Vous êtes sur la page 1sur 1

Application Spotlight

Reduce Validation Costs by Eliminating Re-Parameterization


With the ever increasing need for improved quality and product traceability, there is a growing use of smart sensing devices on automated assembly and packaging lines in the Life Sciences Industry. However, these smart field devices require a higher degree of training for plant technicians and more documentation anytime a device is replaced. The result is increased downtime and costs associated with re-parameterization and full re-validation when replacing these smart components. Balluff offers a Distributed Modular I/O solution that allows for quick and easy replacement without the need for adjustments or re-parameterization.
Communication

Benefits of using Balluffs Distributed Modular I/O include:

Discrete I/O

Discrete I/O

Analog I/O

n Reduce or eliminate re-validation when field devices are replaced n Improve diagnostics capability n Fieldbus neutral; open, non-proprietary, multi-vendor technology n Reduce initial design costs n Decrease planned and unplanned downtime

Power

Discrete I/O

Specialty

Outputs

Power

Discrete I/O

Analog I/O

Valve Manifold Control

RFID or Specialty Devices

Intelligent motor starter parameterization is automatic

Types of Distributed Modular I/O devices

IO-Link Masters

Discrete I/O
M8 ports Up to 16 inputs M12 ports Up to 16 inputs 16 outputs 16 configurable

Analog I/O
4 channels (10 bit) 0-10 V in 4-20mA in plus 8 inputs 1 channel (14 bit) 0-10 V in/out 4-20mA in/out PT100 in

Smart Sensors
Measurement and position sensors RFID Read/write Read only Ultrasonic and inductive position sensors Linear position transducer 2 to 180 stroke lengths 5 m resolution 32 bit signed integer

Valve Manifold Control


M12 ports 4 port master 8 port master configurable 25 pin D-sub

IP67 & Terminal

Balluff, Inc. n 8125 Holton Drive Florence, KY 41042 n 1-800-543-8390 n http://networks.balluff.com

PS_073 Reduce Validation Costs by Eliminating Re-Parameterization 2013-01

With Distributed Modular I/O, it is possible to replace smart programmable devices such as: pressure, gripper, color, laser measurement, fiber optic, registration mark, and edge guide sensors as well as valve manifolds, measuring light curtains, linear transducers, smart starters, and RFID systems without any adjustment or parameterization required at the field device. Balluffs Distributed Modular I/O with the open standard IO-Link (see http://www.io-link.com) allows bidirectional communication between field devices and Industrial Networks. This communication allows for the field device parameters to be stored in the PLC or PC memory, and downloaded automatically to any new replacement part. No longer are push-button teaching, setting of switches or potentiometers necessary to re-calibrate. Correct calibration is assured, and performed promptly by the control system upon replacement.