Vacuum System (Synchrotron Light Source)

J. R. Chen Synchrotron Radiation Research Center Hsinchu 30076, Taiwan The Fourth OCPA Accelerator School, Aug. 2, 2006

Vacuum System
I. II. Introduction (Vacuum and Pressure Units) Considerations on Accelerator Vacuum System III. Vacuum System Design Considerations IV. Outgas, Pumping and Pressure Distribution V. Vacuum Components and Reliability VI. Case Study

Introduction
A. Vacuum B. Pressure Units

Vacuum
Vacuum: an environment with a pressure < 1 atm Low Vacuum : Medium Vacuum: High Vacuum (HV): Very High Vacuum: Ultra High Vacuum (UHV): Extreme High Vacuum (XHV): 760 25 torr 25 10-3 torr 10-3 10-6 torr 10-6 10-9 torr 10-9 10-12 torr < 10-12 torr

Pressure units
Pressure: force per unit of area Pa: Newton/m2 (SI unit), 1 Newton = 1 kg-m-sec-2 bar: (kg/cm2), 106 dyne/cm2, 1 dyne =1 g-cm-sec-2 mbar: milli-bar, 10-3 bar, 103 dyne/cm2 Torr: mm-Hg (at 0)
1 torr = 1.333 mbar = 133.3 Pa 1.316 10-3 atm 1 Pa = 10-2 mbar 7.5 10-3 torr 9.869 10-6 atm 1 atm 760 torr 1013 mbar 1.013 105 Pa

Pressure PV= nRT

Pressure is equivalent to number density.
Number density (at room temperature): at 1 Torr, N ~ 3.2 x 1016 molec./cm3 at 10-10Torr, N ~ 3,200,000 molec./cm3 !!

Considerations on Accelerator Vacuum System

A. Accelerator Vacuum System B. Vacuum Related Beam Considerations

Accelerator Vacuum System

--- to provide a comfortable path for the particle beam (to increase the beam lifetime and also the beam quality) --- to provide a clean environment for the critical components (to keep their high performance) --- a vacuum system contains vacuum chamber, pumps, gauges, valves, mechanical and electrical feedthroughs, the related control units, and many other subsidiary components.

Vacuum Related Beam Considerations

A. Beam Lifetime Issues
Pressure: Ion/Dust Trapping: scattering scattering

B. Beam Stability Issues

Mechanical Stability: Beam Orbit Beam Duct Cross section: Impedance Chamber Material: Frequency Response Ion Effects: Beam Lifetime, Beam Size and Emittance (Electron Clouds: Beam Size and Emittance)

Beam Lifetime and Beam Size Issues

The The less less the the gas gas molecules molecules density density the the less less the the interactions interactions between between the the particle particle beams beams and and the the gas gas molecules molecules the the less less the the blow blow up up of of the the beam beam bunch bunch and and also also the the less less the the beam beam loss. loss.

Beam lifetime (electron rings)

-1 = T-1 + RGS-1 +ion-1
: Beam lifetime (in general,T <RGS<ion) T : Touschek Lifetime RGS : Residual gas lifetime ion : Ion-trapping lifetime

RGS-1 = BS-1 + NS-1 +ee-1

BS : Bremsstrahlung-scattering lifetime NS : Nuclear-scattering lifetime ee : Electron-electron-scattering lifetime (in general, NS < BS <<ee)

Bremsstrahlung-scattering lifetime
BS-1 = c BS N = c(/X0)W
where
X0: radiation length of the residual gas (g - cm-2) : density of the residual gas (g - cm-3), c : velocity of light (3x1010cm-sec-1) W = 4/3 ln( / )(5/6), probability to loss energy > , = Ee /mec2 = MP/24500 760 at room temperature M: mass of the residual gas (a.m.u.) P: pressure (torr) Ref: J. Kouptsidis and A. G. Mathewson, DESY report, DESY 76/49, 1976.

Bremsstrahlung-scattering lifetime
Assume / =1%

BS-1 = 8539 MP/ X0 sec-1 = 3.1 107 MP/ X0 hr 1

M/X0 = i (M/ X0)i

M X0

H 1

C 12

O 16

CH4 H2O CO Ar 16 18 28 40

CO2 44

58 42.5 34.2 45.5 35.9 37.3 19.4 36.1

Nuclear-scattering lifetime
NS-1 = [c1(E2A02/P0)(1/<>)]x-1 + [c1(E2A02/P0)(1/<>)]y-1
where C1 : 1.0 10-7 hr- GeV -2- nTorr-1 E : electron energy P : pressure (nTorr) A0: limiting aperture (min.[vacuum chamber, dynamic aperture]) 0 : Betatron function at the limiting aperture <> = ring ds/L, average betatron function
Ref: H. Wiedemann, Coulumb scattering and vacuum chamber aperture, SSRLACD-NOTE, Dec.13,1983.

EN-1 = c EN N EN = 4r2Z2/ 2 max2 max = (d/2)/< >

where, r : classical electron radius = 2.8 x 10-13 cm Z: atomic number = Ee/meC2 d: diameter of vacuum chamber < >: average betatron function

Assume: d= 5 cm, < > = 10m EN-1 = c EN N = 3x 1010 4 [(2.8 x 10-13)2Z2/ 2 max2] (6 1023/24500) (P/760) = 1.4 105 (Z2/E2)P hr-1

Electron-electron-scattering lifetime
ee-1 = c ee N
where ee : electron-electron scattering cross section = 5.0 10-25 (Z/ )( / ) (cm2) Z: atomic number of the residual gas N = 3.2 1016 P (# of molecules/cm3), at RT P : pressure (Torr)

Beam Stability Issues

Mechanical stability: as stable as possible vibration or thermal expansion of vacuum chambers movement of Magnets or BPMs Beam Orbit Change Beam duct cross section: as smooth as possible abrupt change of cross section wake field Induce Beam Instability (and the lost energy could also heat up vacuum components) Chamber material and thickness: Frequency Response AC or pulse magnetic field Eddy current Shielding or Changing the Original Magnetic Field and Heating the vacuum Chamber

Vacuum System Design Considerations

A. B. Basic Vacuum Issues System Operation Issues

Vacuum System Design Considerations

A. Basic Vacuum Issues
1. How to reduce pressure 2. How to overcome thermal problems

B. System Operation Issues

1. How to keep a precise mechanical structure even after baking 2. How to reduce the impact from the stringent environment (radiation, humidity, dust, etc.) 3. How to protect the vacuum system in case of an accident

Basic Vacuum Issues

--- How to reduce pressure reduce outgassing rate (material, sealing, treatment) effective pumping configuration --- How to reduce thermal problems
increase thermal conductivity (material, direct cooling) absorbers, grazing incident, differential heat removal (low Z material), cooling system

System Operation Issues

--- How to protect the vacuum system in case of an accident
device self protection (IP, IG), electrical or pneumatic actuated valves, reliable vacuum interlock system (e.g. PLC), redundant sensors, reliable utility systems (e.g. compressed air and cooling water systems)

--- How to reduce the impact from the stringent environment

high radiation resistance material, installation under clean room conditions, to avoid the condense of water vapor, and to prevent the contact with humid air (e.g. with isolation coatings, to avoid corrosion)

--- How to keep a precise mechanical structure even after baking

careful dimension control during machining and welding, rigid fixed points (at BPMs, heavy components, critical positions), bellows and flexible supports, pre-displacement so as to have an optimized-force condition for some critical components during baking, to use springs to reduce the load of heavy components

Outgas, Pumping and Pressure Distribution

A. Outgas
1. Thermal outgas 2. Photon-induced desorption

B. Pumping and Pressure Distribution

1. Throughput, Conductance and Effective Pumping Speed 2. Pumping Configurations 3. Pressure Distribution 4. Pumps

In order to get a lower pressure in the UHV range, it is much more effective to reduce outgassing rate than to increase pumping speeds. P=Q/S
where P: pressure Q: outgassing rate S: pumping speeds

Thermal desorption
1. Qth ~ exp(-Ed/kT)
Ed--- surface binding energy of the desorbed gas k --- Boltzmann constant (8.6x10-5eVK-1) T --- temperature (K)

2. Qth :
a) mechanism: surface desorption and diffusion b) can be effectively reduced by the treatments of chemical cleaning and in-situ baking c) water vapor is the major outgas before baking, hydrogen is the major outgas after baking d) Elastomers and the materials with high vapor pressure are not recommended for an UHV system.

Photon-stimulated desorption, PSD

ebeam Synchrotron Radiation Photo-electron Gas molecules I d/dt (d2N()/dId) Y(hv)F() 2 Qpsd = I d/dt (d2N()/dId)Y()F() d 2 Y, F(), Qpsd (normal incident, =90F() minimum) where, I: beam current (mA) Y(): photoelectron yield (# of electrons/ # of photons) 10eV< 1560eV for aluminum, Y() 2.61 -0.94 441.9 1.13 1560eV< < 10keV : desorption coefficient (# of molecules /# of electrons) F() sin-1/2

Ref: A.G. Mathewson et al., KEK report, KEK-78-9, (1978).

Qpsd = I d/dt (d2N()/dId)Y()F() d 2 8.6 1017 I E c-1/3 Y(c ) F() 2

where
d/dt (d2N()/dId)1.51 1014 /E2 (/c )-2/3, for c 0 for > c

I: beam current (mA) E: electron beam energy (GeV) c : critical photon energy = 2.21 103 I E3/ F() sin-1/2 : bending radius (m) for aluminum, Y(c ) = (0.41 - 1.66 c-0.6) hv 1560eV = (1 - 216.2 c-0.6) hv > 1560eV

Throughput, Conductance and Effective Pumping Speed

Throughput is the volume of gas at a known pressure and temperature that
pass a plane in a known time.

Throughput = Outgassing rate (if no absorption in the path)

Q = P(ch)S(ch) = P(pump) S(pump) = C (P(ch) P(pump)) C : conductance of the tube (unit: l/s) = function of geometry, independent of pressure for the molecular flow regime

1/S(ch) = 1/S(pump) + 1/C

S(ch) : effective pumping speed at the chamber C : conductance of the tube

It is useless to use a large pump with a narrow tube!

Pumping
Pumping Configurations
The conductance of the beam duct in an accelerator is always very small so that special pumping configurations are necessary to meet the stringent low pressure requirements. a) Distributed Pumping b) Localized Pumping

Heavy HeavyGas GasLoad Load Ante-chamber Ante-chamber+ +Localized LocalizedPumping Pumping

IP

NEG

DIP NEG IP DIP NEG IP DIP

Conductance ConductanceLimited LimitedArea Area Discrete DiscreteAbsorber Absorber+ +Localized LocalizedPumping Pumping

NEG IP IP

Insertion InsertionDevice DeviceChamber Chamber(extremely (extremelyconductance conductancelimited) limited) (Distributed (Distributedpumping) pumping)(NEG (NEGStrip Strip/ /NEG NEGcoating) coating)

TMP TMP(commissioning) (commissioning) IP+NEG IP+NEG(normal (normaloperation) operation)

TMP IP NEG

Distributed Ion Pump

Pressure Distribution
Si Pi = Qi + Ci(Pi-1 Pi ) + Ci+1(Pi+1 Pi )

Ref: D.C. Chen et al., J. of Vac. Soc. of ROC 1(1), 24(1987).

Pump considerations
a) pumping speeds b) preferred gases c) ultimate pressure d) oil free e) vibration free f) micro-dust free g) failure safe (or interlocked) h) long lifetime and maintenance free

Pumps
a) Mechanical Pumps b) Sputter ion pumps c) Getters (NEG, TSP)
(NEG: Non-evaporable getter, TSP : Ti-sublimation pump)

d) Adsorption pump e) Cryo-pump

NEG

Turbomolecular Pump (TMP)

Titanium Sublimation Pump (TSP)

Non-Evaporable Getter (NEG)

gas molecule N S

Sputter Ion Pump

Ti cathode anode (cell)

electron
magnet

Magnet field

ion N

Ti cathode S

Sputtered-Ti

Sputtered-Ti

gas molecule (trapped)

magnet

Vacuum Components and Reliability

A. B. C. D. E. F. G. Vacuum Chamber Material and Treatment Sealing Technique Valves Bellows Mechanical feedthrough Electrical feedthrough Special components

Vacuum Chamber Material (& thermal absorber)

UHV Considerations --- low defect (to avoid virtual or real leak) --- low outgassing rate, low vapor pressure --- easy machining, easy welding (increase reliability) --- bakable High Thermal Load Considerations --- high thermal conductivity --- grazing incident (to reduce thermal density) --- differential heat removal, the first layer with low Z material

Surface Treatments
1. 2. 3. 4. 5. chemical cleaning in-situ baking glow discharge cleaning surface coating high temperature degas

Sealing Technique
Welding, Tungsten Inert Gas (TIG), metal-to-metal Brazing, between two different materials, metal-toceramics, different metals, E-beam welding Flange sealing, Con-Flat Flange, O-ring, Helicoflex, metal wires (e.g. indium wire, aluminum wire, etc.) leak check, He-gas mass spectrometer
Leak rate unit: Torr-L-sec-1, Pa-m3-sec-1, atm-cc-sec-1

Valves
Gate Valves, Angle Valves, Variable Leak Valves, Fast Closing Valves All metal valves and O-ring valves Considerations: leak tight, tunability, response time, baking temperature, type of actuation, mechanical reliability and lifetime

Bellows
Flexibility, expansion/suppression dimension Rf sliding fingers (touch force, flexibility) Thermal conductivity Mechanical reliability (strength and lifetime)

How to fix ? or free suspended (vacuum force!!)

Mechanical Feedthrough
Applications:
scrapers, screen monitors, rf tunners, front-end and beam line components, etc.

Considerations:
Stroke, Precision, Heat removal (thermal contact and cooling), Mechanical Reliability (wearing and lifetime)

Electrical Feedthrough
Applications:
beam position monitors, stripline monitors, excitation electrodes, gauges, pumps, etc.

Considerations:
Frequency response, HV range, Current range Radiation induced damage (corrosion, degrade of contact or insulation)

Special Components
RF bridge Be-window Ceramic chambers Glass- and ceramic-windows

Case Study
A. TLS Vacuum System 1. Vacuum Chamber Fabrication and Treatments 2. System Installation and Operation TPS Vacuum System Design (Lessons learned from the TLS vacuum system)

B.

TLS Vacuum System

Vacuum Chamber Fabrication and Treatments
1. Aluminum vacuum chambers 2. Oil-less Fabrication Process 3. Low Impedance Structure

System Installation, Operation, and Commissioning

4. Oil-less and Effective Pumping System 5. Low-Dust Treatments 6. Vacuum Safety Interlock System

The TLS Vacuum System

A. Vacuum Chamber Fabrication 1. Aluminum vacuum chambers 2. Oil-less Fabrication Process 3. Low Impedance Structure B.System Installation and Operation 4. Oil-less and Effective Pumping System 5. Low-Dust Treatments 6. Vacuum Safety Interlock System

Aluminum vacuum chambers

Aluminum Components (B-chamber, S- chamber, flanges, gaskets, bellows, BPMs, etc.) Aluminum TIG Welding Al-Al and Al-S.S. Seals with Al Gaskets (between two chambers or components) (no transition material was used) Co-extruded or Co-machined Cooling Channels

Oil-less Fabrication Process

A. Bending Chambers
Oil-less numerical control machining in an ethyl-alcohol environment Degreased cleaning

B. Straight Chambers
Extrusion Detergent + Acid + DI water ultrasonic cleaning

Low Impedance Structure

1. Smooth Cross Section (main chamber: 38mm-H x 80mm-W) 2. Gate Valves, Bellows, Flange Gaps shielded with rf bridges 3. Smooth Transitions in Cross Sections 4. Port with small holes or slots 5. Long Slots with a Large Width to Height Ratio (in B-chamber for extraction SR to beamlines)

Oil-less and Effective Pumping System

1. Oil-less pumps were adopted sorption pump, dry pump (membrane pump + molecular drag pump), magnetic bearing turbo-molecule pump, sputter ion pump, and non-evaporable getters The pump locations and pumping speeds determined by computer simulations Localized pumping + distributed ion pump in the bending chamber Heavy dynamic gas loads mainly evacuated out of the vacuum system (by the TMPs) in the beginning of commissioning

2. 3. 4.

Low-Dust Treatments
1. 2. 3. 4. 5. Welding and pre-assembly in clean rooms. Clean booths were used during installation Ion pumps turned on after baking (at ~10-8 torr) Slow venting (if necessary) Low IP voltage (HV ~ 3kV)

TLS Vacuum System (Fabrication)

4) DIP Installation 3) Surface Cleaning 2) Dimension Check After Machining 1) NC Machining with Ethyl Alcohol

9) Installation in the Tunnel 8) Pre-assembly In Lab 7) Leak Test

5) Welding in Clean Room

6) Deformation Check After Welding

TLS Vacuum System (Fabrication)

88 80

Standard S-Chamber

38

44

80

B-Chamber

60

4.16 m

ID-Chamber for EPU5.6, U5, U9 Undulators ID-Chamber for Wiggler (W20)

174 13 17

171

17

21.5

10 mm

TLS Vacuum System (Cold Chamber)

ID-Chambers for Superconducting Wiggler SWLS (2002), SW6 (2003), IASW x3 (2005-6)

(1) Al Beam duct (Extruded)

(2) TIG welding on one side

(3) Leakage Check

(4) Flatness Check

11 mm inner height Al/SS Bimetal adaptor S.S. Taper SW6

(5) TIG Welding on the other side (with Al beam duct installed in SW6)

Temperature of beam duct ~ 100 K

TLS Operation Results (Beam Dose)

1). Accumulated Beam Dose : ~ 8622 Ah 1993.07 ~ 2005.11 (12 years) Yearly operation hour: ~5000-5500 hours

8622 Ah

TLS Operation Results (Reliability)

2). High Reliability: Vacuum Failure < 2 hr/ year
600 PS Booster 400 Hour RF Control 200 Magnet Vacuum Utility Safety 0 1996 1997 1998 1999 2000 2001 Year Other Total

Machine Failure Hours

-- About 100 hour (~2%) of the users time was lost in a year. -- Less than 2% of the failures (< 2 hours in a year) was attributed to the vacuum failure. -- The most popular items of the vacuum failures are utility related components.

TLS Operation Results (Beam Cleaning)

Installation of New Devices EPU,U5 SWLS W20 U9 SW 6 SRF cavity

a) P/I vs. Beam Dose

110-10 Pa/mA
b) I vs. Beam Dose

27 hours at 200 mA

Lesson Learned from TLS -1 1) Beam Cleaning Interrupted by New ID Installations The data of P/I and I scattered due to frequent installation of new devices.

Busy with Installation Work

Replace new Kicker Chambers W20 EPU5.6 U5 U9 SWLS SRF Cavity SW6 Top-up 300 mA

P/I vs. time

Homework to Design the TPS (Lesson-1) Q1: Beam Cleaning Interrupted by New ID Installations, How to Avoid? A1:
1) -- Most of the ID-chambers are to be fabricated and installed before the TPS is commissioned, to prevent the vacuum from being frequently broken and to allow the beam dose on the ID-chamber to be accumulated effectively. -- Some ID-chambers will be unavailable at the commissioning of the TPS, they will be cleaned in a photon beam line before installation. 2) Effective pumping system is necessary for the ID-Chamber. -- NEG strip is to be installed in a side-channel of the beam duct as a distributed pumping. The arrangement is effective to reduce the potential effects caused by the drop off of the NEG powders in the beam channel. -- Some other pumps (e.g. Ion Pump) are required to remove the inert gases and methane, which the NEG cannot do.

Lesson Learned from TLS -2 2) Effect of the Movements of Vacuum Chambers The expanded vacuum chamber moves the components touched or connected to it. The force transferred to the girder, to the magnets and then to the beam orbit.
200 100 0
0 200 400 600 800 1000

B eam C urrent

mA

1200

1400

Temp (C)

28 27 26 25 24 0 2.0 1.5 1.0 0.5 0 -0.02 -0.04 -0.06 -0.08 200 400 600 800 1000 200 400 600 800 1000

V ac-cham ber T em p

1200

1400

B P M D isplacem ent

um

1200

1400

B eam P osition

mm

200

400

600

800

1000

1200

1400

m in

Movement of the vacuum chamber, sensitivity to water temp.: ~10 m / Movement of the girder (~0.3m/) and BPM (~1m/) Induced beam orbit drift: ~10-30 m /

Homework to Design the TPS (Lesson-2) Q2: Effects of the Movements of Vacuum Chambers, How to Reduce?

A2: For vacuum chambers: 1) Independent supports fixed directly to the ground. 2) A 3mm gap between the magnet and vacuum chamber. 3) The vibration caused by water flow must be suppressed. A heavy chambers is helpful to reduce the vibration amplitude.

Lesson Learned from TLS -3 3) Vacuum Pressure and RF Impedance Need be Better

Vacuum Related Beam Instabilities

1) Pumping slots RF impedance

2) Gas molecules & ions > 1,000,000/cm3 !! (@0.1nTorr)

SGV
SGV() SGV()

RF fingers

RF fingers

RF Fingers

RF Fingers

RF Fingers

RF Fingers

RF Fingers

Al Bellows (R6S6)
Heater RF contact Cu sheet

PT100 Thermal sensor RF Fingers

Homework to Design the TPS (Lesson-3) Q3: Vacuum Pressure and RF Impedance Need be Better, How to Improve?

A3: A large B-chamber with ante-chamber structure.

5m

1) A large B-chamber can confine more PSDs locally. 2) It is easier to design with more pumps and also with a differential pumping structure in a large B-chamber to benefit the ante-chamber design, which is good in reducing the number of gas molecules (and ions) in the beam channel.

Homework to Design the TPS (Lesson-3) 4) In addition to the chambers and pumping ports, the bellows, flange gap, gate valve, tapers, BPMs, and other monitors will be carefully designed to reduce the impedance.

Movable end of RF fingers Movable end of RF fingers

Fixed end of RF fingers

(BPM-chamber: 70mm*13mmLeft side: SGV, Right side: ID )

TPS Vacuum
Parameter Beam energy (GeV) Beam current (mA) QTot at= 1x10-5 molec./e (Torr*l/s) Q (for one cell) Beam Duct Material Bending Angle of Dipole Magnet (deg.) Percentage of the synchrotron light inside the B- chamber Nominal Pumping Speed (per cell) Pump ports per cell Pressure increase (design value) at= 1x10-5 molec./ e |Z/n| (Chamber/Total) TLS 1.5 200 ~5.9x10-6 ~1x10-6 Aluminum 20 77% ~ 4000 L/s 13 (on axis) ~1.3nTorr 0.012/0.0163 TPS 3.0 400 ~2.4x10-5 ~1x10-6 Aluminum 7.5 92.8% ~ 4000 L/s 10 (off axis) ~ 0.3nTorr 0.003/0.0085 more same less 1/4 1/4 (1/2) 4x 1x Remark

Homework to Design the TPS (Lesson-4)

3 GeV, 400 mA, ~ 22 W/mm2 at L = 3.3 m (from BM source)

~196 C

Stepped surfaces ~109 C

fins in the cooling channel

Saw tooth (0.4 mm / 2 mm-step)

Crotch-1 Crotch-2

1) The thermal problem is reduced by designing a larger B-chamber, so that the crotch absorber in the Bchamber is farer away from the source point. The criteria are met by a B-chamber with ~ 5 m long. 2) By using stepped surfaces (to keep a smaller photo electric yield) and fins in the cooling channel enables the maximum temperature of the aluminum chamber surface to be reduced from ~196C to ~109C.

Vacuum Safety Interlock System

device self protection or alarm (IP, IG, TMP) electrical or pneumatic actuated valves reliable vacuum interlock system (e.g. PLC) redundant sensors reliable utility systems (e.g. compressed air and cooling water systems) Thermal problem protections