Dektak 150 Surface Profiler

High-Performance, Versatility and Value

Exceptional Performance Enhanced Ease of Use and Analysis Vast Application Versatility

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3D imaging with MicroForm reveals details of hybrid glass replicas. Image courtesy of INO.

Dektak 150 with 200mm Wafer Support

Unmatched Performance and Versatility
The Dektak 150 Surface Profiler is the culmination of four decades of stylus profiler technology innovations. It provides repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D mapping and film stress analyses. With its small footprint, latest generation technology and extensive add-on capabilities, the Dektak 150 enables superior performance, versatility and value for industry and research engineers. The Industry Standard
Standard Z range of 1 millimeter

enables larger step measurements

Optional D150+ low-noise electronics

provides industry-best 4-angstrom repeatability

Optional X-Y automated stage delivers

programmability of over 200 locations

Optional chucks accommodate diverse

sample requirements, eg., square solar cells

Cast aluminum frame and rigid

support elements drastically improve repeatability and lower noise floor

Data XY Chart
5000 11529215038

Data XY Chart
1000.00

96076791983 4000 76861433586

0.00

57646075090 3000 38430716793

1000.00

4000 Megapascal

19215358396

2000.00 Nanometer 3000.00 4000.00 5000.00 0.0 347.0 694.0 Micrometer 1041.0 6000.00 1388.0

0.00

1000

1921535839

3843071679 0 5764607519

7686143358 1000 9607679198

2000

0.0

32500.0

65000.0 Micrometer

97500.0

1152921503 130000.0

High-resolution long scans up to 55mm (150mm with stitching) enable curve and post-process stress measurements.

The exclusive Step Detection feature automatically levels, detects and measures multiple steps in a single scan, as well as provides an average of all the steps.

EXCEPTIONAL PERFORMANCE

VAST APPLICATION VERSATILITY

The innovative design of the Dektak 150 accommodates samples up to 90 millimeters thick, performs single scans up to 55 millimeters, and provides a large X-Y translation to cover full 6-inch wafers. With the scan-stitching package, the system can perform longer scans, up to 150 millimeters, for stress measurements on wafers and flat surfaces. The Low-Inertia Sensor 3 (LIS 3) head incorporates key technology advances to deliver extremely accurate measurements with unprecedented sensitivity. The systems 1-millimeter standard vertical range, coupled with up to 120,000 data points per scan, deliver exceptional capability. The result of all these features is unsurpassed horizontal and vertical resolution, enabling precise planarity scans for measuring radius of curvature, flatness, waviness, and thinfilm stress on wafers. The Dektak 150 also has a complete suite of hardware and software options to suit special scanning requirements:

The Dektak 150 is available with three configurations to permit the best possible match to your research or industry application:

The standard model utilizes a robust 100 x 100-millimeter X-Y stage with manual theta for straight-forward, simple measurements The system can be equipped also with a 150-millimeter X-Y motorized stage that facilitates 3D mapping, automation and programmability of over 200 sample sites An optional 6-inch square, porous chuck enables comprehensive sample characterization for photovoltaic applications

Other features that enhance the system for specific application needs include wafer alignment pins for ease of use, three-point suspension for stress, lateral calibration for 99.9% accuracy, and a large scan block for improved baseline stability. Whatever your application, we can configure a system to meet your specific requirements:

For steep slopes, the new MicroForm technology reveals difficult shapes and improves accuracy to within 0.25 degrees A low-force N-Lite option with stylus sensitivity to 0.03 milligrams enables non-destructive characterization of delicate surfaces

Metal etch uniformity on wafers Solar cell finger width and height Thin-film stress calculations Transparent films/photoresist thickness, thin- and thick-film measurements Large-step MEMS characterization Microlens height/curvature and V-groove depth analyses Roughness studies on machined parts Aspheric lens characterization Surface quality and defect review High aspect ratio trench depth measurements

ENHANCED EASE OF USE AND ANALYSIS

The Windows XP software interface allows the operator to quickly become a Dektak expert. Analysis functions are both comprehensive and intuitive, from simple one-button loadand-go testing to automatic comparisons of analytical results from multiple scans. Additional analysis capabilities have been added, such as histogram and advanced automation program summary for pass/fail analysis. Brukers Vision analysis software further extends the usefulness of the data, enabling true 3D mapping, bearing ratio, and over 200 additional analyses.

DEKTAK 150 SpEcificATionS

SYSTEM Measurement Capability Sample Viewing Two-dimensional, contact surface profile measurements 640x480-pixel (1/3in.-format) camera, USB; Fixed magnification, 3mm HFOV (180X with 23in. monitor); Optional manual zoom, variable 0.67 to 4.29mm HFOV. (720X to 120X with 23in. monitor) Low-Inertia Sensor (LIS 3) 1 to 15mg with LIS 3 sensor; 0.03 to 15mg with N-Lite sensor option Stylus radius options from 50nm to 25m; High Aspect Ratio (HAR) tips 10m x 2m and 200m x 20m Manual X/Y/ , 100 x 100mm X-Y translation, 360 rotation, manual leveling; Optional X-Y auto stage, 150mm travel, 1m repeatability; Optional 200mm wafer vacuum chuck; Optional 6-inch square porous vacuum chuck for photovoltaic applications Bruker-qualified Dell workstation with 24/7 support line Dektak software running under Windows XP; Step Detection software (std.); Optional Stress Measurement software; Optional 3D Mapping with Vision analysis software; Optional Stitching software Optional vibration isolation table; Optional table-top vibration isolation system 55mm standard; up to 150mm with stitching option 120,000 maximum Up to 90mm, depending on configuration 150mm (200mm with Advanced Automation Package) 6 (D150); 4 (D150+ option); 1 sigma on 0.1m step 524um (1mm optional) 1 max. (at 6.55m range) Between 20 and 25C (68 to 77F) 50% 20C, non-condensing 100 to 120VAC/200 to 240VAC, 50 to 60Hz 292mm W x 508mm D x 527mm H 34kg (75lbs.) CE, NRTL, S2, S8*, China RoHS, EU RoHS*

Stylus Sensor Stylus Force Stylus Options Sample Stage

Computer System Software

Vibration Isolation PERFORMANCE Scan Length Range Data Points Per Scan Max. Sample Thickness Max. Wafer Size Step Height Repeatability Vertical Range Vertical Resolution ENVIRONMENT Temperature Range Humidity Range FACILITY REQUIREMENTS Input Voltage Dimensions Weight Certification

Note: Performance specifications are subject to change without notice. Visit the Bruker website for most up-to-date specifications. *Consult Factory for details.

Front cover images: Dektak 150 provides detailed measurement for many materials, including (from top to bottom) a C-Si solar cell, a microlens, and a pcb board.

WorlDWiDE cuSTomEr SupporT from ThE inDuSTry lEADEr

Bruker Corporation is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis. For more information, visit www.bruker.com, email productinfo@bruker-nano.com, or call +1.520.741.1044/800.366.9956.
2010 Bruker Corporation. All rights reserved. MicroForm is a trademark of Bruker Corporation. Dektak and Vision are registered trademarks of Bruker Corporation. All other trademarks are the property of their respective companies. B509, Rev C0