Académique Documents
Professionnel Documents
Culture Documents
AME1117
1A Low Dropout Positive Voltage Regulator
nGeneral Descriptions
The AME1117 is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage versions. Overcurrent and thermal protection are integrated onto the chip. Output current will limit as while it reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.4V Maximum at full rated output current. The AME1117 series provides excellent regulation over line, load and temperature variations.
nKey Features
l Low dropout voltage ..............1.2V at 1A l Adjustable or fixed voltages 2.5V, 3.3V, 5.0V l Typical line regulation ....... 0.2% l Typical load regulation ...... 0.15% l Adjust pin current less than 90A l Overcurrent protection l Thermal protection l Available in TO-220, TO-252, SOT-223
nApplications
l High Efficiency Linear Regulators l 5V to 3.3V Voltage Converter l Battery Charger l Post Regulators for Switching Supplies
n Typical Application
AM E1117
Load
T h e rm a l P ro te ctio n
O u tp u t
E rro r Am p.
Bandgap R e fe re n c e
A D J/C O M
Figure 1
Figure 2
n Pin Configuration
AME1117
AME 1117
1 2 3
A D J / G N D V OUT
V IN
ADJ/GND V OUT
V IN
AME 1117
1 2 3
AME1117 1
ADJ/GND
2
VOUT
3
VIN
ADJ/GND
V OUT
V IN
n Ordering Information
Part Number
AME1117ACGT AME1117BCGT AME1117CCGT AME1117DCGT AME1117ACCT
AME1117BCCT
AME1117CCCT
AME1117DCCT
5.0
AME1117ACBT
ADJ
AME1117BCBT
AME1117CCBT
AME1117DCBT
5.0
Unit V
C/W
n Electrical Characteristics
AME1117AXXX Parameter Reference voltage Line regulation * Load regulation Dropout voltage Current limit Temp. coefficient Adjust pin current Adjust pin current change Temperature stability Minimum load current RMS output noise Ripple rejection ratio Symbol V REF RegLINE RegLOAD VD IS TC IADJ IADJ TS IO VN RA Test conditions
o
Min.
Typ.
Max.
Unit V
V IN = 5V, IO = 10mA V IN = 4.75~7V, IO = 10mA V IN = 5V, IO = 10mA~1A IO = 10mA~1A, Vo = 1% V IN = 2.75~7V V IN = 2.75~7V, IO = 10mA~1A V IN
TJ = 25 C 1.238 1.250 1.262 Over Temp. 1.225 1.250 1.275 TJ = 25oC TJ = 25oC Over Temp. TJ = 25 C Over Temp. Over Temp.
o
1.0 60
V IN = 2.75~7V, IO = 10mA~1A, Over Temp. V IN = 5V, IO = 100mA, Over Temp. V IN = 5V TJ = 25oC V IN = 5V, IO = 1A, Over Temp.
5 % 10 mA %V O dB
AME1117BXXX Parameter Output voltage Line regulation Load regulation Symbol VO RegLINE RegLOAD VD IS IQ TC TS VN RA Test conditions
o
Min. 2.475 TJ = 25 C Over Temp. 2.450 TJ = 25oC TJ = 25oC Over Temp. TJ = 25 C Over Temp.
o
Typ. 2.500 2.500 0.05 0.2 1.2 1.3 6 0.005 0.5 0.003 72
Unit V
1.0 60
Dropout voltage Current limit Quiescent Current Temp. Coefficient Temperature stability RMS output noise Ripple rejection ratio
V 13 A mA %/C % %V O dB
V IN = 5V, IO = 0A~1A, Over Temp. V IN = 4.75~7V, IO = 0A~1A V IN = 5V, IO = 100mA, Over Temp. TJ = 25oC V IN = 5V, IO = 1A, Over Temp.
AME1117CXXX Parameter Output voltage Line regulation Load regulation Symbol VO RegLINE RegLOAD Test conditions
o
Min. 3.270 TJ = 25 C Over Temp. 3.234 TJ = 25oC TJ = 25 C Over Temp. TJ = 25 C Over Temp.
o o
Typ. 3.300 3.300 0.05 0.2 1.2 1.3 6 0.005 0.5 0.003 72
Unit V
1.0 60
Dropout voltage Current limit Quiescent Current Temp. coefficient Temperature stability RMS output noise Ripple rejection ratio
VD IS IQ TC TS VN RA
V 13 A mA %/C % %V O dB
V IN = 5V, IO = 0A~1A, Over Temp. V IN = 4.75~7V, IO = 0A~1A V IN = 5V, IO = 100mA, Over Temp. TJ = 25 C V IN = 5V, IO = 1A, Over Temp.
o
Min. 4.950 TJ = 25 C Over Temp. 4.900 TJ = 25oC Over Temp. TJ = 25 C Over Temp. TJ = 25 C Over Temp.
o o
Typ. 5.000 5.000 0.05 0.2 1.2 1.3 6 0.005 0.5 0.003 72
Unit V
1.0 60
Dropout voltage Current limit Quiescent Current Temp. coefficient Temperature stability RMS output noise Ripple rejection ratio
V 13 A mA %/C % %VO dB
V IN = 7V, IO = 0A~1A, Over Temp. V IN = 7~10V, IO = 0A~1A V IN = 7V, IO = 100mA, Over Temp. TJ = 25 C V IN = 7V, IO = 1A, Over Temp.
o
V IN
IN ADJ
OUT 100
V OUT
10 Tan
164
10 Tan
Figure 3
n Performance Characteristics
1. Load Regulation 3. Temperature Stablilty
0.00
1.252
-0.05
-0.10
-0.15
-0.20
50
70
90
-50
-25
25
50
75
100
125
Temperature ( C)
Temperature ( C)
4. Dropout Voltage
1.25 1.20
3.0
1.15 1.10 1.05 1.00 0.95 0.90 0 0.2 0.4 0.6 0.8 1
35 30 25 20 15 10 5 0 -50 -25 0 25 50
75
100
125
Temperature( C)
7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9
Time (S)
n Application Descriptions
1. Output voltage adjustment Like most regulators, the AME1117 regulates the output by comparing the output voltage to an internally generated reference voltage. On the adjustable version, the VREF is available externally as 1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2 should be set to conduct 10mA (minimum output load). The output voltage is given by the following equation:
V O U T = V R EF (1+ R2 ) + I AD J x R2 R1
3. Current Limit Protection AME1117 is protected against overload conditions. Current protection is triggered at typically 1.5A.
4. Stability and Load Regulation AME1117 requires a capacitor from VOUT to GND to provide compensation feedback to the internal gain stage. This is to ensure stability at the output terminal. Typically, a 10F tantalum or 50F aluminum electrolytic is sufficient. Note: It is important that the ESR for this capacitor does not exceed 0.5. The output capacitor does not have a theoretical upper limit and increasing its value will increase stability. COUT = 100F or more is typical for high current regulator design. For the adjustable version, the best load regulation is accomplished when the top of the resistor divider (R1) is connected directly to the output pin of the AME1117. When so connected, RP is not multiplied by the divider ratio. For fixed output versions, the top of R1 is internally connected to the output. The ground pin can be connected to the low side of the load in order to eliminate ground loop errors.
RP Parasitic Line Resistance V IN IN ADJ R1 (Connect R1 to case) R2 RL OUT
V IN
C1
IN ADJ IA D J 50 A
OUT V REF R1
VOUT
R2 V O U T = V R E F (1+ R2 ) + I A D J x R2 R1
Figure 4 2. Thermal protection AME1117 has thermal protection which limits junction temperature to 150OC. However, device functionality is only guaranteed to a maximum junction temperature of +125OC. The power dissipation and junction temperature for AME1117 in DPAK package are given by PD = (VIN - VOUT) x IOUT TJUNCTION = TAMBIENT + ( PD x JA) Note: TJUNCTION must not exceed 125OC
Connect R2 to load
Figure 5
5. Thermal Consideration The AME1117 series contain thermal limiting circuitry designed to protect itself from over-temperature conditions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mentioned in thermal protection section, we need to consider all sources of thermal resistance between junction and ambient. It includes junction-to-case, case-to-heat-sink interface and heat sink thermal resistance itself. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. Proper mounting is required to ensure the best possible thermal flow from this area of the package to the heat sink. The case of all devices in this product series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive spacer is recommended.
10
n Advanced Applications
Adjustable Output Voltage
V IN = 5V
V IN
AME1117
V OUT ADJ
* V O = 1.5 ~ 3.45V
10 F
10 F R1 R2 2K 1K
10 F
**
Paralleling Regulators
V IN V IN 10 F
AME1117 V O U T
GND
* 20m
VO I O = 0 to 2A 10 F
V IN
AME1117 V O U T
GND
* 20m
* 20m is ballast resistance The inter-connection of #18 wire could act as ballast resistance.
11
V IN
V IN
AME1117
ADJ
V OUT
* VO
10 F
10 F
1K
10 F
**
* V O = Vref + V Z (V Z is breakdown voltage of Zener Diode) ** Optional for improved ripple rejection
V IN 10 F
V IN
AME1117 V O U T
GND
* VO
100 F
12
n Package Dimension
TO-220
SYMBOLS A b C1 D E e e1 e3 f H1 K CP Q L a b1 R MILLIMETERS MIN MAX 4.06 4.83 0.63 1.02 0.35 0.60 14.22 14.99 9.66 10.54 2.79 4.83 5.33 1.14 1.40 1.14 1.40 5.94 6.55 2.29 2.92 3.71 3.96 2.62 2.87 12.70 14.27 3D 7D 1.14 1.52 6.17 REF. INCHES MIN MAX 0.160 0.190 0.025 0.040 0.0138 0.0236 0.056 0.590 0.385 0.415 0.110 0.190 0.210 0.045 0.055 0.045 0.055 0.234 0.258 0.090 0.115 0.146 0.156 0.103 0.113 0.500 0.5618 3D 7D 0.0449 0.06 0.243 REF.
Notes : 1. Dimension C1 apply for tin plate finish. 2. For solder dip lead finish dimension C1 should be 0.015"-0.027" (0.38-0.69)
SOT-223
SYMBOLS
A A1 B B1 C D E e e1 H L L1 L2 a
MILLIMETERS MIN MAX 1.50 1.80 0.02 0.10 0.60 0.838 2.895 3.15 0.24 0.381 6.299 6.706 3.30 3.708 2.30 BSC 4.60 BSC 6.70 7.30 0.91 MIN 2.00 MAX 0.06 BSC 10? 0?
INCHES MIN MAX 0.0591 0.0709 0.0008 0.0039 0.0236 0.033 0.1140 0.1240 0.0094 0.0150 0.2480 0.2640 0.1299 0.1460 0.090 BSC 0.181 BSC 0.2638 0.2874 0.0360 MIN 0.0787 MAX 0.0024 BSC 0? 10?
13
n Package Dimension
TO-252 (DPAK)
SYMBOLS A B C D E F G H I J K L * : Typical value
NOTES : 1. CONTROLLING DIMENSION : MILLIMETERS. 2. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS MIN MAX 0.45 0.58 1.60 1.95 0.51 0.45 0.60 6.40 6.80 5.40 5.80 2.20 2.85 * 2.30 0.90 0.97 5.20 5.50 0.89 2.03
INCHES MIN MAX 0.0177 0.023 0.06 0.0768 0.02 0.0177 0.0236 0.252 0.2677 0.2126 0.2283 0.0866 0.1122 * 0.0906 0.0354 0.038 0.20 0.22 0.035 0.08
TO-252 (DPAK)
MILLIMETERS MIN MAX 0.45 0.58 1.60 1.95 0.51 0.45 0.60 6.40 6.80 5.40 5.80 2.20 2.85 * 2.30 0.90 0.97 5.20 5.50 0.89 2.03
INCHES MIN MAX 0.0177 0.023 0.06 0.0768 0.02 0.0177 0.0236 0.252 0.2677 0.2126 0.2283 0.0866 0.1122 * 0.0906 0.0354 0.038 0.20 0.22 0.035 0.08
1. CONTROLLING DIMENSION : MILLIMETERS. 2. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
14
www.analogmicro.com
E-Mail: info@analogmicro.com
Life Support Policy: These products of Analog Microelectronics, Inc. are not authorized for use as critical components in lifesupport devices or systems, without the express written approval of the president of Analog Microelectronics, Inc. Analog Microelectronics, Inc. reserves the right to make changes in the circuitry and specifications of its devices and advises its customers to obtain the latest version of relevant information. Analog Microelectronics, Inc. , December, 2001 Document: 1014-DS1117-C
Corporate Headquarters
Analog Microelectronics, Inc.
3100 De La Cruz Blvd. Suite 201 Santa Clara, CA. 95054-2046 Tel : (408) 988-2388 Fax: (408) 988-2489