDDIO = CVDD = 3.3 V

fDAC = 125 MSPS, IF = 12.5 MHz 86 86 86 86 mW
IAVDD 10 10 10 10 mA
IDVDD + IDVDDIO

11 11 11 11 mA
ICVDD 3 3 3 3 mA
Power-Down Mode with Clock 50 50 50 50 mW
Power-Down Mode, No Clock 1.5 1.5 1.5 1.5 mW
Power Supply Rejection Ratio 0.04 0.04 0.04 0.04 % FSR/V
POWER CONSUMPTION, AVDD =
DVDDIO = CVDD = 1.8 V.

fDAC = 125 MSPS, IF = 12.5 MHz 35 35 35 35 mW
IAVDD 10 10 10 10 mA
IDVDD + IDVDDIO 8 8 8 8 mA
ICVDD 1.5 1.5 1.5 1.5 mA
Power-Down Mode with Clock 12 12 12 12 mW
Power-Down Mode, No Clock 850 850 850 850 W
Power Supply Rejection Ratio 0.001 0.001 0.001 0.001 % FSR/V
OPERATING RANGE 40 +25 +85 40 +25 +85 40 +25 +85 40 +25 +85 C

1
Based on a 10 k external resistor.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 7 of 80
DIGITAL SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 2 mA, maximum sample rate, unless
otherwise noted.
Table 2.
Parameter Min Typ Max Unit
DAC CLOCK INPUT (CLKIN)
VIH 2.1 3 V
VIL 0 0.9 V
Maximum Clock Rate 125 MSPS
SERIAL PERIPHERAL INTERFACE
Maximum Clock Rate (SCLK) 25 MHz
Minimum Pulse Width High 20 ns
Minimum Pulse Width Low 20 ns
INPUT DATA
1.8 V Q Channel or DCLKIO Falling Edge
Setup 0.25 ns
Hold 1.2 ns
1.8 V I Channel or DCLKIO Rising Edge
Setup 0.13 ns
Hold 1.1 ns
3.3 V Q Channel or DCLKIO Falling Edge
Setup 0.2 ns
Hold 1.5 ns
3.3 V I Channel or DCLKIO Rising Edge
Setup 0.2 ns
Hold 1.6 ns
VIH 2.1 3 V
VIL 0 0.9 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 8 of 80
AC SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 2 mA, maximum sample rate, unless
otherwise noted.
Table 3.
Parameter
AD9714 AD9715 AD9716 AD9717
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 125 MSPS, fOUT = 10 MHz 75 82 83 84 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 60 61 62 63 dBc
TWO TONE INTERMODULATION
DISTORTION (IMD)

fDAC = 125 MSPS, fOUT = 10 MHz 86 87 88 89 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 71 71 71 71 dBc
NOISE SPECTRAL DENSITY (NSD)
EIGHT-TONE, 500 kHz TONE SPACING

fDAC = 125 MSPS, fOUT = 10 MHz 129 141 149 152 dBc/Hz
fDAC = 125 MSPS, fOUT = 50 MHz 123 135 137 141 dBc/Hz
W-CDMA ADJACENT CHANNEL LEAKAGE
RATIO (ACLR), SINGLE CARRIER

fDAC = 61.44 MSPS, fOUT = 20 MHz 71 71 71 71 dBc
fDAC = 122.88 MSPS, fOUT = 30 MHz 72 72 72 72 dBc
TMIN to TMAX, AVDD = 1.8 V, DVDD = 1.8 V, DVDDIO = 1.8 V, CVDD = 1.8 V, IxOUTFS = 2 mA, maximum sample rate, unless
otherwise noted.
Table 4.
Parameter
AD9714 AD9715 AD9716 AD9717
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 125 MSPS, fOUT = 10 MHz 75 78 79 80 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 55 56 57 58 dBc
TWO TONE INTERMODULATION
DISTORTION (IMD)

fDAC = 125 MSPS, fOUT = 10 MHz 79 80 84 85 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 53 53 53 53 dBc
NOISE SPECTRAL DENSITY (NSD)
EIGHT-TONE, 500 kHz TONE SPACING

fDAC = 125 MSPS, fOUT = 10 MHz 132 141 146 148 dBc/Hz
fDAC = 125 MSPS, fOUT = 50 MHz 126 131 131 132 dBc/Hz
W-CDMA ADJACENT CHANNEL LEAKAGE
RATIO (ACLR), SINGLE CARRIER

fDAC = 61.44 MSPS, fOUT = 20 MHz 68 68 68 68 dBc
fDAC = 122.88 MSPS, fOUT = 30 MHz 68 68 68 68 dBc

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 9 of 80
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
AVDD, DVDDIO, CVDD to AVSS, DVSS, CVSS 0.3 V to +3.9 V
DVDD to DVSS 0.3 V to +2.1 V
AVSS to DVSS, CVSS 0.3 V to +0.3 V
DVSS to AVSS, CVSS 0.3 V to +0.3 V
CVSS to AVSS, DVSS 0.3 V to +0.3 V
REFIO, FSADJQ, FSADJI, CMLQ, CMLI to AVSS 0.3 V to AVDD + 0.3 V
QOUTP, QOUTN, IOUTP, IOUTN, RLQP, RLQN,
RLIP, RLIN to AVSS
1.0 V to AVDD + 0.3 V
DBn
1
(MSB) to DB0 (LSB), CS, SCLK, SDIO,
RESET to DVSS
0.3 V to DVDDIO + 0.3 V
CLKIN to CVSS 0.3 V to CVDD + 0.3 V
Junction Temperature 125C
Storage Temperature Range 65C to +150C

1
n stands for 7 for the AD9714, 9 for the AD9715, 11 for the AD9716, and 13
for the AD9717.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6.
Package Type JA JB
1
JC
1
Unit
40-Lead LFCSP (with No Airflow
Movement)
29.8 19.0 3.4 C/W

1
These calculations are intended to represent the thermal performance of the
indicated packages using a JEDEC multilayer test board. Do not assume the
same level of thermal performance in actual applications without a careful
inspection of the conditions in the application to determine that they are
similar to those assumed in these calculations.
ESD CAUTION




AD9714/AD9715/AD9716/AD9717

Rev. A | Page 10 of 80
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
0
7
2
6
5
-
0
6
6
PIN 1
INDICATOR
1 DB5
2 DB4
3 DB3
4 DB2
5 DVDDIO
6 DVSS
7 DVDD
8 DB1
9 DB0 (LSB)
10 NC
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
1
1
N
C
1
2
N
C
1
3
N
C
1
5
N
C
1
7
C
V
D
D
1
6
D
C
L
K
I
O
1
8
C
L
K
I
N
1
9
C
V
S
S
2
0
C
M
L
Q
1
4
N
C
3
3
F
S
A
D
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3
4
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7

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TOP VIEW
(Not to Scale)
AD9714
NOTES
1. NC = NO CONNECT
2. THE EXPOSED PAD IS CONNECTED TO AVSS AND
SHOULD BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
C
S
/
P
W
R
D
N

Figure 2. AD9714 Pin Configuration
Table 7. AD9714 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[5:2] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD with a
1.0 F capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 DB1 Digital Inputs.
9 DB0 (LSB) Digital Input (LSB).
10 to 15 NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage (1.8 V to 3.3 V). CVDD must be DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip
(QRCML) is disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a
resistor (see the Using the Internal Termination Resistors section). The recommended value for this external
resistor is 0 .
21 RLQN Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage (1.8 V to 3.3 V).
27 RLIP Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 11 of 80
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor
(see the Using the Internal Termination Resistors section). The recommended value for this external resistor
is 0 .
32 FSADJQ/AUXQ Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QRSET) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on chip (QRSET) is enabled, this pin is the auxiliary Q DAC
output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on chip (IRSET) is disabled, this pin is full-scale
current output adjust for I DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on chip (IRSET) is enabled, this pin is the auxiliary I DAC
output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 F capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO CLKIN, pulse 0 to 1 to edge trigger the internal retimer (see the
Retimer section).
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low (pull-
down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the two
complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select. In pin mode, a logic
high (pull-up to DVDDIO) powers down the device, except for the SPI port.
Power-Down (PWRDN). In pin mode, PWRDN powers down the device except for the SPI port.
39 DB7 (MSB) Digital Input (MSB).
40 DB6 Digital Input.
41 (EPAD) Exposed Pad
(EPAD)
The exposed pad is connected to AVSS and should be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 12 of 80
0
7
2
6
5
-
0
6
7
PIN 1
INDICATOR
1 DB7
2 DB6
3 DB5
4 DB4
5 DVDDIO
6 DVSS
7 DVDD
8 DB3
9 DB2
10 DB1
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
1
1
D
B
0

(
L
S
B
)
1
2
N
C
1
3
N
C
1
5
N
C
1
7
C
V
D
D
1
6
D
C
L
K
I
O
1
8
C
L
K
I
N
1
9
C
V
S
S
2
0
C
M
L
Q
1
4
N
C
3
3
F
S
A
D
J
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A
U
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I
3
4
R
E
F
I
O
3
5
R
E
S
E
T
/
P
I
N
M
D
3
6
S
C
L
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/
C
L
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M
D
3
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S
D
I
O
/
F
O
R
M
A
T
3
8
3
9
D
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9

(
M
S
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4
0
D
B
8
3
2
F
S
A
D
J
Q
/
A
U
X
Q
3
1
C
M
L
I
TOP VIEW
(Not to Scale)
AD9715
NOTES
1. NC = NO CONNECT
2. THE EXPOSED PAD IS CONNECTED TO AVSS AND
SHOULD BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
C
S
/
P
W
R
D
N

Figure 3. AD9715 Pin Configuration
Table 8. AD9715 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[7:4] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD with a
1.0 F capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 10 DB[3:1] Digital Inputs.
11 DB0 (LSB) Digital Input (LSB).
12 to 15 NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage (1.8 V to 3.3 V). CVDD must be DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip
(QRCML) is disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a
resistor (see the Using the Internal Termination Resistors section). The recommended value for this external
resistor is 0 .
21 RLQN Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage (1.8 V to 3.3 V).
27 RLIP Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 13 of 80
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor
(see the Using the Internal Termination Resistors section). The recommended value for this external resistor
is 0 .
32 FSADJQ/AUXQ Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QRSET) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on chip (QRSET) is enabled, this pin is the auxiliary Q DAC
output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on chip (IRSET) is disabled, this pin is the full-
scale current output adjust for I DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on chip (IRSET) is enabled, this pin is the auxiliary I DAC
output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 F capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO CLKIN, pulse 0 to 1 to edge trigger the internal retimer (see the
Retimer section).
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low
(pull-down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the
twos complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB9 (MSB) Digital Input (MSB).
40 DB8 Digital Input.
41 (EPAD) Exposed Pad
(EPAD)
The exposed pad is connected to AVSS and should be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 14 of 80
0
7
2
6
5
-
0
0
3
PIN 1
INDICATOR
1 DB9
2 DB8
3 DB7
4 DB6
5 DVDDIO
6 DVSS
7 DVDD
8 DB5
9 DB4
10 DB3
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
1
1
D
B
2
1
2
D
B
1
1
3
D
B
0

(
L
S
B
)
1
5
N
C
1
7
C
V
D
D
1
6
D
C
L
K
I
O
1
8
C
L
K
I
N
1
9
C
V
S
S
2
0
C
M
L
Q
1
4
N
C
3
3
F
S
A
D
J
I
/
A
U
X
I
3
4
R
E
F
I
O
3
5
R
E
S
E
T
/
P
I
N
M
D
3
6
S
C
L
K
/
C
L
K
M
D
3
7
S
D
I
O
/
F
O
R
M
A
T
3
8
3
9
D
B
1
1

(
M
S
B
)
4
0
D
B
1
0
3
2
F
S
A
D
J
Q
/
A
U
X
Q
3
1
C
M
L
I
TOP VIEW
(Not to Scale)
AD9716
NOTES
1. NC = NO CONNECT
2. THE EXPOSED PAD IS CONNECTED TO AVSS AND
SHOULD BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
C
S
/
P
W
R
D
N

Figure 4. AD9716 Pin Configuration
Table 9. AD9716 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[9:6] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD with a
1.0 F capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 12 DB[5:1] Digital Inputs.
13 DB0 (LSB) Digital Input (LSB).
14, 15 NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage (1.8 V to 3.3 V). CVDD must be DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip
(QRCML) is disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a
resistor (see the Using the Internal Termination Resistors section). The recommended value for this external
resistor is 0 .
21 RLQN Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage (1.8 V to 3.3 V).
27 RLIP Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 15 of 80
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor
(see the Using the Internal Termination Resistors section). The recommended value for this external resistor
is 0 .
32 FSADJQ/AUXQ Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QRSET) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on chip (QRSET) is enabled, this pin is the auxiliary Q DAC
output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on chip (IRSET) is disabled, this pin is the full-
scale current output adjust for I DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on chip (IRSET) is enabled, this pin is the auxiliary I DAC
output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 F capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO CLKIN, pulse 0 to 1 to edge trigger the internal retimer (see the
Retimer section).
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low
(pull-down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the
twos complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB11 (MSB) Digital Input (MSB).
40 DB10 Digital Input.
41 (EPAD) Exposed Pad
(EPAD)
The exposed pad is connected to AVSS and should be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.


AD9714/AD9715/AD9716/AD9717

Rev. A | Page 16 of 80
PIN 1
INDICATOR
1 DB11
2 DB10
3 DB9
4 DB8
5 DVDDIO
6 DVSS
7 DVDD
8 DB7
9 DB6
10 DB5
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
1
1
D
B
4
1
2
D
B
3
1
3
D
B
2
1
5
D
B
0

(
L
S
B
)
1
7
C
V
D
D
1
6
D
C
L
K
I
O
1
8
C
L
K
I
N
1
9
C
V
S
S
2
0
C
M
L
Q
1
4
D
B
1
3
3
F
S
A
D
J
I
/
A
U
X
I
3
4
R
E
F
I
O
3
5
R
E
S
E
T
/
P
I
N
M
D
3
6
S
C
L
K
/
C
L
K
M
D
3
7
S
D
I
O
/
F
O
R
M
A
T
3
8
3
9
D
B
1
3

(
M
S
B
)
4
0
D
B
1
2
3
2
F
S
A
D
J
Q
/
A
U
X
Q
3
1
C
M
L
I
TOP VIEW
(Not to Scale)
0
7
2
6
5
-
0
0
2
AD9717
NOTES
1. THE EXPOSED PAD IS CONNECTED TO AVSS AND
SHOULD BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
C
S
/
P
W
R
D
N

Figure 5. AD9717 Pin Configuration
Table 10. AD9717 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[11:8] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD with a
1.0 F capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 14 DB[7:1] Digital Inputs.
15 DB0 (LSB) Digital Input (LSB).
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage (1.8 V to 3.3 V). CVDD must be DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip
(QRCML) is disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a
resistor (see the Using the Internal Termination Resistors section). The recommended value for this external
resistor is 0 .
21 RLQN Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (500 ) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage (1.8 V to 3.3 V).
27 RLIP Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (500 ) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 17 of 80
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor
(see the Using the Internal Termination Resistors section). The recommended value for this external resistor
is 0 .
32 FSADJQ/AUXQ Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QRSET) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on chip (QRSET) is enabled, this pin is the auxiliary Q DAC
output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on chip (IRSET) is disabled, this pin is the full-
scale current output adjust for I DAC and must be connected to AVSS through a resistor (see the Theory of
Operation section). The nominal value for this external resistor is 16 k for a 2 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on chip (IRSET) is enabled, this pin is the auxiliary I DAC
output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 F capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO CLKIN, pulse 0 to 1 to edge trigger the internal retimer (see the
Retimer section).
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low
(pull-down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the
twos complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB13 (MSB) Digital Input (MSB).
40 DB12 Digital Input.
41 (EPAD) Exposed Pad
(EPAD)
The exposed pad is connected to AVSS and should be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 18 of 80
TYPICAL PERFORMANCE CHARACTERISTICS
IxOUTFS = 2 mA, maximum sample rate, unless otherwise noted. DVDD is always at 1.8 V.
1.5
1.0
0.5
0
0.5
1.0
1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
4
Figure 6. AD9717 Precalibration INL at 1.8 V (DVDD = 1.8 V)
1.5
1.0
0.5
0
0.5
1.0
1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
5
Figure 7. AD9717 Precalibration DNL at 1.8 V (DVDD = 1.8 V)
1.75
1.25
0.75
0.25
0.75
0.25
1.25
1.75
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
6
Figure 8. AD9717 Precalibration INL at 3.3 V (DVDD = 1.8 V)
1.5
1.0
0.5
0
0.5
1.0
1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
7
Figure 9. AD9717 Postcalibration INL at 1.8 V (DVDD = 1.8 V)
1.5
1.0
0.5
0
0.5
1.0
1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
8
Figure 10. AD9717 Postcalibration DNL at 1.8 V (DVDD = 1.8 V)
1.75
1.25
0.75
0.25
0.75
0.25
1.25
1.75
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
0
9
Figure 11. AD9717 Postcalibration INL at 3.3 V (DVDD = 1.8 V)
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 19 of 80
1.75
1.25
0.75
0.25
0.75
0.25
1.25
1.75
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
0
Figure 12. AD9717 Precalibration DNL at 3.3 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
1
Figure 13. AD9716 Precalibration INL at 1.8 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
2
Figure 14. AD9716 Precalibration DNL at 1.8 V
1.75
1.25
0.75
0.25
0.75
0.25
1.25
1.75
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
3
Figure 15. AD9717 Postcalibration DNL at 3.3 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
4
Figure 16. AD9716 Postcalibration INL at 1.8 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
5
Figure 17. AD9716 Postcalibration DNL at 1.8 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 20 of 80
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
6
Figure 18. AD9716 Precalibration INL at 3.3 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
7
Figure 19. AD9716 Precalibration DNL at 3.3 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
8
Figure 20. AD9715 Precalibration INL at 1.8 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
1
9
Figure 21. AD9716 Postcalibration INL at 3.3 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
0
Figure 22. AD9716 Postcalibration DNL at 3.3 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
1
Figure 23. AD9715 Postcalibration INL at 1.8 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 21 of 80
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
2
Figure 24. AD9715 Precalibration DNL at 1.8 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
3
Figure 25. AD9715 Precalibration INL at 3.3 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
4
Figure 26. AD9715 Precalibration DNL at 3.3 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
5
Figure 27. AD9715 Postcalibration DNL at 1.8 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
6
Figure 28. AD9715 Postcalibration INL at 3.3 V
0.13
0.08
0.03
0.02
0.07
0.12
0 128 256 384 512 640 768 896 1024
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
7
Figure 29. AD9715 Postcalibration DNL at 3.3 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 22 of 80
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
8
16 48 80 112 144 176 208 240
Figure 30. AD9714 Precalibration INL at 1.8 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
2
9
16 48 80 112 144 176 208 240
Figure 31. AD9714 Precalibration DNL at 1.8 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
0
16 48 80 112 144 176 208 240
Figure 32. AD9714 Precalibration INL at 3.3 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
1
16 48 80 112 144 176 208 240
Figure 33. AD9714 Postcalibration INL at 1.8 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
2
16 48 80 112 144 176 208 240
Figure 34. AD9714 Postcalibration DNL at 1.8 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

I
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
3
16 48 80 112 144 176 208 240
Figure 35. AD9714 Postcalibration INL at 3.3 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 23 of 80
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
R
E
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
4
16 48 80 112 144 176 208 240
Figure 36. AD9714 Precalibration DNL at 3.3 V
126
132
138
144
150
156
0 5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
0
3
8
AD9717
AD9715
AD9714
AD9716
Figure 37. AD9714/AD9715/AD9716/AD9717 Noise Spectral Density at 1.8 V
154
151
148
145
142
139
136
133
5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
1
3
8
40C
+25C
+85C

Figure 38. AD9717 Noise Spectral Density at Three Temperatures, 1.8 V
0.025
0.020
0.015
0.010
0.005
0
0.005
0.010
0.015
0.020
0.025
0 32 64 96 128 160 192 224 256
CODE
P
O
S
T
C
A
L
I
B
R
A
T
I
O
N

D
N
L

(
L
S
B
)
0
7
2
6
5
-
0
3
7
16 48 80 112 144 176 208 240
Figure 39. AD9714 Postcalibration DNL at 3.3 V
126
129
132
135
138
141
144
147
150
153
156
0 5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
0
3
5
AD9717
AD9715
AD9714
AD9716
Figure 40. AD9714/AD9715/AD9716/AD9717 Noise Spectral Density at 3.3 V
154
151
148
145
142
139
136
133
5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
1
4
1
+25C
40C
+85C

Figure 41. AD9717 Noise Spectral Density at Three Temperatures, 3.3 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 24 of 80
157
154
151
148
145
142
139
136
133
130
0 5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
1
4
2
1.8V, 1mA
1.8V, 2mA
Figure 42. AD9717 Noise Spectral Density at Two Output Currents, 1.8 V
10
20
30
40
50
60
70
80
90
100
110
START 1MHz 1.5MHz/DIV STOP 16MHz
(
d
B
m
)
0
7
2
6
5
-
0
8
5

Figure 43. AD9717 Two Tone Spectrum, 1.8 V
88
82
76
70
64
58
52
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
0
9
8
AD9714
AD9715
AD9716
AD9717

Figure 44. AD9714/AD9715/AD9716/AD9717 IMD at 1.8 V
157
154
151
148
145
142
139
136
133
130
0 5 10 15 20 25 30 35 40 45 50 55
f
OUT
(MHz)
N
S
D

(
d
B
c
)
0
7
2
6
5
-
1
4
5
3.3V, 1mA
3.3V, 4mA 3.3V, 2mA
Figure 45. AD9717 Noise Spectral Density at Three Output Currents, 3.3 V
10
20
30
40
50
60
70
80
90
100
110
START 1MHz 1.4MHz/DIV STOP 15MHz
(
d
B
m
)
0
7
2
6
5
-
0
8
8

Figure 46. AD9717 Two Tone Spectrum, 3.3 V
100
94
88
82
76
70
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
0
4
0
AD9717
AD9715
AD9714
AD9716

Figure 47. AD9714/AD9715/AD9716/AD9717 IMD at 3.3 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 25 of 80
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
40C
+85C
+25C
0
7
2
6
5
-
1
4
8

Figure 48. AD9717 IMD at Three Temperatures, 1.8 V
88
82
76
70
64
58
52
5 10 15 20 25 30 35 40 45 50
f
IN
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
0
8
9
0dB
3dB
6dB
Figure 49. AD9717 IMD at Three Digital Input Levels, 1.8 V
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
1
5
0
1mA
2mA
Figure 50. AD9717 IMD at Two Output Currents, 1.8 V
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
40C
+85C
+25C
0
7
2
6
5
-
1
5
1

Figure 51. AD9717 IMD at Three Temperatures, 3.3 V
91
88
85
82
79
76
5 10 15 20 25 30 35 40 45 50
f
IN
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
0
9
0
0dB
3dB
6dB
Figure 52. AD9717 IMD at Three Digital Input Levels, 3.3 V
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50
f
OUT
(MHz)
I
M
D

(
d
B
c
)
0
7
2
6
5
-
1
5
3
1mA
2mA
4mA
Figure 53. AD9717 IMD at Three Output Currents, 3.3 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 26 of 80
10
20
30
40
50
60
70
80
90
100
110
START 1MHz 1.5MHz/DIV STOP 16MHz
(
d
B
m
)
0
7
2
6
5
-
0
8
4
Figure 54. AD9717 Single-Tone Spectrum, 1.8 V
50
56
62
68
74
80
86
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
1
5
5
AD9717
AD9716
AD9715
AD9714
Figure 55. AD9714/AD9715/AD9716/AD9717 SFDR at 1.8 V
48
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
1
5
6
40C
+85C
+25C
Figure 56. AD9717 SFDR at Three Temperatures, 1.8 V
10
20
30
40
50
60
70
80
90
100
110
START 1MHz 1.4MHz/DIV STOP 15MHz
(
d
B
m
)
0
7
2
6
5
-
0
8
7
Figure 57. AD9717 Single-Tone Spectrum, 3.3 V
66
69
72
75
78
84
87
81
93
90
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
1
5
8
AD9717
AD9716
AD9715
AD9714
Figure 58. AD9714/AD9715/AD9716/AD9717 SFDR at 3.3 V
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
1
5
9
3.3V, +85C
3.3V, 40C 3.3V, +25C
Figure 59. AD9717 SFDR at Three Temperatures, 3.3 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 27 of 80
90
85
80
75
70
65
60
55
50
0 10 20 30 40 50 60
f
IN
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
0
9
2
0dB
3dB
6dB
Figure 60. SFDR at Three Digital Input Levels vs. fIN, 1.8 V
48
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
1mA
2mA
0
7
2
6
5
-
1
6
0
Figure 61. SFDR at Two Output Currents, 1.8 V
CENTER 22.90MHz
TOTAL CARRIER POWER 19.81dBm/7.87420MHz
REF CARRIER POWER 19.81dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. 19.81dBm 5.000MHz 3.840MHz 70.32 90.13 72.61 92.42
2. 85.75dBm 10.00MHz 3.840MHz 71.81 91.61 71.60 91.41
15.00MHz 3.840MHz 72.59 92.40 65.50 85.31
1
0
d
B
/
D
I
V
VBW 300kHz
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
SPAN 38.84MHz
RES BW 30kHz SWEEP 126ms (601pts)
0
7
2
6
5
-
1
6
1
AC-COUPLED: UNSPECIFIED
BELOW 20MHz
Figure 62. AD9717 One-Carrier ACLR, 1.8 V
90
85
80
75
70
65
60
55
50
0 10 20 30 40 50 60
f
IN
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
0
9
1
0dB
3dB
6dB
Figure 63. SFDR at Three Digital Input Levels vs. fIN, 3.3 V
54
60
66
72
78
84
90
5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
S
F
D
R

(
d
B
c
)
0
7
2
6
5
-
1
6
2
2mA
4mA
1mA
Figure 64. SFDR at Three Output Currents, 3.3 V
CENTER 22.90MHz
TOTAL CARRIER POWER 25.42dBm/7.68000MHz
REF CARRIER POWER 25.42dBm/3.84000MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. 25.42dBm 5.000MHz 3.840MHz 72.52 97.94 72.44 97.86
2. 88.16dBm 10.00MHz 3.840MHz 72.82 98.24 73.02 98.44
15.00MHz 3.840MHz 72.18 97.60 71.88 97.30
1
0
d
B
/
D
I
V
VBW 300kHz
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
SPAN 38.84MHz
RES BW 30kHz SWEEP 126ms (601pts)
0
7
2
6
5
-
1
6
3
AC-COUPLED: UNSPECIFIED
BELOW 20MHz
Figure 65. AD9717 One-Carrier ACLR, 3.3 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 28 of 80
60
65
70
75
15 25 35 45
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
6
8
1mA POSTCAL
2mA POSTCAL
1mA PRECAL
2mA PRECAL
Figure 66. AD9717 One-Carrier W-CDMA First ACLR, 1.8 V
60
65
70
75
15 25 35 45
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
1
1mA PRECAL
2mA PRECAL
2mA POSTCAL
1mA POSTCAL
Figure 67. AD9717 One-Carrier W-CDMA Second ACLR, 1.8 V
60
65
70
75
20 30 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
2
1mA PRECAL
2mA PRECAL
1mA POSTCAL
2mA POSTCAL
Figure 68. AD9717 One-Carrier W-CDMA Third ACLR, 1.8 V
60
65
70
75
80
15 25 35 45
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
0
1mA POSTCAL
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA POSTCAL
4mA PRECAL
Figure 69. AD9717 One-Carrier W-CDMA First ACLR, 3.3 V
60
65
70
75
80
15 25 35 45
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
4
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA POSTCAL
4mA PRECAL
1mA POSTCAL
Figure 70. AD9717 One-Carrier W-CDMA Second ACLR, 3.3 V
60
65
70
75
80
20 30 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
5
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA POSTCAL
4mA PRECAL
1mA POSTCAL
Figure 71. AD9717 One-Carrier W-CDMA Third ACLR, 3.3 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 29 of 80
CENTER 22.90MHz
TOTAL CARRIER POWER 23.08dBm/7.87420MHz
REF CARRIER POWER 25.84dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. 25.84dBm 5.000MHz 3.840MHz 65.45 91.30 65.63 91.47
2. 26.35dBm 10.00MHz 3.840MHz 67.01 92.85 67.05 92.89
15.00MHz 3.840MHz 65.22 91.06 65.33 91.18
1
0
d
B
/
D
I
V
VBW 300kHz
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
SPAN 38.84MHz
RES BW 30kHz SWEEP 126ms (601pts)
0
7
2
6
5
-
1
6
4
AC-COUPLED: UNSPECIFIED
BELOW 20MHz
Figure 72. AD9717 Two-Carrier ACLR, 1.8 V
55
60
65
70
15 20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
3
2mA POSTCAL
2mA PRECAL
1mA PRECAL
1mA POSTCAL
Figure 73. AD9717 Two-Carrier W-CDMA First ACLR, 1.8 V
55
60
65
70
15 20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
7
1mA PRECAL
1mA POSTCAL
2mA PRECAL
2mA POSTCAL
Figure 74. AD9717 Two-Carrier W-CDMA Second ACLR, 1.8 V
CENTER 22.90MHz
TOTAL CARRIER POWER 33.14dBm/7.87420MHz
REF CARRIER POWER 25.86dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. 25.86dBm 5.000MHz 3.840MHz 66.28 92.13 66.68 92.53
2. 26.47dBm 10.00MHz 3.840MHz 68.17 94.02 66.93 92.78
15.00MHz 3.840MHz 64.89 90.73 65.84 91.69
1
0
d
B
/
D
I
V
VBW 300kHz
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
SPAN 38.84MHz
RES BW 30kHz SWEEP 126ms (601pts)
0
7
2
6
5
-
1
6
5
AC-COUPLED:UNSPECIFIED
BELOW 20MHz
Figure 75. AD9717 Two-Carrier ACLR, 3.3 V
55
60
65
70
75
15 20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
6
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA POSTCAL
4mA PRECAL
1mA POSTCAL
Figure 76. AD9717 Two-Carrier W-CDMA First ACLR, 3.3 V
55
60
65
70
75
15 20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
8
0
1mA POSTCAL
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA POSTCAL
4mA PRECAL
Figure 77. AD9717 Two-Carrier W-CDMA Second ACLR, 3.3 V
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 30 of 80
55
60
65
70
20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
7
8
1mA PRECAL
1mA POSTCAL 2mA PRECAL
2mA POSTCAL
Figure 78. AD9717 Two-Carrier W-CDMA Third ACLR, 1.8 V
0.4
0.3
0.2
0.1
0
0.1
0.2
0.3
0.5
0.4
0
CODE
A
U
X
D
A
C

D
N
L

(
L
S
B
)
128 256 384 512 640 768 896 1024
0
7
2
6
5
-
1
4
7

Figure 79. AUXDAC DNL
25
20
15
10
5
0
0 20 40 60 80 100 120 140
f
CLK
(MHz)
C
U
R
R
E
N
T

(
m
A
)
0
7
2
6
5
-
0
4
1
CVDD
TOTAL CURRENT @ 1mA OUT
TOTAL CURRENT @ 2mA OUT
DVDD
AVDD @ 1mA OUT
AVDD @ 2mA OUT

Figure 80. Supply Current vs. Clock Frequency at 1.8 V
55
60
65
70
75
20 25 30 35 40
f
OUT
(MHz)
A
C
L
R

(
d
B
c
)
0
7
2
6
5
-
0
8
1
1mA POSTCAL
1mA PRECAL
2mA PRECAL
2mA POSTCAL
4mA PRECAL
4mA POSTCAL

Figure 81. AD9717 Two-Carrier W-CDMA Third ACLR, 3.3 V
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
1.0
0.8
0
CODE
A
U
X
D
A
C

I
N
L

(
L
S
B
)
128 256 384 512 640 768 896 1024
0
7
2
6
5
-
1
4
4
Figure 82. AUXDAC INL
CVDD
DVDD
30
20
10
0
0 20 40 60 80 100 120 140
f
CLK
(MHz)
C
U
R
R
E
N
T

(
m
A
)
0
7
2
6
5
-
0
4
4
TOTAL CURRENT @ 4mA OUT
TOTAL CURRENT @ 2mA OUT
AVDD @ 1mA OUT
AVDD @ 4mA OUT
AVDD @ 2mA OUT
TOTAL CURRENT @ 1mA OUT

Figure 83. Supply Current vs. Clock Frequency at 3.3 V

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 31 of 80
TERMINOLOGY
Linearity Error or Integral Nonlinearity (INL)
Linearity error is defined as the maximum deviation of the
actual analog output from the ideal output, determined by
a straight line drawn from zero scale to full scale.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
Offset error is the deviation of the output current from the
ideal of zero. For IOUTP, 0 mA output is expected when the
inputs are all 0. For IOUTN, 0 mA output is expected when all
inputs are set to 1.
Gain Error
Gain error is the difference between the actual and the ideal
output span. The actual span is determined by the difference
between the output when all inputs are set to 1 and the output
when all inputs are set to 0.
Output Compliance Range
Output compliance range is the range of allowable voltage at
the output of a current-output DAC. Operation beyond the
maximum compliance limits can cause either output stage
saturation or breakdown, resulting in nonlinear performance.
Temperature Drift
Temperature drift is specified as the maximum change from
the ambient value (25C) to the value at either TMIN or TMAX.
For offset and gain drift, the drift is reported in ppm of full-
scale range per degree Celsius (ppm FSR/C). For reference
drift, the drift is reported in parts per million per degree
Celsius (ppm/C).
Power Supply Rejection
Power supply rejection is the maximum change in the full-scale
output as the supplies are varied from minimum to maximum
specified voltages.
Settling Time
Settling time is the time required for the output to reach and
remain within a specified error band around its final value,
measured from the start of the output transition.
Spurious Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the peak
amplitude of the output signal and the peak spurious signal
between dc and the frequency equal to half the input data rate.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic
components to the rms value of the measured fundamental.
It is expressed as a percentage or in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the
Nyquist frequency, excluding the first six harmonics and dc.
The value for SNR is expressed in decibels (dB).
Adjacent Channel Leakage Ratio (ACLR)
ACLR is the ratio in decibels relative to the carrier (dBc)
between the measured power within a channel relative to its
adjacent channel.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect of
wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.


AD9714/AD9715/AD9716/AD9717

Rev. A | Page 32 of 80
THEORY OF OPERATION
I DAC
Q DAC
AUX1DAC
AUX2DAC
BAND
GAP
CLOCK
DIST
10k
QR
SET
16k
IR
SET
16k
I
REF
100A
IR
CML
1k TO
250
QR
CML
1k TO
250
500
500
500
500
SPI
INTERFACE
1 INTO 2
INTERLEAVED
DATA
INTERFACE
I DATA
Q DATA
1.8V
LDO
1V
AD9717
0
7
2
6
5
-
0
4
6
RLIN
IOUTN
IOUTP
RLIP
AVDD
AVSS
RLQP
QOUTP
QOUTN
RLQN
DB11
DB10
DB9
DB8
DVDDIO
DVSS
DVDD
DB7
DB6
DB5
D
B
1
2
D
B
1
3

(
M
S
B
)
S
D
I
O
/
F
O
R
M
A
T
S
C
L
K
/
C
L
K
M
D
R
E
S
E
T
/
P
I
N
M
D
R
E
F
I
O
F
S
A
D
J
I
/
A
U
X
I
F
S
A
D
J
Q
/
A
U
X
Q
C
M
L
I
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0

(
L
S
B
)
D
C
L
K
I
O
C
V
D
D
C
L
K
I
N
C
V
S
S
C
M
L
Q
C
S
/
P
W
R
D
N

Figure 84. Simplified Block Diagram
Figure 84 shows a simplified block diagram of the AD9714/
AD9715/AD9716/AD9717 that consists of two DACs, digital
control logic, and a full-scale output current control. Each DAC
contains a PMOS current source array capable of providing a
nominal full-scale current (IxOUTFS) of 2 mA and a maximum of
4 mA. The arrays are divided into 31 equal currents that make
up the five most significant bits (MSBs). The next four bits, or
middle bits, consist of 15 equal current sources whose value is
1/16 of an MSB current source. The remaining LSBs are binary
weighted fractions of the current sources of the middle bits.
Implementing the middle and lower bits with current sources,
instead of an R-2R ladder, enhances its dynamic performance
for multitone or low amplitude signals and helps maintain the
high output impedance of the DACs (that is, >200 M).
All of these current sources are switched to one or the other
of the two output nodes (IOUTP or IOUTN) via PMOS differential
current switches. The switches are based on the architecture that
was pioneered in the AD976x family, with further refinements
to reduce distortion contributed by the switching transient. This
switch architecture also reduces various timing errors and
provides matching complementary drive signals to the inputs
of the differential current switches.
The analog and digital I/O sections of the AD9714/AD9715/
AD9716/AD9717 have separate power supply inputs (AVDD and
DVDDIO) that can operate independently over a 1.8 V to 3.3 V
range. The core digital section requires 1.8 V. An optional on-chip
LDO is provided for DVDDIO supplies greater than 1.8 V, or the
1.8 V can be supplied directly through DVDD. A 1.0 F bypass
capacitor at DVDD (Pin 7) is required when using the LDO.
The core is capable of operating at a rate of up to 125 MSPS. It
consists of edge-triggered latches and the segment decoding logic
circuitry. The analog section includes PMOS current sources,
associated differential switches, a 1.0 V band gap voltage
reference, and a reference control amplifier.
Each DAC full-scale output current is regulated by the reference
control amplifier and can be set from 1 mA to 4 mA via an external
resistor, xRSET, connected to its full-scale adjust pin (FSADJx).
The external resistor, in combination with both the reference
control amplifier and voltage reference, VREFIO, sets the reference
current, IxREF, which is replicated to the segmented current sources
with the proper scaling factor. The full-scale current, IxOUTFS, is
32 IxREF.
Optional on-chip xRSET resistors are provided that can be pro-
grammed between a nominal value of 8 k to 32 k (4 mA to
1 mA IxOUTFS, respectively).
The AD9714/AD9715/AD9716/AD9717 provide the option of
setting the output common mode to a value other than AVSS
via the output common-mode pins (CMLI and CMLQ). This
facilitates directly interfacing the output of the AD9714/AD9715/
AD9716/AD9717 to components that require common-mode
levels greater than 0 V.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 33 of 80
SERIAL PERIPHERAL INTERFACE (SPI)
The serial port of the AD9714/AD9715/AD9716/AD9717 is a
flexible, synchronous serial communications port that allows easy
interfacing to many industry-standard microcontrollers and
microprocessors. The serial I/O is compatible with most synchron-
ous transfer formats, including both the Motorola SPI and Intel
SSR protocols. The interface allows read/write access to all registers
that configure the AD9714/AD9715/AD9716/AD9717. Single or
multiple byte transfers are supported, as well as MSB first or
LSB first transfer formats. The serial interface port of the AD9714/
AD9715/AD9716/AD9717 is configured as a single I/O pin on
the SDIO pin.
GENERAL OPERATION OF THE SERIAL INTERFACE
There are two phases to a communications cycle on the AD9714/
AD9715/AD9716/AD9717. Phase 1 is the instruction cycle, which
is the writing of an instruction byte into the AD9714/AD9715/
AD9716/AD9717, coinciding with the first eight SCLK rising
edges. In Phase 2, the instruction byte provides the serial port
controller of the AD9714/AD9715/AD9716/AD9717 with infor-
mation regarding the data transfer cycle. The Phase 1 instruction
byte defines whether the upcoming data transfer is a read or write,
the number of bytes in the data transfer, and the starting register
address for the first byte of the data transfer. The first eight SCLK
rising edges of each communication cycle are used to write the
instruction byte into the AD9714/AD9715/AD9716/AD9717.
A Logic 1 on Pin 35 (RESET/PINMD), followed by a Logic 0,
resets the SPI port timing to the initial state of the instruction
cycle. This is true regardless of the present state of the internal
registers or the other signal levels present at the inputs to the
SPI port. If the SPI port is in the midst of an instruction cycle
or a data transfer cycle, none of the present data is written.
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the AD9714/
AD9715/AD9716/AD9717 and the system controller. Phase 2 of
the communication cycle is a transfer of one, two, three, or four
data bytes, as determined by the instruction byte. Using one multi-
byte transfer is the preferred method. Single-byte data transfers
are useful to reduce CPU overhead when register access requires
one byte only. Registers change immediately upon writing to the
last bit of each transfer byte.
INSTRUCTION BYTE
The instruction byte contains the information shown in Table 11.
Table 11.
MSB LSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
R/W N1 N0 A4 A3 A2 A1 A0
R/W (Bit 7 of the instruction byte) determines whether a read or a
write data transfer occurs after the instruction byte write. Logic 1
indicates a read operation. Logic 0 indicates a write operation.
N1 and N0 (Bit 6 and Bit 5 of the instruction byte) determine the
number of bytes to be transferred during the data transfer cycle.
The bit decodes are shown in Table 12.
Table 12. Byte Transfer Count
N1 N0 Description
0 0 Transfer 1 byte
0 1 Transfer 2 bytes
1 0 Transfer 3 bytes
1 1 Transfer 4 bytes
A4, A3, A2, A1, and A0 (Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0 of the
instruction byte) determine which register is accessed during the
data transfer portion of the communications cycle. For multi-
byte transfers, this address is the starting byte address. The
following register addresses are generated internally by the
AD9714/AD9715/AD9716/AD9717, based on the LSBFIRST bit
(Register 0x00, Bit 6).
SERIAL INTERFACE PORT PIN DESCRIPTIONS
SCLKSerial Clock
The serial clock pin is used to synchronize data to and from the
AD9714/AD9715/AD9716/AD9717 and to run the internal state
machines. The SCLK maximum frequency is 20 MHz. All data
input to the AD9714/AD9715/AD9716/AD9717 is registered on
the rising edge of SCLK. All data is driven out of the AD9714/
AD9715/AD9716/AD9717 on the falling edge of SCLK.
CSChip Select
An active low input starts and gates a communications cycle.
It allows more than one device to be used on the same serial
communications lines. The SDIO/FORMAT pin reaches a
high impedance state when this input is high. Chip select
should stay low during the entire communications cycle.
SDIOSerial Data I/O
The SDIO pin is used as a bidirectional data line to transmit
and receive data.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 34 of 80
MSB/LSB TRANSFERS
The serial port of the AD9714/AD9715/AD9716/AD9717 can
support both most significant bit (MSB) first or least significant
bit (LSB) first data formats. This functionality is controlled by
the LSBFIRST bit (Register 0x00, Bit 6). The default is MSB first
(LSBFIRST = 0).
When LSBFIRST = 0 (MSB first), the instruction and data bytes
must be written from the most significant bit to the least significant
bit. Multibyte data transfers in MSB first format start with an
instruction byte that includes the register address of the most
significant data byte. Subsequent data bytes should follow in
order from a high address to a low address. In MSB first mode,
the serial port internal byte address generator decrements for
each data byte of the multibyte communications cycle.
When LSBFIRST = 1 (LSB first), the instruction and data bytes
must be written from the least significant bit to the most signifi-
cant bit. Multibyte data transfers in LSB first format start with
an instruction byte that includes the register address of the least
significant data byte followed by multiple data bytes. The serial
port internal byte address generator increments for each byte
of the multibyte communication cycle.
The serial port controller data address of the AD9714/AD9715/
AD9716/AD9717 decrements from the data address written
toward 0x00 for multibyte I/O operations if the MSB first mode
is active. The serial port controller address increments from the
data address written toward 0x1F for multibyte I/O operations
if the LSB first mode is active.
SERIAL PORT OPERATION
The serial port configuration of the AD9714/AD9715/AD9716/
AD9717 is controlled by Register 0x00. It is important to note
that the configuration changes immediately upon writing to the
last bit of the register. For multibyte transfers, writing to this
register can occur during the middle of the communications
cycle. Care must be taken to compensate for this new configu-
ration for the remaining bytes of the current communications cycle.
The same considerations apply to setting the software reset bit
(Register 0x00, Bit 5). All registers are set to their default values
except Register 0x00, which remains unchanged.
Use of single-byte transfers or initiating a software reset is
recommended when changing serial port configurations to
prevent unexpected device behavior.
R/W N1 N0 A4 A3 A2 A1 A0 D7N D6N D5N D00 D10 D20 D30
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO
0
7
2
6
5
-
2
9
1

Figure 85. Serial Register Interface Timing, MSB First Write
R/W N1 N0 A4 A3 A2 A1 A0
D7
D6N D5N D00 D10 D20 D30
INSTRUCTION CYCLE DATA TRANSFER CYCLE
SCLK
SDIO
SDO 0
7
2
6
5
-
2
9
0
CS

Figure 86. Serial Register Interface Timing, MSB First Read

A0 A1 A2 A3 A4 N0 N1 R/W D00 D10 D20 D7N D6N D5N D4N
INSTRUCTION CYCLE DATA TRANSFER CYCLE
SCLK
SDIO
0
7
2
6
5
-
2
8
9
CS

Figure 87. Serial Register Interface Timing, LSB First Write

INSTRUCTION CYCLE DATA TRANSFER CYCLE
SCLK
SDIO
SDO
A0 A1 A2 A3 A4 N0 N1 R/W D1
0
D2
0
D7
N
D6
N
D5
N
D4
N
D0
0
7
2
6
5
-
2
8
8
CS

Figure 88. Serial Register Interface Timing, LSB First Read
PIN MODE
The AD9714/AD9715/AD9716/AD9717 can also be operated
without ever writing to the serial port. With the RESET/PINMD
pin tied high, the SCLK pin becomes CLKMD to provide for
clock mode control (see the Retimer section), the SDIO pin
becomes FORMAT and selects the input data format, and the
CS/PWRDN pin serves to power down the device.
Operation is otherwise exactly as defined by the default register
values in Table 13; therefore, external resistors at FSADJI and
FSADJQ are needed to set the DAC currents, and both DACs
are active. This is also a convenient quick checkout mode.
DAC currents can be externally adjusted in pin mode by sourcing
or sinking currents at the FSADJI/AUXI and FSADJQ/AUXQ
pins as desired with the fixed resistors installed. An op amp
output with appropriate series resistance is one of many possibili-
ties. This has the same effect as changing the resistor value.
Place at least 10 k resistors in series right at the DAC to guard
against accidental short circuits and noise modulation. The
REFIO pin can be adjusted 25% in a similar manner, if desired.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 35 of 80
SPI REGISTER MAP
Table 13.
Name Addr Default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SPI Control 0x00 0x00 Reserved LSBFIRST Reset LNGINS
Power-Down 0x01 0x40 LDOOFF LDOSTAT PWRDN Q DACOFF I DACOFF QCLKOFF ICLKOFF EXTREF
Data Control 0x02 0x34 TWOS Reserved IFIRST IRISING SIMULBIT DCI_EN DCOSGL DCODBL
I DAC Gain 0x03 0x00 Reserved I DACGAIN[5:0]
IRSET 0x04 0x00 IRSETEN Reserved IRSET[5:0]
IRCML 0x05 0x00 IRCMLEN Reserved IRCML[5:0]
Q DAC Gain 0x06 0x00 Reserved Q DACGAIN[5:0]
QRSET 0x07 0x00 QRSETEN Reserved QRSET[5:0]
QRCML 0x08 0x00 QRCMLEN Reserved QRCML[5:0]
AUXDAC Q 0x09 0x00 QAUXDAC[7:0]
AUX CTLQ 0x0A 0x00 QAUXEN QAUXRNG[1:0] QAUXOFS[2:0] QAUXDAC[9:8]
AUXDAC I 0x0B 0x00 IAUXDAC[7:0]
AUX CTLI 0x0C 0x00 IAUXEN IAUXRNG[1:0] IAUXOFS[2:0] IAUXDAC[9:8]
Reference Resistor 0x0D 0x00 Reserved RREF[5:0]
Cal Control 0x0E 0x00 PRELDQ PRELDI CALSELQ CALSELI CALCLK DIVSEL[2:0]
Cal Memory 0x0F 0x00 CALSTATQ CALSTATI CALMEMQ[1:0] CALMEMI[1:0]
Memory Address 0x10 0x00 Reserved MEMADDR[5:0]
Memory Data 0x11 0x34 Reserved MEMDATA[5:0]
Memory R/W 0x12 0x00 CALRSTQ CALRSTI CALEN SMEMWR SMEMRD UNCALQ UNCALI
CLKMODE 0x14 0x00 CLKMODEQ[1:0] Searching Reacquire CLKMODEN CLKMODEI[1:0]
Version 0x1F 0x03 Version[7:0]

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 36 of 80
SPI REGISTER DESCRIPTIONS
Reading these registers returns previously written values for all defined register bits, unless otherwise noted.
Table 14.
Register Address Bit Name Description
SPI Control 0x00 6 LSBFIRST 0 (default): MSB first, per SPI standard.
1: LSB first, per SPI standard.
Note that the user must always change the LSB/MSB order in single-byte
instructions to avoid erratic behavior due to bit order errors.
5 Reset Execute software reset of SPI and controllers, reload default register values except
Register 0x00.
1: sets software reset; write 0 on the next (or any following) cycle to release reset.
4 LNGINS 0 (default): the SPI instruction word uses a 5-bit address.
1: the SPI instruction word uses a 13-bit address.
Power-Down 0x01 7 LDOOFF 0 (default): LDO voltage regulator on.
1: turns core LDO voltage regulator off.
6 LDOSTAT 0: indicates that the core LDO voltage regulator is off.
1 (default) : indicates that the core LDO voltage regulator is on.
5 PWRDN 0 (default): all analog and digital circuitry and SPI logic are powered on.
1: powers down all analog and digital circuitry except for SPI logic.
4 Q DACOFF 0 (default): turns on Q DAC output current.
1: turns off Q DAC output current.
3 I DACOFF 0 (default): turns on I DAC output current.
1: turns off I DAC output current.
2 QCLKOFF 0 (default): turns on Q DAC clock.
1: turns off Q DAC clock.
1 ICLKOFF 0 (default): turns on I DAC clock.
1: turns off I DAC clock.
0 EXTREF 0 (default): turns on internal voltage reference.
1: powers down internal voltage reference (external reference required).
Data Control 0x02 7 TWOS 0 (default): unsigned binary input data format.
1: twos complement input data format.
5 IFIRST 0: pairing of dataQ first of pair on data input pads.
1 (default): pairing of dataI first of pair on data input pads.
4 IRISING 0: Q data latched on DCLKIO rising edge.
1 (default): I data latched on DCLKIO rising edge.
3 SIMULBIT 0 (default): allows simultaneous input and output enable on DCLKIO.
1: disallows simultaneous input and output enable on DCLKIO.
2 DCI_EN Controls the use of the DCLKIO pad for data clock input.
0: data clock input disabled.
1 (default): data clock input enabled.
1 DCOSGL Controls the use of the DCLKIO pad for data clock output.
0 (default): data clock output disabled.
1: data clock output enabled; regular strength driver.
0 DCODBL Controls the use of the DCLKIO pad for data clock output.
0 (default): DCODBL data clock output disabled.
1: DCODBL data clock output enabled; paralleled with DCOSGL for 2 drive
current.
I DAC Gain 0x03 5:0 I DACGAIN[5:0] DAC I fine gain adjustment; alters the full-scale current as shown in Figure 100.
Default IDACGAIN = 0x00.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 37 of 80
Register Address Bit Name Description
IRSET 0x04 7 IRSETEN 0 (default): IRSET resistor value for I channel is set by an external resistor connected
to the FADJI/AUXI pin. Nominal value for this external resistor is 16 k.
1: enables the on-chip IRSET value to be changed for I channel.
5:0 IRSET[5:0] Changes the value of the on-chip IRSET resistor for I channel; this scales the full-scale
current of the DAC in ~0.25 dB steps twos complement (nonlinear); see Figure 99.
000000 (default): IRSET = 16 k.
011111: IRSET = 32 k.
100000: IRSET = 8 k.
111111: IRSET = 16 k.
IRCML 0x05 7 IRCMLEN 0 (default): IRCML resistor value for the I channel is set by an external resistor
connected to the CMLI pin. Recommended value for this external resistor is 0 .
1: enables on-chip IRCML adjustment for I channel.
5:0 IRCML[5:0] Changes the value of the on-chip IRCML resistor for I channel; this adjusts the
common-mode level of the DAC output stage.
000000 (default): IRCML = 250 .
100000: IRCML= 625 .
111111: IRCML = 1 k.
Q DAC Gain 0x06 5:0 Q DACGAIN[5:0] DAC Q fine gain adjustment; alters the full-scale current as shown in Figure 100.
Default QDACGAIN = 0x00.
QRSET 0x07 7 QRSETEN 0 (default): QRSET resistor value for Q channel is set by an external resistor connected
to the FADJQ/AUXQ pin. Recommended value for this external resistor is 16 k.
1: enables on-chip QRSET adjustment for Q channel.
5:0 QRSET[5:0] Changes the value of the on-chip QRSET resistor for Q channel; this scales the full-
scale current of the DAC in ~0.25 dB steps twos complement (nonlinear); see
Figure 99.
000000 (default): QRSET = 16 k.
011111: QRSET = 32 k.
100000: QRSET = 8 k.
111111: QRSET = 16 k.
QRCML 0x08 7 QRCMLEN 0 (default): QRCML resistor value for the Q channel is set by an external resistor
connected to CMLQ pin. Recommended value for this external resistor is 0 .
1: enables on-chip QRCML adjustment for Q channel.
5:0 QRCML[5:0] Changes the value of the on-chip QRCML resistor for Q channel; this adjusts the
common-mode level of the DAC output stage.
000000 (default): QRCML = 250 .
100000: QRCML = 625 .
111111: QRCML = 1 k.
AUXDAC Q 0x09 7:0 QAUXDAC[7:0] AUXDAC Q output voltage adjustment word LSBs.
0x3FF: sets AUXDAC Q output to full scale.
0x200: sets AUXDAC Q output to midscale.
0x000 (default): sets AUXDAC Q output to bottom of scale.
AUX CTLQ 0x0A 7 QAUXEN 0 (default): AUXDAC Q output disabled.
1: enables AUXDAC Q output.
6:5 QAUXRNG[1:0] 00 (default): sets AUXDAC Q output voltage range to 2 V.
01: sets AUXDAC Q output voltage range to 1.5 V.
10: sets AUXDAC Q output voltage range to 1.0 V.
11: sets AUXDAC Q output voltage range to 0.5 V.
4:2 QAUXOFS[2:0] 000 (default): sets AUXDAC Q top of range to 1.0 V.
001: sets AUXDAC Q top of range to 1.5 V.
010: sets AUXDAC Q top of range to 2.0 V.
011: sets AUXDAC Q top of range to 2.5 V.
100: sets AUXDAC Q top of range to 2.9 V.
1:0 QAUXDAC[9:8] AUXDAC Q output voltage adjustment word MSBs (default = 00).
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 38 of 80
Register Address Bit Name Description
AUXDAC I 0x0B 7:0 IAUXDAC[7:0] AUXDAC I output voltage adjustment word LSBs.
0x3FF: sets AUXDAC I output to full scale.
0x200: sets AUXDAC I output to midscale.
0x000 (default): sets AUXDAC I output to bottom of scale.
AUX CTLI 0x0C 7 IAUXEN 0 (default): AUXDAC I output disabled.
1: enables AUXDAC I output.
6:5 IAUXRNG[1:0] 00 (default): sets AUXDAC I output voltage range to 2 V.
01: sets AUXDAC I output voltage range to 1.5 V.
10: sets AUXDAC I output voltage range to 1.0 V.
11: sets AUXDAC I output voltage range to 0.5 V.
4:2 IAUXOFS[2:0] 000 (default): sets AUXDAC I top of range to 1.0 V.
001: sets AUXDAC I top of range to 1.5 V.
010: sets AUXDAC I top of range to 2.0 V.
011: sets AUXDAC I top of range to 2.5 V.
100: sets AUXDAC I top of range to 2.9 V.
1:0 IAUXDAC[9:8] AUXDAC I output voltage adjustment word MSBs (default = 00).
Reference
Resistor
0x0D 5:0 RREF[5:0] Permits an adjustment of the on-chip reference voltage and output at REFIO (see
Figure 98) twos complement.
000000 (default): sets the value of RREF to 10 k, VREF = 1.0 V.
011111: sets the value of RREF to 12 k, VREF = 1.2 V.
100000: sets the value of RREF to 8 k, VREF = 0.8 V.
111111: sets the value of RREF to 10 k, VREF = 1.0 V.
Cal Control 0x0E 7 PRELDQ 0 (default): preload Q DAC calibration reference set to 32.
1: preload Q DAC calibration reference set by user (Cal Address 1).
6 PRELDI 0 (default): preload I DAC calibration reference set to 32.
1: preload I DAC calibration reference set by user (Cal Address 1).
5 CALSELQ 0 (default): Q DAC self-calibration done.
1: select Q DAC self-calibration.
4 CALSELI 0 (default): I DAC self-calibration done.
1: select I DAC self-calibration.
3 CALCLK 0 (default): calibration clock disabled.
1: calibration clock enabled.
2:0 DIVSEL[2:0] Calibration clock divide ratio from DAC clock rate.
000 (default): divide by 256.
001: divide by 128.

110: divide by 4.
111: divide by 2.
Cal Memory 0x0F 7 CALSTATQ 0 (default): Q DAC calibration in progress.
1: calibration of Q DAC complete.
6 CALSTATI 0 (default): I DAC calibration in progress.
1: calibration of I DAC complete.
3:2 CALMEMQ[1:0] Status of Q DAC calibration memory.
00 (default): uncalibrated.
01: self-calibrated.
10: user calibrated.
1:0 CALMEMI[1:0] Status of I DAC calibration memory.
00 (default): uncalibrated.
01: self-calibrated.
10: user calibrated.
Memory Address 0x10 5:0 MEMADDR[5:0] Address of static memory to be accessed.
Memory Data 0x11 5:0 MEMDATA[5:0] Data for static memory access.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 39 of 80
Register Address Bit Name Description
Memory R/W 0x12 7 CALRSTQ 0 (default): no action.
1: clear CALSTATQ.
6 CALRSTI 0 (default): no action.
1: clear CALSTATI.
4 CALEN 0 (default): no action.
1: initiate device self-calibration.
3 SMEMWR 0 (default): no action.
1: write to static memory (calibration coefficients).
2 SMEMRD 0 (default): no action.
1: read from static memory (calibration coefficients).
1 UNCALQ 0 (default): no action.
1: reset Q DAC calibration coefficients to default (uncalibrated).
0 UNCALI 0 (default): no action.
1: reset I DAC calibration coefficients to default (uncalibrated).
CLKMODE 0x14 7:6 CLKMODEQ[1:0] Depending on the CLKMODEN bit setting, these two bits reflect the phase
relationship between DCLKIO and CLKIN, as described in Table 16.
If CLKMODEN = 0, read only; reports the clock phase chosen by the retimer.
If CLKMODEN = 1, read/write; value in this register sets Q clock phases; force if
needed to better synchronize the DACs (see the Retimer section).
4 Searching Data path retimer status bit.
0 (default): clock relationship established.
1: indicates that the internal data path retimer is searching for clock relationship
(device output is not usable while this bit is high).
3 Reacquire Edge triggered, 0 to 1 causes the retimer to reacquire the clock relationship.
2 CLKMODEN 0 (default): CLKMODEI/CLKMODEQ values computed by the two retimers and
read back in CLKMODEI[1:0] and CLKMODEQ[1:0].
1: CLKMODE values set in CLKMODEI[1:0] override both I and Q retimers.
1:0 CLKMODEI[1:0] Depending on CLKMODEN bit setting, these two bits reflect the phase
relationship between DCLKIO and CLKIN as described in Table 16.
If CLKMODEN = 0, read only; reports the clock phase chosen by the retimer.
If CLKMODEN = 1, read/write; value in this register sets I clock phases; force if
needed to better synchronize the DACs (see the Retimer section).
Version 0x1F 7:0 Version[7:0] Hardware version of the device. This register is set to 0x03 for the latest version of
the device.


AD9714/AD9715/AD9716/AD9717

Rev. A | Page 40 of 80
DIGITAL INTERFACE OPERATION
Digital data for the I and Q DACs is supplied over a single
parallel bus (DB[n:0), where n is 7 for the AD9714, 9 for
the AD9715, 11 for the AD9716, and 13 for the AD9717)
accompanied by a qualifying clock (DCLKIO). The I and Q
data are provided to the chip in an interleaved double data
rate (DDR) format. The maximum guaranteed data rate is
250 MSPS with a 125 MHz clock. The order of data pairing
and the sampling edge selection is user programmable using
the IFIRST and IRISING data control bits, resulting in four
possible timing diagrams. These are shown in Figure 89,
90, Figure 91, and Figure 92.
DCLKIO
Z A B C D E F G H
I DATA Z B D F
Q DATA Y A C E
0
7
2
6
5
-
0
4
7
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE AD9715, 11 FOR THE
AD9716, AND 13 FOR THE AD9717.
DB[n:0]

Figure 89. Timing Diagram with IFIRST = 0, IRISING = 0

DCLKIO
Z A B C D E F G H
I DATA Y A C E
Q DATA X Z B D
0
7
2
6
5
-
0
4
8
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE AD9715, 11 FOR THE
AD9716, AND 13 FOR THE AD9717.
DB[n:0]

Figure 90. Timing Diagram with IFIRST = 0, IRISING = 1

DCLKIO
Z A B C D E F G H
I DATA Z B D F
Q DATA A C E G
0
7
2
6
5
-
0
4
9
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE AD9715, 11 FOR THE
AD9716, AND 13 FOR THE AD9717.
DB[n:0]

Figure 91. Timing Diagram with IFIRST = 1, IRISING = 0

DCLKIO
Z A B C D E F G H
I DATA Y A C E
Q DATA Z B D F
0
7
2
6
5
-
0
5
0
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE AD9715, 11 FOR THE
AD9716, AND 13 FOR THE AD9717.
DB[n:0]

Figure 92. Timing Diagram with IFIRST = 1, IRISING = 1
Ideally, the rising and falling edges of the clock fall in the center
of the keep-in-window formed by the setup and hold times, tS
and tH. Refer to Table 2 for setup and hold times. A detailed
timing diagram is shown in Figure 93.
DCLKIO
0
7
2
6
5
-
0
5
1
t
S
t
H
t
S
t
H
DB[n:0]
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE
AD9715, 11 FOR THE AD9716, AND 13 FOR THE AD9717.

Figure 93. Setup and Hold Times for All Input Modes
In addition to the different timing modes listed in Table 2, the
input data can also be presented to the device in either unsigned
binary or twos complement format. The format type is chosen
via the TWOS data control bit.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 41 of 80
3 2 1 0
D-FF D-FF
4
D-FF D-FF D-FF
OR
DCLKIO-INT CLKIN-INT
DB[n:0]
(INPUT)
TO DAC CORE
I
OUT
I
OUT
D
E
L
A
Y
1
DELAY2
D
E
L
A
Y
1
R
E
T
I
M
E
R
-
C
L
K
IE
IE OE
DCLKIO
(INPUT/OUTPUT)
CLKIN
(INPUT)
0
7
2
6
5
-
0
5
2
NOTES
D-FFs:
0: RISING OR FALLING EDGE
TRIGGERED FOR I OR Q DATA.
1, 2, 3, 4: RISING EDGE TRIGGERED.
RETIMER-CLK
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9714, 9 FOR THE AD9715, 11 FOR THE AD9716, AND 13 FOR THE AD9717.

Figure 94. Simplified Diagram of AD9714/AD9715/AD9716/AD9717 Timing
DIGITAL DATA LATCHING AND RETIMER BLOCK
The AD9714/AD9715/AD9716/AD9717 have two clock inputs,
DCLKIO and CLKIN. The CLKIN is the analog clock whose
jitter affects DAC performance, and the DCLKIO is a digital
clock from an FPGA that needs to have a fixed relationship with
the input data to ensure that the data is picked
up correctly by the flip-flops on the pads.
Figure 94 is a simplified diagram of the entire data capture
system in the AD9714/AD9715/AD9716/AD9717. The double
data rate input data (DB[n:0), where n is 7 for the AD9714, 9
for the AD9715, 11 for the AD9716, and 13 for the AD9717) is
latched at the pads/pins either on the rising edge or the falling edge
of the DCLKIO-INT clock, as determined by IRISING, Bit 4 of
SPI Address 0x02. Bit 5 of SPI Address 0x02, IFIRST, determines
which channel data is latched first (that is, I or Q). The captured
data is then retimed to the internal clock (CLKIN-INT) in the
retimer block before being sent to the final analog DAC core
(D-FF 4), which controls the current steering output switches. All
delay blocks depicted in Figure 94 are noninverting, and any wires
without an explicit delay block can be assumed to have no delay.
Only one channel is shown in Figure 94 with the data pads
(DB[n:0), where n is 7 for the AD9714, 9 for the AD9715, 11 for
the AD9716, and 13 for the AD9717) serving as double data
rate pads for both channels.
The default PINMD and SPI settings are IE = high (closed)
and OE = low (open). These settings are enabled when RESET/
PINMD (Pin 35) is held high. In this mode, the user has to supply
both DCLKIO and CLKIN. In PINMD, it is also recommended
that the DCLKIO and the CLKIN be in phase for proper func-
tioning of the DAC, which can easily be ensured by tying the
pins together on the PCB. If the user can access the SPI, setting
Bit 2 of SPI Address 0x02, DCI_EN, to logic low causes the
CLKIN to be used as the DCLKIO also.
Setting Bit 1 or Bit 0 of SPI Address 0x02, DCOSGL or DCODBL,
respectively, to logic high allows the user to obtain a DCLKIO
output from the CLKIN input for use in the users PCB system.
It is strongly recommended that DCI_EN = DCOSGL = high or
DCI_EN = DCODBL = high not be used even though the
device may appear to function correctly. Similarly, do not set
DCOSGL and DCODBL to logic high simultaneously.
Retimer
The AD9714/AD9715/AD9716/AD9717 have an internal data
retimer circuit that compares the CLKIN-INT and DCLKIO-INT
clocks and, depending on their phase relationship, selects a
retimer clock (RETIMER-CLK) to safely transfer data from
the DCLKIO used at the chips input interface to the CLKIN
used to clock the analog DAC cores (D-FF 4).
The retimer selects one of the three phases shown in Figure 95.
The retimer is controlled by the CLKMODE SPI bits, as shown
in Table 15.
0
7
2
6
5
-
0
4
2
1/2 PERIOD
1/4 PERIOD 1/2 PERIOD
DATA
CLOCK
RETIMER-CLKs
180
90
270

Figure 95. RETIMER-CLK Phases
Note that, in most cases, more than one retimer phase works
and ,in such cases, the retimer arbitrarily picks one phase that
works. The retimer cannot pick the best or safest phase. If the
user has a working knowledge of the exact phase relationship
between DCLKIO and CLKIN (and thus DCLKIO-INT and
CLKIN-INT because the delay is approximately the same for
both clocks and equal to DELAY1), then the retimer can be
forced to this phase with CLKMODEN = 1, as described in
Table 15 and the following paragraphs.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 42 of 80
Table 15. Timer Register List
Bit Name Description
CLKMODEQ[1:0] Q data path retimer clock selected output. Valid after the searching bit goes low.
Searching High indicates that the internal data path retimer is searching for the clock relationship (DAC is not usable until it is low again).
Reacquire Changing this bit from 0 to 1 causes the data path retimer circuit to reacquire the clock relationship.
CLKMODEN 0: uses CLKMODEI/CLKMODEQ values (as computed by the two internal retimers) for I and Q clocking.
1: uses the CLKMODE value set in CLKMODEI[1:0] to override the bits for both I and Q retimers (that is, force the retimer).
CLKMODEI[1:0] I data path retimer clock selected output. Valid after searching goes low.
If CLKMODEN = 1, a value written to this register overrides both the I and Q automatic retimer values.
Table 16. CLKMODEI/CLKMODEQ Details
CLKMODEI[1:0]/CLKMODEQ[1:0] DCLKIO-to-CLKIN Phase Relationship RETIMER-CLK Selected
00 0 to 90 Phase 2
01 90 to 180 Phase 3
10 180 to 270 Phase 3
11 270 to 360 Phase 1

When RESET is pulsed high and then returns low (the part is in
SPI mode), the retimer runs and automatically selects a suitable
clock phase for the RETIMER-CLK within 128 clock cycles. The
SPI searching bit, Bit 4 of SPI Address 0x14, returns to low,
indicating that the retimer has locked and the part is ready for
use. The reacquire bit, Bit 3 of SPI Address 0x14, can be used to
reinitiate phase detection in the I and Q retimers at any time.
CLKMODEQ[1:0] and CLKMODEI[1:0] of SPI Address 0x14
provide readback for the values picked by the internal phase
detectors in the retimer (see Table 16).
To force the two retimers (I and Q) to pick a particular phase
for the retimer clock (they must both be forced to the same
value), CLKMODEN, Bit 2 of SPI Address 0x14, should be set
high and the required phase value is written into CLKMODEI[1:0]
and CLKMODEQ[1:0]. For example, if the DCLKIO and the
CLKIN are in phase to the first order, the user can safely force the
retimers to pick Phase 2 for the RETIMER-CLK. This forcing
function may be useful for synchronizing multiple devices.
In pin mode, it is expected that the user tie CLKIN and DCLKIO
together. The device has a small amount of programmable
functionality using the unused SPI pins (SCLK, SDIO, and CS).
If the two chip clocks are tied together, the SCLK pin can be
tied to ground, and the chip uses a clock for the retimer that is
180 out of phase with the two input clocks (that is, Phase 2,
which is the safest and best option). The chip has an additional
option in pin mode when the redefined SCLK pin is high. Use
this mode if using pin mode, but CLKIN and DCLKIO are not
tied together (that is, not in phase). Holding SCLK high causes
the internal clock detector to use the phase detector output to
determine which clock to use in the retimer (that is, select a
suitable RETIMER-CLK phase). The action of taking SCLK
high causes the internal phase detector to reexamine the two
clocks and determine the relative phase. Whenever the user
wants to reevaluate the relative phase of the two clocks, the
SCLK pin can be taken low and then high again.
ESTIMATING THE OVERALL DAC PIPELINE DELAY
DAC pipeline latency is affected by the phase of the RETIMER-
CLK that is selected. If latency is critical to the system and must
be constant, the retimer should be forced to a particular phase and
not be allowed to automatically select a phase each time.
Consider the case in which DCLKIO = CLKIN (that is, in
phase), and the RETIMER-CLK is forced to Phase 2. Assume
that IRISING is 1 (that is, Q data is latched on the rising edge
and I data is latched on the falling edge). Then the latency to the
output for the I channel is three clock cycles (D-FF 1, D-FF 3,
and D-FF 4, but not D-FF 2 because it is latched on the half
clock cycle or 180). The latency to the output for the Q channel
from the time the falling edge latches it at the pads in D-FF 0
is 2.5 clock cycles ( clock cycle to D-FF 1, 1 clock cycle to
D-FF 3, and 1 clock cycle to D-FF 4). This latency for the AD9714/
AD9715/AD9716/AD9717 is case specific and needs to be calcu-
lated based on the RETIMER-CLK phase that is automatically
selected or manually forced.











AD9714/AD9715/AD9716/AD9717

Rev. A | Page 43 of 80
REFERENCE OPERATION
The AD9714/AD9715/AD9716/AD9717 contain an internal
1.0 V band gap reference. The internal reference can be disabled
by setting Bit 0 (EXTREF) of the power-down register (Address
0x01) through the SPI interface. To use the internal reference,
decouple the REFIO pin to AVSS with a 0.1 F capacitor, enable
the internal reference, and clear Bit 0 of the power-down register
(Address 0x01) through the SPI interface. Note that this is the
default configuration. The internal reference voltage is present
at REFIO. If the voltage at REFIO is to be used anywhere else in
the circuit, an external buffer amplifier with an input bias current
of less than 100 nA must be used to avoid loading the reference.
An example of the use of the internal reference is shown in
Figure 96.
CURRENT
SCALING
32
AD9714/AD9715/
AD9716/AD9717
I DAC
OR
Q DAC
0
7
2
6
5
-
2
1
8
I
xOUTFS
xR
SET
0.1F
REFIO
I
xREF
AVSS
FSADJx
V
BG
1.0V
+


Figure 96. Internal Reference Configuration
REFIO serves as either an input or an output, depending on
whether the internal or an external reference is used. Table 17
summarizes the reference operation.
Table 17. Reference Operation
Reference Mode REFIO Pin Register Setting
Internal Connect 0.1 F
capacitor
Register 0x01, Bit 0 = 0
(default)
External Apply external
capacitor
Register 0x01, Bit 0 = 1
(for power saving)
An external reference can be used in applications requiring
tighter gain tolerances or lower temperature drift. Also, a
variable external voltage reference can be used to implement a
method for gain control of the DAC output.
Recommendations When Using an External Reference
Apply the external reference to the REFIO pin. The internal
reference can be directly overdriven by the external reference,
or the internal reference can be powered down to save power
consumption
The external 0.1 F compensation capacitor on REFIO is not
required unless specified by the external voltage reference
manufacturer. The input impedance of REFIO is 10 k when
the internal reference is powered up and 1 M when it is
powered down.

REFERENCE CONTROL AMPLIFIER
The AD9714/AD9715/AD9716/AD9717 contain a control
amplifier that regulates the full-scale output current, IxOUTFS.
The control amplifier is configured as a V-I converter, as shown
in Figure 96. The output current, IxREF, is determined by the
ratio of the VREFIO and an external resistor, xRSET, as stated in
Equation 4 (see the DAC Transfer Function section). IxREF, is
mirrored to the segmented current sources with the proper scale
factor to set IxOUTFS, as stated in Equation 3.
The control amplifier allows a 2.5:1 adjustment span of IxOUTFS
from 1 mA to 4 mA by setting IxREF between 125 A and 31.25 A
(set xRSET between 8 k and 32 k). The wide adjustment span
of IxOUTFS provides several benefits. The first relates directly to
the power dissipation of the AD9714/AD9715/AD9716/AD9717,
which is proportional to IxOUTFS (see the DAC Transfer Function
section). The second benefit relates to the ability to adjust the
output over a 8 dB range with 0.25 dB steps, which is useful for
controlling the transmitted power. The small signal bandwidth
of the reference control amplifier is approximately 500 kHz.
This allows the device to be used for low frequency, small signal
multiplying applications.
When an external resistor greater than 16 k is used on the
FSADJx pins, care must be taken to maintain the high frequency
equivalent circuit to an impedance lower than 16 k by
splitting the resistor into two resistors in series with a 10 nF
capacitor in parallel with the resistor to AVSS (see Figure 97).
AD9714/AD9715/
AD9716/AD9717
0
7
2
6
5
-
2
1
9
xR
SET
0.1F
R < 16k
REFIO
AVSS
FSADJx
10nF

Figure 97. xRSET Configuration for Values > 16 k










AD9714/AD9715/AD9716/AD9717

Rev. A | Page 44 of 80
DAC TRANSFER FUNCTION
The AD9714/AD9715/AD9716/AD9717 provide two differen-
tial current outputs, IOUTP/IOUTN and QOUTP/QOUTN.
IOUTP and QOUTP provide a near full-scale current output,
IxOUTFS, when all bits are high (that is, DAC CODE = 2
N
1,
where N = 8, 10, 12, or 14 for the AD9714, AD9715, AD9716,
and AD9717, respectively), while IOUTN and QOUTN, the
complementary outputs, provide no current. The current
outputs appearing at the positive DAC outputs, IOUTP and
QOUTP, and at the negative DAC outputs, IOUTN and QOUTN,
are a function of both the input code and IxOUTFS and can be
expressed as follows:
IOUTP = (IDAC CODE/2
N
) IIOUTFS (1)
QOUTP = (QDAC CODE/2
N
) IQOUTFS
IOUTN = ((2
N
1) IDAC CODE)/2
N
IIOUTFS (2)
QOUTN = ((2
N
1) QDAC CODE)/2
N
IQOUTFS
where:
IDAC CODE and QDAC CODE = 0 to 2
N
1 (that is, decimal
representation).
IIOUTFS and IQOUTFS are functions of the reference currents, IIREF
and IQREF, respectively, which are nominally set by a reference
voltage, VREFIO, and external resistors, IRSET and QRSET, respec-
tively. IIOUTFS and IQOUTFS can be expressed as follows:
IIOUTFS = 32 IIREF (3)
IQOUTFS = 32 IQREF
where:
IIREF = VREFIO/IRSET (4)
IQREF = VREFIO/QRSET
or
IIOUTFS = 32 VREFIO/IRSET (5)
IQOUTFS = 32 VREFIO/QRSET
A differential pair (IOUTP/IOUTN or QOUTP/QOUTN)
typically drives a resistive load directly or via a transformer. If
dc coupling is required, the differential pair (IOUTP/IOUTN or
QOUTP/QOUTN) should be connected to matching resistive
loads, xRLOAD, that are tied to analog common, AVSS. The
single-ended voltage output appearing at the positive and
negative nodes is
VIOUTP = IOUTP IRLOAD (6)
VQOUTP = QOUTP QRLOAD
VIOUTN = IOUTN IRLOAD (7)
VQOUTN = QOUTN QRLOAD
To achieve the maximum output compliance of 1 V at the
nominal 4 mA output current, IRLOAD = QRLOAD must be set
to 250 .
Substituting the values of IOUTP, IOUTN, and IxREF, VIDIFF can
be expressed as
VIDIFF = {(2 IDAC CODE (2
N
1))/2
N
} (8)
(32 VREFIO/IRSET) IRLOAD
Equation 8 highlights some of the advantages of operating the
AD9714/AD9715/AD9716/AD9717 differentially. First, the
differential operation helps cancel common-mode error sources
associated with IOUTP and IOUTN, such as noise, distortion,
and dc offsets. Second, the differential code-dependent current and
subsequent voltage, VIDIFF, is twice the value of the single-ended
voltage output (that is, VIOUTP or VIOUTN), thus providing twice
the signal power to the load. Note that the gain drift temperature
performance for a single-ended output (VIOUTP and VIOUTN) or
differential output (VIDIFF) of the AD9714/AD9715/AD9716/
AD9717 can be enhanced by selecting temperature-tracking
resistors for xRLOAD and xRSET because of their ratiometric
relationship, as shown in Equation 8.
ANALOG OUTPUT
The complementary current outputs in each DAC, IOUTP/
IOUTN and QOUTP/QOUTN, can be configured for single-
ended or differential operation. IOUTP/IOUTN and QOUTP/
QOUTN can be converted into complementary single-ended
voltage outputs, VIOUTP and VIOUTN, as well as VQOUTP and VQOUTN
via a load resistor, xRLOAD, as described in the DAC Transfer
Function section by Equation 6 through Equation 8. The differen-
tial voltages, VIDIFF and VQDIFF, existing between VIOUTP and VIOUTN,
and VQOUTP and VQOUTN, can also be converted to a single-ended
voltage via a transformer or a differential amplifier configuration.
The ac performance of the AD9714/AD9715/AD9716/AD9717
is optimum and is specified using a differential transformer-
coupled output in which the voltage swing at IOUTP and IOUTN
is limited to 0.5 V. The distortion and noise performance of
the AD9714/AD9715/AD9716/AD9717 can be enhanced when
it is configured for differential operation. The common-mode
error sources of both IOUTP/IOUTN and QOUTP/QOUTN
can be significantly reduced by the common-mode rejection
of a transformer or differential amplifier. These common-mode
error sources include even-order distortion products and noise.
The enhancement in distortion performance becomes more
significant as the frequency content of the reconstructed wave-
form increases and/or its amplitude increases. This is due to
the first-order cancellation of various dynamic common-mode
distortion mechanisms, digital feedthrough, and noise. Performing
a differential-to-single-ended conversion via a transformer also
provides the ability to deliver twice the reconstructed signal
power to the load (assuming no source termination). Because
the output currents of IOUTP/IOUTN and QOUTP/QOUTN
are complementary, they become additive when processed
differentially.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 45 of 80
SELF-CALIBRATION
The AD9714/AD9715/AD9716/AD9717 have a self-calibration
feature that improves the DNL of the device. Performing a self-
calibration on the device improves device performance in low
frequency applications. The device performance in applications
where the analog output frequencies are above 5 MHz are generally
influenced more by dynamic device behavior than by DNL and,
in these cases, self-calibration is unlikely to provide much benefit.
The calibration clock frequency is equal to the DAC clock
divided by the division factor chosen by the DIVSEL value. Each
calibration clock cycle is between 32 and 2048 DAC input clock
cycles, depending on the value of DIVSEL[2:0] (Register 0x0E,
Bits[2:0]). The frequency of the calibration clock should be
between 0.5 MHz and 4 MHz for reliable calibrations. Best
results are obtained by setting DIVSEL[2:0] (Register 0x0E,
Bits[2:0]) to produce a calibration clock frequency between
these values. Separate self-calibration hardware is included
for each DAC. The DACs can be self-calibrated individually or
simultaneously.
To perform a device self-calibration, the following procedure
can be used:
1. Write 0x00 to Register 0x12. This ensures that the
UNCALI and UNCALQ bits are reset.
2. Set up a calibration clock between 0.5 MHz and 4 MHz
using DIVSEL[2:0], and then enable the calibration clock
by setting the CALCLK bit (Register 0x0E, Bit 3).
3. Select the DAC(s) to self-calibrate by setting either Bit 4
(CALSELI) for the I DAC and/or Bit 5 (CALSELQ) for the
Q DAC in Register 0x0E. Note that each DAC contains
independent calibration hardware so that they can be
calibrated simultaneously.
4. Start self-calibration by setting the CALEN bit (Register 0x12,
Bit 4). Wait approximately 300 calibration clock cycles.
5. Check if the self-calibration has completed by reading
the CALSTATI bit (Bit 6) and CALSTATQ bit (Bit 7) in
Register 0x0F. Logic 1 indicates that the calibration has
completed.
6. When the self-calibration has completed, write 0x00 to
Register 0x12.
7. Disable the calibration clock by clearing the CALCLK bit
(Register 0x0E, Bit 3).
The AD9714/AD9715/AD9716/AD9717 allow reading and
writing of the calibration coefficients. There are 32 coefficients
in total. The read/write feature of the coefficients can be useful
for improving the results of the self-calibration routine by
averaging the results of several self-calibration cycles and
loading the averaged results back into the device.
To read the calibration coefficients, use the following steps:
1. Select which DAC core to read by setting either Bit 4
(CALSELI) for the I DAC or Bit 5 (CALSELQ) for the
Q DAC in Register 0x0E. Write the address of the first
coefficient (0x01) to Register 0x10.
2. Set the SMEMRD bit (Register 0x12, Bit 2) by writing 0x04
to Register 0x12.
3. Read the 6-bit value of the first coefficient by reading the
contents of Register 0x11.
4. Clear the SMEMRD bit by writing 0x00 to Register 0x12.
5. Repeat Step 2 through Step 4 for each of the remaining 31
coefficients by incrementing the address by 1 for each read.
6. Deselect the DAC core by clearing either Bit 4 (CALSELI)
for the I DAC or Bit 5 (CALSELQ) for the Q DAC in
Register 0x0E.
To write the calibration coefficients to the device, use the
following steps:
1. Select which DAC core to write to by setting either Bit 4
(CALSELI) for the I DAC or Bit 5 (CALSELQ) for the Q
DAC in Register 0x0E.
2. Set the SMEMWR bit (Register 0x12, Bit 3) by writing 0x08
to Register 0x12.
3. Write the address of the first coefficient (0x01) to
Register 0x10.
4. Write the value of the first coefficient to Register 0x11.
5. Repeat Step 2 through Step 4 for each of the remaining 31
coefficients by incrementing the address by one for each
write.
6. Clear the SMEMWR bit by writing 0x00 to Register 0x12.
7. Deselect the DAC core by clearing either Bit 4 (CALSELI)
for the I DAC or Bit 5 (CALSELQ) for the Q DAC in
Register 0x0E.
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 46 of 80
COARSE GAIN ADJUSTMENT
Option 1
A coarse full-scale output current adjustment can be achieved
using the lower six bits in Register 0x0D. This adds or subtracts
up to 20% from the band gap voltage on Pin 34 (REFIO), and
the voltage on the FSADJx resistors tracks this change. As a
result, the DAC full-scale current varies by the same amount.
A secondary effect to changing the REFIO voltage is that the
full-scale voltage in the AUXDAC also changes by the same
magnitude. The register uses twos complement format, in
which 011111 maximizes the voltage on the REFIO node
and 100000 minimizes the voltage.
1.30
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0 8 16 24 32 40 48 56
CODE
V
R
E
F
0
7
2
6
5
-
0
5
4

Figure 98. Typical VREF Voltage vs. Code
Option 2
While using the internal FSADJx resistors, each main DAC can
achieve independently controlled coarse gain using the lower
six bits of Register 0x04 (IRSET[5:0]) and Register 0x07
(QRSET[5:0]). Unlike Coarse Gain Option 1, this impacts only
the main DAC full-scale output current. The register uses twos
complement format and allows the output current to be changed
in approximately 0.25 dB steps.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0 10 20 30 40 50 60
xR
SET
CODE
O
U
T
P
U
T

O
F

I
/
V

C
O
N
V
E
R
T
E
R

(
V
)
0
7
2
6
5
-
0
5
5
V
OUT
_
Q
OR V
OUT
_
I

Figure 99. Effect of xRSET Code
Option 3
Even when the device is in pin mode, full-scale values can be
adjusted by sourcing or sinking current from the FSADJx pins.
Any noise injected here appears as amplitude modulation of the
output. Thus, a portion of the required series resistance (at least
20 k) must be installed right at the pin. A range of 10% is
quite practical using this method.
Option 4
As in Option 3, when the device is in pin mode, both full-scale
values can be adjusted by sourcing or sinking current from the
REFIO pin. Noise injected here appears as amplitude modulation
of the output; therefore, a portion of the required series resis-
tance (at least 10 k) must be installed at the pin. A range of
25% is quite practical when using this method.
Fine Gain
Each main DAC has independent fine gain control using the
lower six bits in Register 0x03 (I DAC gain) and Register 0x06
(Q DAC gain). Unlike Coarse Gain Option 1, this impacts only
the main DAC full-scale output current. These registers use straight
binary format. One application in which straight binary format
is critical is for side-band suppression while using a quadrature
modulator. This is described in more detail in the Applications
Information section.
2.22
2.20
2.18
2.16
2.14
2.12
2.10
0 8 16 24 32 40 48 56 64
GAIN DAC CODE
I
O
U
T
F
S

(
m
A
)
0
7
2
6
5
-
0
5
6
3.3V DAC1
3.3V DAC2
1.8V DAC1
1.8V DAC2

Figure 100. Typical DAC Gain Characteristics
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 47 of 80
USING THE INTERNAL TERMINATION RESISTORS
The AD9717/AD9716/AD9715/AD9714 have four 500
termination internal resistors (two for each DAC output).
To use these resistors to convert the DAC output current to a
voltage, connect each DAC output pin to the adjacent load pin.
For example, on the I DAC, IOUTP must be shorted to RLIP
and IOUTN must be shorted to RLIN. In addition, the CMLI
or CMLQ pin must be connected to ground directly or through
a resistor. If the output current is at the nominal 2 mA and the
CMLI or CMLQ pin is tied directly to ground, this produces a
dc common-mode bias voltage on the DAC output equal to 0.5 V.
If the DAC dc bias must be higher than 0.5 V, an external
resistor can be connected between the CMLI or CMLQ pin and
ground. This part also has an internal common-mode resistor
that can be enabled. This is explained in the Using the Internal
Common-Mode Resistor section.
0
7
2
6
5
-
0
5
7
I DAC
OR
Q DAC
R
CML
CML
RLIN
IOUTN
IOUTP
RLIP
500
500

Figure 101. Simplified Internal Load Options
Using the Internal Common-Mode Resistor
These devices contain an adjustable internal common-mode
resistor that can be used to increase the dc bias of the DAC
outputs. By default, the common-mode resistor is not con-
nected. When enabled, it can be adjusted from ~250 to
~1 k. Each main DAC has an independent adjustment
using the lower six bits in Register 0x05 (IRCML[5:0]) and
Register 0x08 (QRCML[5:0]).
1200
1100
1000
900
800
700
600
500
400
300
200
0 8 16 24 32 40 48 56
CODE
R
E
S
I
S
T
A
N
C
E

(

)
0
7
2
6
5
-
0
5
8

Figure 102. Typical CML Resistor Value vs. Register Code
Using the CMLx Pins for Optimal Performance
The CMLx pins also serve to change the DAC bias voltages
in the parts allowing them to run at higher dc output bias
voltages. When running the bias voltage below 0.9 V and an
AVDD of 3.3 V, the parts perform optimally when the CMLx
pins are tied to ground. When the dc bias increases above 0.9 V,
set the CMLx pins at 0.5 V for optimal performance. The maxi-
mum dc bias on the DAC output should be kept at or below 1.2 V
when the supply is 3.3 V. When the supply is 1.8 V, keep the dc
bias close to 0 V and connect the CMLx pins directly to ground.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 48 of 80
APPLICATIONS INFORMATION
OUTPUT CONFIGURATIONS
The following sections illustrate some typical output confi-
gurations for the AD9714/AD9715/AD9716/AD9717. Unless
otherwise noted, it is assumed that IxOUTFS is set to a nominal
2 mA. For applications requiring the optimum dynamic perfor-
mance, a differential output configuration is suggested. A
differential output configuration can consist of either an
RF transformer or a differential op amp configuration. The
transformer configuration provides the optimum high fre-
quency performance and is recommended for any application
that allows ac coupling. The differential op amp configuration
is suitable for applications requiring dc coupling, signal gain,
and/or a low output impedance.
A single-ended output is suitable for applications in which low
cost and low power consumption are primary concerns.
DIFFERENTIAL COUPLING USING A TRANSFORMER
An RF transformer can be used to perform a differential-to-
single-ended signal conversion, as shown in Figure 103. The
distortion performance of a transformer typically exceeds
that available from standard op amps, particularly at higher
frequencies. Transformer coupling provides excellent rejection
of common-mode distortion (that is, even-order harmonics)
over a wide frequency range. It also provides electrical isolation
and can deliver voltage gain without adding noise. Transformers
with different impedance ratios can also be used for impedance
matching purposes. The main disadvantages of transformer
coupling are low frequency roll-off, lack-of-power gain, and
high output impedance.
AD9714/AD9715/
AD9716/AD9717
IOUTN
IOUTP
29
28
OPTIONAL R
DIFF
R
LOAD
0
7
2
6
5
-
0
5
9

Figure 103. Differential Output Using a Transformer
The center tap on the primary side of the transformer must be
connected to a voltage that keeps the voltages on IOUTP and
IOUTN within the output common-mode voltage range of the
device. Note that the dc component of the DAC output current
is equal to IxOUTFS and flows out of both IOUTP and IOUTN.
The center tap of the transformer should provide a path for
this dc current. In most applications, AGND provides the most
convenient voltage for the transformer center tap. The complemen-
tary voltages appearing at IOUTP and IOUTN (that is, VIOUTP
and VIOUTN) swing symmetrically around AGND and should be
maintained with the specified output compliance range of the
AD9714/AD9715/AD9716/AD9717.
A differential resistor, RDIFF, can be inserted in applications
where the output of the transformer is connected to the load,
RLOAD, via a passive reconstruction filter or cable. RDIFF, as
reflected by the transformer, is chosen to provide a source
termination that results in a low voltage standing wave ratio
(VSWR). Note that approximately half the signal power is
dissipated across RDIFF.
SINGLE-ENDED BUFFERED OUTPUT USING
AN OP AMP
An op amp such as the ADA4899-1 can be used to perform
a single-ended current-to-voltage conversion, as shown in
Figure 104. The AD9714/AD9715/AD9716/AD9717 are config-
ured with a pair of series resistors, RS, off each output. For best
distortion performance, RS should be set to 0 . The feedback
resistor, RFB, determines the peak-to-peak signal swing by the
formula
VOUT = RFB IFS
The common-mode voltage of the output is determined by the
formula
2
1
FS FB
B
FB
REF CM
I R
R
R
V V

|
|
.
|

\
|
+ =
The maximum and minimum voltages out of the amplifier are,
respectively,
|
|
.
|

\
|
+ =
B
FB
REF MAX
R
R
V V 1
VMIN = VMAX IFS RFB
+5V
AD9714/AD9715/
AD9716/AD9717
IOUTP
IOUTN 29
R
FB
V
OUT
REFIO 34
28
R
S
AVSS 25
C
F
C
R
S
R
B
0
7
2
6
5
-
0
6
0
+

ADA4899-1
5V

Figure 104. Single-Supply Single-Ended Buffer
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 49 of 80
DIFFERENTIAL BUFFERED OUTPUT
USING AN OP AMP
A dual op amp (see the circuit shown in Figure 105) can be used
in a differential version of the single-ended buffer shown in
Figure 104. The same RC network is used to form a one-pole
differential, low-pass filter to isolate the op amp inputs from
the high frequency images produced by the DAC outputs. The
feedback resistors, RFB, determine the differential peak-to-peak
signal swing by the formula
VOUT = 2 RFB IFS
The maximum and minimum single-ended voltages out of the
amplifier are, respectively,
|
|
.
|

\
|
+ =
B
FB
REF MAX
R
R
V V 1
VMIN = VMAX RFB IFS
The common-mode voltage of the differential output is
determined by the formula
VCM = VMAX RFB IFS
0
7
2
6
5
-
0
6
1
AD9714/AD9715/
AD9716/AD9717
IOUTP
IOUTN
R
FB
V
OUT
REFIO 34
28
R
S
AVSS 25
C
F
C
R
FB
R
B
C
F
R
S
R
B
29
+

ADA4841-2
+

ADA4841-2

Figure 105. Single-Supply Differential Buffer
AUXILIARY DACs
The DACs of the AD9714/AD9715/AD9716/AD9717 feature
two versatile and independent 10-bit auxiliary DACs suitable
for dc offset correction and similar tasks.
Because the AUXDACs are driven through the SPI port, they
should never be used in timing-critical applications, such
as inside analog feedback loops.
To keep the pin count reasonable, these auxiliary DACs each
share a pin with the corresponding FSADJx resistor. They are,
therefore, usable only when enabled and when that DAC is
operated on its internal full-scale resistors. A simple I-to-V
converter is implemented on chip with selectable shunt resistors
(3.2 k to 16 k) such that if REFIO is set to exactly 1 V, REFIO/2
equals 0.5 V and the following equation describes the no load
output voltage:
O
|
|
.
|

\
|
= k 16
5 . 1
V 5 . 0
S
DAC OUT
R
I V
Figure 106 illustrates the function of all the SPI bits controlling
these DACs with the exception of the QAUXEN (Register 0x0A,
Bit 7) and IAUXEN (Register 0x0C, Bit 7) bits and gating to
prohibit RS < 3.2 k.
0
7
2
6
5
-
0
4
3
+

OP AMP
AUXDAC
[9:0]
AVDD RNG0
RNG1
REFIO
2
16k 16k
16k
4k 8k
OFS2
OFS1
OFS0
(OFS > 4 = 4)
AUX
PIN
RNG: 00 = > 125A f
S
01 = > 62A f
S
10 = > 31A f
S
11 = > 16A f
S

Figure 106. AUXDAC Simplified Circuit Diagram
The SPI speed limits the update rate of the auxiliary DACs. The
data is inverted such that IAUXDAC is full scale at 0x000 and zero
at 0x1FF, as shown in Figure 107.
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0 10 20 30 40 50 60 70 80 90 100 120 130
I
AUXDAC
(A)
O
U
T
P
U
T

(
V
)
0
7
2
6
5
-
0
4
5
110
R
OFFSET
= 3.3k
R
OFFSET
= 4k
R
OFFSET
= 5.3k
R
OFFSET
= 8k
R
OFFSET
= 16k
OP AMP OUTPUT VOLTAGE vs. CHANGES
IN R
OFFSET
AND DAC CURRENT IN A

Figure 107. AUXDAC Op Amp Output vs. Current, AVDD = 3.3 V, No Load,
AUXDAC 0x1FF to 0x000
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 50 of 80
Two registers are assigned to each DAC with 10 bits for the actual
DAC current to be generated, a 3-bit offset (and gain) adjust-
ment, a 2-bit current range adjustment, and an enable/disable
bit. Setting the QAUXOFS (Register 0x0A, Bits[4:2]) and
IAUXOFS (Register 0x0C, Bits[4:2]) bits to all 1s disables the
respective op amp and routes the DAC current directly to the
respective FSADJI/AUXI or FSADJQ/AUXQ pins. This is
especially useful when the loads to be driven are beyond the
limited capability of the on-chip amplifier.
When not enabled (QAUXEN or IAUXEN = 0), the respective
DAC output is in open circuit.
DAC-TO-MODULATOR INTERFACING
The auxiliary DACs can be used for local oscillator (LO) cancella-
tion when the DAC output is followed by a quadrature modulator.
This LO feedthrough is caused by the input referred dc offset
voltage of the quadrature modulator (and the DAC output offset
voltage mismatch) and can degrade system performance. Typical
DAC-to-quadrature modulator interfaces are shown in Figure 108
and Figure 109, with the series resistor value chosen to give an
appropriate adjustment range. Figure 108 also shows external
load resistors in use. Often, the input common-mode voltage for
the modulator is much higher than the output compliance range
of the DAC, so that ac coupling or a dc level shift is necessary. If
the required common-mode input voltage on the quadrature
modulator matches that of the DAC, the dc blocking capacitors in
Figure 108 can be removed and the on-chip resistors can be
connected.
AD9714/AD9715/
AD9716/AD9717
I OR Q DAC
AD9714/AD9715/
AD9716/AD9717
AUX DAC
OPTIONAL
PASSIVE
FILTERING
MODULATOR
V+
QUADRATURE
MODULATOR
I OR Q
INPUTS
499
0.1F
5k
TO
100k
0.1F
499
0
7
2
6
5
-
1
6
6

Figure 108. Typical Use of Auxiliary DACs and External Components for
Coupling to Quadrature Modulators
Figure 109 shows a greatly simplified circuit that takes full
advantage of the internal components supplied in the DAC. A
low-pass or band-pass passive filter is recommended when
spurious signals from the DAC (distortion and DAC images)
at the quadrature modulator inputs can affect the system
performance. In the example shown in Figure 109, the filter
must be able to pass dc to properly bias the modulator. Placing
the filter at the location shown in Figure 108 and Figure 109
allows easy design of the filter because the source and load imped-
ances can easily be designed close to 500 for a 2 mA full-scale
output. Once the resistance at the modulator inputs is known,
the user can easily look up the range of input offsets that may be
encountered and compute a value for the series resistor on the
AUXDAC output.
AD9714/AD9715/
AD9716/AD9717
I OR Q DAC
AD9714/AD9715/
AD9716/AD9717
AUX DAC
OPTIONAL
LOW-PASS
FILTERING
ADL537x
FAMILY
I OR Q
INPUTS
50k
500 500
1k
0
7
2
6
5
-
1
6
7

Figure 109. Simplified DC Coupling to Quadrature Modulator ADL537x
Family or Equivalent Is Enabled By Using Internal Components
CORRECTING FOR NONIDEAL PERFORMANCE OF
QUADRATURE MODULATORS ON THE IF-TO-RF
CONVERSION
Analog quadrature modulators make it very easy to realize
single sideband radios. However, there are several nonideal
aspects of quadrature modulator performance. Among these
analog degradations are gain mismatch and LO feedthrough.
Gain Mismatch
The gain in the real and imaginary signal paths of the quad-
rature modulator may not be matched perfectly. This leads
to less than optimal image rejection because the cancellation of
the negative frequency image is less than perfect.
LO Feedthrough
The quadrature modulator has a finite dc referred offset, as well
as coupling from its LO port to the signal inputs. These can lead
to a significant spectral spur at the frequency of the quadrature
modulator LO.
The AD9714/AD9715/AD9716/AD9717 have the capability
to correct for both of these analog degradations. However,
understand that these degradations drift over temperature;
therefore, if close to optimal single sideband performance
is desired, a scheme for sensing these degradations over
temperature and correcting them may be necessary.
I/Q-CHANNEL GAIN MATCHING
Fine gain matching is achieved by adjusting the values in the
DAC fine gain adjustment registers. For the I DAC, these values
are in the I DAC gain register (Register 0x03). For the Q DAC,
these values are in the Q DAC gain register (Register 0x06). These
are 6-bit values that cover 2% of full scale. To perform gain
compensation starting from the default values of zero, raise the
value of one of these registers a few steps until it can be deter-
mined if the amplitude of the unwanted image is increased or
decreased. If the unwanted image increases in amplitude, remove
the step and try the same adjustment on the other DAC control
register. Iterate register changes until the rejection cannot be
improved further. If the fine gain adjustment range is not sufficient
to find a null (that is, the register goes full scale with no null
apparent), adjust the course gain settings of the two DACs
accordingly and try again. Variations on this simple method
are possible.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 51 of 80
Note that LO feedthrough compensation is independent of
phase compensation. However, gain compensation can affect
the LO compensation because the gain compensation may
change the common-mode level of the signal. The dc offset of
some modulators is common-mode level dependent. Therefore,
it is recommended that the gain adjustment be performed prior
to LO compensation.
LO FEEDTHROUGH COMPENSATION
To achieve LO feedthrough compensation in a circuit, each
output of the two AUXDACs must be connected through a
100 k resistor to one side of the differential DAC output. See
the Auxiliary DACS section for details of how to use AUXDACs.
The purpose of these connections is to drive a very small amount
of current into the nodes at the quadrature modulator inputs,
thereby adding a slight dc bias to one or the other of the
quadrature modulator signal inputs.
To achieve LO feedthrough compensation, the user should start
with the default conditions of the AUXDAC registers, and then
increment the magnitude of one or the other AUXDAC output
voltages. While this is being done, the amplitude of the LO
feedthrough at the quadrature modulator output should be
sensed. If the LO feedthrough amplitude increases, try either
decreasing the output voltage of the AUXDAC being adjusted,
or try adjusting the output voltage of the other AUXDAC. It
may take practice before an effective algorithm is achieved. The
AD9714/AD9715/AD9716/AD9717 evaluation board can be
used to adjust the LO feedthrough down to the noise floor,
although this is not stable over temperature.
RESULTS OF GAIN AND OFFSET CORRECTION
The results of gain and offset correction can be seen in Figure 110
and Figure 111. Figure 110 shows the output spectrum of the
quadrature demodulator before gain and offset correction.
Figure 111 shows the output spectrum after correction. The
LO feedthrough spur at 450 MHz has been suppressed to the
noise level. This result can be achieved by applying the correc-
tion, but the correction must be repeated after a large change in
temperature.
Note that gain matching improves the negative frequency image
rejection, but it is also related to the phase mismatch in the
quadrature modulator. It can be improved by adjusting the
relative phase between the two quadrature signals at the digital
side or properly designing the low-pass filter between the DACs
and quadrature modulators. Phase mismatch is frequency depen-
dent; therefore, routines must be developed to adjust it if
wideband signals are desired.
5
5
15
25
35
45
55
65
75
85
95
0
10
20
30
40
50
60
70
80
90
447.5 449.0 450.0 451.0 452.5
0
7
2
6
5
-
0
6
4
FREQUENCY (MHz)
(
d
B
)

Figure 110. AD9714/AD9715/AD9716/AD9717 and ADL5370 with a Single-
Tone Signal at 450 MHz, No Gain or LO Compensation
5
5
15
25
35
45
55
65
75
85
95
0
10
20
30
40
50
60
70
80
90
447.5 449.0 450.0 451.0 452.5
0
7
2
6
5
-
0
6
5
FREQUENCY (MHz)
(
d
B
)

Figure 111. AD9714/AD9715/AD9716/AD9717 and ADL5370 with a Single-
Tone Signal at 450 MHz, Gain and LO Compensation Optimized
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 52 of 80
MODIFYING THE EVALUATION BOARD TO
USE THE ADL5370 ON-BOARD QUADRATURE
MODULATOR
The evaluation board contains an Analog Devices, Inc.,
ADL5370 quadrature modulator. The AD9714/AD9715/
AD9716/AD9717 and the ADL5370 provide an easy-to-
interface DAC/modulator combination that can be easily
characterized on the evaluation board. Solderable jumpers
can be configured to evaluate the single-ended or differential
outputs of the AD9714/AD9715/AD9716/AD9717. This setup
is the default configuration from the factory and consists of
the following population of the components:
- JP55, JP56, JP76, JP82unsoldered
- R13, R14, R52, R53unpopulated
- R50, R57, T1, T2populated
To evaluate the ADL5370 on this board, the population of these
same components should be reversed so that they are in the
following positions:
- JP55, JP56, JP76, JP82soldered
- R13, R14, R52, R53populated
- R50, R57, T1, T2unpopulated
The AUXDAC outputs can be connected to Test Point TP44 and
Test Point TP45 if LO feedthrough compensation is necessary.

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 53 of 80
EVALUATION BOARD SHEMATICS AND ARTWORK
SCHEMATICS
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Figure 112. Power Supplies and Filters
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 54 of 80
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5
X
D
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6
X
D
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6
1
0
1
1
1
2
1
3
1
4
1
5
2 3 4 5 6 7 8 1
1
6 9
R
P
3
1
R
6
0
M
S
B
T
P
2
2
T
P
1
0
B
L
K
W
H
T
D
B
1
3
X
D
B
7
X
D
B
8
X
D
B
9
X
D
B
1
0
X
D
B
1
1
X
D
B
1
2
X
D
B
1
0
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
9
1
6
1 8 7 6 5 4 3 2
1
5
1
4
1
3
1
2
1
1
1
0
R
P
4
0 7 2 6 5 - 1 8 5
S
S
W
-
1
2
0
-
0
2
-
S
M
-
D
-
R
-
A
H E A D E R R I G H T A N G L E F E M A L E
P
C
B

B
o
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S
i
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1 3 7 5 9 1
1
1
3
1
5
1
7
1
9
2
1
2
3
2
5
2
7
2
9
3
1
3
3
3
5
3
7
3
9
2 4 6 8 1
0
1
2
1
4
1
6
1
8
2
0
2
2
2
4
2
6
2
8
3
0
3
2
3
4
3
6
3
8
4
0
J
1
1
D
I
G
I
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A
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I
N
P
U
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D
B
1
3
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1
1
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9
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8
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7
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6
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5
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4
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3
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J
1
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R
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3
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T
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M
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B

I
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1
3
,

D
B
1
1
,

D
B
9
,

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7
,

D
E
P
E
N
D
I
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O
N

T
H
E
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A
R
T
.

Figure 113. Digital Inputs
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 55 of 80
0 7 2 6 5 - 1 8 6
R
C
0
4
0
2
R
C
0
4
0
2
R
C
0
4
0
2
R
C
0
4
0
2
C
C
C
C
C
R
C
0
4
0
2
R
C
0
4
0
2
R
C
0
4
0
2
C
C
0
6
0
3
C
C
0
6
0
3
R C 0 6 0 3
R C 0 4 0 2
S
N
7
4
L
V
C
1
G
3
4
D
C
K
C
C
0
6
0
3
C
C
0
6
0
3
C
C
0
6
0
3
C
C
0
6
0
3
C
C
0
6
0
3
C
C
0
4
0
2
C
C
0
4
0
2
C
C
0
6
0
3
A
C
A
S
E
R C 0 4 0 2
C
C
0
4
0
2
C
C
0
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2
C
R
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7
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6
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2
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0

(
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1
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1
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(
M
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R C 0 4 0 2
R C 0 4 0 2
R C 0 4 0 2
R C 0 4 0 2
R
C
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R
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R C 0 4 0 2
C
=


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B
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1
.

Figure 114. Clock Input and DUT
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 56 of 80
0 7 2 6 5 - 1 8 7
R C 0 6 0 3
R
C
0
6
0
3
R
C
0
6
0
3
C C 0 4 0 2
A
C
A
S
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D
N
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RC0805
RC0805
RC0805
R C 0 6 0 3
R C 0 6 0 3
R C 0 6 0 3
R C 0 6 0 3
A
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1
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2
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9
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R C 0 6 0 3
R C 0 6 0 3
A
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C C 0 6 0 3
C C 0 8 0 5
C C 0 6 0 3
C
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0
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3
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C
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0
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3
R C 0 6 0 3
R
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RC0603
RC0603
F
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E R A 6 Y E B 3 2 3 V , E R A 6 Y
E R A 6 Y E B 3 2 3 V , E R A 6 Y
E R A 6 Y E B 3 2 3 V , E R A 6 Y
U
1
3

Figure 115. IOUT Network and FSADJ1
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 57 of 80
0 7 2 6 5 - 1 8 8
R C 0 6 0 3
R
C
0
6
0
3
R
C
0
6
0
3
R
C
0
6
0
3
R C 0 6 0 3
C
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0
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RC0805
RC0805
E R A 6 Y E B 3 2 3 V , E R A 6 Y
E R A 6 Y E B 3 2 3 V , E R A 6 Y
E R A 6 Y E B 3 2 3 V , E R A 6 Y
R C 0 6 0 3
R C 0 6 0 3
R C 0 6 0 3
RC0805
R C 0 6 0 3
R C 0 6 0 3
R
C
0
6
0
3
R
C
0
6
0
3
R
C
0
6
0
3
R C 0 6 0 3
R C 0 6 0 3
R
C
0
6
0
3
R C 0 6 0 3
R C 0 6 0 3
R C 0 6 0 3
R C 0 6 0 3
C
C
0
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Figure 116. QOUT Network and FSADJ2
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 58 of 80
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Figure 117. SPI Port
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 59 of 80
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Figure 118. Modulated Output
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 60 of 80
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R
8
9
0
D
N
P


R
9
0
C
V
D
D
X
4
.
1
2
K
R
8
1
R
7
6
1
.
8
K
1
3
4
2
S
W
2
C
G
N
D
;
5
C
V
D
D
X
1
.
8
K
R
7
7
0
.
1
U
F
C
4
6
C
4
5
0
.
1
U
F
R
9
1
4
9
.
9
1
2
3
D
3
2 3 1
5 6 4
T
9
0
.
1
U
F
C
6
6
C
6
7
0
.
1
U
F
0
.
1
U
F
C
6
8
C
7
6
0
.
1
U
F
0
.
1
U
F
C
7
1
C
7
0
0
.
1
U
F
0
.
1
U
F
C
6
9
O
U
T
2
R

R
1
0
9
D
N
P
J
1
0
0 7 2 6 5 - 1 9 1
R
C
04
0
2
0
R
8
6
R
A
0
C
C
A
D
9
5
1
2
B
C
P
Z
D
S
Y
N
C
B
V
S
1
V
S
2
N
C
1
V
S
3
C
L
K
2
C
L
K
2
B
V
S
4
C
L
K
1
C
L
K
1
B
F
U
N
C
S
T
A
T
U
S
S
C
L
K
S
D
I
O
S
D
O
C
S
B
V
S
5
G
N
D
1
O
U
T
2
B
O
U
T
2
V
S
6
V
S
7
V
S
1
8
V
S
1
7
G
N
D
6
R
S
E
T
V
S
1
6
G
N
D
5
O
U
T
0
O
U
T
0
B
V
S
1
5
V
S
1
4
G
N
D
4
G
N
D
3
V
S
1
3
O
U
T
3
O
U
T
3
B
V
S
1
2
V
S
1
1
O
U
T
4
O
U
T
4
B
V
S
1
0
V
S
9
O
U
T
1
O
U
T
1
B
V
S
8
G
N
D
2
D
S
Y
N
C
M
O
D
E
-
S
D
I
O
M
O
D
E
-
S
D
O
2 3 4 5 6 7 8 9
1
0
1
1
1
2
1
3
1
4
1
5
1
6
1
7
1
8
1
9
2
0
2
1
2
2
2
3
4
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
3
9
3
8
3
7
3
6
3
5
3
4
3
3
3
2
3
1
3
0
2
9
2
8
2
7
2
6 5
2
4
2
1
U
1
0
C
G
N
D
;
4
9
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
R
M
O
D
E
-
S
C
L
K
S
L
E
E
P
-
C
S
B
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
L
O
C
K

D
R
I
V
E
R

C
H
I
P
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
V
D
D
X
C
G
N
D
;
3
,
4
,
5
W
H
E
N

R
9
0

A
N
D

R
1
0
9
A
R
E

N
O
T

D
N
P
,

4
9
.
9
I
S

R
E
C
O
M
M
E
N
D
E
D

Figure 119. Clock Driver Chip
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 61 of 80
SILKSCREENS
0
7
2
6
5
-
2
0
3

Figure 120. Layer 2, Ground Plane
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 62 of 80
0
7
2
6
5
-
2
0
4

Figure 121. Layer 3, Power Plane
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 63 of 80
0
7
2
6
5
-
2
0
5

Figure 122. AssemblyPrimary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 64 of 80
0
7
2
6
5
-
2
0
6

Figure 123. AssemblySecondary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 65 of 80
0
7
2
6
5
-
2
1
7

Figure 124. Solder MaskPrimary Side with Socket


AD9714/AD9715/AD9716/AD9717

Rev. A | Page 66 of 80
0
7
2
6
5
-
2
0
7

Figure 125. Solder MaskSecondary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 67 of 80
0
7
2
6
5
-
2
0
8

Figure 126. Hard Gold Plated with Bumps and Socket
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 68 of 80
0
7
2
6
5
-
2
0
9

Figure 127. Primary Side Paste
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 69 of 80
0
7
2
6
5
-
2
1
0

Figure 128. Secondary Side Paste
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 70 of 80
0
7
2
6
5
-
2
1
1

Figure 129. SilkscreenPrimary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 71 of 80
0
7
2
6
5
-
2
1
2

Figure 130. SilkscreenSecondary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 72 of 80
0
7
2
6
5
-
2
1
3

Figure 131. Layer 1Primary Side

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 73 of 80
0
7
2
6
5
-
2
1
4

Figure 132. Layer 4Secondary Side
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 74 of 80
0
7
2
6
5
-
2
1
5

Figure 133. Immersion Gold, No Socket, No Bumps
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 75 of 80
0
7
2
6
5
-
2
1
6

Figure 134. Solder MaskPrimary Side, No Socket

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 76 of 80
BILL OF MATERIALS
Table 18.
Qty Reference Designator Device Package Description
Part No./
Manufacturer
6 C1, C2, C4, C5, C32, C57 CAPSMDA ACASE 10 F, 6.3 V capacitor
17 C3, C6, C7, C8, C9, C10, C11,
C15, C16, C22, C24, C26,
C27, C48, C60, C61, C107
CC0603 CC0603 0.1 F capacitor
11 C12, C14, C17, C18, C20,
C21, C31, C37, C39, C86, C88
CC0603 CC0603 1 F capacitor
5 C13, C19, C30, C38, C89 CC0603 CC0603 100 pF capacitor
3 C23, C25, C28 CC0603 CC0603 0.01 F capacitor
6 C29, C36, C47, C52, C72, C90 CC0402 CC0402 0.1 F capacitor
2 C33, C49 CC0603 CC0603 10 pF, 1% capacitor
18 C34, C40, C42, C45, C46,
C55, C58, C66, C67, C68,
C69, C70, C71, C76, C77,
C85, C101, C113
CC0402 CC0402 0.1 F capacitor
1 C35 CAPSMDA ACASE 22 F,16 V capacitor
3 C41, C43, C44 CAPSMDB ACASE 10 F, 10 V capacitor
8 C50, C51, C53, C54, C63,
C73, C83, C87
CC0402 CC0402 100 pF capacitor
2 C56, C62 CC0402 CC0402 1 nF capacitor
1 C59 CAPSMDA ACASE 4.7 F, 6.3 V capacitor
4 C64, C75, C79, C82 CC0805 CC0805 7.5 pF, 1% capacitor
4 C65, C74, C80, C81 CC0805 CC0805 4.7 pF, 1% capacitor
1 C78 CC0402 CC0402 0.01 F capacitor
11 C84, C97, C98, C99, C100,
C106, C108, C109, C111,
C112, C114
CC0603 CC0603 0.1 F capacitor
4 C91, C92, C93, C94 CC0805 CC0805 DNP
2 C95, C96 CC0603 CC0603 DNP
1 C102 CC0402 CC0402 0.2 nF capacitor
2 C103, C104 CAPSMDA ACASE 10 F, 10 V capacitor
1 C105 CC0805 CC0805 1 F ceramic capacitor
1 C110 CC0603 CC0603 470 nF capacitor
1 D1 Panasonic LNJ312G8TRA 1.6 mm x 0.8 mm LED-SMD-TSS-GRN LNJ312G8TRA
1 D3 HSMS-281C SOT323-3 HSMS-281C HSMS-281C
1 J1 Samtec
SSW-120-02-SM-D-RA
40-pin through
hole
40-pin right angle
header female
SSW-120-02-SM-D-RA/
Samtec
6 J2, J3, J4, J5, J8, J11 SMAEDGE SMAEDGE DNP SMA connector
edge right angle

2 J6, J7 SMAEDGE SMAEDGE SMA connector
edge right angle

5 J10, S3, S5, S6, S11 SMAUPA04 SMA200UP SMA connector RF
5-pin upright

5 S4, S8, S9, S10, S12 SMAUPA04 SMA200UP DNP
11 JP3, JP7, JP8, JP9, JP11, JP12,
JP16, JP20, JP21, JP28, JP77
JPRBLK02 JPRBLK02 2-pin jumper header
10 JP6, JP10, JP15, JP22, JP26,
JP29, JP54, JP78, JP88, JP89
JPRBLK03 JPRBLK03 3-pin jumper header
10 JP32, JP33, JP34, JP35, JP55,
JP56, JP76, JP82, JP90, JP91
JPRSLD02 JPRSLD02 Solder jumper
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 77 of 80
Qty Reference Designator Device Package Description
Part No./
Manufacturer
11 L1, L2, L3, L4, L5, L6, L7,
L12, L13, L16, L19
IND1812 LC1812 EXC-CL4532U1 EXC-CL4532U1
4 L8, L9, L10, L11 IND1008 LC1008 1.8 H, 10%
4 L14, L17, L18, L20 IND1008 LC1008 DNP
1 L15 IND1210 LC1210 EXC-CL3225U1 EXC-CL3225U1
1 P1 USB-MINIB USB-MINIB USB mini 5-pin
1 P3 Molex 0532610571 Molex 0532610571 1.25 mm, 5-pin wire-
to-board connector
0532610571/
Molex
2 R1, R58 RC0805 RC0805 32 k, 0.1% resistor ERA6YEB323V,
ERA6Y
5 R2, R23, R25, R31, R36 RC0603 RC0603 76.8 k resistor
5 R3, R4, R5, R10, R29 RC0603 RC0603 78.7 k resistor
6 R6, R33, R34, R64, R65, R67 RC0402 RC0402 0 resistor
7 R17, R66, R68, R69, R107,
R110, R122
RC0402 RC0402 DNP
1 R7 RC0603 RC0603 10 k resistor
5 R8, R12, R30, R32, R92 RC0603 RC0603 64.9 k resistor
8 R9, R37, R42, R56, R97, R98,
R100, R101
RC0603 RC0603 DNP
4 R11, R38, R79, R83 RC0603 RC0603 0 resistor
4 R13, R14, R52, R53 RC0603 RC0603 DNP
10 R15, R16, R123, R124,
R73 to R75, R78, R93, R94,
R105, R106
RC0603 RC0603 0 resistor
6 R22, R54, R118, R119,
R120, R121
RC0603 RC0603 DNP
1 R18 RC0402 RC0402 49.9 resistor
2 R19, R21 RC0402 RC0402 0 resistor
3 R20 , R26, R80 RC0402 RC0402 DNP
2 R24, R61 RC0603 RC0603 1 k resistor
1 R27 RC0603 RC0603 1 M resistor
7 R28, R39, R40, R41, R44,
R45, R103
RC0402 RC0402 22 resistor
4 R35, R55, R99, R102 RC0603 RC0603 100 k resistor
1 R43 RC0402 RC0402 0 resistor
8 R46, R47, R48, R62, R82,
R86, R116, R117
RC0402 RC0402 0 resistor
2 R49, R59 RC0805 RC0805 16 k, 0.1% resistor ERA6YEB323V,
ERA6Y
2 R50, R57 RC0603 RC0603 453 resistor
2 R51, R60 RC0805 RC0805 8 k, 0.1% resistor ERA6YEB323V,
ERA6Y
3 R63, R113, R115 RC0402 RC0402 499 resistor
3 R70, R71, R108 RC0402 RC0402 10 k resistor
1 R72 RC0402 RC0402 25 resistor
2 R76, R77 RC0402 RC0402 1.8 k resistor
1 R81 RC0402 RC0402 4.12 k resistor
1 R87 RC1206 RC1206 0 resistor
2 R88, R89 RC0402 RC0402 0 resistor
2 R90, R109 RC0402 RC0402 DNP
1 R91 RC0805 RC0805 49.9 resistor
2 R111, R112 RC0603 RC0603 DNP
1 R114 RC0402 RC0402 15 resistor
2 RP1, RP5 RNETCTS743-8 RNETCTS743-8 DNP
AD9714/AD9715/AD9716/AD9717

Rev. A | Page 78 of 80
Qty Reference Designator Device Package Description
Part No./
Manufacturer
2 RP3, RP4 RNETCTS743-8 RNETCTS743-8 22 resistor
2 SW1, SW2 KEYBDSWG OMRONB3SG B3S-1100 push-button
4 T1, T2, T3, T6 ADTL1-12 MINI_CD542 DNP
1 T4 ETC1-1-13 SM-22 M/A COM ETC1-1-13 ETC1-1-13/
M/A-COM
2 T5, T8 ADT9-1T MINI_CD542 ADT9-1T ADT9-1T/
Mini-Circuits
1 T9 JTX-4-10T MINI_BH292 JTX-4-10T+ JTX-4-10T/
Mini-Circuits
16 TP1, TP3, TP17, TP18,
TP19, TP20, TP22, TP25,
TP26, TP30, TP31, TP34,
TP35, TP38, TP44, TP45
LOOPMINI LOOPMINI White test point
4 TP32, TP33, TP36, TP37 LOOPMINI LOOPMINI DNP
8 TP5, TP8, TP12, TP13,
TP16, TP24, TP39, TP42
LOOPMINI LOOPMINI Red test point
1 TP2 LOOPMINI LOOPMINI DNP
12 TP4, TP6, TP7, TP9, TP10,
TP11, TP14, TP15, TP21,
TP23, TP41, TP43
LOOPMINI LOOPMINI Black test point
1 TP40 LOOPMINI LOOPMINI Orange test point
1 U1 40-lead LFCSP, AD9717 LFCSP040-CP1 40-lead LFCSP,
AD9717
AD9717/
Analog Devices
5 U2, U4, U6, U7, U11 ADP3334 8-lead SOIC ADP3334 voltage
regulator
ADP3334/
Analog Devices
1 U3 USB-PIC18F4550-I/ML-ND QFN044P65MM-EP1 PIC18F4550,
microchip USB
port chip
QFN44 8X8MM
PIC18F4550
2 U5, U14 ADG3304BRUZ 14-lead TSSOP ADG3304,
14-lead TSSOP
ADG3304BRUZ/
Analog Devices
1 U8 74LVC1G34 SC70-05 SN74LVC1G34DCK,
TI buffer
TI-DCK =
SC70_05 PKG
1 U9 ADL5370 LFCSP024P5MM-EP1 ADL5370ACPZ ADL5370ACPZ/
Analog Devices
1 U10 AD9512 LFCSP048-CP1 AD9512BCPZ AD9512BCPZ/
Analog Devices
1 U12 OSC-S1703 OSC-S1703 DNP
1 U13 8-lead SOIC, ADA4899-1 SOIC8-N-EP Op amp, ADA4899-1 ADA4899-1/
Analog Devices
1 Y1 ABM3B-20.000MHZ-10-1-U-T SMD 3.2 mm 5.0 mm 20 MHz 300-8214-1-ND/
Digi-Key

AD9714/AD9715/AD9716/AD9717

Rev. A | Page 79 of 80
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATOR
5.75
BSC SQ
12 MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOT TOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2 0
7
2
1
0
8
-
A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.

Figure 135. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm 6 mm, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9714BCPZ
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9714BCPZRL7
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9715BCPZ
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9715BCPZRL7
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9716BCPZ
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9716BCPZRL7
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9717BCPZ
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9717BCPZRL7
1
40C to +85C 40-Lead LFCSP_VQ CP-40-1
AD9714-EBZ
1
Evaluation Board
AD9715-EBZ
1
Evaluation Board
AD9716-EBZ
1
Evaluation Board
AD9717-EBZ
1
Evaluation Board

1
Z = RoHS Compliant Part.




AD9714/AD9715/AD9716/AD9717

Rev. A | Page 80 of 80
NOTES

20082009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07265-0-3/09(A)

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