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Laser Micromachining: Advantages of Liquid Environments

Marc J. Palmeri Princeton University Arnold Lab

Outline
Motivation
Applications of laser micromachining Problems with laser micromachining

How do lasers work? What is laser micromachining? Micromachining assembly Methods & Techniques
General setup Laser micromachining in liquid environment

Results Conclusions Future Research

Motivation
Many applications require detailed, controlled structures on small scales
Drilling (PC boards) Inkjet printer nozzles MEMS (data storage, controls) Medical devices Cutting of high-strength materials

Laser micromachining
High precision/resolution/speed Problems
Accumulation of ablated material Heat affected zone 0.3mm thick layer of diamond

How can we improve the quality of laser micromachined structures?

How do lasers work?


Light Amplification by the Stimulated Emission of Radiation Monochromatic, directional, coherent Pump source
Electricity, Light source (lamp, flashtube), Another laser Diode-pumped, Solid-state, Qswitched Laser
Pump source = laser diodes Lasing material = Neodymium: Yttrium Aluminum Garnet, or Nd:YAG ( = 1064 nm) Q-switching: produces laser pulses (nanoseconds) Lithium Triborate (LBO) used as frequency doubler/tripler

Lasing material
Solid-state, dye, gas, semiconductor

Mirrors
Partial and total reflectors

What is laser micromachining?


Short laser pulses strike sample surface
P = E/t (~106-109 W/cm2)

Sample absorbs energy


Ablated material is scattered
Accumulates on or near ablation

Heat affected zone

Micromachining Assembly
Optical Assembly
Mirrors, telescope, converging lens Controls spot size

XY-stage
Software (NViewMMI) controls movement

Ndrive
Controls Pulse Synchronized Output (PSO) of laser

Optical Assembly

Methods & Techniques System Setup


Link XY-stage, Ndrive, computer software
Wiring
Joystick (XY-stage) Ndrive
Fires laser pulse depending on movement of stage

Computer programs using XY-stage software


Aperture Array of small circles Rectangular bars

Methods & Techniques Micromachining


Focus laser beam (optics/ microscopy) Make patterns on samples
Steel, Silicon, Ti64 (Ti-6Al-4V)

Obtain images of sample (microscopy) Compare laser ablation of polished Si wafer in air/water
Cleanliness Depth Warping of material

Why use water?


Micromachining in air
Buildup of ablated material Heat affected zone

Micromachining in water
May prevent redeposition of ablated material
May become suspended in water (gelatin effect)

May cool down heat affected zone


Heat transfer faster through water than air

Methods & Techniques (contd)


Silicon experiment in water/air environment
Test for general cleanliness of ablation Create program to make short lines with small separation Variables
Diode current: 20A, 25A, 30A, 35A Pulse spacing: 1m, 5m, 10m, 15m Environment: still air, flowing air, still water, flowing water

Diameter of beam: ~25m Optical microscope used to obtain images


Comparison made between images

Results (20A, 1m pulse spacing)

100 m (a) Si in static air

100 m (b) Si in air with air flowing across surface

100 m (c) Si in static water

100 m (d) Si in flowing water

Results (25A, 15m pulse spacing)

100 m (a) Si in static air

100 m (b) Si in air with air flowing across surface

100 m (c) Si in static water

100 m (d) Si in flowing water

Results (35A, 1m pulse spacing)

100 m (a) Si in static air

100 m (b) Si in air with air flowing across surface

100 m (c) Si in static water

100 m (d) Si in flowing water

Conclusion & Summary


Laser micromachining in flowing air/water redeposits less material than in still air/water Micromachining in water redeposits less material than in air Still water micromachining yields inconsistent results
Ablated material suspended in water

Flowing water micromachining causes deviations from desired path

Future Research
Repeat experiment with steady, laminar flow of liquid Use profilometry to determine crosssectional profiles of samples
Heat affected zone

Use SEM for higher resolution images


Depth of micromachining

Use different liquids Use different materials

References
Laser Safety Training Guide. http://web.princeton.edu/sites/ehs/laserguide/index.htm. 7/27/05. How Lasers Work. http://science.howstuffworks.com/laser3.htm. 7/30/05. Tutorial: Spot Size. http://www.iiviinfrared.com/ttr_spotsize.html. 7/30/05. Gwynne, Peter. New Technology Emerging For New and Old Lasers. http://www.spie.org/web/oer/december/dec00/cover1.html. 7/31/05. Easy Opening Selective Weakening of Flexible Film. http://www.rofin.com/index-fe.htm?start=/english/applications/flexiblepackaging/easy-opening.php. 7/31/05. MEMS/MOEMS Components & Their Applications. http://www.spie.org/Conferences/Calls/05/pw/mf/index.cfm?fuseaction=MF0 3. 8/2/05. Laser Cutting. http://www.oxfordlasers.com/applications/laser_cutting.htm. 8/2/05. New Applications. http://www.exitech.co.uk/Research.asp. 8/3/05.

Acknowledgements
Professor Craig Arnold Graduate Students
Guo-Dan Wei Euan McLeod

REU coordinators
Prof. Benziger Soonoo Aria

Fellow REU students


D.G. Escalade and crew

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