Silicon3D Microelectronics

Si3D develops and markets Converged Enterprise Communication Systems integrating IP-EPBX, Router & Server in a unified & cost-effective platform for SOHO & SME applications. Our products have industrys smallest footprint, competitive price and feature-rich with Internet/Cloud support offering a Plug-n-Play user experience. 1. Modular H/W design leverages patented SiP (System-in-Package) technology achieving cost & size advantages with quick scalability to customer requirements. 2. S/W architecture integrates our proprietary embedded S/W with open-source user interface enabling standard applications. 3. Offers true converged Quad-play Gateway (Voice / Video / Data / Wireless) with integrated Router & Server Si3D is located in Bangalore, India and San Jose, California.

Si3D Solutions in the Network: Unified & Optimized Office-in-a-Box & Home-in-a-Box

Si3D Solutions
Si3Ds Converged Enterprise Communication Systems includes Gateway products, Analog & Digital Telephony Line Cards & some associated peripherals like VoIP Phones & Wi-Fi Extenders. Our converged systems offer true quad-play (Voice, Video, Data, and Wireless) enterprise system solution where cost, ease of use, scalability, support & porting custom applications are often the ultimate considerations.

Solution Office-in-a-Box (IP-PBX, Router, Server)

Key Spec. SOHO: 8 FXO/FXS, 50 SIP, Wi-Fi SME: 16-128 FXS, 100-300 VoIP, 1/2 PRI, 1U 4/8/16 GSM

Gateway / IAD

4/8/24/32/64 FXO/FXS 1/2/4/8 PRI

Home-in-a-Box

4/8FXS/FXO, GSM, HDMI, RF, Wi-Fi, Router IP Phone with FXO (PSTN)

Peripherals

Wi-Fi VoIP Router Wi-Fi Extender (Bridge + AP) 4/8/16 FXO/FXS

Asterisk PCI / PCIe Line cards

1/2 PRI + 4/8 FXS 4/8 GSM

Si3D Technology

Si3Ds innovative SiP (System-in-Package) technology underscored by several US patents, which is the key technology barrier, is leveraged to make very cost effective and small form-factor communication modules like FXS, FXO, PRI, Echo Cancellation, GSM, Wi-Fi Router, etc. with embedded S/W. These modules are scalable & optimized for higher integration, performance and price. As a result, our solutions deliver over 50% size reduction and dramatic cost advantage.

Our system architecture is built around the telecom SiP modules and other associated components for scalability & quick configuration. The embedded drivers, firmware & software provide highly efficient & reliable proprietary backbone interfacing with open source Linux (CentOS) & Asterisk (the Android of Telephony). This allows the end user to avail of a large no. of applications & optimize the product based on the target requirement enabled by VPN / Cloud based support.

Si3D Patents
Si3D till date has filed 6 provisional US patents in the areas of implementing highly integrated telecommunication line card modules and Router functions & MIMO Antenna

using SiP technology. The innovation is in the RF Antenna design using AMC (Artificial Magnetic Conductor) & Packaging technology (thermal management). In future, further patents in the area of Modular System & Load Balancing architecture are expected.