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Di st i l l er Ser ver - 67523_FM.
pdf - 000001 of 000022 - Febr uar y 14, 2005

i
Thermal
Conductivity
Theory, Properties,
and Applications
Di st i l l er Ser ver - 67523_FM. pdf - 000002 of 000022 - Febr uar y 14, 2005
ii
PHYSICS OF SOLIDS AND LIQUIDS
Editorial Board: Jozef T. Devreese University of Antwerp, Belgium
Roger P. Evrary University of Li` ege, Belgium
Stig Lundqvist Chalmers University of Technology, Sweden
Gerald D. Mahan University of Tennessee, USA
Norman H. March University of Oxford, England
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THERMAL CONDUCTIVITY: Theory, Properties, and Applications
Edited by Terry M. Tritt
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iii
Thermal
Conductivity
Theory, Properties,
and Applications
Edited by
Terry M. Tritt
Clemson University
Clemson, South Carolina
Kluwer Academic / Plenum Publishers
New York, Boston, Dordrecht, London, Moscow
iv
Library of Congress Cataloging-in-Publication Data
Thermal conductivity: theory, properties, and applications/[edited by] Terry Tritt.
p. cm. (Physics of solids and liquids)
Includes bibliographical references and index.
ISBN 0-306-48327-0
1. Thermal conductivity. I. Tritt, Terry M. II. Series.
QC176.8.T39T48 2004
536.2012dc22
2003064141
ISBN 0-306-48327-0
2004, Kluwer Academic / Plenum Publishers, New York
233 Spring Street, New York, New York 10013
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PREFACE
It has been almost thirty years since a book was published that was entirely dedi-
cated to the theory, description, characterization and measurement of the thermal
conductivity of solids. For example, the excellent texts by authors such as Berman
1
,
Tye
2
and Carlslaw & Jaeger
3
remain as the standards in the eld of thermal con-
ductivity. Tremendous eorts were expended in the late 1950s and 1960s in rela-
tion to the measurement and characterization of the thermal conductivity of solid-
state materials. These eorts were made by a generation of scientists, who for the
most part are no longer active, and this expertise would be lost to us unless we are
aware of the great strides they made during their time.
I became interested in the eld of thermal conductivity in the mid 1990s in relation
to my own work on the next generation thermoelectric materials, of which the
measurement and understanding of thermal conductivity is an integral part.
4
In
my search for information, I found that most of the books on the subject of
thermal conductivity were out of print. Much of the theory previously formulated
by researchers such as Klemens
5
and Slack
6
contain considerable theoretical insight
into understanding thermal conductivity in solids. However, the discovery of new
materials over the last several years which possess more complicated crystal struc-
tures and thus more complicated phonon scattering mechanisms have brought new
challenges to the theory and experimental understanding of these new materials.
These include: cage structure materials such as skutterudites and clathrates, metal-
lic glasses, quasicrystals as well as many of new nano-materials which exist today.
In addition the development of new materials in the form of thin lm and super-
lattice structures are of great theoretical and technological interest. Subsequently,
new measurement techniques (such as the 3-! technique) and analytical models to
characterize the thermal conductivity in these novel structures were developed.
Thus, with the development of many new and novel solid materials and new mea-
surement techniques, it appeared to be time to produce a more current and readily
available reference book on the subject of thermal conductivity. Hopefully, this
book, Thermal Conductivity-2004: Theory, Properties and Applications, will serve
not only as a testament to those researchers of past generations whose great care in
experimental design and thought still stands today but it will also describe many of
the new developments over the last several years. In addition, this book will serve
as an extensive resource to the next generation researchers in the eld of thermal
conductivity.
First and foremost, I express great thanks to the authors who contributed to this
book for their hard work and dedication in producing such an excellent collection
of chapters. They were very responsive to the many deadlines and requirements and
they were a great group of people to work with. I want to personally acknowledge
my many conversations with Glen Slack, Julian Goldsmid, George Nolas and
Ctirad Uher, as well as many other colleagues in the eld, as I grasped for the
knowledge necessary to personally advance in this eld of research. I also want to
acknowledge the support and encouragement of my own institution, Clemson Uni-
versity (especially my Chairman: Peter Barnes), during this editorial and manu-
script preparation process. I am truly indebted to all my graduate students, for their
contributions to these volumes, their hard work, for the patience and understanding
they exemplied during the editorial and writing process. A special thanks goes to
the publishers and editors at Kluwar Press for their encouragement and patience in
all stages of development of these manuscripts for publication. I am indebted to my
assistant at Clemson University, Lori McGowan, whose attention to detail and
hard work (copying, reading, ling, corresponding with authors, etc.) helped
make this book possible. I especially wish to acknowledge my wonderful wife,
Penny, and my great kids for their patience and understanding for the many hours
that I spent on this work.
Terry M. Tritt
September 18, 2003
Clemson University
Clemson, SC
REFERENCES
1. Thermal Conduction in Solids, R. Berman, Clarendon Press, Oxford, 1976.
2. Thermal Conductivity Vol. I and Vol. II, edited by R. P. Tye, Academic Press, New York, 1969.
3. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids (Oxford University Press, Oxford,
1959).
4. Recent Ternds in Thermoelectric Materials Research Terry M. Tritt, editor, (Academic Press,
Volumes 69^71, Semiconductors and Semimetals, 2002).
5. See for example P. G. Klemens, Chapter 1, p1 of Thermal Conductivity Vol. I, edited by R. P. Tye,
Academic Press, New York, 1969.
6. Solid State Physics, G. A. Slack, 34, 1, Academic Press, New York, 1979.
VI PREFACE
LIST OF SYMBOLS
Ch. 1.1 Yang
i ^ total thermal conductivity
c ^ excitation
Q ^ heat ow rate/ heat ux vector
T ^ absolute temperature
c ^ heat capacity
n ^ concentration of particles
rT ^ temperature gradient
v ^ velocity
01,0t^ Time rate of change of energy
t ^ relaxation time
C ^ total heat capacity
l ^ particle mean free path
k ^ electron wave vector
E ^ electric eld
f
0
k
^ distribution function
E
F
^ Fermi energy constant
k
B
^ Boltzmanns constant
v
k
^ electron velocity
e ^ electron charge
E
ef f
^ eective eld
J ^ elecrical current density
1
n
^ general integral
o ^ electrical conductivity
L
o
^ standard Lorentz number
0
D
^ Debye temperature for phonons
k
f
^ electron wave number at Fermi surface
q
D
^ phonon Debye wave number
G ^ constant representing strength of electron-phonon interaction
/ ^ Planck constant
m* ^ electron eective mass
n
c
^ number unit cells per unit volume
v
F
^ electron velocity at Fermi surface
, ^ resistivity
W
e
^ electronic thermal resistivity
W
i
^ constant
,
o
^ residual electrical resistivity
E
G
^ energy gap
f
0
e
^ equilibrium distribution for electron
f
0
h
^ equilibrium distribution for holes
1
c
1
^ distances of Fermi level below bottom of conduction band
1
/
1
^ distances of Fermi level above top of valence band
1
i
^ integral for electrons
1
0
i
^ integral for holes
c ^ constant
h ^ holes
j ^ mobility
.
^ phonon frequencey
0.
^ group velocity
q ^ wave vector
`
^ phonon distribution function
q
^ phonon group velocity
t
^ phonon scattering relaxation time

0 ^ angle between
q
and rT
i
L
^ lattice thermal conductivity
.
1
^ Debye frequency (resonant frequency ?)
`` ^ constant vector-determine s anisotropy of phonon distribution

u ^ parameter dened in the text (units of time)
B ^ constant
^ Gru neisen constant
M ^ average atomic mass
V ^ volume per atom
m
i
^ mass of atom
f
i
^ fraction of atoms with mass mi
" ii ^ average mass of all atoms
d ^ sample size for single crystal or grain size for a polycrystalline sample
N
D
^ number dislocation lines per unit area
r ^ core radius
B
D
^ Burgers vector of dislocation
C ^ constant proportional to concentration of resonant defects
c ^ electron-phonon interaction constant or deformation potential
d ^ mass density
G ^ proportionality constant
^ chemical shift related to splitting of electronic states
r
0
^ mean radius of localized state
L
e
^ mean free path of electron
`
p
^ wavelength of phonon
VIII LIST OF SYMBOLS
Ch. 1.2 Uher
i
e
^ thermal conductivity of electrons
i
p
^ thermal conductivity of phonons
, ^ resistivity
L ^ constant that relates thermal conductivity of pure metals to their electrical
conductivity
J
e
^ electrical current density
n ^ number of electrons per unit volume
v ^ velocity
t ^ time
c ^ electrical eld
t ^ relaxation time/ collision time
l
e
^ mean free path between electrons
m ^ electron mass
J
Q
^ thermal current density
c
v
^ electronic specic heat per unit volume
c
M
^ molar specic heat
^ chemical potential/ Fermi level/ Fermi energy (E
F
)
E ^ particular energy state
D ^ density
U ^ internal energy of electron
k
B
^ Boltzmann constant
T
F
^ Fermi temperature
N
A
^ Avagardos number
Z ^ valence of electron
R ^ universal gas constant
^ coecient of linear specic heat of metals#Sommereld constant
"/ ^ Plancks constant
k ^ Bloch wave vector of an electron
E(k) ^ Bloch energy of an electron
k
^ wavefunction
U
k
^ internal energy
H ^ perturbation Hamiltonian
E ^ varying function of E ?
S ^ Seebeck coecient#thermoelectric power
^ Peltier coecient
m* ^ eective mass
A(E) ^ vector quantity
,
imp
^ impurity resistivity
W
kk
0 ^ collision probability
V ^ volume
k
TF
^ Thomas-Fermi screening parameter
k
F
^ Fermi wave-vector (momentum)
a
0
^ Bohr radius
n
i
^ density of impurities
q ^ wave vector
.
q
^ frequency of vibration
LIST OF SYMBOLS IX
!
D
^ Debye frequency
V
0
^ sample volume
k ^ incoming Bloch state
k ^ outgoing Bloch state
G ^ reciprocal lattice vector
r ^ point of electron
R
i
^ point of lattice ion
H
eion
^ potential energy of an electron in the eld of all ions of lattice^interaction
Hamiltonian
e
q
^ unit polarization vectors
c ^ speed of sound
D
^ Debye temperature
s
^ temperature related to longitudinal sound velocity
d ^ dimensionality of metallic system
L
exp
^ Wiedemann-Franz ratio
W
exp
^ total measured electronic thermal resistivity
exp
^ electrical resistivity
U
^ umklapp electron-electron value of the eectiveness parameter
W
ep
^ ideal thermal resistivity of metals
M ^ mass of an ion
C
2
j
^ coupling constant
M
a
^ average atomic mass
n
c
^ number of atoms in a primitive cell
^ high temperature Gru neisen constant
0
^ low temperature heat capacity
N
D
^ dislocation density
B ^ Burgers vector of dislocation
T
L:T:
^ low temperature domain
T
H:T:
^ high temperature regime (T = 1)
k ^ electron wave vector
q ^ phonon small wave vector
C ^ constant
D ^ constant
Ch. 1.3 Murashove & White
^ thermal conductivity
C ^ heat capacity per unit volume
v ^ average phonon group velocity
^ heat transfer in gases
m ^ polarization branch
!
D
^ Debye cut-o frequency
l ^ mean free path of phonons
t ^ relaxation time
k ^ wave vectors
n ^ number of atoms
n
D
^ Debye cut-o frequency
! ^ frequency
G ^ reciprocal lattice vector
X LIST OF SYMBOLS
N ^ phonon concentration
t ^ time
d ^ dimension
A ^ temperature-independent parameter
V
0
^ eective volume of defects
M ^ mass of regular elementary unit of substance
M ^ dierence in mass btw defect and regular unit
0
D
^ Debye characteristic temperature
?? ^ static binding energy
r
0
^ nearest-neighbor distance
.
0
^ characteristic resonant frequency
l ^ interatomic spacing
D ^ coecient depticting strength of host-guest coupling
0
E
^ Einstein temperature
0
C
^ cut-o frequency
h ^ refractive index
o ^ Stefan-Boltzmann constant
k
r
^ Rosseland mean absorption coecient
Ch. 1.4 Nolas & Goldsmid
t ^ relaxation time
E ^ energy
r ^ constant
t
0
^ constant
i ^ electric current
-e ^ electronic charge
u ^ velocity of charge carriers in x direction
f(E) ^ Fermi distribution function
g(E) ^ carrier distribution function
^ Fermi energy
m* ^ eective mass of carriers
1 ^ electric eld
c ^ Seebeck coecient
i
e
^ electronic thermal conductivity
g ^ density of states
^ E/K
B
T
F
n
^ Fermi-Dirac integral
K
S
^ integrals
j ^ reduced Fermi energy
^ gamma function
m ^ mobility of charge characters
L ^ Lorenz number
r ^ scattering parameter
i ^ electric current density
i
L
^ lattice contribution to total thermal conductivity
l
t
^ mean free path of phonon
c
v
^ specic heat per unit volume
LIST OF SYMBOLS XI
v ^ speed of sound
0
D
^ Debye temperature
. ^ angular frequency of phonons
b ^ constant
A ^ constant
B ^ constant
C ^ constant
c
i
^ concentration of unit cells
M
i
^ mass of unit cells
`` ^ average mass per unit cell

M ^ average atomic mass
N ^ number of cells per unit volume
.
D
^ Debye frequency
L ^ grain size
`
D
^ lattice conductivity
V ^ average atomic volume
^ Gru neisen parameter
c
T
^ thermal expansion coecient
^ compressibility
, ^ density
R ^ gas constant
T
m
^ melting temperature
c
m
^ melting energy
N
A
^ Avagadros number
A
m
^ mean atomic weight
Ch. 1.5 Nolas
Z ^ thermoelectric gure of merit
c ^ Seebeck coecient
i ^ thermal conductivity
i
E
^ electronic contribution to thermal conductivity
T ^ temperature
y
max
^ maximum lling fraction
y ^ lling fraction
G ^ guest ion
i
L
^ lattice thermal conductivity
U
iso
^ mean square displacement average over all directions
^ vacancy
L ^ tting parameter#represents inelastic scattering length
Ch. 1.6 Mahan
J
Q
^ heat ow
o
B
^ boundary conductance
R
B
^ boundary resistance
K ^ thermal conductivity at zero electric eld
XII LIST OF SYMBOLS
K ^ thermal conductivity
S
B
^ boundary impedence
K
B
^ boundary impedence
`
q
^ phonon mean free path
R
i
^ site location
v
i
^ site velocity
.
`
^ frequency
q ^ wave vector
` ^ polarization
N ^ number unit cells
^ polarization vector
l
`p
^ mean free path of phonon
"/ ^ Plancks constant
T ^ temperature
T
e
^ temperature for electrons
T
p
^ temperature for phonons
K
e.p
^ bulk thermal conductivity of electrons and phonons
P ^ constant
,J
2
^ Joule heating
` ^ length scale
r ^ point in time
t ^ time
v
z`
(q) ^ velocity of phonon
t
`
(q) ^ lifetime
h
B
(w
`
(q)) ^ Boson occupation function
Ch. 1.7 Yang and Chen
Z ^ gure of merit
i
E
^ thermal conductivity of electrons
i
L
^ electrical conductivity
S ^ Seebeck coecient
Ch. 2.1 Tritt & Weston
i
L
i
E
^ electronic contribution to total thermal conductivity
i
TOT
^ the total thermal conductivity,
P
SAM
^ the power owing through the sample,
L
S
^ the sample length between thermocouples,
T ^ the temperature dierence measured and
A ^ the cross sectional area of the sample through which the power ows.
P
LOSS
^ the power that is lost (radiation, conduction etc.)
P
IN
^ is the power input
c ^ thermopower
T ^ temperature gradient
o
SB
^ the Stephan-Boltzman constant o
SB
= 5.7 x 10
8
W/m
2
-K
4
)
LIST OF SYMBOLS XIII
c ^ emissivity
T
SAM
^ the temperature of the sample
T
SURR
^ the temperature of the surroundings
o ^ the electrical conductivity
, ^ the electrical conductivity
L
0
^ the Lorentz number
C ^ heat capacity
I ^ electric current
r
1
. r
2
^ sample radii for the radial ow method
1 ^ thermal diusivity
C
p
^ heat capacity
K ^ thermal conductance
T
PP
^ temperature gradient peak to peak
dQ,dT^ the time rate of change of heat in the heater
T
1
^ the heater temperature
C ^ the heater heat capacity
1 ^ the heater resistance
1 ^ the sample thermal conductance
T
0
^ bath temperature
t ^ relaxation time
V
A
^ adiabatic voltage
V
IR
^ resistive voltage
V
TE
^ thermoelectric voltage
Q
P
^ Peltier Heat
R
C1
^ Contact Resistance
ZT ^ gure of merit
Ch. 2.2 Borca-Tasciuc and Chen
. ^ angular modulation frequency
I
0
^ amplitude
P ^ power
R
h
^ resistance
T
2.
^ amplitude of AC temperature rise
^ phase shift
C
^ temperature coecient of resistance

R
0
^ heater resistance under no heating conditions
V ^ voltage
V
1.
^ amplitude of the voltage applied across the heater
b ^ half-width of the heater
p/w ^ power amplitude dissipated per unit length of the heater
d
F
^ lm thickness
k
F
^ cross-plane thermal conductivity of the lm
T
s
^ temperature rise at the lm-substrate interface
c
s
^ thermal diusivity of the substrate
h ^ constant 1
f
linear
^ linear function of ln.
K
Fxy
^ ratio between the in-plane and cross-plane thermal conductivity
k
y
^ cross-plane thermal conductivity
XIV LIST OF SYMBOLS
k
x
^ in-plane thermal conductivity
d
h
^ heater thickness
(,c
h
^ heat capacitance
R
th
^ thermal boundary resistance
T ^ average complex temperature rise
L ^ distance from the heater to the heat sink
T
h
^ heater temperature rise
T
s
^ temperature of the sink
R
Membraam
^ thermal resistance of the membrane
R
Heater
^ total thermal resistance
T(x,t) ^ temperature response of a thin lm membrane
c ^ thermal diusivity along the membrane
2A ^ magnitude of the heat ux along x
T
ac
^ AC temperature
0 ^ complex amplitude of the ac temperature rise
q ^ amplitude of the heat ux generated by the heater
m ^ (i2./c)
1,2
as dened in the text
o ^ Stefan-Boltzmann constant
T
0
^ ambient and heat sink temperature
R ^ bridge electrical resistance
c ^ emissivity
t ^ time constant of the bridge
P
^ cross-section
k ^ thermal conductivity
r ^ reectivity
Ch. 3.1 Sun & White
T
c
^ superconducting transition temperature
ZT ^ gure of merit
S ^ Seebeck coecient
Z ^ average coordination number
<r> ^ mean coordination number
Ch. 3.2 Pope and Tritt
i
L
i
E
^ electronic contribution to total thermal conductivity
i
TOT
^ the total thermal conductivity,
c ^ thermopower
T ^ temperature gradient
o ^ the electrical conductivity
, ^ the electrical conductivity
L
0
^ the Lorentz number [2.45 x 10
8
(V/K)
2
]
ZT ^ gure of merit
LIST OF SYMBOLS XV
Ch. 3.3 Savage & Rao
o
tot
^ total electrical conductivity
o
c
^ electron conductivity
o
/
^ hole conductivity
n ^ electron concentration
j ^ carrier mobility
j
/
^ hole mobility
, ^ electrical resistivity
,
1
^ electrical resistivity due to scattering by phonons
,
1
^ residual electrical resistivity due to scattering by impurities and defects
1 ^ electrical resistance
,
1
^ electrical resistivity for empty single wall carbon nanotube bundles
,
1
^ electrical resistivity for lled single wall carbon nanotube bundles
/ ^ Boltzmann constant
c ^ electron charge
1
1
^ Fermi energy
1
q
^ energy gap
o ^ thermopower
o
d
^ diusion thermopower
o
q
^ phonon-drag thermopower
o
tot.ict
^ total thermopower in metals
o
:ci
^ thermopower in semiconductors
T ^ temperature
p ^ hole concentration
C ^ heat capacity
^ phonon mean free path
,
Q
^ rate of heat ux
l ^ energy
C
j
^ heat capacity at constant pressure
C
.
^ heat capacity at constant volume
C
j/
^ heat capacity contribution due to phonons
C
c|
^ heat capacity contribution due to electons
H ^ magnetic eld
7T ^ gure of merit
LA ^ longitundinal acoustic
XVI LIST OF SYMBOLS
CONTENTS
Section 1. ^ Overview of Thermal Conductivity in Solid Materials
Chapter 1.1 ^ Theory of Thermal Conductivity (Jihui Yang)
Introduction 1
Simple Kinetic Theory 2
Electronic Thermal Conduction 3
Lattice Thermal Conductivity 9
Summary 17
References 17
Chapter 1.2 ^ Thermal Conductivity of Metals (Ctirad Uher)
Introduction 21
Carriers of Heat in Metals 22
The Drude Model 24
Specic Heat of Metals 29
The Boltzmann Equation 32
Transport Coecients 35
Electrical Conductivity 40
Electrical Thermal Conductivity 44
Scattering Processes 46
Impurity Scattering 46
Electron-Phonon Scattering 50
Electron-Electron Scattering 61
Eect of e-e Processes on Electrical Resistivity 64
Eect of e-e Processes on Thermal Resistivity 69
Lattice Thermal Conductivity 73
Phonon Thermal Resistivity Limited By Electrons 73
Other Processes Limiting Phonon Thermal Conductivity in Metals 77
Thermal Conductivity of Real Metals 79
Pure Metals 79
Alloys 86
Conclusion 87
References 88
Chapter 1.3 ^ Thermal Conductivity of Insulators and Glasses
(Vladimir Murashov and Mary Anne White)
Introduction 93
Phononic Thermal Conductivity in Simple, Crystalline Insulators 94
Acoustic Phonons Carry Heat 94
Temperature-Dependence of 96
Impurities 97
More Complex Insulators: The Role of Optic Modes 97
Molecular and Other Complex Systems 97
Optic-Acoustic Coupling 99
Thermal Conductivity of Glasses 100
Comparison with Crystals 100
More Detailed Models 100
The Exception: Recent Amorphous Ice Results 101
Minimum Thermal Conductivity 101
Radiation 102
References 102
Chapter 1.4 ^ Thermal Conductivity of Semiconductors
(G. S. Nolas and H. J. Goldsmid)
Introduction 105
Electronic Thermal Conductivity in Semiconductors 106
Transport Coecients for a Single Band 106
Nondegenerate and Degenerate Approximations 109
Bipolar Conduction 110
Separation of Electronic and Lattice Thermal Conductivities 112
Phonon Scattering in Impure and Imperfect Crystals 114
Pure Crystals 114
Scattering of Phonons by Impurities 115
Boundary Scattering 117
Prediction of the Lattice Thermal Conductivity 118
References 120
Chapter 1.5 ^ Semiconductors and Thermoelectric Materials
(G. S. Nolas, J. Yang, and H. J. Goldsmid)
Introduction 123
Established Materials 124
Bismuth Telluride and Its Alloys 124
Bismuth and Bismuth-Antimony Alloys 126
IV-VI Compounds 127
Silicon, Germanium, and Si-Ge Alloys 128
Skutterudites 129
Binary (Unlled) Skutterudites 130
Eect of Doping on the Co Site 132
Filled Skutterudites 133
Clathrates 137
Half-Heusler Compounds 141
Eect of Annealing 142
Isoelectronic Alloying on the M and Ni Sites 142
Eect of Grain Size Reduction 144
XVIII CONTENTS
Novel Chalcogenides and Oxides 145
Tl
9
GeTe
6
146
Tl
2
GeTe
5
and Tl
2
SnTe
5
146
CsBi
4
Te
6
147
NaCo
2
O
4
147
Summary 149
References 149
Chapter 1.6 ^ Thermal Conductivity of Superlattices (G. D. Mahan)
Introduction 153
Parallel to Layers 154
Perpendicular to Layers 154
Thermal Boundary Resistance 154
Multilayer Interference 156
What is Temperature? 157
Superlattices with Thick Layers 159
Non-Kapitzic Heat Flow 161
Analytic Theory 162
Summary 163
References 164
Chapter 1.7 ^ Experimental Studies on Thermal Conductivity of Thin Film and
Superlattices (Bao Yang and Gang Chen)
Introduction 167
Thermal Conductivity of Metallic Thin Films 169
Thermal Conductivity of Dielectric Films 171
Amorphous SiO
2
Thin Films 171
Thin Film Coatings 173
Diamond Films 174
Multilayer Interference 174
Thermal Conductivity of Semiconductor and Semimetal Thin Films 174
Silicon Thin Films 175
Semimetal Thin Films 177
Semiconductor Superlattices 178
Conclusions 182
Acknowledgments 182
References 182
Section 2 ^ Measurement Techniques
Chapter 2.1 ^ Measurement Techniques and Considerations for Determining
Thermal Conductivity of Bulk Materials (Terry M. Tritt and David Weston)
Introduction 187
Steady State Method (Absolute Method) 188
Overview of Heat Loss and Thermal Contact Issues 189
Heat Loss Terms 191
The Comparative Technique 193
The Radial Flow Method 195
Laser-Flash Diusivity 197
CONTENTS XIX
The Pulse-power Method (Maldonado Technique) 199
Parallel Thermal Conductance Technique 200
Z-Meters or Harman Technique 201
Summary 202
References 202
Chapter 2.2 ^ Experimental Techniques for Thin^Film Thermal Conductivity
Characterization (T. Borca-Tasciuc and G. Chen)
Introduction 205
Electrical Heating and Sensing 208
Cross-Plane Thermal Conductivity Measurements of Thin Films 208
The 3! Method 208
Steady-State Method 213
In-Plane Thermal Conductivity Measurements 214
Membrane Method 216
Bridge Method 222
In-Plane Thermal Conductivity Measurement without Substrate
Removal 225
Optical Heating Methods 225
Time Domain Pump-and-Probe Methods 226
Frequency^Domain Photothermal and Photoacoustic Methods 230
Photothermal Reectance Method 230
Photothermal Emission Method 230
Photothermal Displacement Method 231
Photothermal Defelection Method (Mirage Method) 231
Photoacoustic Method 231
Optical-Electrical Hybrid Methods 232
Summary 233
Acknowledgments 234
References 234
Section 3 ^ Thermal Properties and Applications of Emerging Materials
Chapter 3.1 - Ceramics and Glasses (Rong Sun and Mary Anne White)
Introduction 239
Ceramics 239
Traditional Materials with High Thermal Conductivity 240
Aluminum Nitride (AlN) 240
Silicon Nitride (Si
3
N
4
) 243
Alumina (Al
2
O
3
) 244
Novel Materials with Various Applications 244
Ceramic Composites 244
Diamond Film on Aluminum Nitride 244
Silicon Carbide Fiber-reinforced Ceramic Matrix Composite
(SiC-CMC) 244
Carbon Fiber-incorporated Alumina Ceramics 245
Ceramic Fibers 245
Glass-ceramic Superconductor 245
Other Ceramics 246
XX CONTENTS
Rare-earth Based Ceramics 246
Magnesium Silicon Nitride (MgSiN
2
) 247
Thermoelectric Ceramics 247
Glasses 248
Introduction 248
Chalcogenide Glasses 248
Other Glasses 249
Conclusions 250
References 250
Chapter 3.2 ^ Thermal Conductivity of Quasicrystalline Materials
(A. L. Pope and Terry M. Tritt)
Introduction 255
Contributions to Thermal Conductivity 257
Low-Temperature Thermal Conduction in Quasicrystals 257
Poor Thermal Conduction in Quasicrystals 258
Glasslike Plateau in Quasicrystalline Materials 258
Summary 259
References 259
Chapter 3.3 ^ Thermal Properties of Nanomaterials and Nanocomposites
(T. Savage and A. M. Rao)
Nanomaterials 262
Carbon Nanotubes 262
Electrical Conductivity, 262
Thermoelectric Power (TEP) 265
Thermal Conductivity, 271
Heat Capacity, C 274
Nanowires 276
Thermoelectric Power 277
Thermal Conductivity and Heat Capacity 278
Nanoparticles 278
Nanocomposites 279
Thermal Conductivity 280
Applications 280
References 282
Index 285
CONTENTS XXI

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^ phonon distribution function

^ phonon scattering relaxation time

`` ^ constant vector-determine s anisotropy of phonon distribution

`` ^ average mass per unit cell

^ temperature coecient of resistance

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