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ABB.

ICSTT-SDS-8100
3/$17*8$5' TMR Controller
3ODQWJXDUG Controller Chassis-P8100

Dec 2002
FRONT PANEL



DESCRIPTION

The 3ODQWJXDUG Controller Chassis is designed to accommodate a maximum of
eight single-width 3ODQWJXDUG Interfaces and up to two triple-width 3ODQWJXDUG
TMR Processors.

The chassis consists of a backplane, power connection terminals, and the Inter-
Module Bus connectors. The chassis is 6U (10.5ins) high and is either front
mounted in a 483mm (19-inch) fixed frame or swingframe, or can be panel (rear)
mounted in a suitable electrical enclosure.

The two slot positions on the left (as viewed from the front) are for installing the
3ODQWJXDUG 705 3URFHVVRUV. The eight remaining slots are for installing the
3ODQWJXDUG Interfaces. Each module plugs into the chassis backplane, connecting to
the triplicated Inter-Module Bus. Double and single connector options are available.

The backplane is part of the 3ODQWJXDUG Controller Chassis and provides
electrical interconnection and other services for the modules. A triplicated 4-
position DIP switch is provided for user configuration of the system identification..

Power connection to the 3ODQWJXDUG Controller Chassis is provided via a 4-pole
connector on the chassis backplate. The 3ODQWJXDUGController Chassis is designed
for a nominal dual +24V dc power supply.










FEATURES

2 x 90mm 3ODQWJXDUG TMR
Processor slots

8 x 30mm 3ODQWJXDUG InterIace
Module slots

No user-serviceable parts

Fast assembly

Minimum tooling/parts

Up to twelve High Integrity
I/O modules supported per
3ODQWJXDUG Expander Chassis

Dual redundant power
supplies Irom the 3ODQWJXDUG
High Integrity Power Supply
Unit

Module slot keying

Triplicated Inter-Module Bus
connections

Front or rear (panel) mounting
on 483mm (19-inch)
dimensions

32,48,64 and 96-way DIN41612
I/O port connector capability




ABB.ICSTT-SDS-8100
3/$17*8$5' TMR Controller
3ODQWJXDUG Controller Chassis-P8100


ABB

Technical data sheets are intended for
information and guidance. ABB has a policy of
continual product development and
improvement. Specifications are subject to
change without notice.
BACKPLANE BLOCK DIAGRAM



ELECTRICAL SPECIFICATION

Power Requirements 20 to 32V dc
Power Dissipation None refer to the TMR Processor and associated
TMR Interface module Data Sheets
Module InterIace Triple redundant Inter-Module Bus

MECHANICAL
SPECIFICATION

Dimensions (HxWxD):
266.7mm x 483mm x
312mm
(10.5ins x 19ins x 12.28ins)

Weight:
5kg
(11lbs.

ENVIROMENTAL

Operating Temperature:

-5C to 60C
(23F to 140F)

Operating Humidity:
5 to 95%, non-condensing

Vibration:
10 to 57Hz 0.075mm
57 to 500Hz 1.0g

Shock:
15g, sine wave, 11ms

EMI (IEC 801):
ESD
Air discharge to 15kV
Contact discharge to 8kV

Radiated Fields
10V/m, 27MHz to
500MHz

Transients and Bursts
2kV, 2.5kHz for
t=60 seconds

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