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Ref: [Keiser Ch6 and Ch7.1, 7.2, 7.4, 7.5 ][Agrawal Ch4]
Depletion region
n p
-- -- -- -- -- +
+
+
+
+
+
+
+
+
+ -
+ -- -- -- -- -- + + + + +
+ + + + +
barrier potential
P N
Region (1) : depletion region, electrons & holes swept by E (electric field)
-- drift current (fast)
Region (2) : hole and electrons diffuse randomly towards depletion region -
- diffusion current (slow)
Region (3) : far away from depletion region (useless)
Ec
hc 1.24 hν
λc = or λc (in μ m) =
Eg Eg (in eV ) Eg
Ev
Note: Two-photon or three-photon absorption are possible, but with very small probability.
(e.g. check out the three-photon lasing at http://optics.org/article/news/8/2/14 )
I = I photo + I dark
−α s w q
I photo = Pinc (1 − Re )(1 − e )
hν
where
• α ∼104 /cm
• 1.55 μm - In 0.53 Ga 0.47 As(III − V), Ge(IV)
• 1.3 μm) - In 0.7 Ga 0.3 As 0.64 P 0.36 (III-V)
• 0.85 μm - Si or GaAs
Photo-current: I p = Prec (1 − Re ) 1 − e( q
−α s w
hν
)
Define Quantum efficiency : η = (1 − R e ) 1 − e (
−α s w
) η=
Ip q
Prec (hν )
ηq
and Responsivity: Ro = Unit: A/W
hν
Thus, I p = Prec Ro
• Advantages of P-I-N: P I N
+ -
guard ring(n)
SiO2 hν SiO2
n p+
p Metal
contact n
p+ Depletion Metal
Depletion
region n+
contact
region
Avalanche photodiode pn photodiode
Depletion region
Photon carrier hν
π
p+
p+ region
Impact ionization
• a single primary electron (hole), generated
through absorption of a photon, creates Photon carrier hν
many secondary electrons and holes
Æ impact ionization coefficients: αe (electrons), αh (holes) p+ region
• Cons:
– fabrication difficulties (complex structure, high cost)
– multiplication process (random) gives additional noise
– high bias voltages (100-400 volts)
– temperature dependence of device (can be compensated by
feedback control)
4k B TB
• Thermal noise σ T2 =
Req
4k B TFt B
• In the presence of FET preamplifier, σ T2 =
Req
where Ft is the amplifier noise figure
(Ft represents the factor by which thermal noise is enhanced by various resistors
used in the preamplifier)
σ i2 = 2q(i p + iD )M FA B
100
2
50
SNR =
2
M i p2
=
(MR P )
o rec
2
2q(i p + iD )FA M B + 2qiL B + 4kBTBFt / Req 2q(Ro Prec + iD )FA M B + 2qiL B + 4kBTBFt / Req
2 2
Use SNR =
(R P )
o rec
2
• There exists an optimum APD gain (Mopt) to achieve the maximum SNR
• Recall: SNR =
(M R P )
o rec
2
2 q (R o Prec + i D )F A M B + 4 k B TBF t / R eq
2
Substitute FA = k A M + (1 − k A )(2 − 1 / M )
16
65
14
SNR (dB)
SNR (dB)
12
60
10
Prec = -40dBm Prec =0dBm
8 55
6
4 50
2
45
20 40 60 80 100 20 40 60 80 100
At high Prec, the optimum APD gain, Mopt =1 ⇒ APD even worsen the SNR
⇒ use P-I-N photodetector
At low Prec , the optimum APD gain, Mopt >1 ⇒ APD can improve the SNR
⇒ use APD photodetector
1⎡ ⎛ V ⎞⎤
Pe= ⎢1- erf ⎜ ⎟⎥
2⎣ ⎝ 2 2σ ⎠⎦
2 x
erf( x) = ∫ e − y dy
2
where
π 0
1⎡ ⎛ Q ⎞⎤
Pe= ⎢1-erf ⎜ ⎟⎥
2⎣ ⎝ 2 ⎠⎦
vth − voff von − vth
where Q is defined as Q = =
σ off σ on
P 1
NEP= = [2q ( I p + I d )]1/ 2 (unit: W Hz -1/2 )
Be1/ 2 Be =1Hz
R0
Data In
Laser Data Out
Driver PD
LD PreAmp. AGC
Fiber
Post Amp. Timing /
Data Recovery
Components Functions
Detectors (Photodiode PD) Convert hν to e-
Preamplifier 1st amplification brings μV to mV
(incoming signal ~ -30 dBm, 1A/W)
Postamplifier 2nd amplification brings mV to a usable range of a few V
Automatic Gain Control Fixes the gain / dynamic range
(AGC)
Timing and Data Recovery Retrieval of data and timing (for digital)
Ip RL CT
Ip RL CT
For examples: Si bipolar preamp or GaAs MESFET are used for high frequency (>~ GHz) and
Si MOSFET or JFET preamp are used for low frequency (<50MHz).
Rf
G
B≤
2π R f CT
-G
Ip RL CT 4k BTBFt
σ T2 =
Rf
P (mW)
Amplitude Modulation :
P = P0 [1 + m s (t )]
Ps
Po
where P0 is the received DC optical
power and m is the optical modulation I (mA)
index. s(t) is the analog modulation Ith
signal.
• JDSU:
http://www.jdsu.com/products/optical-
communications/products/detectors-receivers.html