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DIODES NMOS and PMOS Transistors Approach Q Select a process i.e channel length driven acquire .MODEL card for NMOS and PMOS devices Q Enter the Schematic post design Q SPICE the VTC (.DC) and then Transient (.TRAN) Q accurate results demand we enter AD,AS, PD, and PS Q Layout the Design- DRC, extract and resimulate Q LVS to verify schematic against extracted layout
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DIODES
IS RS TT CJ MJ PB Is R T Cj0 mj saturation current Series contact resistance NOT dynamic resistance Transit time forward zero bias Cap Grading coiefficent exponent built in potential
MOS TRAN
VT0 VTX threshold where X = N or P mobility where X = n or p U0 X gate oxide thickness TOX tox LD LD gate drain (source) overlap GAMMA body threshold modulation parameter substate doping X = A or D for N or P MOS NSUB NX PHI |2F| surface strong inversion potential built in contact potential junction to bulk PB 0 CJ Cj0 zero bias bottom cap. for D-Bdy and S- Bdy CJSW Cj-sw0 zero bias side wall cap. for D-Bdy and S- Bdy LAMBDA 1/ recipocal forward early voltage 1/= VA RX RE Series S and D contact resistance X = S o D Grading coiefficent exponent junction bot. MJ mj MJSW mj-sw Grading coiefficent exponent junction sidewall CGD0 Cgd/W per unit width G-D and G-S overlap cap.
Level 1 is primarily for academic discussion & Hand Calculations. Use Level 49 or BSIM3 or proprietary models Q This is required to handle short channel effects What are we using for hand analysis? Q VTO, kn (kn), to determine effect Ron (or desired W given L) Q CJ and CJSW along with AD, AS, PD and PS to calculate the added cap due to the depletion cap contributions. Q TOX along with the effective dielectric constant to determine Cgs. Note we will limp Cgs = WLCox. Q We need RS, RD and the poly sheet Res.in high speed design
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MODEL CARD EX 1
MODEL CARD EX 2
SPICE GUIDELINES
Calculate Rise and Fall times in advance. Know the order of magnitude of the answer. DIVIDE and Conquer approach. KISS Principle.(keep it simple,stupid) Use SPICE-spectre like a Bench Scope
Dont forget Body Ties when extracting.
LAYOUT EX
AD = AS = 7 X 4 = 28 2 PD = PS = 2 X 7 + 4 = 22 EX resistance of ploy looking into the ploy gate Rg = Rpolysheet [(2/4) + (1 + 4 + 2 )/( 2 )] Rg = Rpolysheet( 1/2 + 7/2) Note this diagram does NOT show a body tie!!
C. Hutchens Chap 4 ECEN 4303 Handouts
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Csegment =C/n
= RC
(1)
or
=Rsegment Csegment and the effective trise is 1/2. Lumped -Active or Passive RC
W 2 kp V DD L2
(2)
SPICE EXAMPLE
Beta matched inv vdd 1 0 3.3 .PROBE .op .include TSOS.lib m1 2 5 1 1 pFET w=30u l=2u pd=30u ps=30u + ad = 90p as= 90p m4 2 5 6 6 nFET w=15u l=2u pd=15u ps=15u + ad = 450p as= 45p Vin 5 0 dc -0 .dc vin 0 3.3 .05 .tran 0 3.3 0.1nS 1nS 1nS 20nS 50nS .end
*NEURAL SOS LOT 911 * *TYPICAL CASE PARAMETERS, 1.25-10 MICRON, T=25 DEGREES C ********* .MODEL NSS1_25U NMOS (LD=0.0E-7 XJ=1.0E-7 TOX=2.5E-8 + VTO=0.74 UO=376 NSUB=4.7E16 + UEXP=0.5 UCRIT=3.0E5 UTRA=0.5 + GAMMA=1.0 LAMBDA=0.05 NFS=1.0E11 + LEVEL=2 PHI=.6 CJ=0.0 MJSW=3.33E-1 + CJSW=6.0E-11 MJ=5.0E-1 + CGSO=2.80E-10 CGDO=2.80E-10 RSH=200 ) ********* .MODEL PSS1_25U PMOS (LD=0.0E-7 XJ=1.0E-7 TOX=2.5E-8 + VTO=-0.9 UO=204 NSUB=1.0E15 + GAMMA=1.1 UEXP=0.2 UCRIT=8.0E4 UTRA=0.5 + LAMBDA=0.035 NFS=1.0E11 + LEVEL=2 CJ=0.0E-4 MJSW=3.33E-1 + CJSW=3.0E-12 MJ=5.0E-1 + CGSO=2.8E-10 CGDO=2.8E-10 RSH=200 )
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Tapered Buffer EX
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Tappered Buffer
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