Feap Training Manual

Disclaimer
CRANES SOFTWARE, INC. MAKES NO WARRANTY OR REPRESENTATIONS IN CONNECTION WITH NISA/HEAT, NISA/EMAG, NISA/ROTOR, NISA/CIVIL, NISA II, DISPLAY III/IV, NISA-COMPOSITE, ENDURE, NISAOPT, FEAP, NISA/3D-FLUID, DYMES, OR ANY OTHER SOFTWARE PROGRAM OF CRANES SOFTWARE, INC. (HEREINAFTER REFERRED TO AS NISA/DISPLAY SOFTWARE), EXPRESS OR IMPLIED, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. CRANES SOFTWARE, INC. MAKES NO WARRANTY AND ASSUMES NO LIABILITY FOR THE NISA/ DISPLAY SOFTWARE. CRANES SOFTWARE, INC. ASSUMES NO RESPONSIBILITY FOR THE USE OF THE PROGRAMS OR FOR THE ACCURACY OR VALIDITY OF ANY RESULTS OBTAINED FROM THE NISA/DISPLAY SOFTWARE. CRANES SOFTWARE, INC. SHALL NOT BE LIABLE FOR LOSS OF PROFIT, LOSS OF BUSINESS, OR OTHER FINANCIAL LOSS WHICH MAY BE CAUSED DIRECTLY OR INDIRECTLY BY THE NISA/DISPLAY SOFTWARE, WHEN USED FOR ANY PURPOSE OR USE, OR DUE TO ANY DEFECT OR DEFICIENCY THEREIN. Any questions relating to the use or interpretation of the SOFTWARE or their operation should be directed to: Cranes Software, Inc. 1607 E. Big Beaver Road, Suite 250 Troy, MI, 48083, USA Tel: (248) 689-0077 Fax: (248) 689-7479 NOTICE FOR U.S. GOVERNMENT USERS ONLY: RESTRICTED RIGHTS LEGEND. Use, duplication or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227-7013.
NISA, DISPLAY III/IV, ENDURE, NISAOPT, FEAP, NISA/3D-FLUID, NISA/ EMAG, NISA/HEAT, NISA/ROTOR, NISA/CIVIL and DYMES are registered trademarks of Cranes Software, Inc. Copyright 2005-2007 by the Cranes Software, Inc. 1607 E. Big Beaver Road, Suite 250, Troy, Michigan 48083, U.S.A. All rights reserved. No part of this manual may be reproduced, stored in a retrieval system, or transmitted in any way without the prior authorization of Cranes Software, Inc.
1-iii
Table of Contents
Preface - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi Version 15.0 New Features - - - - - - - - - - - - - - - - - - - viii 1. Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - -1.1 1.1 Flow of FEAP Analysis - - - - - - - - - - - - - - - - -1.2 1.2 FEAP Options - - - - - - - - - - - - - - - - - - - - - - -1.3 2. Steady State Heat Transfer in PCB - - - - - - - - - -2.1 2.1 Problem Definition - - - - - - - - - - - - - - - - - - - -2.1 2.2 Creation of PCB Interactively - - - - - - - - - - - -2.2 2.3 FEAP Input File (TRN1.INP) - - - - - - - - - - - -2.12 2.4 Steady State Heat Transfer Analysis - - - - - - -2.13 2.5 Thermal Stress Analysis - - - - - - - - - - - - - - -2.18 3. Transient Heat Transfer in a PCB - - - - - - - - - - -3.1 3.1 Problem Definition - - - - - - - - - - - - - - - - - - -3.1 3.2 Creation of Input (.INP) File - - - - - - - - - - - - -3.5 3.3 FEAP Input File (TRN2.INP) - - - - - - - - - - - -3.6 3.4 Transient Heat Transfer Analysis - - - - - - - - - -3.8 3.5 Thermal Stress Analysis - - - - - - - - - - - - - -3.13 4. Multiple Type Analyses of a PCB - - - - - - - - - - - -4.1 4.1 Problem Definition - - - - - - - - - - - - - - - - - - -4.1 4.2 Creation of PCB Model - - - - - - - - - - - - - - - -4.5 4.3 FEAP Input File - - - - - - - - - - - - - - - - - - - -4.51 4.4 Board Level NISA Analysis - - - - - - - - - - - - -4.55
4.5 Component Level Analysis - - - - - - - - - - - - - 4.98 4.6 Pin Level Analysis - - - - - - - - - - - - - - - - - 4.114 4.7 Fatigue Life Prediction - - - - - - - - - - - - - - 4.133
Preface
You have with you the latest version of NISA - A standard in Finite Element Analysis. NISA is one of the few, commercially available, proven and robust Finite Element Analysis software that has enjoyed a long-standing presence in the arena of engineering analysis and design. Today it is the result of more than three decades of innovation and dedication of highly skilled scientists, technology architects and software engineers. As a result, generations of scientists, engineers and researchers have come to depend on NISA to solve their most complex engineering problems. NISA which has a heritage of more than 30 years, changed hands from EMRC, to Cranes Software, Inc. in July of 2005. Cranes Software, Inc is a wholly owned subsidiary of Cranes Software International Limited - a global software products and solutions provider. With this change comes an induction of fresh talent and resources which is poised to take NISA to a new level in the world of FEA. NISA Version 15.0 is the achievement of a great development team which has worked rigorously for the past year in accordance to the best in breed software development life cycle management practices. As manuals are very important to us, a lot of thought has gone into the design and content of the manuals. These have been totally revamped as per the new features and look of the product. New additions to the various modules have been consolidated and presented in an integrated manner. The NISA Shell is now more appropriately called Application Launcher. The new application launcher makes selecting modules, input/ output files, analysis type and various CAD/FEA translators a simple task. Significant updates and error correction have been made to individual modules of the NISA suite of programs.
vi
vii
Version 15.0 New Features
NISA II: Improved iterative and sparse matrix equation solvers; end release for pipe and elbow element; General spring element (NKTP=38) upgraded to a general spring and damper element; facility to input user element stiffness, mass, and damping matrices; rigid link forces output for linear transient dynamic analysis; ability to post process larger problems involving multiple load cases. ADVANCED DYNAMICS: Multiple Support Excitation, for shock spectrum analysis to handle non-uniform support excitations. This feature also includes seven modal summation rules namely ABS, SRSS, CQC, Grouping Method, Ten percent Method, Double Sum Method, and with & without Missing Mass; Centroidal Stresses, Stress Resultants at Element Centroid and Base Shear computation for Shock Spectrum Analysis. DYSPAN: Spectrum compatible Power Spectral Density generation. ENDURE: Improved functionality of features in Shell; expansion of crack propagation configurations; Automatic identification of EDI path; Automatic mesh generation for plate, pipe, and elbow with different types of cracks; and fatigue initiation theory based on the MANSON approach. DISPLAY III: Pre & post processing support new features of NISA modules. In addition to this, general features are: Viewing the input function such as time amplitude, spectra etc. as a graph; Realistic plot for 3-D General Beam, 3-D Straight pipe, 3-D Elbow elements (NKTP=48); Automatic selection of Master and Slave node for Rigid links; Post processing of Non-linear Beam element (NKTP 39) stresses; Post processing of 3-D beam results such as - filtering of the results and report generation, reporting maximum stresses and ASME ratios at critical points across section; Option to plot the XY points in the graph with-
viii
out the connecting lines; Area under the curve with respect to X-Axis; History plot for nonlinear results for external results; Reading/ Writing of Multiple External results for linear and nonlinear static analyses; Viewing results for complete model using Symmetry for external results; Variation of stress triaxiality along a line of nodes; Crack mouth opening displacement graph; Crack opening area calculation; facility to integrate fluid quantities such as pressure, temperature on surface. DISPLAY IV: Pre & post processing support new features of NISA modules. Key additional features in DISPLAY IV are: Enhancement of Dialog boxes, accelerator keys. XP style file open dialog; enhancement of Entity-Status view in the workspace to facilitate the deletion of a single entity or the entire group using mouse right click or by using Delete key on the keyboard; a wizard that helps navigate analysis data. Up-gradation of translators such as SAT2NEU translator to support ACIS R16 geometry kernel; Solid Works translator S/W 2007; geometric import from IGES 5.3 version. EMAG: 3D-Magnetodynamic analysis (harmonics) and 3D Transient Magnetic analysis capabilities using magnetic vector potential and electric scalar potential (with and without massive conductors). NISA/HEAT3 and 3DFLUID: Heat Flux computation and Printing of Heat Balance Sheet, Sparse Matrix Equation Solver has been implemented; printing of Local Reynolds and Peclet numbers. NISA/CIVIL: Revised code of practice conforming to ACI 318 -2005, BS 8110-1997, BS 5950-1:2000 and LRFD 2002 for concrete and steel designs, Module to design pipes conforming to ASME-NB, NC & ND codes is now part of NISA/CIVIL. More emphasis is given to produce good structural design drawings of RCC slabs, Beams, Columns, Footings, & structural steel drawings, Inclusion of concrete and steel quantities in structural drawings, customized design report generation in ASCII, MS-Word and MS-Excel formats, stress resultants, contours for shell elements, reinforcement contouring for shell elements, combined isolated footings for expansion joint columns, improved realistic plots, standard animation feature for all Stress Resultants and Eigen Modes, animation of Color Contours.
ix
Chapter
1
Introduction
The electronic industry is faced with several challenges in the design and packaging of electronic components and PCBs. Two major problems under consideration are: The techniques required to reduce the heat and temperatures generated by ICs and PCBs. The vibration to which the PCBs are subjected in moving vehicles, airplanes, etc. Finite Element Analysis of PCBs (FEAP) which gives the designer a means to model PCBs and critical ICs without carrying out any expensive testing. FEAP is comprised of FEAP, NISA II, DISPLAY III, ENDURE and NISA/3D-FLUID
1-1
Flow of FEAP Analysis
1.1
Flow of FEAP Analysis

The flow of FEAP analysis is as follows:
1. The problem can be defined through a very user-friendly interactive graphics or alphanumeric preprocessor that will create the FEAP input file. 2. Once the FEAP input file is obtained, it can be used to automatically generate a finite element mesh for the PCB and its critical components which is then presented in NISA format along with boundary conditions. 3. The finite element models generated can be analyzed using appropriate modules.
1-2
Introduction
4. The results obtained from NISA analysis can then be processed to identify the critical components of interest or to evaluate temperature profiles. 5. The mesh within the area of interest along with the critical component can be refined and the corresponding boundary conditions applied automatically. 6. The problem can be re-analyzed for further improvements of results. 7. Detailed solid models of end pins can be generated. Results from the static analysis of these models can be supplied to ENDURE for component fatigue life prediction. 8. If the system consists of Mother Board and Daughter Board arrangement, FEAP can assemble the PCBs in the cabinet and create a Flo-Thermal model of the system.
1.2
FEAP Options
There are nine options available in FEAP at Board-Component -Pin level. They are as follows:
1. Define a new problem using the preprocessor to create a FEAP input file 2. Process a FEAP input file to generate finite element meshes 3. Read a FEAP input file into the FEAP preprocessor to introduce modifications 4. Generate refined meshes around critical components 5. Generate solid models for individual component pins 6. Calculate the fatigue life of a critical component 7. Plot finite element meshes and heat transfer results 8. Create a static file to calculate PCB thermal stresses 9. Modify the FEAP database. Change the unit system
This is the FEAP main menu. For a detailed discussion on each option refer to Chapter 1 in FEAP users manual. System level model creation is carried out through FEAP Shell.
1-3
FEAP Options
1-4
Chapter
2
Steady State Heat Transfer in PCB
2.1
Problem Definition
A PCB of size 100mm x 100mm is made of a single layer material. It has a DIP mounted on its top face. It is required to subject this PCB for Steady state heat transfer analysis. Important data for the problem are listed below. Description Name of the problem Units used PCB dimensions Thickness of the heat sink Thermal conductivity of heat sink Stress free PCB temperature Temperature at bottom edge PCB bottom edge PCB right edge PCB top edge PCB left edge PCB layer Thickness 1.5 Data Trn1 mm, kg, W, C 100 x 100 0.5 0.367 30.0 30.0 Clamped Free Free Free
2-1
Creation of PCB Interactively
Youngs moduli (X,Y) Major Poissons ratio Thermal expansion Components mounted
1659 0.12 0.99E-05 DIP (1No.)
2.2

To start the session, type FSHELL and follow instructions carefully. Before asking for the PCB data, the program asks for a confirmation of the unit system to be used. After confirmation you will be taken through an alphanumeric dialogue session followed by a graphic session to create the PCB.
The dialogue session is written in a file called 'Session file'. For this problem it is TRN1.SES. The interactive session for this training problem is given below with user input in bold letters.
Problem Definition Phase

The following Finite Element Analyses are available:
1. 2. 3. 4.
- Heat Transfer / Thermal Stresses / 3-D Fluid Flow. - Dynamic (Random Vibr.; Transient (shock); Freq. Resp.) - All of the above. - Eigenvalue Analysis only (no post-processing).
Choose an option > 1 The following Heat Transfer Analyses are available:
2-2
1. 2. 3.
- Steady-state heat transfer. - Transient heat transfer. - Both.
Choose an option > 1 Enter a name for this problem (four letters or numbers) > trn1 Enter a title for this problem (up to 80 char.) : Steady State Heat Transfer in a PCB
Printed Circuit Board (PCB) Input Phase

Enter maximum PCB dimensions along X and Y axes > 100.0 100.0
PCB Properties Input Phase

<< Thermal Properties : >> All or a part of the actual PCB thickness may be modeled as the heat sink layer. For composite layer, the conductivity and thickness values will be used to compute an equivalent value. Enter the number of heat sink layers (<CR> if single layer) > 1 Enter Thickness and Thermal Conductivity (Power/length-temp) > 0.5 0.367 Enter the Initial (stress-free) Temperature of the PCB > 30.0 << Structural Properties : >> Enter the No. of composite layers (0 for isotropic PCB) > 0 Enter the thickness, Youngs modulus and Poissons ratio > 1.5 1659.0 0.12 Enter the coefficient of thermal expansion > 9.90E-06
Thermal Boundary Conditions Input Phase

The following Thermal Boundary Conditions can be applied to the PCB:
1.
- Constant Temperature along edges, i.e. conductive B.C. (Required for 3-D Fluid Flow analysis).
2-3
2.
- Convection through PCB surfaces -- requires film coef. (Only for Heat Transfer analysis; Automatically set for 3-D Fluid Flow analysis). - Above options combined.
3.
Enter 1, 2 or 3 > 1 Is the bottom edge (Y = 0.00) a Conduction B.C.?(y/n) y Enter the Constant Temperature for this edge > 30.0 Is the right edge (X =100.00) a Conduction B.C.?(y/n) n Is the top edge (Y =100.00) a Conduction B.C.?(y/n) n Is the left edge (X = 0.00) a Conduction B.C.?(y/n) n Do you wish to create a 3-D Fluid Flow mesh ? (y/[n]) n
Mechanical Boundary Conditions Input Phase

The following Mechanical Boundary Conditions can be applied to the PCB:
1. 2. 3.
- Edge boundary conditions. - Point attachments. - Above options combined.
Enter 1, 2 or 3 > 1 The following edge conditions can be applied to the PCB:
1. 2. 3. 4.
- All four edges clamped (Free Ux, Uy). - All four edges simply supported (Free Ux, Uy). - User defined. - No edge boundary conditions.
Enter 1, 2, 3 or 4 > 3 For the bottom edge (Y = 0.00) :
2-4
Ux
Uy Free Free Free 0 0 0 0
Uz 0 0 Free 0 0 0 0
Rotx 0 Free Free 0 Free 0 Free
Roty 0 0 Free 0 0 0 0
1. - Clamped: 2. - Simply supported: 3. - Free: 4. - Clamped: 5. - Simply supported: 6. - Clamped: 7. - Simply supported:
Free Free Free Free Free 0 0
Enter 1 thru 7 > 1 For the right edge (X =100.00) : Ux Uy Free Free Free Free Free 0 0 Uz 0 0 Free 0 0 0 0 Rotx 0 0 Free 0 0 0 0 Roty 0 Free Free 0 Free 0 Free
Enter 1 thru 7 > 3 For the top edge (Y =100.00) :
Free Free Free 0 0 0 0
Ux
Uy Free Free Free
Uz 0 0 Free
Rotx 0 Free Free
Roty 0 0 Free
1. - Clamped: 2. - Simply supported: 3. - Free:
Free Free Free
2-5
4. - Clamped: 5. - Simply supported: 6. - Clamped: 7. - Simply supported:

Enter 1 thru 7 > 3 For the left edge (X = 0.00) :
Free Free 0 0
0 0 0 0
0 0 0 0
0 Free 0 Free
0 0 0 0
Ux
Uy Free Free Free Free Free 0 0
Uz 0 0 Free 0 0 0 0
Rotx 0 0 Free 0 0 0 0
Roty 0 Free Free 0 Free 0 Free
Enter 1 thru 7 > 3
Free Free Free 0 0 0 0
Characteristics of the Printed Circuit Board

Title of the problem : Steady State Heat Transfer in a PCB Name of the problem : trn1 PCB upper right corner : (100.00,100.00) Heat Sink Thick. and Cond.: .50000, .3670 , .3670 Initial PCB Temperature : 30.00 Thermal Boundary Conditions : Cond at the bottom edge. Temp : 30.00
2-6
Mechanic Boundary Conditions : PCB edges, bot-right-top-left : Clamped- Free - Free - Free PCB Thickness, Ex, Nu, Alpx : 1.500 .166E+04 .120 .990E-05 Individual values can be modified later (PCB MODIFICATION menu) Restart PCB definition? (above data will be lost!) (y/[n]) n Do you wish to read a CAD neutral file? (y/[n]) n ELECTRONIC COMPONENTS
(1) (2) (3) (4) (5) (6) (7) (8) (9) (0)
DIP-SIP-ZIP HYBRID PACKAGE PIN GRID ARRAY FLAT PACK CHIP CARRIER RESISTOR CAPACITOR MISCELLANEOUS COMP. HEAT SOURCE/PT.MASS EXIT THIS MENU
Choose one of the options (default=0) > 1 DIP - SIP - ZIP
(1)
(2) (3) (4)
DIP
SIP ZIP COMPONENT MENU
Choose one of the options (default=4) > 1
2-7
DIPs (1) (2) (3) (4) (5) (6) (7) LIST 7 DEFAULTS SKIP INITIAL ENTRIES SELECT BY NAME SEARCH BY PATTERN USER DEFINED DIP SIP ZIP MENU COMPONENT MENU
Choose one of the options (default=7) > 1 DIPs (1) (2) (3) (4) (5) (6) 18-PIN DIP S-B S 20-PIN DIP BENT B 24-PIN DIP S-B S 36-PIN VERT. DIP V 40-PIN DIP BENT B PREVIOUS MENU
Choose one of the options (default=6) > 1 18-PIN DIP S-B A = 3.05 B = 4.06 C = 7.62 D = 1.27 E = .254 H = 2.54 Do you wish to use these values ([y]/n) y 18-PIN DIP S-B 2-8
BODY PROPERTIES EX = .380E+05 NU = .3000 KXX = .335E-01 ALPX = .560E-05 LEAD PROPERTIES EX = .137E+05 NU = .3000 KXX = .213E-01 ALPX = .139E-04 Do you wish to use these values ([y]/n) y The INLN-PKG can be aligned in : (1) (2) X-axis (default) Y-axis
Choose one of the options > 1 The INLN-PKG can be mounted on : (1) (2) PCB top surface (default) PCB bottom surface
Choose one of the options > 1 Enter the coordinates of the lower left lead > 36.7 50.4 Lower left lead at: [ 36.70, 50.40]. Accept these coordinates? ([y]/n/q) y INLN-PKG PROPERTIES NO RADIATION BC NO CONVECTION BC HGR = 1.0000 Tjc = .55556 NO THERMAL PAD Do you wish to modify these values (y/[n]/q) n Enter a Reference Designator for this component 2-9
or 0 for the next available value > 1 ELECTRONIC COMPONENTS
(1) (2) (3) (4) (5) (6) (7) (8) (9) (0)
Choose one of the options (default=0) > 0 PRE-PROC. MAIN MENU
(1) (2) (3) (4) (5) (6) (7)
TOP SURFACE LAYOUT BOT. SURFACE LAYOUT CRITICAL COMPONENTS PCB STIFFENERS/RIBS PCB MODIFICATION SAVE FEAP FILE EXIT PRE-PROCESSOR
Choose one of the options (default=7) > 6 PRE-PROC. MAIN MENU
(1)
TOP SURFACE LAYOUT

2-10
(2) (3) (4) (5) (6) (7)
BOT. SURFACE LAYOUT CRITICAL COMPONENTS PCB STIFFENERS/RIBS PCB MODIFICATION SAVE FEAP FILE EXIT PRE-PROCESSOR
Choose one of the options (default=7) > 7 At the end of this session FEAP input file named TRN1.INP is also saved.
2-11
FEAP Input File (TRN1.INP)
2.3

FEAP input file is an ASCII file where the problem data is stored in a form directly read by FEAP option 2 and 3. The input file can be created by the following ways. i. ii. iii. Directly using a text editor Using FEAP option (1) reading a session file Using FEAP option (1) saved at the end of interactive session file creation
We have already created TRN1.INP by method (iii). The input file is given below. For detailed explanation of various cards used in .INP file refer to FEAP users manual. ** E M R C / F E A P ** ANAL = SHEAT FILE = trn1 EXEC = CGO ECHO = ON UNIT = MM,KG,WAT,DC *TITLE Steady State Heat Transfer in a PCB *PCB 0, 1, 100.000, 100.000, .00000, 30.00, 0 .5000 , .3670 , .0000 , .0000 , .3670 1.500 , .12, 1659. , 0.0000, .9900E-05 *BOUND 1 1 30.00 3, 1, 1, 2, 3, 3, 3, 4, 3 *DIP 18, 36.700, 50.400, 1, 1, 1, 1, 1, .0000 3.0480 4.0640 7.6200 1.2700 .2540 .0000 .0000 2.5400 .3352E-01, .3797E+05, .300, 1.0000, .5598E-05,,,, .5556 .2126E-01, .1371E+05, .300, .1386E-04, .0000 , .0000 *END
2-12
2.4
Steady State Heat Transfer Analysis

TRN1.INP has the PCB data and analysis data. Now this data has to be converted to a form that the thermal analyzer understands. To enable this TRN1.INP file is translated into a FE data file and written in the standard NISA format. Then the thermal analyzer is invoked to analyze the FE model and the results are post processed. Input file Output file 39 file 26 file TRN1.SHT TRN1.SHO TRN1H39.DAT TRN1H26.DAT
Two types of post processing are possible. One is to see the temperature contour of the PCB in DISPLAY III. Two is to see the case and junction temperature results in FEAP post processor.
2-13
Post Processing Using DISPLAY III

"CKECK TEMPERATURE OF THE PCB (SS)" option loads the result file into DISPLAY III and shows temperature contours of PCB.
Mesh of PCB (TRN1) with Edge temperature and Component Heat Generation
2-14
Temperature Contours of PCB (TRN1)
Post Processing using FEAP Post Processor

If you are interested in the case and junction temperatures do the following.
2-15
A DIP with reference designator U1 is added for case temperature post processor. Case temperature contour is plotted on the screen. With the same procedure if Junction Temperature is selected instead of Case Temperature Junction Temperature Contour is obtained. Case and junction temperatures are also available ASCII file TRNG.TEM
Case Temperature for the DIP
2-16
Junction Temperature of the DIP
TRN1.TEM File with Case and Junction

F.E.A.P. - Finite Element Analysis of Printed Circuit Boards(PCBs Summary of Case and Junction Temperatures Predicted by the Steady State Heat Transfer Analysis of PCB trn1. Ref.Des U1 Case Temperature 58.383 Junction Temper. 58.939 PCB face Top
2-17
Thermal Stress Analysis
2.5

Thermal stress analysis can be carried out with the temperature loads calculated by steady state thermal analysis. Following steps may be followed.
2-18
As you must have noticed, the input file for thermal stress analysis is automatically created and analyzed. At the end of these operations we are inside DISPLAY III with the distorted PCB on the screen. The files corresponding to this analysis are Input file Output file 27 file 26 file TRN1.TST TRN1.TSO TRN1T27.DAT TRN1T26.DAT
2-19
2-20
Chapter
3
Transient Heat Transfer in a PCB
3.1
Problem Definition
In the first session we created a PCB and conducted a thermal stress analysis using the thermal loading calculated by steady state heat transfer analysis. The PCB is of size 100mm x 100mm. It has a DIP mounted on its top face. In this session we want to do the following modification to the problem. (i) (ii) Transient Heat Transfer Analysis Stress analysis using the Transient Thermal Loading
(iii) Finer Mesh (iv) Edge temperature and Heat generation are time varying Description Name of the problem Units used PCB dimensions Thickness of the heat sink Thermal conductivity of heat sink Density of heat sink Specific heat of heat sink 3-1 Data Trn2 mm, kg, W, C 100 x 100 0.5 0.367 8900.0E-09 390.0
Problem Definition
Stress free PCB temperature Temperature at bottom edge PCB bottom edge PCB right edge PCB top edge PCB left edge PCB layer Thickness Youngs moduli (X,Y) Major Poissons ratio Thermal expansion Component mounted
30.0 30.0 Clamped Free Free Free 1.5 1659 0.12 0.99E-05 DIP (1 No.)
The edge temperature of the PCB and the component heat generation are functions of temperature. The function is given in the form of a curve (TIMEAMP curves).
3-2
Heat Generation Curve
3-3
Problem Definition
Edge Temperature Curve
3-4
3.2
Creation of Input (.INP) File
3-5
While going through the above session we have created an input file named TRN2.INP and saved it.
3.3

** E M R C / F E A P ** ANAL = FILE = trn2 THEAT
3-6
EXEC = ECHO = MESH UNIT = *TITLE
CGO ON
= GRD2 MM,KG,WAT,DC
FEAP Training Problem No.2 - Transient Heat Transfer in a PCB *PCB 0, 1, 100.000, 100.000, .00000, 30.00, 0 . 5000 , .3670 , .8900E-05, 380.0 , .3670 1.500 , .12, 1659. , 0.0000, .9900E-05 *THTR 600.000 , 6.00000 , 4, 3 . 00000 , 50.000 , 50.000 , 50.000 , 100.00 , 50.000 , *CURVES 1, 5,Heat Generation Curve . 00000 , .00000 , 20.000 , 1.0000 , 300.00 , 1.0000 , 320.00 , .00000 . 00000 , 1.0000 *BOUND 1 1 30.00 3-7 , 600.00 , .00000 , , 60.000 , 1.0170 , 300.00 , 1.0330 , 2, 5,Edge Temperature Curve 360.00 , 1.0170 , 600.00 , 1.0000 ,
Transient Heat Transfer Analysis
10 0 1 2 3, 1, 1, 2, 3, 3, 3, 4, 3 *DIP 18, 36.700, 50.400, 1, 1, 1, 1, 1, .0000 3.0480 4.0640 7.6200 1.2700 .2540 .0000 .0000 2.5400 . .3352E-01, .3797E+05, .300, 1.0000, .5598E-05,,,, .5556 . .2126E-01, .1371E+05, .300, .1386E-04, .0000 , .0000 . .35980E-05, 930.20 , .88580E-05, 453.20 , 1, 0 *END Compare this file with the TRN1.INP to see the modification incorporated. For detailed explanation of the cards see FEAP User Manual.
3.4
3-8
This session takes us inside DISPLAY III where the results can be studied.
Snap shot 1
Snap shot 12
Snap shot 25
Temperature history
Post Processing using FEAP Post Processor

If you are interested in the case and junction temperature histories do the following.
3-9
A DIP with reference designator U1 is added for case temperature post processing. Case temperature history is plotted on the screen. With the same procedure if Junction Temperature is selected instead of Case Temperature Junction Temperature History is obtained. Case and junction temperatures are also available in an ASCII file TRN2.TEM
Case Temperature
Junction Temperature
TRN2.TEM FILE with Case and Junction

F.E.A.P. - Finite Element Analysis of Printed Circuit Boards(PCBs Summary of Case and Junction Temperatures Predicted by the Transient Heat Transfer Analysis of PCB "trn2". 3-10
3-11
3-12
3.5

Thermal stress analysis can be carried out with the temperature loads calculated by transient thermal analysis. Following steps may be followed.
3-13
3-14
Deformation - Snap Shot 1
Deformation - Snap Shot 12
DeFormation - Snap Shot 25
Von Mises Stress - Snap Shot 12
The thermal loading at each snap shot of the thermal transients is taken as a LOADCASE and analyzed.
3-15
3-16
Chapter
4
Multiple Type Analyses of a PCB
Chapter-3 and 4 demonstrated various stages involved in creating a PCB model and analyzing it. But for simplicity we took a PCB with just one component and carried out steady state heat transfer analysis followed by thermal stress analysis. In this chapter we take a three-layer-PCB with three components mounted on it. The aim of this chapter is to demonstrate the multiple analysis capabilities of FEAP. Naturally the problem size is bigger and needs considerable effort to create the INP file through an interactive session. Hence it is suggested that the SES file be used instead of interactive session, when this problem is attempted for the first time. When the usage of FEAP becomes clear, the user can try creating the session file and the input file through an interactive session.
4.1
Problem Definition
A PCB of size 5.0x4 is made of a 3-layer composite material. It has three DIPs mounted on its top face. It is required to subject this PCB for the following analyses at board level, component level and pin level.
Board Level
Steady state heat transfer Transient heat transfer Thermal stress with Steady State Temperature Thermal stress with Transient Temperature Fluid dynamic
4-1
Problem Definition
Eigen value Random vibration Transient dynamic (Shock testing) Frequency response
Component Level Stress (U1)

Static thermal stress with Steady State Temperature Static thermal stress with Transient Temperature Static stress with Random vibration Static stress with Frequency response Static stress with Transient dynamic (Shock testing)
Pin Level Stress (End Pins of U1)

Static thermal stresses with Steady State Temperatures Static thermal stresses with Transient Temperatures Static stress with Frequency Response Static stress with Random Vibration Static stress with Transient Dynamics
Life Estimation (End Pins of U1)

Fatigue Life with Steady State Temperatures Fatigue Life with Transient Temperatures Fatigue Life with Frequency Response Fatigue Life with Random Vibration Life Based on Stress with Transient Dynamics
Important Data for the Problem

Description Data
4-2
Name of the problem Units used PCB dimensions Thickness of the heat sink Thermal conductivity of heat sink Density of heat sink Specific heat of heat sink Stress free PCB temperature Temperature at right and left edges Weight of PCB No. of PCB natural frequencies Modes considered in advanced dynamics PCB bottom edge PCB right edge
Trn3 Inch, lb, W, F 5.0 x 4.0 0.01 1.950 0.0987 253.2 67.0 67.0 0.45 3 3 Clamped Simply supported UX : free UY : free
PCB right edge from Y=1.0 to Y=3.0
Simply supported UX = 0 UY : free ROTK = 0.5
PCB top edge
Free
4-3
Problem Definition
PCB left edge
Simply supported UX : free UY : free
Constant temperature points (CTP) at Temperature at CTP Thermal resistance at CTP Mechanical springs in top edge at Spring constant perpendicular to PCB Rotational spring constant along edge Thermocouple locations (3) Response points for dynamics (2) PCB top layer (1) and bottom layer (3) Thickness Youngs moduli (X,Y) Major Poissons ratio Shear moduli (XY,YZ,ZX) Thermal expansion Rotation of fibres PCB middle layer (2) Thickness Youngs moduli (X,Y) Major Poissons ratio 4-4
(1.0,2.0); (4.0,2.0) 60.0 0.5 (1.5,4.0); (3.5,4.0) 1.5 0.7 (1.0,1.0); (4.0,1.0); (4.0,3.0) (2.5,1.5); (2.5,3.5) 0.01 2 500 000 0.12 300 000 0.0000055 0.0
0.03 10 000 000 0.3
Shear moduli (XY,YZ,ZX) Thermal expansion Rotation of fibres Cooling fluid Flow is from Thermal conductivity Dynamic viscosity Velocity Specific heat Density Temperature Components mounted
1 000 000 0.0000055 0.0 Air Left edge to right edge 3.617E-04 1.02E-06 40.0 252.0 4.333E-05 55.0 DIPs on top surface (3 No.)
4.2
Creation of PCB Model

The steps involved are essentially same as in Steady State Heat Transfer in PCB . Once all required data are fed, FEAP writes out a session file (.SES) and an input file (.INP). The interactive session for this training problem is given below.
Problem Definition Phase

The following Finite Element Analyses are available:
1. - Heat Transfer / Thermal Stresses / 3-D Fluid Flow. 2. - Dynamic (Random Vibr.; Transient (shock); Freq. Resp.) 3. - All of the above. 4. - Eigenvalue Analysis only (no post-processing).
4-5
Choose an option >
The following Heat Transfer Analyses are available:
1. - Steady-state heat transfer. 2. - Transient heat transfer. 3. - Both.

Choose an option > 3
Enter a name for this problem (four letters or numbers) > trn3 Enter a title for this problem (up to 80 char.): 3-LAYER COMPOSITE PCB WITH 3 DIPs.
Printed Circuit Board (PCB) Input Phase

Enter Maximum PCB Dimensions Along X And Y Axes > 5.0 4.0
PCB Properties Input Phase << Thermal Properties: >>

All or a part of the actual PCB thickness may be modeled as the heat sink layer. For composite layer, the conductivity and thickness values will be used to compute an equivalent value. Enter the number of heat sink layers (<CR> if single layer) > 1 Enter Thickness and Thermal Conductivity (Power/length-temp)> 1.0E-02 1.95 Enter the Initial (stress-free) Temperature of the PCB > 67.0 << Transient Heat Transfer Properties: >> Enter the Density (mass/vol.) and Specific Heat (power-time/mass-temp) of the Heat Sink > 9.87E-02 253.2 Enter the total transient analysis time and the time step size > 7200.0 100.0 4-6
Enter the number of time steps per snap shot > 2 No. of thermocouples (response points) on the PCB surface > 3 Enter 3 sets of X-Y PCB coordinates: 1.0 1.0 4.0 1.0 4.0 3.0 << Dynamic Properties: >> Enter the weight of the PCB excluding resistors, capacitors transformers and point masses > 4.5E-01 Enter the number of PCB natural frequencies to be calculated > 3 << Structural Properties: >> Enter the No. of composite layers (0 for isotropic PCB) > There are 3 composite layers to be defined. They are layers No.: 1 2 3 Layers are numbered from top to bottom 3
How many layers with the same properties ? > 2 Enter the layer numbers > 1 3 Enter thickness, major Poissons ratio and Youngs moduli E1 & E2 -parallel and normal to the fibers-> 1.5E-02 1.2E-01 2500000.0 2500000.0 Enter rotation and three shear moduli G12; G23 and G31 > 0.0 300000.00 300000.0 300000.0 Enter two coefficients of thermal expansion ALP1 & ALP2 > 5.5E-06 5.5E-06 There are 1 composite layers to be defined. They are layers No.: 2 Layers are numbered from top to bottom How many layers with the same properties ? > 1 Enter the layer numbers > 2 Enter thickness, major Poissons ratio and Youngs moduli E1 & E2 -parallel and normal to the fibers-> 3.000000E-02 3.000000E-01 1.000000E+07 1.000000E+07 Enter rotation and three shear moduli G12; G23 and G31 > 0.000000E+00 1000000.000000 1000000.000000 1000000.000000 Enter two coefficients of thermal expansion ALP1 and ALP2 > 5.500000E-06 4-7
5.500000E-06 Which kind of Dynamic Analysis would you like to perform ?
1. 2. 3. 4. 5. 6. 7.
- Random Vibration. - Transient Dynamic (shock testing). - Random and Transient. - Frequency Response. - Random and Frequency. - Transient and Frequency. - All of the above.
7
Enter 1, 2, 3, 4, 5, 6 or 7 >
Random Vibration Input Phase

Enter the No. of points required to define the forcing function (curr.= 0) > 6 Enter 6 frequency-PSD pairs of values : Read 6 entries. Need 6 more > 10.000000 4.000000E-03 50.000000 4.000000E-03 100.000000 2.500000E-02 400.000000 2.500000E-02 600.000000 1.000000E-02 2000.000000 1.000000E-02
Transient Dynamic Input Phase

Enter the duration of the analysis (starting at 0.0sec) and the time increment for integration > 5.000000E-02 1.000000E-03 Enter the No. of points required to define the time function (curr.= 0) > 2 Enter 2 time-accel(Gs) pairs of values : 0.000000E+00 25.000000 4.000000E-03 25.000000
Frequency Response Input Phase

Enter the No. of points required to define the amplitude spectrum (curr.= 0) > 4 4-8
Enter 4 frequency-amplitude pairs of values : Read 6 entries. Need 2 more > 15.000000 4.000000E-02 100.000000 6.000000E-02 500.000000 6.000000E-02 2000.000000 3.000000E-02 The Amplitude spectrum is in terms of displacements Change it to accelerations? (y/[n]) N
Advanced Dynamics (General) Input Phase

Enter the No. of modes to be considered > 3 No. of accelerometers (response points) on the PCB surface > Enter 2 sets of X-Y PCB coordinates : Enter 2 sets 2.500000 1.500000 2.500000 3.500000 2
Thermal Boundary Conditions Input Phase

The following Thermal Boundary Conditions can be applied to the PCB :
1. 2.
- Constant Temperature along edges, i.e. conductive B.C. (Required for 3-D Fluid Flow analysis). - Convection through PCB surfaces -- requires film coef. (Only for Heat Transfer analysis; Automatically set for 3-D Fluid Flow analysis). - Above options combined.
1
3.
Enter 1, 2 or 3 >
Is the bottom edge (Y = 0.00) a Conduction B.C.?(y/n) N Is the right edge (X = 5.00) a Conduction B.C.?(y/n) Y Enter the Constant Temperature for this edge > 71.000000 Is the top edge (Y = 4.00) a Conduction B.C.?(y/n) N Is the left edge (X = 0.00) a Conduction B.C.?(y/n) Y
4-9
Enter the Constant Temperature for this edge > 67.000000 Do you wish to create a 3-D Fluid Flow mesh ? (y/[n]) Y
3-D Fluid Flow Input Phase

The fluid mesh can be Coarse (recommended for film coefficient calculation) or Standard. Do you want it Coarse ? ([y]/n) Y Enter the height of the fluid channel, measured from the PCB surface (a negative value generates a model for the bottom face of the PCB) > 5.000000E-01 A zero inlet velocity denotes Free Convection. Enter the velocity (length/sec) and temperature of the fluid at the inlet > 40.000000 55.000000 Enter the Thermal Conductivity (Heat gen. rate/length-temper.) and Mass Density (mass/length-cube) of the fluid > 3.617000E-04 4.333000E-05 Enter the Viscosity (mass/length-sec) and Specific Heat (Heat gen. rate-sec/mass-temper.) of the fluid > 1.020000E-06 252.000000 Default fluid Inlet: left edge - Outlet: right edge. Do you wish to change these defaults? (y/[n]) N
Mechanical Boundary Conditions Input Phase

The following Mechanical Boundary Conditions can be applied to the PCB :
1. 2. 3.
- Edge boundary conditions. - Point attachments. - Above options combined.
Enter 1, 2 or 3 > 1 The following edge conditions can be applied to the PCB :
1.
- All four edges clamped (Free Ux,Uy).
4-10
2. 3. 4.
- All four edges simply supported (Free Ux,Uy). - User defined. - No edge boundary conditions.
Enter 1, 2, 3 or 4 > 3 For the bottom edge (Y = 0.00) : Ux 1 - Clamped: 2 - Simply supported: 3 - Free: 4 - Clamped: 5 - Simply supported: 6 - Clamped: 7 - Simply supported: Enter 1 thru 7 > 1 For the right edge (X = 5.00) : Ux 1 - Clamped: 2 - Simply supported: 3 - Free: 4 - Clamped: 5 - Simply supported: 6 - Clamped: 7 - Simply supported: Free Free Free 0 0 0 0 Uy Free Free Free Free Free 0 0 Uz 0 0 Free 0 0 0 0 Rotx 0 0 Free 0 0 0 0 Roty 0 Free Free 0 Free 0 Free Free Free Free Free Free 0 0 Uy Free Free Free 0 0 0 0 Uz 0 0 Free 0 0 0 0 Rotx 0 Free Free 0 Free 0 Free Roty 0 0 Free 0 0 0 0
4-11
Enter 1 thru 7 > 2 For the top edge (Y = 4.00) : Ux 1 - Clamped: 2 - Simply supported: 3 - Free: 4 - Clamped: 5 - Simply supported: 6 - Clamped: 7 - Simply supported: Enter 1 thru 7 > 3 For the left edge (X = 0.00) : Ux 1 - Clamped: 2 - Simply supported: 3 - Free: 4 - Clamped: 5 - Simply supported: 6 - Clamped: 7 - Simply supported: Enter 1 thru 7 > 2 Free Free Free 0 0 0 0 Uy Free Free Free Free Free 0 0 Uz 0 0 Free 0 0 0 0 Rotx 0 0 Free 0 0 0 0 Roty 0 Free Free 0 Free 0 Free Free Free Free Free Free 0 0 Uy Free Free Free 0 0 0 0 Uz 0 0 Free 0 0 0 0 Rotx 0 Free Free 0 Free 0 Free Roty 0 0 Free 0 0 0 0
4-12
Characteristics of the Printed Circuit Board

Title of the problem : VER. PROBLEM 1: 5"x4" 3-LAYER COMPOSITE PCB WITH 3 DIPs. Name of the problem : trn3 PCB upper right corner : ( 5.00, 4.00) Heat Sink Thick. and Cond.: .01000, 1.950 , 1.950 Initial PCB Temperature : 67.00
Heat Sink Dens and Spec Heat : .9870E-01, 253.2 Thermal Boundary Conditions : Cond at the right edge. Temp : 71.00
Cond at the left edge. Temp : 67.00 3-D Fluid Flow Characteristics : Channel Height, Inlet Velocity and Temp : .500 40.00 55.00 Thermal conduct. and density of fluid : .3617E-03 .4333E-04 Viscosity and Specific Heat of fluid : .1020E-05 252.0 Weight of the PCB : .45000 Mechanic Boundary Conditions : PCB edges, bot-right-top-left : Clamped- S.S. - Free - S.S. L T E1 E2 NU G12 G23 G31 ALP1 ALP2 ROT
1 .01 .25E+07 .25E+07 .12 .30E+06 .30E+06 .30E+06 .55E-05 .55E-05 .0 2 .03 .10E+08 .10E+08 .30 .10E+07 .10E+07 .10E+07 .55E-05 .55E05 .0 3 .01 .25E+07 .25E+07 .12 .30E+06 .30E+06 .30E+06 .55E-05 .55E05 .0 Number of PCB Natural Frequencies : 3
4-13
Modes considered in Adv Dyn : 3 Forcing functions and accelerometers : Freq.: 10.0 50.0 100.0 400.0 600.0 2000.0 PSD : .0040 .0040 .0250 .0250 .0100 .0100 Time : .00 .00400 G : 25.00 25.00 Freq.: 15.0 100.0 500.0 2000.0
Ampl.: .0400 .0600 .0600 .0300 X: 2.50 2.50
Y : 1.50 3.50 Individual values can be modified later (PCB MODIFICATION menu) Restart PCB definition? (above data will be lost!) (y/[n]) N Do you wish to read a CAD neutral file? (y/[n]) N ELECTRONIC COMPONENTS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
4-14
Choose one of the options (default=0) > DIP- SIP - ZIP
1. 2. 3. 4.
DIP SIP ZIP COMPONENT MENU

1
Choose one of the options (default=4) > DIPs
1. 2. 3. 4. 5. 6. 7.
LIST 5 DEFAULTS SKIP INITIAL ENTRIES SELECT BY NAME SEARCH BY PATTERN USER DEFINED DIP SIP ZIP MENU COMPONENT MENU
1
1. 2. 3. 4. 5. 6.
18-PIN DIP S-B S 20-PIN DIP BENT B 24-PIN DIP S-B S 36-PIN VERT. DIP V 40-PIN DIP BENT B PREVIOUS MENU
1
Choose one of the options (default=6) > 4-15
18-PIN DIP S-B A = .120 B = .160 C = .300 D = .500E-01 E = .100E-01 H = .100 Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES EX = .540E+08 NU = .3000 KXX = .473 ALPX = .311E-05 LEAD PROPERTIES EX = .195E+08 NU = .3000 KXX = .300 ALPX = .770E-05 Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES
4-16
DENS = .130 CP = 234. LEAD PROPERTIES DENS = .320 CP = 253. Do you wish to use these values ([y]/n) Y The INLN-PKG can be aligned in :
1. 2.
X-axis (default) Y-axis
Choose one of the options > 1 The INLN-PKG can be mounted on :
1. 2.
PCB top surface (default) PCB bottom surface

2.000000 1.000000
Choose one of the options > 1 Enter the coordinates of the lower left lead > Lower left lead at: [ 2.00, 1.00]. Accept these coordinates? ([y]/n/q) Y INLN-PKG PROPERTIES NO RADIATION BC NO CONVECTION BC HGR = 1.0 Tjc = 1.0 NO THERMAL PAD WEIGHT= UNSPECIFIED 4-17
Do you wish to modify these values (y/[n]/q) Y Radiation can take place :
1. Through the bottom face 2. Through the top face 3. Through both faces 0. No Radiation BC
Choose one of the options (def.=0) > 0
-Only for Heat Transfer, not for Fluid FlowConvection can take place :
1. Through the bottom face 2. Through the top face 3. Through both faces 0. No Convection BC
Choose one of the options (def.=0) > 2
Enter the Ambient Temperature and Film coefficient: T= .0 h=.00 > 71.000000 3.200000E-03 Enter a pointer to *CURVES for time-dependent temperature: IDCONV= 0 (0 for none) > 3 Enter the heat generated by the INLN-PKG HGR= 1.0 (0 for none) > 1.000000 Enter a pointer to *CURVES for time-dependent HGR: IDCRV= 0 (0 for none) > 1 Enter Theta_jc, thermal resistance junction-to-case: Tjc = 1.0 (0 for none) > 1.000000 Enter the conductivity and thickness of the thermal pad: K= .00 T= .0 (0 for none) > 2.000000E-02 1.000000E-01 Enter the Weight of this INLN-PKG [ .00 ] > 1.000000E-01 4-18
INLN-PKG PROPERTIES NO RADIATION BC TOP FACE CONVECTION T= 71.0 h= .32E-02 IDCRV= 1 IDCONV= 3 HGR = 1.0 Tjc = 1.0 THERMAL PAD PROPS: K= .20E-01 T= .1000 WEIGHT= .10000 Do you wish to modify these values (y/[n]/q) N Enter a Reference Designator for this component or 0 for the next available value > 0 Reference Designator assigned to this component: U1 Access previously referenced curve: 1 3 ? (y/[n]) Y
Cannot find curve 1. Define it ? (y/[n]) Y Enter the curve title (upto 72 characters) or QUIT: > HEAT GENERATION CURVE (1) Edit curve using coordinates? (y/[n]) N Enter the No. of points in this curve (curr.= 0) > 4 Enter a pair of values > 0.000000E+00 5.000000E-01 Enter a pair of values > 2000.000000 8.000000E-01 Enter a pair of values > 4000.000000 1.000000 Enter a pair of values > 10000.000000 1.000000 4 points on curve ID: 1 successfully defined/updated. 4-19
Cannot find curve 3. Define it ? (y/[n]) Y Enter the curve title (upto 72 characters) or QUIT: > CONDUCTION-CONVECTION CURVE Edit curve using coordinates? (y/[n]) N Enter the No. of points in this curve (curr.= 0) > 3 Enter a pair of values > 0.000000E+00 9.500000E-01 Enter a pair of values > 4000.000000 1.000000 Enter a pair of values > 10000.000000 1.000000 3 points on curve ID: 3 successfully defined/updated. ELECTRONIC COMPONENTS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
1
1. 2. 3.
DIP SIP ZIP

4-20
4.
COMPONENT MENU
1
1. 2. 3. 4. 5. 6. 7.
1
1. 2. 3. 4. 5. 6.
1
Choose one of the options (default=6) > 18-PIN DIP S-B A = .120 B = .160 C = .300
4-21
D = .500E-01 E = .100E-01 H = .100 Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES EX = .540E+08 NU = .3000 KXX = .473 ALPX = .311E-05 LEAD PROPERTIES EX = .195E+08 NU = .3000 KXX = .300 ALPX = .770E-05 Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES DENS = .130 CP = 234. LEAD PROPERTIES DENS = .320
4-22
CP = 253. Do you wish to use these values ([y]/n) Y The INLN-PKG can be aligned in :
1. 2.
X-axis (default) Y-axis

1
Choose one of the options >
The INLN-PKG can be mounted on :
1. 2.

2.000000 2.000000
Choose one of the options > 1 Enter the coordinates of the lower left lead > Lower left lead at: [ 2.00, 2.00]. Accept these coordinates? ([y]/n/q) Y INLN-PKG PROPERTIES NO RADIATION BC NO CONVECTION BCHGR = 1.0 Tjc = 1.0 NO THERMAL PAD WEIGHT= UNSPECIFIED Do you wish to modify these values (y/[n]/q) Y Radiation can take place :
1.
Through the bottom face

4-23
2. 3. 4.
Through the top face Through both faces No Radiation BC
Choose one of the options (def.=0) > 0 -Only for Heat Transfer, not for Fluid FlowConvection can take place :
1. 2. 3. 4.
Through the bottom face Through the top face Through both faces No Convection BC
2
Choose one of the options (def.=0) >
Enter the Ambient Temperature and Film coefficient: T= .0 h=.00 > 71.000000 3.200000E-03 Enter a pointer to *CURVES for time-dependent temperature: IDCONV= 0 (0 for none) > 3 Enter the heat generated by the INLN-PKG HGR= 1.0 (0 for none) > 1.000000 Enter a pointer to *CURVES for time-dependent HGR: IDCRV= 0 (0 for none) > 2 Enter Theta_jc, thermal resistance junction-to-case: Tjc = 1.0 (0 for none) > 1.000000 Enter the conductivity and thickness of the thermal pad: K= .00 T= .0 (0 for none) > 2.000000E-02 1.000000E-01 Enter the Weight of this INLN-PKG [ .00 ] > 1.000000E-01 INLN-PKG PROPERTIES NO RADIATION BC TOP FACE CONVECTION 4-24
T= 71.0 h= .32E-02 IDCRV= 2 IDCONV= 3 HGR = 1.0 Tjc = 1.0 THERMAL PAD PROPS: K= .20E-01 T= .1000 WEIGHT= .10000 Do you wish to modify these values (y/[n]/q) N Enter a Reference Designator for this component or 0 for the next available value > 0 Reference Designator assigned to this component: U2 Access previously referenced curve: Cannot find curve 2 3 ? (y/[n]) Y
2. Define it ? (y/[n]) Y
Enter the curve title (upto 72 characters) or QUIT: > HEAT GENERATION CURVE (2) Edit curve using coordinates? (y/[n]) N Enter the No. of points in this curve (curr.= 0) > 5 Enter a pair of values > 0.000000E+00 2.000000E-01 Enter a pair of values > 2000.000000 7.000000E-01 Enter a pair of values > 6000.000000 9.500000E-01 Enter a pair of values > 8000.000000 1.000000 Enter a pair of values > 10000.000000 1.000000 5 points on curve ID: 2 successfully defined/updated. Accessing previously defined curve: 3
4-25
This curve has 3 points. Curve title : CONDUCTION-CONVECTION CURVE Modify this title ? (y/[n]) N Edit curve using coordinates? (y/[n]) N Enter the No. of points in this curve (curr.= 3) > Do you wish to update this curve? (y/[n]) N ELECTRONIC COMPONENTS 3
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
1
1. 2. 3. 4.
DIP SIP ZIP COMPONENT MENU

1
Choose one of the options (default=4) > 4-26
DIPs
1. 2. 3. 4. 5. 6. 7.
1
1. 2. 3. 4. 5. 6.
1
Choose one of the options (default=6) > 18-PIN DIP S-B A = .120 B = .160 C = .300 D = .500E-01 E = .100E-01 H = .100 4-27
Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES EX = .540E+08 NU = .3000 KXX = .473 ALPX = .311E-05 LEAD PROPERTIES EX = .195E+08 NU = .3000 KXX = .300 ALPX = .770E-05 Do you wish to use these values ([y]/n) Y 18-PIN DIP S-B BODY PROPERTIES DENS = .130 CP = 234. LEAD PROPERTIES DENS = .320 CP = 253. Do you wish to use these values ([y]/n) Y The INLN-PKG can be aligned in :
1.
X-axis (default)
4-28
2.
Y-axis
Choose one of the options > 1 The INLN-PKG can be mounted on :
1. 2.

2.000000 3.000000
Choose one of the options > 1 Enter the coordinates of the lower left lead > Lower left lead at: [ 2.00, 3.00]. Accept these coordinates? ([y]/n/q) Y INLN-PKG PROPERTIES NO RADIATION BC NO CONVECTION BC HGR = 1.0 Tjc = 1.0 NO THERMAL PAD WEIGHT= UNSPECIFIED Do you wish to modify these values (y/[n]/q) Y Radiation can take place :
1. Through the bottom face 2. Through the top face 3. Through both faces 0. No Radiation BC
Choose one of the options (def.=0) > 0 -Only for Heat Transfer, not for Fluid FlowConvection can take place : 4-29
1. Through the bottom face 2. Through the top face 3. Through both faces 0. No Convection BC
Choose one of the options (def.=0) > 2 Enter the Ambient Temperature and Film coefficient: T= .0 h=.00 > 71.000000 3.200000E-03 Enter a pointer to *CURVES for time-dependent temperature: IDCONV= 0 (0 for none) > 3 Enter the heat generated by the INLN-PKG HGR= 1.0 (0 for none) > 1.000000 Enter a pointer to *CURVES for time-dependent HGR: IDCRV= 0 (0 for none) > 2 Enter Theta_jc, thermal resistance junction-to-case: Tjc = 1.0 (0 for none) > 1.000000 Enter the conductivity and thickness of the thermal pad: K= .00 T= .0 (0 for none) > 2.000000E-02 1.000000E-01 Enter the Weight of this INLN-PKG [ .00 ] > 1.000000E-01 INLN-PKG PROPERTIES NO RADIATION BC TOP FACE CONVECTION T= 71.0 h= .32E-02 IDCRV= 2 IDCONV= 3 HGR = 1.0000 Tjc = 1.0000 THERMAL PAD PROPS: K= .20E-01 T= .1000 WEIGHT= .10000 4-30
Do you wish to modify these values (y/[n]/q) N Enter a Reference Designator for this component or 0 for the next available value > 0 Reference Designator assigned to this component: U3 Access previously referenced curve: 2 3 ? (y/[n]) N ELECTRONIC COMPONENTS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
0
Choose one of the options (default=0) > PRE-PROC. MAIN MENU
1. 2. 3. 4. 5. 6.
TOP SURFACE LAYOUT BOT. SURFACE LAYOUT CRITICAL COMPONENTS PCB STIFFENERS/RIBS PCB MODIFICATION SAVE FEAP FILE
4-31
7.
EXIT PRE-PROCESSOR
5
Choose one of the options (default=7) > PCB MODIFICATION
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
EXECUTIVE COMMANDS *TITLE CARD PCB CHARACTERISTICS *CUTOUT CARD ADVANCED DYNAMICS *THTR (trans. heat) *CURVES CARD *BOUND CARD *FLUID CARD PREVIOUS MENU
4
Choose one of the options (default=0) > PCB CUTOUTS [TOT= 0]
1. 2. 3. 4. 5. 6.
TOP SURFACE LAYOUT BOT. SURFACE LAYOUT ADDITION DELETION MODIFICATION PREVIOUS MENU
1
Choose one of the options (default=6) > 3 Enter the ID No. (pointer to *BOUND) or 0 to quit > The cutout can be at a corner or along a PCB edge. Is this a corner cutout? ([y]/n) Y 4-32
Enter the corner No. (1-4, with 1 being the [0,0] corner) > Enter "A" and "B" (X and Y dimensions) > 1.000000 PCB CUTOUTS [TOT= 1]
4 1.000000
1. 2. 3. 4. 5. 6.
1
Choose one of the options (default=6) > 3 Enter the ID No. (pointer to *BOUND) or 0 to quit > The cutout can be at a corner or along a PCB edge. Is this a corner cutout? ([y]/n) N Enter the corner No. (1-4, with 1 being the [0,0] corner) > Enter A (length along edge), B (depth of cutout) and C (min Y distance to X axis) > 2.500000 1.000000 PCB CUTOUTS [TOT= 2]
4 5.000000E-01
1. 2. 3. 4. 5. 6.
3
Choose one of the options (default=6) > 3 Enter the ID No. (pointer to *BOUND) or 0 to quit >
4-33
The cutout can be at a corner or along a PCB edge. Is this a corner cutout? ([y]/n) N Enter the edge No. (1-4, with 1 being the bottom edge) > 1 Enter A (length along edge), B (depth of cutout) and C (min X distance to Y axis) > 1.500000 5.000000E-01 2.500000 PCB CUTOUTS [TOT= 3]
1. 2. 3. 4. 5. 6.
4
Choose one of the options (default=6) > 3 Enter the ID No. (pointer to *BOUND) or 0 to quit > The cutout can be at a corner or along a PCB edge. Is this a corner cutout? ([y]/n) N Enter the edge No. (1-4, with 1 being the bottom edge) > Enter A (length along edge), B (depth of cutout) and C (min X distance to Y axis) > 1.000000 3.500000
1 7.000000E-01
4-34
PCB CUTOUTS [TOT= 4]
1. 2. 3. 4. 5. 6.
6
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
8
Choose one of the options (default=0) > BOUNDARY CONDITIONS
1. 2. 3.
HEAT CONDUCTION HEAT CONVECTION MECHANICAL (EDGES)

4-35
4. 5. 6. 7. 8. 9.
POINTS AND SPRINGS HEAT COND. (CUTOUTS) MECHANICAL (CUTOUTS) PIECE-WISE (EDGES) RADIATION (SURFACES) PREVIOUS MENU
Choose one of the options (default=9) > 5 Currently 0 heat conduction B.C.s defined for cutouts. IDs: Enter old or new ID (0 to quit) > 1 For ID No. 1 (counter-clockwise numbering of edges) No entries found. The B.C. along edge No. 1 is adiabatic. Do you wish to change it to isothermic? (y/[n]) Y Enter the constant temperature [degrees] and edge resistance [degrees/heat gener.] for this edge > 0.000000E+00 Enter a pointer to *CURVES (def= 0) > The B.C. along edge No. 2 is adiabatic. Do you wish to change it to isothermic? (y/[n]) Y Enter the constant temperature [degrees] and edge resistance [degrees/heat gener.] for this edge > 0.000000E+00 Enter a pointer to *CURVES (def= 0) > The B.C. along edge No. 3 is adiabatic. Do you wish to change it to isothermic? (y/[n]) Y Enter the constant temperature [degrees] and edge resistance [degrees/heat gener.] for this edge > 0.000000E+00 Enter a pointer to *CURVES (def= 0) > BOUNDARY CONDITIONS
67.000000 0
67.000000 0
67.000000 0
1. 2.
HEAT CONDUCTION HEAT CONVECTION
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3. 4. 5. 6. 7. 8. 9.
MECHANICAL (EDGES) POINTS AND SPRINGS HEAT COND. (CUTOUTS) MECHANICAL (CUTOUTS) PIECE-WISE (EDGES) RADIATION (SURFACES) PREVIOUS MENU
Choose one of the options (default=9) > 6 Currently 0 mechanical B.C.s defined for cutouts. IDs: Enter old or new ID (0 to quit) > 3 For ID No. 3 (counter-clockwise numbering of edges) No entries found. Edge # 1 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 3 Edge # 2 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 1 Enter (1) for normal In-Plane constraint (UX or UY =0) (2) for full In-Plane constraint (UX=UY=0) or (0) for UX and UY free (default) > 0 Rotational spring along edge K= .000 Enter new value > 0.000000E+00 Edge # 3 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 3 4-37
BOUNDARY CONDITIONS
1. 2. 3. 4. 5. 6. 7. 8. 9.
HEAT CONDUCTION HEAT CONVECTION MECHANICAL (EDGES) POINTS AND SPRINGS HEAT COND. (CUTOUTS) MECHANICAL (CUTOUTS) PIECE-WISE (EDGES) RADIATION (SURFACES) PREVIOUS MENU
Choose one of the options (default=9) > 6 Currently 1 mechanical B.C.s defined for cutouts. IDs: 3 Enter old or new ID (0 to quit) > 4 For ID No. 4 (counter-clockwise numbering of edges) No entries found. Edge # 1 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0) to quit > 3 Edge # 2 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0) to quit > 1 Enter (1) for normal In-Plane constraint (UX or UY =0) (2) for full In-Plane constraint (UX=UY=0) or (0) for UX and UY free (default) > 0 Rotational spring along edge K= .000 Enter new value > 0.000000E+00
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Edge # 3 is: Free Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 3
; Rotational spring along edge K= .000
BOUNDARY CONDITIONS
1. 2. 3. 4. 5. 6. 7. 8. 9.
Choose one of the options (default=9) > 6 Currently 2 mechanical B.C.s defined for cutouts. IDs: 3 4 Enter old or new ID (0 to quit) > 1 For ID No. 1 (counter-clockwise numbering of edges) No entries found. Edge # 1 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 2 Enter (1) for normal In-Plane constraint (UX or UY =0) (2) for full In-Plane constraint (UX=UY=0) or (0) for UX and UY free (default) > 0 Rotational spring along edge K= .000
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Enter new value > 0.000000E+00 Edge # 2 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0)to quit > 2 Enter (1) for normal In-Plane constraint (UX or UY =0) (2) for full In-Plane constraint (UX=UY=0) or (0) for UX and UY free (default) > 0 Rotational spring along edge K= .000 Enter new value > 2.000000 Edge # 3 is: Free ; Rotational spring along edge K= .000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0) to quit > 0 BOUNDARY CONDITIONS
1. 2. 3. 4. 5. 6. 7. 8. 9.
4
Choose one of the options (default=9) > Enter: 1 - for point attachments (default) 2 - for constant temperature points 3 - for mechanical point 3-D springs
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4 - for radiation points or 0 - to quit > 3 No Points defined. 0 POINT 3-D SPRINGS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION RELOCATION MODIFICATION POINT ATTACHMENTS CONST.TEMPER.PNTS RADIATION POINTS PREVIOUS MENU
Choose one of the options (default=0) > 3 For POINT 3-D SPRING No. 1 Enter X and Y coordinates > 1.500000 4.000000 Enter 3 translational spring constants, for X,Y,Z (def=0,0,0) > 0.000000E+00 0.000000E+00 1.500000 Enter 2 rotational spring constants, about X and Y (def=0,0) > 7.000000E-01 0.000000E+00 1 POINT 3-D SPRINGS
1. 2. 3. 4.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION
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5. 6. 7. 8. 9. 0.
RELOCATION MODIFICATION POINT ATTACHMENTS CONST.TEMPER.PNTS RADIATION POINTS PREVIOUS MENU
Choose one of the options (default=0) > 3 Currently 1 POINT 3-D SPRINGS out of 1 PCB point B.C.s defined (max=40) For POINT 3-D SPRING No. 2 Enter X and Y coordinates > 3.500000 4.000000 Enter 3 translational spring constants, for X,Y,Z (def=0,0,0) > 0.000000E+00 0.000000E+00 1.500000 Enter 2 rotational spring constants, about X and Y (def=0,0) > 7.000000E-01 0.000000E+00 2 POINT 3-D SPRINGS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION RELOCATION MODIFICATION POINT ATTACHMENTS CONST.TEMPER.PNTS RADIATION POINTS PREVIOUS MENU
8
Choose one of the options (default=0) >
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0 CONST.TEMPER.PNTS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION RELOCATION MODIFICATION POINT ATTACHMENTS POINT 3-D SPRINGS RADIATION POINTS PREVIOUS MENU
3
For CONST.TEMPER.PNT No. 1 Enter X and Y coordinates > 1.000000 2.000000 Enter constant temperature at this point > 60.000000 Enter the thermal resistance [degrees/heat gen.] (def=0) > Enter a pointer to *CURVES (def= 0) > 0 1 CONST.TEMPER.PNTS
5.000000E-01
1. 2. 3. 4. 5. 6. 7.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION RELOCATION MODIFICATION POINT ATTACHMENTS
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8. 9. 0.
POINT 3-D SPRINGS RADIATION POINTS PREVIOUS MENU
Choose one of the options (default=0) > 3 Currently 1 CONST.TEMPER.PNTS out of 3 PCB point B.C.s defined (max=40) For CONST.TEMPER.PNT No. 2 Enter X and Y coordinates > 4.000000 2.000000 Enter constant temperature at this point > 60.000000 Enter the thermal resistance [degrees/heat gen.] (def=0) > 5.000000E-01 Enter a pointer to *CURVES (def= 0) > 0 2 CONST.TEMPER.PNTS
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
PCB TOP FACE PCB BOTTOM FACE ADDITION DELETION RELOCATION MODIFICATION POINT ATTACHMENTS POINT 3-D SPRINGS RADIATION POINTS PREVIOUS MENU
0
Choose one of the options (default=0) > BOUNDARY CONDITIONS
1. 2.
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3. 4. 5. 6. 7. 8. 9.
Choose one of the options (default=9) > 1 PCB right edge. Constant temperature: 71.00. Pointer to *CURVES: 0 PCB left edge. Constant temperature: 67.00. Pointer to *CURVES: 0 All other edges are adiabatic. The B.C. along the bottom edge is adiabatic. Do you wish to change it to isothermic? (y/[n]) N PCB right edge. Constant temperature: 71.00. Pointer to *CURVES: Do you wish to change it to adiabatic? (y/[n]) N Enter the constant temperature for this edge > 71.000000 Enter a pointer to *CURVES (def= 0) > 3 Access previously referenced curve: 3 ? (y/[n]) N The B.C. along the top edge is adiabatic. Do you wish to change it to isothermic? (y/[n]) N PCB left edge. Constant temperature: 67.00. Pointer to *CURVES: 0 Do you wish to change it to adiabatic? (y/[n]) N Enter the constant temperature for this edge > 67.000000 Enter a pointer to *CURVES (def= 0) > 0 BOUNDARY CONDITIONS 0
1. 2.
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3. 4. 5. 6. 7. 8. 9.
7 2 2
Select: 1-Thermal; 2-Mechanical (0 to quit) >
Enter PCB edge: 1-Bottom; 2-Right; 3-Top; 4-Left (0-quit) > For the right PCB edge : Enter BC No. ( 1 for next; -1 to repeat or 0 to quit) > 1 The starting and ending points of the B.C. can be exactly represented by adding extra nodes on the edge, or approximated to the closest available node. Add extra nodes if needed ? (y/[n]/q) N From Y= .00 to Y= 4.00 Enter starting and ending points > 1.000000 3.000000 Enter (1) for Clamped Enter (2) for S.S. Enter (3) for Free or (0) to quit (def=0) > 2 Enter (1) for normal In-Plane constraint (UX or UY =0) (2) for full In-Plane constraint (UX=UY=0) or (0) for UX and UY free (def=0) > 1 Enter rotational spring constant along edge [ROTK= .000 ] > BOUNDARY CONDITIONS
5.000000E-01
1. 2.

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3. 4. 5. 6. 7. 8. 9.
9
1. 2. 3. 4. 5. 6. 7. 8. 9. 0.
0
1. 2. 3.
TOP SURFACE LAYOUT BOT. SURFACE LAYOUT CRITICAL COMPONENTS

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4. 5. 6. 7.
PCB STIFFENERS/RIBS PCB MODIFICATION SAVE FEAP FILE EXIT PRE-PROCESSOR

5
1. 2. 3. 4. 5. 6. 7. 8. 9. 10.
5
Choose one of the options (default=0) > ADVANCED DYNAMICS
1. 2. 3. 4. 5. 6.
*PSD CARD *TDYN CARD *FRES CARD RESPONSE POINTS No. OF MODES PREVIOUS MENU
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Choose one of the options (default=6) > Edit curve using coordinates? (y/[n]) N
Forcing function: 6 frequency-PSD pairs of values were defined : Freq : 10.0 50.0 100.0 400.0 600.0 2000.0 PSD : .0040 .0040 .0250 .0250 .0100 .0100 XYZ factors: [ .0000 , .0000 , 1.000 ]; IDCRV= 0 Enter the No. of points required to define the forcing function (curr.= 6) > 6 Do you wish to update the forcing function? (y/[n]) N Enter a pointer to *CURVES (IDCRV= 0) > 0 Enter XYZ factors for the forcing function [ .000 , .000 , 1.00 ] > 0.000000E+00 0.000000E+00 ADVANCED DYNAMICS
2.000000E-02
1. 2. 3. 4. 5. 6.
3
Choose one of the options (default=6) > Edit curve using coordinates? (y/[n]) N
Amplitude spectrum: 4 frequency-amplitude pairs of values were defined : Freq : 15.0 100.0 500.0 2000.0 Ampl.: .0400 .0600 .0600 .0300 XYZ factors: [ .0000 , .0000 , 1.000 ]; IDCRV= 0 Enter the No. of points required to define the amplitude spectrum (curr.= 4) > 4 Do you wish to update the amplitude spectrum? (y/[n]) N 4-49
Enter a pointer to *CURVES (IDCRV= 0) > 0 Enter XYZ factors for the amplitude spectrum [ .000 , .000 , 1.00 ] > 0.000000E+00 0.000000E+00 The Amplitude spectrum is in terms of displacements Change it to accelerations? (y/[n]) N ADVANCED DYNAMICS
2.000000E-02
1. 2. 3. 4. 5. 6.
6
1. 2. 3. 4. 5. 6. 7. 8. 9. 10.
0
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PRE-PROC. MAIN MENU
1. 2. 3. 4. 5. 6. 7.
6
1. 2. 3. 4. 5. 6. 7.
7
At the end of this session FEAP input file named TRN3.INP is also saved.
4.3
FEAP Input File

The input file (TRN3.INP) is given below. For detailed explanation of various cards used in .INP file refer to FEAP users manual.
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FEAP Input File
Feap Input File TRN3.INP

** E M R C / F E A P ** ANAL = SHEAT,THEAT,EIGEN,RANDOM,TRANS,FREQ FILE = trn3 EXEC = CGO ECHO = ON UNIT = IN,LB,WAT,DF *TITLE 3-LAYER COMPOSITE PCB WITH 3 DIPs. *PCB 3, 3, 5.000, 4.000, .45000, 67.00, 3 1000E-01, 1.950 , .9870E-01, 253.2 , 1.950 1500E-01, .12, .2500E+07, .2500E+07, .5500E-05, .5500E-05 .00, .3000E+06, .3000E+06, .3000E+06 3000E-01, .30, .1000E+08, .1000E+08, .5500E-05, .5500E-05 00, .1000E+07, .1000E+07, .1000E+07 1500E-01, .12, .2500E+07, .2500E+07, .5500E-05, .5500E-05 00, .3000E+06, .3000E+06, .3000E+06 *CUTOUT 1, 1, 4, 1.000, 1.000, .000 1, 2, 4, 2.500, .500, 1.000 3, 2, 1, 1.500, .500, 2.500 4, 2, 1, 1.000, .700, 3.500 *PSD 10.0, 2000.0, 3, 6, 2, .0000 , .0000 , .2000E-01, 0
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10.0 .0040 50.0 .0040 100.0 .0250 400.0 .0250 600.0 .0100 2000.0 .0100 2.50 *TDYN .050, .001000, 3, 2, 2, .0000 , .0000 , 1.000 , 0 .00000 25.00 .00400 25.00 *FRES 15.0, 2000.0, 3, 4, 2, .0000 , .0000 , .2000E-01, 0 15.0 .0400 100.0 .0600 500.0 .0600 2000.0 .0300 *THTR 7200.00 , 100.000 , 2, 3 1.0000 , 1.0000 , 4.0000 , 1.0000 , 4.0000 , 3.0000 , *CURVES 1, 4, HEAT GENERATION CURVE (1) .00000 , .50000 , 2000.0 , .80000 , 4000.0 , 1.0000 , 10000. , 1.0000 , 3, 3, CONDUCTION-CONVECTION CURVE .00000 , .95000 , 4000.0 , 1.0000 , 10000. , 1.0000 , 2, 5, HEAT GENERATION CURVE (2) .00000 , .20000 , 2000.0 , .70000 , 6000.0 , .95000 , 8000.0 , 1.0000 , 10000. , 1.0000 , *BOUND 1 2 71.00 4 67.00 10 0 2 3 3, 1, 1, 2, 2, 3, 3, 4, 2 511 67.00 2 67.00 3 67.00 4-53 1.50 2.50 3.50
FEAP Input File
16,
1, 1, 2, .000
, 2, 2, 2.00
, 3, 3, .000
6, 3, 1, 3, 2, 1, 3, 3 6, 4, 1, 3, 2, 1, 3, 3 13, 2, 18, 18, 17, 17, 1.000, 1.500, 3.500, 1.000, 4.000, 3.000, 5 , .500 4.000, .000 , .000 , 1.50 , .700 , .000 4.000, .000 , .000 , 1.50 , .700 , .000 2.000, 60.000, .500 , 0 2.000, 60.000, .500 , 0
*FLUID .500, 40.000, .3617E-03, .4333E-04, .1020E-05, 252.0 , 55.00 *DIP 18, 2.000, 1.000, 1, 1, 1, 1, 1, .1000 .1200 .1600 .3000 .0500 .0100 .0000 .0000 .1000 .473 , .540E+08, .300, 1.000, .311E-05,2, 71.00, .320E-02, 1.00 .3000 , .1950E+08, .300, .7700E-05, .2000E-01, .1000 13000 , 234.40 , .32000 , 253.20 , 1, 3 *DIP 18, 2.000, 2.000, 1, 1, 1, 2, 1, .1000 .1200 .1600 .3000 .0500 .0100 .0000 .0000 .1000
.473 , .540E+08, .300, 1.000, .311E-05,2, 71.00, .320E-02, 1.00 .3000 , .1950E+08, .300, .7700E-05, .2000E-01, .1000 13000 , 234.40 , .32000 , 253.20 , 2, 3 *DIP 18, 2.000, 3.000, 1, 1, 1, 3, 1, .1000 .1200 .1600 .3000 .0500 .0100 .0000 .0000 .1000
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.473 , .540E+08, .300, 1.000, .311E-05,2, 71.00, .320E-02, 1.00 .3000 , .1950E+08, .300, .7700E-05, .2000E-01, .1000 .13000 , 234.40 , .32000 , 253.20 , 2, 3 *END
4.4
Board Level NISA Analysis

Through FSHELL execute FEAP option (2) by giving the problem name as TRN3. This run reads data from TRN3.INP and creates NISA files for all the analysis types requested. In this example following files are created. Analysis Type Steady state heat transfer Transient heat transfer Conjugate heat / flow Eigen value Random vibration Transient dynamics Frequency response File Name TRN3.SHT TRN3.THT TRN3.FLC TRN3.EGN TRN3.RVB TRN3.TRN TRN3.FRQ
4.4.1
Steady State Heat Transfer

Select Heat Transfer Analysis of PCB (Steady) option from FSHELL. This option runs HEAT. Input file Output file 39 file 26 file TRN3.SHT TRN3.SHO TRN3H39.DAT TRN3H26.DAT
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Select Check results option. This loads the result file into DISPLAY III and shows temperature contours of PCB. If you are interested only in the case and junction temperatures do the following.
A DIP with reference designator U1 is added for case temperature post processor. Similarly add components U2 and U3 and press ENTER. Case temperature contour is plotted on the screen. With the same procedure if Junction Temperature is selected instead of Case Temperature Junction Temperature Contour is obtained. Case and junction temperatures are also available in an ASCII file TRN3.TEM
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FE Mesh for Steady State Heat Transfer
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Steady State Heat Transfer Results
TRN3.TEM Containing Case and Junction Temperatures
4-58
4.4.2
Transient Heat Transfer

Select Heat Transfer Analysis of PCB (Transient) option from FSHELL. This option runs HEAT. Description Input file Output file 39 file 26 file File TRN3.THT TRN3.THO TRN3R39.DAT TRN3R26.DAT
Select Check results option. This loads the result file into DISPLAY III and shows temperature contours of PCB at first time step. Snap shots at other time steps and temperature history at thermocouple locations can be viewed in DISPLAY III.
Isotherms at Snap Shot - 1 4-59
Isotherms at Snap Shot - 24 If you are interested only in the case and junction temperature histories do the following.
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Similarly add components 2 and 3 and press ENTER. Case temperature contour is plotted on the screen. With the same procedure if Junction Temperature is selected instead of Case Temperature Junction Temperature Contour is obtained. Case and junction temperatures are also available in TRN3.TEM.
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Case and Junction Temperatures Taken From TRN3.TEM
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4.4.3
Conjugate Heat / Flow

This section explains the steps to be followed to do a 3D Flow analysis of PCB. Description Input file Output file 55 file 26 file 27 file File TRN3.FLC TRN3.FLO TRN3C55.DAT TRN3C26.DAT TRN3C27.DAT
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Steps to be followed:
Check Temperature Contours (PCB & Components) shows temperature contours of PCB and Components and Check Air Flow Pattern at Component' shows air flow velocity distribution plotted by DISPLAY III.
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Flow mesh along with board
Board mesh burried inside flow mesh 4-69
Velocity distribution
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Board temperature distribution
4.4.4
Stress Analysis with Steady State Temperature

Thermal stress analysis can be carried out with the temperature loads calculated by steady state thermal analysis or transient thermal analysis. Stress analysis using steady state thermal load is explained in this section. Following steps may be followed with the heat transfer results in the current directory.
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When you say Create Thermal Stress Input File, FEAP Option (8) is accessed. This option uses the geometry given in TRN3.INP, thermal loading available in TRN339.dat and the mechanical loading defined in TRN3.INP to create the static analysis file namely TRN3.TST. Thermal stress Analysis of PCB runs NISA2 and writes out results. Check Results takes you inside DISPLAY III and projects the distorted PCB on the screen. Detailed post processing may be carried out as required.
4.4.5
Stress Analysis with Transient Temperature

Thermal Stress analysis using transient thermal load is explained in this section. Following steps may be followed. At the end of these operations we are inside DISPLAY III with the distorted PCB on the screen. The procedure is essentially same as in Section 4.4.4. But thermal stresses are calculated with transient temperatures using each snap-shot temperature as a load case. In this example there are 24 load cases. Results at all these snap shots can be post processed.
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Distorted PCB with Thermal Loading of Snap-Shot 1
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Distorted Pcb with Thermal Loading of Snap-Shot 24
4.4.6 Eigen Value

Eigen value analysis is performed on the board to find the natural frequencies and the mode shapes. This section explains the steps to be followed to do an Eigen Value Analysis of PCB. Description Input file Output file 27 file 26 file File TRN3.EGN TRN3.EGO TRN3D27.DAT TRN3D26.DAT
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Check Results option displays Vibration Modes in DISPLAY III. The mode shapes corresponding to the first three natural frequencies are given below. The natural frequencies are 136, 258 and 450.
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4.4.7
Random Vibration
In case the loads on PCB are described in terms of stationary random processes, FEAP performs Random Vibration Analysis using model summation in frequency domain. This section explains the steps to be followed to do a Random Vibration Analysis of PCB.
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Forcing function used for Random Vibration Analysis of PCB is shown in the figure. This is applied as a ground excitation. Damping value of 4% is used. Description Input file Output file 27 file 26 file File TRN3.RVB TRN3.RVO TRN3D27.DAT TRN3D26.DAT
Go through the following steps to perform a Random Vibration Analysis.
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These operations takes us inside DISPLAY III, where the desired results can be seen. The analysis yields the steady state RMS responses and respective PSDs.
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RMS Deformation
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RMS X-Displacement
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RMS Y-Displacement
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RMS Z-Displacement
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Z-Displacement Response PSD
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Z-Velocity Response PSD
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Z-Acceleration Response PSD The responses show significant effects in Z direction (perpendicular to the board). As can be seen from the response graphs, the first mode is the most predominant one followed by the second. The third mode effect is not significant. These comments are made based on the displacement, velocity and acceleration responses. Still there is a distinct possibility that the third mode is effective in the stress response because of the large relative deformation associated with the high frequency of the mode.
4.4.8
Frequency Response
This is a frequency domain analysis, which involves computing the steady state response of the PCB to a set of harmonic loads. FEAP employs normal mode method to calculate the response. In this example a z-displacement amplitude spectrum is given as input. Phase spectrum is taken to be flat and zero. 4-89
Description Input file Output file 27 file 26 file
File name TRN3.FRQ TRN3.FRO TRN3D27.DAT TRN3D26.DAT
A damping value of 4% is assumed for frequency response analysis. The displacement amplitude spectrum is given as ground excitation and the responses studied. Go through the following steps to perform a Frequency Response Analysis
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These operations takes us inside DISPLAY III, where the desired results can be seen.
Z-Amplitude Input Spectrum
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Z-amplitude Response Spectrum
4.4.9
Transient Dynamics
Transient Dynamics is a time domain analysis. This is used to determine the response of the PCB due to a specified time-dependent load. In this example ground acceleration in the Z-direction is given as load as function of time and the PCB response is studied. Description Input file Output file 27 file 26 file File TRN3.RVB TRN3.RVO TRN3D27.DAT TRN3D26.DAT 4-93
Go through the following steps to perform transient dynamic analysis of PCB.
These operations takes us inside DISPLAY III, where the desired results can be seen.
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Input Time Function (Shock Testing)
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Z-Displacement Response
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Z-Velocity Response
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Component Level Analysis
Z-Acceleration Response
4.5

FEAP can isolate any critical component defined on the PCB and create a submodel composed of the component itself and a refined mesh of the board around it. FEAP generates this model to improve the accuracy of the results within areas of interest and as an intermediate step towards component life predictions. Refined meshes can be created from thermal and/or dynamic results. For the thermal case, mesh refinement can be made either from the steady state or the transient temperature distribution. For the dynamic case mesh refinement is possible for Random Vibration, Frequency Response and Transient Dynamic results of the board.
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4.5.1
Static Submodel - Steady State Temperatures

In this section we want to create refined mesh for the DIP with reference designator U1 and conduct thermal stress analysis on this model. Let us use steady state temperatures for thermal loading. Following files are required to create sub-model for U1. File TRN3.SHT TRN3.TST TRN3T26.DAT TRN3T27.DAT TRN3.FEA TRN3.FEP Created by FEAP option (2) FEAP option (8) Static run on TRN3.TST Static run on TRN3.TST FEAP option (2) FEAP option (2)
Go through the following steps to create the sub-model.
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Resultant displacement is shown in DISPLAY III. Other results may be viewed as required.
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Output File TRN3U1.TSM TRN3U1T26.DAT TRN3U1T27.DAT
Description Sub-model for U1 Static run on TRN3U1.TSM Static run on TRN3U1.TSM
4.5.2
Static Submodel - Transient Temperatures

In this section we want to create refined mesh for the DIP with reference designator U1 and conduct thermal stress analysis on this model. Let us use transient temperatures of all the 24 snap-shots for thermal loading. Following files are required to create sub-model for U1. 4-101
File TRN3.THT TRN3.TST TRN3T26.DAT TRN3T27.DAT TRN3.FEA TRN3.FEP
Created by FEAP option (2) FEAP option (8) Static run on TRN3.TST Static run on TRN3.TST FEAP option (2) FEAP option (2)
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Resultant displacement is shown in DISPLAY III for snap-shot no.1 (load case 1).
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Other results may be viewed as required. Output File TRN3U1.TSM TRN3U1T26.DAT TRN3U1T27.DAT Description Sub-model for U1 Static run on TRN3U1.TSM Static run on TRN3U1.TSM
Deformation at Snap Shot -1
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Deformation at Snap Shot - 24
4.5.3
Static Submodel - Frequency Response

In this section we want to create refined mesh for the DIP with reference designator U1 and conduct Frequency Response analysis on this model. Following files are required to create sub-model for U1. File TRN3.EGN TRN3.FRQ TRN3D26.DAT TRN3D27.DAT TRN3.FEA TRN3.FEP Created by FEAP option (2) FEAP option (2) Dynamic run on TRN3.FRQ Dynamic run on TRN3.FRQ FEAP option (2) FEAP option (2)
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Go through the following steps to create the sub-model. Allow the program to select the frequency automatically.
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Resultant displacement mapped on deformed mesh is shown in DISPLAY III. Other results may be viewed as required. Output File TRN3U1.DSM TRN3U1D26.DAT TRN3U1D27.DAT Description Sub-model for U1 Dynamic run on TRN3U1.DSM Dynamic run on TRN3U1.DSM
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Deformation of U1
4.5.4
Static Submodel - Transient Dynamic

In this section we want to create refined mesh for the DIP with reference designator U1 and conduct Transient Dynamic analysis on this model. Following files are required to create sub-model for U1. File TRN3.EGN TRN3.TRN TRN3D26.DAT TRN3D27.DAT TRN3.FEA TRN3.FEP Created by FEAP option (2) FEAP option (2) Dynamic run on TRN3.FRQ Dynamic run on TRN3.FRQ FEAP option (2) FEAP option (2) 4-108
4-109
Resultant displacement mapped on deformed mesh is shown in DISPLAY III.
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Other results may be viewed as required.
Deformation of U1
4.5.5
Static Submodel - Random Vibration

No static sub-model needs to be created for this analysis type. However, Creating a Dynamic sub-model step is still used to store end pin loads in the TRN3.RES binary file. These loads are later retrieved and used in solid end pin model analysis results for fatigue life computations. Following files are required to write out end pin responses. File TRN3.EGN TRN3.RVB Created by FEAP option (2) FEAP option (2)
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TRN3D26.DAT TRN3D27.DAT TRN3.FEA TRN3.FEP
Dynamic run on TRN3.RVB Dynamic run on TRN3.RVB FEAP option (2) FEAP option (2)
Go through the following steps.
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End-pin responses required for life estimation are written in TRN3.RES
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Pin Level Analysis
4.6
Pin Level Analysis

Pin level analysis is carried out to calculate the stresses on the end-pins of a critical component accurately. The solder joint connecting the lead wires to the PCB is also included in the analysis because of the inherent weakness of the material. All pins are represented by beam elements in the sub-model. In pin level analysis pins are modeled using solid elements to increase the accuracy of results. The force and moment loading for the pin model is transferred from the sub-model analysis. In this section we create solid models of U1 end-pins and perform stress analysis. Through hole pins are assumed for this modeling session.
4.6.1
Pin Stresses - Steady Temperatures

To create and analyze the end-pin models of U1 with steady temperatures, following files are required. File TRN3.INP TRU1T26.DAT TRU1T27.DAT TRN3.RES Created by FEAP option (1) Static run results of TRN3U1.TST Static run results of TRN3U1.TST FEAP option (4)
End-pin model is built from the sub-model results. Use the following steps to create and analyze pin models.
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Pin Level Analysis
VonMises stresses are plotted in DISPLAY III for all four corner pins. Output File TRN3U1.LED TRN3U1.LEO Description Static Pin Model Static Pin Model Results
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TRU1L26.DAT TRN1L27.DAT
Static run results of TRN3U1.LED Static run results of TRN3U1.LED
FE Model with Boundary Conditions
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Pin Level Analysis
Deformed Shape of Pin -1
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Resultant Displacements for Pin-1
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Pin Level Analysis
Stresses in Pin-1
4.6.2
Pin Stresses - Transient Temperatures

To create and analyze the end-pin models of U1 with time varying temperatures, following files are required. File TRN3.INP TRU1T26.DAT TRU1T27.DAT TRN3.RES Created by FEAP option (1) Static run on TRN3U1.TST Static run on TRN3U1.TST FEAP option (4)
End-pin model is built from the U1 sub-model results. Use the following steps to create and analyze pin models.
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Pin Level Analysis
VonMises stresses are plotted in DISPLAY III for all four corner pins. Output File TRN3U1.LED TRN3U1.LEO TRU1L26.DAT TRN1L27.DAT Description Static Pin Model Static Pin Model Results Static run on TRN3U1.LED Static run on TRN3U1.LED
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Stresses at Load Case 1 Corresponds to Pin-1 Snap Shot 1
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Pin Level Analysis
Stressed at Load Case 91 Corresponding to Pin-1 Snap Shot 24
4.6.3
Pin Stresses - Frequency Response

To create end-pin models of U1 and perform frequency response analysis, following files are required. File TRN3.INP TRU1D26.DAT TRU1D27.DAT TRN3.RES Created by FEAP option (1) Dynamic run results of TRN3U1.DSM Dynamic run results of TRN3U1.DSM FEAP option (4)
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Pin Level Analysis
VonMises stresses are plotted in DISPLAY III for all four corner pins. Output File TRN3U1.LED TRN3U1.LEO TRU1L26.DAT TRN1L27.DAT Description Static Pin Model Static Pin Model Results Static run results of TRN3U1.LED Static run results of TRN3U1.LED
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Stressed in Pin-1 During Frequency Response
4.6.4
Pin Stresses - Transient Dynamics

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Pin Level Analysis
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VonMises stresses are plotted in DISPLAY III for all four corner pins. Output File TRN3U1.LED TRN3U1.LEO TRU1L26.DAT TRN1L27.DAT Description Static Pin Model Static Pin Model Results Static run results of TRN3U1.LED Static run results of TRN3U1.LED
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Pin Level Analysis
Pin-1 Stresses During Transient Dynamics
4.6.5
Random Vibration
End-pin model is built from the sub-model results. Use the following steps to create and analyze pin models
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Pin Level Analysis
VonMises stresses are plotted in DISPLAY III for all four corner pins. It is to be remembered that these stresses are not actual stresses. They are stresses obtained using unit loads. Output File TRN3U1.LED TRN3U1.LEO TRU1L26.DAT TRN1L27.DAT Description Static Pin Model Static Pin Model Results Static run results of TRN3U1.LED Static run results of TRN3U1.LED
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4.7
Fatigue Life Prediction

A fatigue analysis typically requires the load history and the stress response information. FEAP enables the user to generate these information automatically. Fatigue life estimation is then performed on end pins of selected components for analysis types such as cyclic thermal loading, random vibration and frequency response. In the case of transient dynamics automatic post-processing of results is available to detect end-pin failures.
4.7.1
Pin Life - Steady Temperatures

At off service conditions the PCB is in a state of zero stress. When in service it operates at a stress distribution. When switched off it again comes back to zero stress. This constitutes a cycle. Fatigue analysis results provide the number of such cycles-to-failure for the end-pins of a component. For the present analysis the max stress corresponds to the stress distribution obtained from the stress analysis of the pin model. File required TRN3.INP TRN3.RES TRU1L26.DAT TRU1L27.DAT Created by FEAP option (1) FEAP option (4) Static run result of TRN3U1.LED Static run result of TRN3U1.LED
To create the Fatigue model of U1 end-pins with steady stage thermal loading follow the steps given below.
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Life / Log life contours for all the four end pins are displayed by DISPLAY III Output file TRN3U1.LOD TRN3U1.END TRN3.RES TRN3U1.LF1 TRU1P1.A TRU1P1.B TRU1P1.C TRU1P1.D Description Load file for Endure Created by FEAP (6) Input file for Endure created by FEAP (6) Data for end pin model generation and analysis Endure output Text file for pin 1 Endure output Life contours data for pin 1 Endure output Log Life contours data for pin 1 Endure output Local Stress - Life data for pin 1 Endure output Load History data for pin 1
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TRN3U1.LF2 TRU1P2.A TRU1P2.B TRU1P2.C TRU1P2.D TRN3U1.LF3 TRU1P3.A TRU1P3.B TRU1P3.C TRU1P3.D TRN3U1.LF4 TRU1P4.A TRU1P4.B TRU1P4.C TRU1P4.D
Endure output Text file for pin 2 Endure output Life contours data for pin 2 Endure output Log Life contours data for pin 2 Endure output Local Stress - Life data for pin 2 Endure output Load History data for pin 2 Endure output Text file for pin 3 Endure output Life contours data for pin 3 Endure output Log Life contours data for pin 3 Endure output Local Stress - Life data for pin 3 Endure output Load History data for pin 3 Endure output Text file for pin 4 Endure output Life contours data for pin 4 Endure output Log Life contours data for pin 4 Endure output Local Stress - Life data for pin 4 Endure output Load History data for pin 4
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4.7.2
Pin Life - Transient Temperatures

Transient heat transfer analysis of PCB wrote snap shots of temperatures. While creating component sub-model for U1 we have taken all the snap-shots into account. These snap-shots represent successive stages within a single fatigue load cycle. Fatigue life estimation with time varying temperatures uses end-pin responses for unitary loadings together with the transient loads. Hence the fatigue life is computed in terms of the number of such cycles to failure. File required TRN3.INP TRN3.RES Created by FEAP option (1) FEAP option (4)
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TRU1L26.DAT TRU1L27.DAT
Static run result of TRN3U1.LED Static run result of TRN3U1.LED
To create the Fatigue model of U1 end-pins with time varying thermal loading follow the steps given below
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Life / Log life contours for all the four end pins are displayed by DISPLAY III Out put file TRN3U1.LOD TRN3U1.END TRN3.RES TRN3U1.LF1 TRU1P1.A Description Load file for Endure Created by FEAP (6) Input file for Endure created by FEAP (6) Data for end pin model generation and analysis Endure output Text file for pin 1 Endure output Life contours data for pin 1
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TRU1P1.B TRU1P1.C TRU1P1.D TRN3U1.LF2 TRU1P2.A TRU1P2.B TRU1P2.C TRU1P2.D TRN3U1.LF3 TRU1P3.A TRU1P3.B TRU1P3.C TRU1P3.D TRN3U1.LF4 TRU1P4.A TRU1P4.B TRU1P4.C TRU1P4.D
Endure output Log Life contours data for pin 1 Endure output Local Stress - Life data for pin 1 Endure output Load History data for pin 1 Endure output Text file for pin 2 Endure output Life contours data for pin 2 Endure output Log Life contours data for pin 2 Endure output Local Stress - Life data for pin 2 Endure output Load History data for pin 2 Endure output Text file for pin 3 Endure output Life contours data for pin 3 Endure output Log Life contours data for pin 3 Endure output Local Stress - Life data for pin 3 Endure output Load History data for pin 3 Endure output Text file for pin 4 Endure output Life contours data for pin 4 Endure output Log Life contours data for pin 4 Endure output Local Stress - Life data for pin 4 Endure output Load History data for pin 4
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4.7.3
Pin Life - Frequency Response

Fatigue life is computed based on a fully reversed loading approach. The peak stress is obtained from the results of a static analysis of the end-pin models. The fatigue life predicted represents the number of cycles to failure at the frequency selected during mesh refinement. File required TRN3.INP TRN3.RES TRU1L26.DAT TRU1L27.DAT Created by FEAP option (1) FEAP option (4) Static run result of TRN3U1.LED Static run result of TRN3U1.LED
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To create the Fatigue model of U1 end-pins with frequency response loading follow the steps given below.
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Life / Log life contours for all the four end pins are displayed by DISPLAY III Out put file TRN3U1.LOD TRN3U1.END TRN3.RES TRN3U1.LF1 TRU1P1.A Description Load file for Endure Created by FEAP (6) Input file for Endure created by FEAP (6) Data for end pin model generation and analysis Endure output Text file for pin 1 Endure output Life contours data for pin 1 4-145
TRU1P1.B TRU1P1.C TRU1P1.D TRN3U1.LF2 TRU1P2.A TRU1P2.B TRU1P2.C TRU1P2.D TRN3U1.LF3 TRU1P3.A TRU1P3.B TRU1P3.C TRU1P3.D TRN3U1.LF4 TRU1P4.A TRU1P4.B TRU1P4.C TRU1P4.D
Endure output Log Life contours data for pin 1 Endure output Local Stress - Life data for pin 1 Endure output Load History data for pin 1 Endure output Text file for pin 2 Endure output Life contours data for pin 2 Endure output Log Life contours data for pin 2 Endure output Local Stress - Life data for pin 2 Endure output Load History data for pin 2 Endure output Text file for pin 3 Endure output Life contours data for pin 3 Endure output Log Life contours data for pin 3 Endure output Local Stress - Life data for pin 3 Endure output Load History data for pin 3 Endure output Text file for pin 4 Endure output Life contours data for pin 4 Endure output Log Life contours data for pin 4 Endure output Local Stress - Life data for pin 4 Endure output Load History data for pin 4
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4.7.4 Pin Life - Transient Dynamics

For this analysis type an upper limit, usually the yield stress, is used as the failure criterion. Nodal von Mises stresses obtained from the analysis of the solid pin model are automatically checked for violation of the stress limit for all the corner pins of the component. File required TRN3.INP TRN3.RES TRU1L26.DAT TRU1L27.DAT Created by FEAP option (1) FEAP option (4) Static run result of TRN3U1.LED Static run result of TRN3U1.LED
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To create the Fatigue model of U1 end-pins with Transient Dynamic loading follow the steps given below.
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A report of life expectancy with Transient Dynamic loading is written in the file TRNSDYN.OUT
4.7.5
Pin Life - Random Vibration

The random load is represented by the power spectral density function. PSD is a measure of the load intensity in the frequency range and is a function of the load amplitude. In this analysis, a pseudo-static approach is adopted. Unitary loadings are applied at the tips of the solid models of the end-pins in each of the six degrees of freedom, constituting a set of six load cases. The static analysis results of these models are used in the ENDURE program in conjunction with the force PSD responses of the end-pins, as predicted by the original PCB model. The inputs from 4-149
these load cases are processed in a multi-channel manner, indicating independently varying loads in each of the six degrees of freedom. File required TRN3.INP TRN3.RES TRU1L26.DAT TRU1L27.DAT Created by FEAP option (1) FEAP option (4) Static run result of TRN3U1.LED Static run result of TRN3U1.LED
To create the Fatigue model of U1 end-pins with Random Vibration loading follow the steps given below.
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Life / Log life contours for all the four end pins are displayed by DISPLAY III Out put file TRN3U1.LOD TRN3U1.END TRN3.RES TRN3U1.LF1 TRU1P1.A TRU1P1.B Description Load file for Endure Created by FEAP (6) Input file for Endure created by FEAP (6) Data for end pin model generation and analysis Endure output Text file for pin 1 Endure output Life contours data for pin 1 Endure output Log Life contours data for pin 1
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TRU1P1.C TRU1P1.D TRN3U1.LF2 TRU1P2.A TRU1P2.B TRU1P2.C TRU1P2.D TRN3U1.LF3 TRU1P3.A TRU1P3.B TRU1P3.C TRU1P3.D TRN3U1.LF4 TRU1P4.A TRU1P4.B TRU1P4.C TRU1P4.D
Endure output Local Stress - Life data for pin 1 Endure output Load History data for pin 1 Endure output Text file for pin 2 Endure output Life contours data for pin 2 Endure output Log Life contours data for pin 2 Endure output Local Stress - Life data for pin 2 Endure output Load History data for pin 2 Endure output Text file for pin 3 Endure output Life contours data for pin 3 Endure output Log Life contours data for pin 3 Endure output Local Stress - Life data for pin 3 Endure output Load History data for pin 3 Endure output Text file for pin 4 Endure output Life contours data for pin 4 Endure output Log Life contours data for pin 4 Endure output Local Stress - Life data for pin 4 Endure output Load History data for pin 4
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4-154

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Version 15.0 New Features

Flow of FEAP Analysis

Flow of FEAP Analysis

Creation of PCB Interactively

1659 0.12 0.99E-05 DIP (1No.)

Creation of PCB Interactively

Problem Definition Phase

Steady State Heat Transfer in PCB

- Steady-state heat transfer. - Transient heat transfer. - Both.

Printed Circuit Board (PCB) Input Phase

PCB Properties Input Phase

Thermal Boundary Conditions Input Phase

Creation of PCB Interactively

Mechanical Boundary Conditions Input Phase

- Edge boundary conditions. - Point attachments. - Above options combined.

Enter 1, 2, 3 or 4 > 3 For the bottom edge (Y = 0.00) :

Steady State Heat Transfer in PCB

Uy Free Free Free 0 0 0 0

Rotx 0 Free Free 0 Free 0 Free

Free Free Free Free Free 0 0

Free Free Free 0 0 0 0

Uy Free Free Free

Rotx 0 Free Free

1. - Clamped: 2. - Simply supported: 3. - Free:

Free Free Free

Creation of PCB Interactively

4. - Clamped: 5. - Simply supported: 6. - Clamped: 7. - Simply supported:

Uy Free Free Free Free Free 0 0

Roty 0 Free Free 0 Free 0 Free

Free Free Free 0 0 0 0

Characteristics of the Printed Circuit Board

Steady State Heat Transfer in PCB

Choose one of the options (default=0) > 1 DIP - SIP - ZIP

Choose one of the options (default=4) > 1

Creation of PCB Interactively

Steady State Heat Transfer in PCB

Creation of PCB Interactively

or 0 for the next available value > 1 ELECTRONIC COMPONENTS

Choose one of the options (default=0) > 0 PRE-PROC. MAIN MENU

(1) (2) (3) (4) (5) (6) (7)

Choose one of the options (default=7) > 6 PRE-PROC. MAIN MENU

TOP SURFACE LAYOUT

Steady State Heat Transfer in PCB

(2) (3) (4) (5) (6) (7)

FEAP Input File (TRN1.INP)

FEAP Input File (TRN1.INP)

Steady State Heat Transfer in PCB

Steady State Heat Transfer Analysis

Steady State Heat Transfer Analysis

Post Processing Using DISPLAY III

Steady State Heat Transfer in PCB

Temperature Contours of PCB (TRN1)

Post Processing using FEAP Post Processor

Steady State Heat Transfer Analysis

Case Temperature for the DIP

Steady State Heat Transfer in PCB

Junction Temperature of the DIP

TRN1.TEM File with Case and Junction

Thermal Stress Analysis

Thermal Stress Analysis

Steady State Heat Transfer in PCB

Thermal Stress Analysis