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TABLE OF CONTENTS :
Serial no.
Topics
1 2 3 4 5 6 7 8 9 10 11 12 13
Introduction to solid state devices Diodes Schottky diodes Construction Real Schottky diodes Schottky barrier diode Schottky junction Operation of schottky diodes V-I characteristics Comparison with p-n junction diodes Advantages Applications References
ACKNOWLEDGEMENT
The topic is about the SCHOTTKY DIODE and consists a stipulated amount of information about its types . The project has been conveniently and satisfactorily completed by me. For the completion of this project I want to convey my gracious thanks to the Wi-Fi connection of the Lovely University, whose internet connection contributed a lot to make an end to this project . Gyan Ankush Das
DIODES :
Diodes are the fundamental electronic building block. They have a very good ability to restrict current flow substantially to one direction is a critical property relied upon in every electronic circuit manufactured till date, from the smallest power supply to the largest industrial process control. In recent years, mobile communication equipment which includes digital cellular phones and high speed data communication equipment have been required to be small, thin and lightweight, low power consumption, a high frequency and multi bands. In response to reduction in the size of the high frequency module, various diodes which includes a variable capacitance diode, a PIN diode, a Schottky diode which is used in the high frequency module are required to be small.
SCHOTTKY DIODES :
Schottky diodes are those semiconductor devices which consists of a metal semiconductor transition as their basic structure and its basic electronic properties are defined by this transition.
CONSTRUCTION :
It is formed by the connection of a metal or silicide layer to a doped semiconductor layer. A barrier known as the Schottky barrier is formed at the junction of the metal layer and the doped semiconductor layer. A separate metallization layer is insulatively disposed over the substrate to provide an electrical contact to the Schottky contact layer.
Figure : Deposited metal and oxide film Schottky diode It is also safe to interpose a separate diffusion barrier layer between the metallization layer and the underlying Schottky contact layer to prevent interdiffusion of the metallization layer with the Schottky layer and the semiconductor substrate. These diodes
consist of a metal semiconductor transition as their basic structure and whose basic electronic properties are defined by this transition.
SCHOTTKY JUNCTION :
It is formed by plating a very pure metal, typically by evaporation under vacuum, onto a wafer that has been doped with either p-type or n-type dopant atoms. When these materials are brought into contact and equilibrium is achieved, then their Fermi levels become equal. Electrons from semiconductors lower their energy levels by inward flow into the metal resulting in the accumulation of charge in the interface, distorting the energy bands in the semiconductor. This creates the Schottky barrier which prevents more electrons from flowing from the n-type material to the metal without assistance from an external energy source of the correct polarity to elevate their energy above the Schottky barrier height. The external energy of the opposite polarity increases the barrier height, thus preventing conduction. When the metal is brought into contact with the n-type semiconductor during fabrication of the chip, electrons diffuse out of the semiconductor into the metal leaving a region known as the depletion layer under the contact which consists of no free electrons. This region contains donor atoms. The process of diffusion continues until the semiconductor is so positive with respect to the, that no more electrons can go into the metal. The voltage difference between the metal and the semiconductor is referred to as the contact potential, and falls in the range 0.3-0.8 V for typical Schottky diodes.
allowing the current to pass through the structure more readily with one polarity than the other.
Figure : Tendency of forward voltage drop with different types of voltage and barrier height
ADVANTAGES :
High speed. High frequency. Low forward voltage drop. Low heat dissipation
APPLICATIONS :
They are widely used in ICs such as decoupling devices in digital circuits (silicon bipolar and gallium-arsenide MOSFET ) because they are majority carrier devices. They are used as clamping devices to prevent heavy saturation of bipolar transistors.
Figure : An N-P-N transistor with schottky diode clamp They are used as a switch to speed up operations. It is an important power device such as OR circuits- Here a load is driven by two power supplies. In this case it is necessary that the power from one supply does not enter the other and is achieved by using diodes. It is used extensively as output rectifiers in switching mode power supplies- Their high current density and low forward voltage drop means that less power is wasted as compared to ordinary p-n diodes. This increased efficiency means that less heat is to dissipate. It is used in high switching applications, such as motor drives, switching of communication device, industry automation and electronic automation. It is also useful in solar cell applications- Solar cells are connected to rechargeable batteries because power may be required 24 hours a day. A diode is required in series with the solar cells. Any drop in voltage results in a reduction in efficiency and therefore a low voltage drop diode is needed.
REFERENCES
powerelectronics.com/mag/405PET31.pdf www.electro-tech-online.com/.../17640-difference-between-