The design and modeling of microscale electro-mechanical systems (MEMS) is a unique engineering discipline.

At small length scales, the design of resonators, gyroscopes, accelerometers, and actuators must consider the effects of several physical phenomena. MEMS devices and sensors may even utilize multiphysics phenomena for its very function or for increased sensitivity. To this end, the MEMS Module provides user interfaces for electromagnetic-structure, thermal-structure, or fluid-structure interactions. A variety of damping phenomena can be included in a model: thin-film gas damping, anisotropic loss-factors for solid and piezo materials, as well as anchor damping. For elastic vibrations and waves, perfectly matched layers (PMLs) provide state-ofthe-art absorption of outgoing elastic energy. Best-in-class piezoelectric and piezoresistive tools allow for simulations where composite piezo-elastic-dielectric materials can be combined in any imaginable configuration. The MEMS Module includes analyses in the stationary and transient domains as well as fully-coupled eigenfrequency, parametric, quasi-static, and frequency response analyses. Lumped parameter extraction of capacitance, impedance, and admittance and connections to external electrical circuits via SPICE netlists are made easy. Built upon the core capabilities ofCOMSOL Multiphysics, the MEMS Module can be used to address virtually any phenomena related to mechanics at the microscale.

NanoWire Modelling

Meshed solid model of a hexagonal array of nanowires and a randomly generated rough surface. The surface roughness has a Gaussian distribution to mimic the real surface of a processor chip package.

The removal of heat from IC processors is achieved by attaching a heat sink to the microprocessor package and using either natural or forced convection. The inherent roughness of the mating surfaces severly impacts the performance of the cooling system since intimate contact between two rigid rough surfaces occurs only at a small number of discrete points. Typically the air pockets between these gaps is filled with a thermally conductive and deformable material such as thernal grease. The Nano-interconnection team in Tyndall is investigatiing the use of Nanowires as potential thermal interface meterials. The thermal performace of the nanowires is dependent on the mechical contact they make with a mating surface, their deformation with applied pressure and their interaction with neighbouring wires. Contact and buckling simulations were carried out in ANSYS to gain an understanding into the physical behaviour of the wires and consequently to give an insight into their thermal performance as interface materials. The surface of a micro-processor chip was found experimentally to have a Gaussian profile. In addition to this roughness, the individual wires vary in length because the surface they are grown on also has a Gaussian profile. A rough equivalent surface was generated in ANSYS by scaling the heights of the surface keypoints by a randomally

generated matrix with a Gaussian distribution and connecting them with splines. Buckling simulations indicate that the first wire to make contact buckles almost instantneously upon contact with the rough surface. The adjacent wire is immediatly impacted by its neighbour and conforms to its buckled shape. In this way the conduction path from source to sink is enhanced This domino effect is stopped only when a wire in the domino chain also makes contact. with the surface. Further increasing the pressure between the heat source and sink results in increased contact pressure between the wire tips and the mating surface as well as between the indivual wires.

MEMS Modelling

Deflection of a wide, 1um thick cantilever beam due to stress gradient. MEMS modelling is multifaceted because of the inherent multi-physics nature of MEMS devices. At Tyndall, finite element and system level modelling is performed to aid in the design, understanding and optimisation of MEMS structures. The simulation tools available to us include ANSYS, COMSOL, Coventorware. HFSS and Matlab. Devices

modelled include RF MEMS switches and capacitors, Energy Harvesting cantilevers. Analyses types include both linear and non-linear static analysis, modal, harmonic, buckling, contact, and electrostatic analysis. Some examples of specific modelling work is outlined.

System Level Modelling of a Feedback System for an RF MEMS Switch

Left: SEM of a capacitive RF MEMS switch fabricated in Tyndall's surface micro-machining process. The top (structural) metal which is formed from 1um thick aluminium sits approximately 2-3um above the substrate. Right: The characteristic CV sweep for the switch.

The predominant failure mechanism of capacitive MEMS switches is stiction due to charging of the dielectric. After repeated actuation using a DC bias, charge accumulates in the dielectric. This accumulation of charge results in a shift of

the capacitance-voltage characteristic of the switch. When enough charge is accumulated that the resulting downward electrostatic force exceeds the mechanical restoring force of the switch springs, the switch will fail to return to the up-state upon release of the bias voltage. A system level model of the switch was developed using Matlab/Simulink to facilitate analysis of the combined electrostatic, dynamic and reliability aspects of the device.