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1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. 47. 48. 49. InPat: Supply Chain/ Wood et al, Honda Motor Co InPat: Banking & Cash Flow/ Selfridge, Bank of America Corp InPat: Cashless Services/ Schwartz, Automated Currency Inc InPat: Mediclaim/ Revak et al, Siemens Medical Solutions InPat: Risk Management/ Braun et al, Hartford Fire Insurance InPat: Engineering & Technology/ Besore et al, GE InPat: Civil Engineering/ Toyooka, Hitachi InPat: Mechanical Engineering/ Appleby et al, Mikro Systems InPat: Electrical Engineering/ Mak et al, IBM Corp InPat: Chemical Engineering/ Kojima et al, Fuji Xerox InPat: Electronics/ Dede, Toyota InPat: Computer Science/ Huomo & Vesikivi, Nokia InPat: Information Technology/ Abbas et al, IBM Corp InPat: Aerodynamic Engineering/ Mangalam, Tao Systems Int. InPat: Aeronautical Engineering/ Bureau et al, NRCC InPat: Aerospace Engineering/ Crew et al, Airbus Ltd InPat: AgroTech/ Hong, Korea Met Adm InPat: Apparel Technology/ Nurse, Nike Inc InPat: Automobile Engineering/ Samuel, Toyota Motor InPat: Avionics Engineering/ Marc et al, Airbus InPat: Biochemical Engineering/ Voelker et al, Metabolic Exp InPat: Bioinformatics/ Hsiao et al, Yahoo! Inc InPat: Biomedical Engineering/ Kaganove, Michigan Mole Ins InPat: Biotechnology/ Brod et al, Bayer InPat: CFL & LED/ Bembridge, Philips Electronics InPat: Cloud Computing/ Masone, Google Inc. InPat: Communication Systems/ Winzer et al, Alcatel-Lucent InPat: Computer Aided Designs/ Opincar et al, Ame Imaging InPat: Computer Networks/ Cahill et al, Microsoft Corp InPat: Control Systems/ Thiel et al, Disney Enterprises Inc InPat: Cryogenic Engineering/ Rost et al, Selas Fluid Processing InPat: Cyber Security/ Amini et al, IBM Corp InPat: Desalination/ AI-Garni AZ et al, King Fahd University InPat: Digital Communications/ Bretl et al, Zenith Electronics InPat: Digital Systems/ Dangelo et al, LSI Logic Corp InPat: DTH/ Kahn et al, The DIRECTV Group Inc InPat: Embedded Systems/ Megen et al, Microsoft Corp InPat: Energy Engineering/ Hoffman et al, Boeing InPat: Engine Designs/ Lewis DJ et al, Ford Motor InPat: Food Technology/ Thorsoe et al, Dupont Nutrition InPat: Form, Fill, Seal/ Kondo & Makoto, Ishida Co. InPat: Fuel & Combustion/ Takaoku et al, Hitachi Automotive InPat: High Definition/ Niu et al, Samsung Electronics InPat: High Voltage Engineering/ Richards et al, Twin Cr Tech InPat: Hydraulics Engineering/ Chung et al, Defense Dev (KR) InPat: Illumination Technology/ Ninan et al, Dolby Lab InPat: Image Processing/ Kameyama et al, Fujifilm Corp InPat: Industrial Safety/ Taschke et al, Siemens AG InPat: Instrumentation Engg/ Rees et al, Hewlett-Packard
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New Release New Release New Release New Release New Release 978-93-82434-00-9 978-93-82434-01-6 978-93-82434-02-3 978-93-82434-03-0 978-93-82434-04-7 978-93-82434-05-4 978-93-82434-06-1 978-93-82434-07-8 978-93-82434-08-5 978-93-82434-09-2 978-93-82434-10-8 978-93-82434-11-5 978-93-82434-12-2 978-93-82434-13-9 978-93-82434-14-6 978-93-82434-15-3 978-93-82434-16-0 978-93-82434-17-7 978-93-82434-18-4 978-93-82434-19-1 978-93-82434-20-7 978-93-82434-21-4 978-93-82434-22-1 978-93-82434-23-8 978-93-82434-24-5 978-93-82434-25-2 978-93-82434-26-9 978-93-82434-27-6 978-93-82434-28-3 978-93-82434-29-0 978-93-82434-30-6 978-93-82434-31-3 978-93-82434-32-0 978-93-82434-33-7 978-93-82434-34-4 978-93-82434-35-1 978-93-82434-36-8 978-93-82434-37-5 978-93-82434-38-2 978-93-82434-39-9 978-93-82434-40-5 978-81-921845-8-6 978-93-82434-41-2 978-93-82434-42-9
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50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. 71. 72. 73. 74. 75. 76. 77. 78. 79. 80. 81. 82. 83. 84. 85. 86. 87. 88. 89. 90. 91. 92. 93. 94. 95. InPat: Internal Combustion/ Takaoku et al, Hitachi Automotive InPat: Internet Engineering/ Huttunen, Digifonica Ltd InPat: Irrigation Engineering/ Wong, City Greening Engg Co InPat: Laser & Electro-Optics/ Tamaya et al, Mitsubishi InPat: Leather Technology/ Covington, BLC Leather Tech Ltd InPat: Machine Design/ Miyamoto et al, IBM Corp InPat: Manufacturing Systems/ Jain et al, Hewlett-Packard InPat: Marine Engineering/ Hayes et al, IBM Corp InPat: Materials Technology/ Sameshima, Japan Port Cons Ltd InPat: Mechatronics/ Bohm et al, Siemens Aktiengesellschaft InPat: Medical Electronics/ Herlitz, General Electric InPat: Metallurgy/ Arvin et al, IBM Corp InPat: Micro-Electronics/ Gregory, Intraglobal Corp InPat: Microwave/ Kuroda et al, Univ of Electro-Comm. (JP) InPat: Mobile Communication/ Park et al, LG Electronics Inc InPat: Nano Technology/ Colli et al, Nokia Corporation InPat: Network Engineering/ Venouss, MCI Communications InPat: Neural Networks/ Sasagawa, Panasonic Corp InPat: Optics & Optoelectronics/ Falicoff, Light Pres Innovators InPat: Pulp & Paper/ Nguyen, International Paper Co InPat: Petrochemical Engineering/ Choi et al, Saudi Ara Oil Co InPat: Photovoltaic/ Duerr M et al, Sony Corp InPat: Plastics Technology/ Bhattacharyya et al, Intel Corp InPat: Polymer Technology/ Araghi et al, ConocoPhillips Co InPat: Power Electronics/ Sihler et al, General Electric Co InPat: Power Systems/ Castles et al, DRS Power & Control Tech InPat: Power Transmission/ Zhu et al, Samsung Electronics InPat: Printing Technology/ Jia et al, Xerox Corp InPat: Production Systems/ Beemer et al, First Data Corp InPat: Real Time Systems/ Hazan et al, IBM Corp InPat: Remote Sensing/ Maleki et al, CALTECH InPat: Renewable Energy/ Shen et al, Univ of Massachusetts InPat: Robotics/ Tsusaka, Panasonic Corp InPat: Rubber & Tires/ Nakayama et al, Bridgestone Corp InPat: Semiconductors/ Toda, Kabushiki Kaisha Toshiba InPat: Sensing & Actuation/ Radivojevic, Nokia Corp InPat: Signal Processing/ Tominaga, Sony Corp InPat: Smart Materials/ Cheng et al, Ford Global Tech InPat: Television Engineering/ Gu et al, Microsoft Corp InPat: Thermal Engineering/ Maltezos et al, CALTECH (US) InPat: Tool Design/ Rosen et al, The Boeing Company InPat: Transistors/ Yabuta et al, Canon Kabushiki Kaisha InPat: Turbo Machinery/ Shibata et al, Hitachi Plant Tech InPat: VLSI/ Correale et al, IBM Corp InPat: Wind Energy/ Schubert et al, Nordex Energy GmbH InPat: Wireless Technology/ Penick et al, Rockwell Automation 978-93-82434-43-6 978-93-82434-44-3 978-93-82434-45-0 978-93-82434-46-7 978-93-82434-47-4 978-93-82434-48-1 978-93-82434-49-8 978-93-82434-50-4 978-93-82434-51-1 978-93-82434-52-8 978-93-82434-53-5 978-93-82434-54-2 978-93-82434-55-9 978-93-82434-56-6 978-93-82434-57-3 978-93-82434-58-0 978-93-82434-59-7 978-93-82434-60-3 978-93-82434-61-0 978-93-82434-62-7 978-93-82434-63-4 978-93-82434-64-1 978-93-82434-65-8 978-93-82434-66-5 978-93-82434-67-2 978-93-82434-68-9 978-93-82434-69-6 978-93-82434-70-2 978-93-82434-71-9 978-93-82434-72-6 978-93-82434-73-3 978-93-82434-74-0 978-93-82434-75-7 978-93-82434-76-4 978-93-82434-77-1 978-93-82434-78-8 978-93-82434-79-5 978-93-82434-80-1 978-93-82434-81-8 978-93-82434-82-5 978-93-82434-83-2 978-93-82434-84-9 978-93-82434-85-6 978-93-82434-86-3 978-93-82434-87-0 978-93-82434-88-7 1600 2000 2000 2200 2100 2100 2200 2200 2000 2000 2000 2200 2000 2000 2000 2200 2100 2100 2200 2200 2200 2200 2000 1800 1600 2000 1800 1600 2000 1600 2000 1600 1600 2000 1600 2000 1600 2200 2000 1600 2200 2100 1600 2100 2200 1600 2,50,000/1,60,000/29,000/Total 225 350 350 450 400 400 450 450 350 350 350 450 350 350 350 450 400 400 450 450 450 450 325 300 250 325 300 250 350 225 350 225 250 350 225 350 225 450 350 225 450 400 225 400 450 225
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