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Topics: What is a transistor? History of transistors Views of an n-type transistor schematic and cross section channel length, channel width Where are we headed? Final cross section for CMOS CMOS vs. NMOS Layout layers for a transistor Layout and Cross section for an NMOS transistor CMOS Formation Substrate and Doping Why Isolate? Isolation, Nwell Vt Adjust Poly P+ Diffusion N+ Diffusion Final Cross Section for CMOS
1/16/01 Joseph A. Elias, PhD
gate drain
Substrate, bulk, well, or back gate
Why is this important? W, L, S, D, G are fundamental to every aspect of IC design (circuit level, gate level, layout, simulation) Each transistor is the basically the same, so know one, you know them all
1/16/01 Joseph A. Elias, PhD
Cross Section
Partial Layout
Why is this important? Design Engineers: understanding of how transistors are formed leads to better designs Process Engineers: each step in the formation is related to the next Product Engineers: debugging of product-level issues involves cross section CAD/Layout Engineers: integrating rules and determining violations to layout
1/16/01 Joseph A. Elias, PhD
1/16/01
Isolation Region
Isolation Region
Isolation Region
Isolation Region
1/16/01
Presently, most starting material (substrate) is <100> p-type silicon Silicon is a group IV element (4 outer electrons) p-type dopants are ones with less electrons, or more holes (B) n-type dopants are ones with more electrons, or less holes (P, As)
1/16/01 Joseph A. Elias, PhD
1/16/01
Diff-tap
Deposit SiO2, Si3N4, photoresist (PR) Use DiffTap (aka moat, active) mask to define isolation regions. This is where transistors will NOT be located, which is the inverse of diffusion and tap regions Grow isolation (LOCOS), or etch silicon and deposit oxide (STI), strip Si3N4 Deposit photoresist, expose NWELL mask, develop, implant N-type well (Phos) Optional : Implant field regions for channel stop (CS), punchthrough (PT)
1/16/01 Joseph A. Elias, PhD
Diff-tap
Implant will show up here as well, but be counter-doped later in the process
The order of events can vary, but in general: With NWELL pattern still on silicon, implant gate threshold adjust Strip thin oxide, regrow oxide to 30-100A (depending on process node) Done since oxide has been damaged due to implant Allows for gate oxide to be as clean as possible Purpose of Vt adjust will become apparent further in the semester
1/16/01 Joseph A. Elias, PhD
Diff-tap poly
Deposit polysilcon everywhere on wafer, deposit PR Use POLY mask to define regions where poly is to remain Expose, develop PR; etch polysilicon; implant poly with P or As
1/16/01
Pdiff
Diff-tap poly
Use Diff-Tap layout to generate, or manually draw p-diff mask Size up the diff-tap region to account for misalignment Implant is self-aligned to gate, as gate acts as a mask
1/16/01
Pdiff
Ndiff
poly
Use Diff-Tap layout to generate, or manually draw n-diff mask Size up the diff-tap region to account for misalignment Implant is self-aligned to gate, as gate acts as a mask Taps should NOT cross well boundaries!
1/16/01 Joseph A. Elias, PhD
Further processing: CT (contact) mask to open up regions in thin oxide to contact diff CT (contact) mask to open up regions over poly to contact gates Deposition of ILD (inter-level dielectric) , shown as CVD SiO2 MET1 (metal 1) mask to identify routing Deposition of ILD, VIA mask to contact MET1, MET2 mask to route Deposition of PO (protective oxide), shown as Overglass
1/16/01 Joseph A. Elias, PhD