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  • Mechatronic News Edge Grip Endeffektor EG 450 English 07-04-2011

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    sandeep5
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    mechatronic systemtechnik gmbh, a manufacturer of thin-wafer handling systems based in Austria, has developed a new edge grip end effector that is capable of handling 450mm (18-inch) wafers. This expands mechatronic's portfolio of edge grip end effectors, which previously supported wafers of 150mm, 200mm, and 300mm in diameter. The new end effector fixes the wafer laterally between stationary and movable pins, touching only the edge exclusion area to reduce contamination and damage risks. It is designed for both chip- and back-side handling of silicon wafers and other materials.

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    mechatronic systemtechnik gmbh, a manufacturer of thin-wafer handling systems based in Austria, has developed a new edge grip end effector that is capable of handling 450mm (18-inch) wafers. This expands mechatronic's portfolio of edge grip end effectors, which previously supported wafers of 150mm, 200mm, and 300mm in diameter. The new end effector fixes the wafer laterally between stationary and movable pins, touching only the edge exclusion area to reduce contamination and damage risks. It is designed for both chip- and back-side handling of silicon wafers and other materials.

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    55 vues2 pages

    Mechatronic News Edge Grip Endeffektor EG 450 English 07-04-2011

    Transféré par

    sandeep5
    mechatronic systemtechnik gmbh, a manufacturer of thin-wafer handling systems based in Austria, has developed a new edge grip end effector that is capable of handling 450mm (18-inch) wafers. This expands mechatronic's portfolio of edge grip end effectors, which previously supported wafers of 150mm, 200mm, and 300mm in diameter. The new end effector fixes the wafer laterally between stationary and movable pins, touching only the edge exclusion area to reduce contamination and damage risks. It is designed for both chip- and back-side handling of silicon wafers and other materials.

    Droits d'auteur :

    Attribution Non-Commercial (BY-NC)
    Téléchargez comme PDF, TXT ou lisez en ligne sur Scribd
    Signaler comme contenu inapproprié
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    News

    mechatronic systemtechnik gmbh is ready for handling 450mm (18) wafers


    (Villach/Austria, April 7, 2011) Carinthia-based mechatronic systemtechnik gmbh manufacturer of thin-wafer handling systems announces a new edge grip end effector capable of handling 450mm (18) wafers. The new component means an extension of mechatronics portfolio of edge grip end effectors for wafer-diameters of 150mm (6), 200mm (8) and 300mm (12) by adding the capability of handling 450mm (18) wafers to mechatronics handling solutions. The edge grip technology fixes the wafer laterally at its edge between two stationary and two movable PEEK stop pins. Due to this special design of the holding mechanism the wafer is touched at edge exclusion area only while the process area is kept in certain distance to the end effector, regardless the spatial orientation. Therefore, the risk of contamination or damage is reduced significantly. The end effector is designed for chip- and back-side handling and can be utilized for silicon wafers as well as other materials (i.e. glass).

    Edge Grip Endeffector EG 450 with 450 mm (18) wafer

    Side-view and detail of the end effector with 450mm (18) wafer

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    About mechatronic systemtechnik gmbh mechatronic systemtechnik gmbh based in Villach (Austria) develops, manufactures and markets special-purpose machines for the semiconductor industry since 1998 and has a world-wide unique product portfolio for handling of silicon thin-wafers. Discs made from semiconductor material find application above all in the growing market of entertainment electronics, e.g. mobile phones, MP3 players, digital cameras or camcorders. With their patented thin wafer handling systems, mechatronic systemtechnik has a unique selling proposition in the international market. mechatronic systemtechnik handling-systems transport wafers contactless and 100 percent automatic. Various processes and instruments have been developed for this purpose. Depending upon customer requirements, these can be installed, e.g. Bernoulli (Vacuum) Technology. This gives a minimum technological lead of four years. Leading international companies such as Infineon, NXP, Nikon, Rudolph, TSMC, UMC, ASE, STATS ChipPAC, ... are amongst the customers. Contact: Martina Lintner Public Relations mechatronic systemtechnik gmbh Tiroler Strae 80 A-9500 Villach Tel.: +43-(0)4242-33999-0 Email: martina.lintner@mechatronic.at Internet: www.mechatronic.at

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