Materials System Specification

34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable) Instrumentation Standards Committee Members
Al-Awami. L.H., Chairman Tuin, R., Vice Chairman Al-Dakhil, T.K. Al-Dhafeeri, F.T. Al-Khalifa, A.H. Al-Madhi, F.A. Alqaffas, S.A. Bogusz, Z.J. Ell, S.T. Fadley, G.L. Falkenberg, A.R. Gawargy, N.E. Grainger, J.F. Jumah, Y.A. Mahmood, B. Mike Shead Qarni, M.A. Trembley, R.J.

30 November 2005

Saudi Aramco DeskTop Standards

Table of Contents

1 2 3 4 5 6 7 8 9 10 11

Scope............................................................. 2 Conflicts and Deviations................................ 2 References..................................................... 2 Environmental Conditions.............................. 4 Electrical Requirements and Certifications.... 4 Basic Design Philosophy............................... 5 ESD System Configuration............................ 6 ESD System Construction and Spares........ 10 Quality Control............................................. 11 Documentation Requirements...................... 12 ESD System Testing.................................... 13

Previous Issue: 30 April 2002 Next Planned Update: 1 December 2010 Revised paragraphs are indicated in the right margin Primary contact: Austin Brell on phone 873-9455

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

Scope This specification together with 34-SAMSS-820, (Instrument Control Cabinets Indoor) or 34-SAMSS-821, (Instrument Control Cabinets - Outdoor) defines the minimum mandatory requirements for hard-wired, non-programmable, fail-safe, solidstate emergency shutdown (ESD) systems. In case of any conflict between both documents, the requirements of this specification shall prevail. Excluded from this specification are programmable controller-based ESD systems (refer to 34-SAMSS-623), and relay-based ESD systems (see 34-SAMSS-622). All terminology used in the documentation shall be in accordance with IEEE 100.

Conflicts and Deviations 2.1 Any conflicts between this specification and other applicable Saudi Aramco Materials Systems Specifications (SAMSSs), Engineering Standards (SAESs), Standard Drawings (SASDs), or industry standards, codes, and forms shall be resolved in writing by the Company or Buyer Representative through the Manager, Process and Control Systems Department of Saudi Aramco, Dhahran. Direct all requests to deviate from this specification in writing to the Company or Buyer Representative, who shall follow internal company procedure SAEP-302 and forward such requests to the Manager, Process and Control Systems Department of Saudi Aramco, Dhahran.

2.2

References Material or equipment supplied to this specification shall comply with the latest edition of the references listed below, unless otherwise noted. 3.1 Saudi Aramco Standards Saudi Aramco Engineering Procedure SAEP-302 Instructions for Obtaining a Waiver of a Mandatory Saudi Aramco Engineering Requirement

Saudi Aramco Inspection Requirements Form 175-344200 ESD Systems Hard-Wired Solid-State (Nonprogrammble)

Saudi Aramco Materials System Specifications 34-SAMSS-820 Instrument Control Panel - Indoor
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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

34-SAMSS-821 3.2 Industry Codes and Standards

Instrument Control Panel - Outdoor

American National Standards Institute/ National Fire Protection Association ANSI/NFPA 70 Canadian Standards CSA C22.2 No. 0 German Industrial Standards DIN VDE 19250 DIN VDE 0110 DIN VDE 0116 Basic Safety Considerations for Control and Instrumentation Technology Equipment Insulation Coordination for Equipment within Low Voltage Systems Electrical Equipment for Furnaces CSA General Requirements (Electrical) National Electrical Code

Institute of Electrical and Electronics Engineers IEEE 100 Standard Dictionary of Electrical and Electronics Terms

Instrument Society of America ISA-S84.01, w/Annex B Application of Safety Instrumented Systems for the Process Industries (Solid-State Logic)

International Electrotechnical Commission (IEC) IEC 61000-4-1 IEC 61000-4-2 IEC 61000-4-3 IEC 61000-4-4 IEC 61000-4-5 IEC 61508 Testing & Measurement Techniques Electrostatic Discharge Requirements Radiated Electromagnetic Field Requirements Electrical Fast Transient/Burst Requirements Surge Immunity Requirements Functional Safety - Safety Related Systems Part 1: General Requirements Part 2: Requirements for E/E/PES Systems Part 3: Software Requirements Part 4: Definitions Part 5: Guidelines on Application - Pt.1 Part 6: Guidelines on Application -Pt. 2&3 Part 7: Bibliography of Techniques
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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

International Organization for Standardization ISO 9001 Quality Systems - Model for Quality Assurance in Design/Development, Production, Installation and Servicing

National Electrical Manufacturers Association NEMA ICS 6 3.3 Engineering Units All dimensions and measurements shall be in the "International System of Units" (SI), and may be followed by the equivalent value in English units between brackets. When not critical, the equivalent dimensions and measurements may be rounded to their nearest practical value.
Exceptions: This requirement does not apply to the vendor's standard documentation. Values displayed on monitor screens, diagnostic displays, or generated on print-outs shall be in English units.

Enclosures for Industrial Controls and Systems

Environmental Conditions Unless otherwise specified, solid-state ESD cabinets shall be installed in air-conditioned buildings. In the event of an air conditioning failure, all panel or enclosed ESD cabinet equipment and wiring shall be designed for continuous operation at 50C (122F) and relative humidity of 95% (non-condensing).
Commentary Note: The temperature of 50C allows for a 35C room ambient plus a 15C rise within the cabinet.

Electrical Requirements and Certifications 5.1 Unless otherwise specified, solid-state ESD equipment shall be powered from individual UPS branch feeders at 120 VAC ( 5%), 60 Hz ( 1%), which are over-current protected. Unless otherwise specified, ESD components shall be installed within a general purpose, non classified electrical area per NFPA 70, (NEC) Article 500. ESD system components shall be listed, labeled or conform to standards or guidelines issued by UL, FM, CSA, or CENELEC.

5.2

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

5.3

Safety System Certification Solid-state, fail-safe ESD systems shall be compliant with the design principles of either DIN VDE 19250, DIN VDE 0110, and DIN VDE 0116 (latest revision), or IEC 61508 (SIL-3). The testing and certification of proposed safety systems shall be carried out by an internationally recognized testing agency such as SIRA, TUV or UL. TUV certification shall be for AK-5/6 or better.

Basic Design Philosophy 6.1 The ESD system shall be designed as SIL-3 logic systems in accordance with IEC-61508, Parts 1-7 (excluding software) or ISA-S84.01, Annex B. The ESD system shall be configured to perform the operational and process requirements shown in basic logic and/or cause and effect diagrams supplied by the Buyer or Buyer's engineer. Solid-state ESD systems shall consist of separate sections, (not including ESD cabinets). These sections include: Input-Output (I/O) interface, logic, diagnostic interfaces or tools, and power supplies (logic and/or field). The ESD Logic solver shall be designed as a 24 VDC solid state system regardless of input/output module, voltage or current requirements. The ESD system shall be configured to fail-safe, i.e., any single failure or defect in system hardware or logic, shall cause the affected logic and output(s) to deenergize immediately to its designated failure position. Fail-safe ESD configurations, which are also fault-tolerant (i.e., those which utilize multiple input or output modules or logic solver arrangements) may be quoted as options, depending on the specification requirements for fault tolerance. The ESD system shall include comprehensive I/O, logic, and power supply module, self-checking and diagnostics, i.e., automatic internal checking and diagnostics, with the capability of detecting both overt and covert faults in hardware and logic elements. Should a component or functional failure occur within the I/O, logic, or power supply sections, an alarm and/or shutdown shall be initiated, along with a diagnostic message or fault code, to an associated graphic display unit and communications/printer port. All components or modules using edge connectors shall use gold-plated contacts. Edge connectors, which incorporate a keying system, are the preferred method of preventing incorrect positioning of a board or module. Plug-in

6.2

6.3

6.4

6.5

6.6

6.7

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

components shall be capable of being removed while energized. Each module or component shall be identified by a type number. 7 ESD System Configuration 7.1 Input-Output Section The I/O section shall consist of I/O chassis, housing, or board assemblies in which I/O modules (with associated termination panels or assemblies) and I/O bypass switch panels reside. Housings shall be rack-mounted, or sub-panel mounted and be of rigid, heavy-duty construction. Termination panels or assemblies shall have screw type terminals for the field wiring. 7.1.1 I/O Modules 7.1.1.1 The I/O modules shall be plug-in type only (without screw terminals) to allow insertion into or removal from the I/O housings without disturbing external wiring connections. External wiring shall be terminated at a separate I/O module termination panel or assembly. Light Emitting Diodes (LEDs) or similar type indicators on the visible front edge of the I/O modules shall indicate the status of all inputs and all outputs in addition to I/O and logic element health-fault status.

7.1.1.2

7.1.2

I/O Module Signal Levels (Discrete or Analog) 7.1.2.1 Input modules shall be capable of accepting either discrete (AC or DC) or analog type (24 VDC, 0-20 ma) input signals. Where analog inputs from 2-wire transmitters are utilized, the input module should provide the 24 VDC power for the transmitter, a signal out-of range alarm, a short circuit alarm, and a stuck sensor alarm, operating on a variable time base. Discrete input circuits shall incorporate optical or electrical isolation and noise/transient filtering rated for a minimum of 500 V RMS or 500 VDC common-mode. Analog input circuits shall be designed to function normally when the applied voltage varies between 85% and 110% of its normal value. Output modules shall convert logic level signals to AC or DC output circuits capable of supplying power to individually isolated, field loads (e.g., motor starters elementary circuits,
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7.1.2.2

7.1.2.3

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

interposing relays, single or dual solenoids arrangements, etc.). Output modules shall be capable of handling a 2 amp resistive load. 7.1.2.4 Output circuits shall be designed with protective elements (e.g., reverse diode, transient suppression circuits, short circuit, and reverse voltage) to protect against transients resulting from switching inductive loads or improper wiring connections. 7.1.3 I/O Housing and Module Orientation 7.1.3.1 I/O modules shall be oriented in the vertical plane with heat generation sources, e.g., power supplies, located above them. It shall be possible to install the I/O modules in any configuration within chassis or back-planes, regardless of signal voltage level. Note: Input and output modules should preferentially be structured or organized such that input and output circuits for related pieces of process equipment are physically grouped together within a chassis or adjacent chassis. This permits maintenance activities to be conducted on unrelated process equipment (e.g., standby compressors) without impacting other process equipment. It is also good engineering practice to maintain sufficient separation between I/O modules of different signal genders, i.e., AC & DC, so as to minimize signal interference problems.

7.1.3.2

7.1.4

I/O Bypass Switches 7.1.4.1 Each 'shutdown' input into the ESD system shall have individual or grouped, key-lockable switch(s) bypassing the particular field device without impairing the associated dedicated alarm, or alarm print out function. Key-lockable ESD output bypass switches are only permitted on an exception basis, contingent upon prior approval by the Supervisor, P&CSD/PCD/Process Automation Systems Unit. In the event that field output bypasses are approved, outputs to annunciators, data loggers, and indicating lights shall not be capable of being bypassed. One additional set of contacts shall be provided for common or specific output bypass alarms. Switch contacts shall be wired in parallel with the outputs noted on the logic diagram.
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7.1.4.2

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

7.1.4.3 Each bypass switch shall have an associated INPUT CLEAR indicator, or OUTPUT CLEAR indicator (if approved) showing that the switch may be safely returned to its normal position. A separate and unique BYPASS indicator shall also be provided, identifying that the switch is in the bypass position. All bypass switch contacts shall be encapsulated or sealed. Each bypass switch shall have a pair of independent contacts, wired to a terminal strip, for remote indication. 7.1.4.4 7.2 Each bypass switch shall have a name plate identifying the tag number of the device it bypasses.

ESD Logic Section 7.2.1 ESD logic shall be designed to use 24 VDC solid-state, discrete, analog or timer modules or a combination of solid-state components to achieve fail-safe logic design per detailed logic or cause and effect drawings. ESD logic and output design shall prevent incorrect commands from being sent to output devices when main power is applied or restored. This means that power to the output drivers shall not be applied before power to the logic circuitry has been established and all circuits have been reset.

7.2.2

7.3

ESD System Power Supplies 7.3.1 ESD Chassis Power Supplies Redundant chassis power supplies shall be used in all cases to supply power to internal ESD system modules (or cards). Each power supply must be separate and distinct; connected via robust cabling or internal bus structure. Each power supply shall be sized to provide 100% of the ampacity requirements (at rated voltage, connected load, and maximum temp. of 50C) for the specified configuration of I/O cards, CPU's, etc., including provision for expansion capability (see paragraph 9.6), with all modules and outputs energized and carrying their maximum connected load. 7.3.2 Field I/O Power Supplies Redundant, linear (non-switching) field power supplies shall be used in all cases to power the I/O portion of the ESD system. Each I/O power supply shall be sized to continuously supply 125% of its connected load (at rated voltage, ampacity, and at maximum cabinet temperature
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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

of 50C). It shall be possible to configure power supplies in either a master-slave or load sharing arrangement and to locally monitor the output voltage and current of each power supply. Power supply loads shall be calculated with all points energized, and all outputs carrying their maximum connected load. The load calculation shall include provision for installed spares and future expansion capability. 7.3.3 Power supply protection - General Each power supply shall be protected by a properly sized circuit breaker or fuse. Output protection shall be provided via a combination of strategies (i.e., diode auctioning/isolation - where diodes are rated at not less than 300% of the maximum power supply current delivery and time-over voltage/over-current protection). Fast-acting crow-bar circuits, designed to shunt output loads are not permitted. Fuses or circuit breakers shall be capable of being replaced or reset without physically having to remove any wiring terminations. 7.3.4 ESD Chassis Power Supply Diagnostics System diagnostics shall detect events which may compromise internal (ESD chassis) power supply health or integrity (e.g., whenever extreme overvoltage, overcurrent, or high temperature conditions are detected within the power supply or at the DC output(s) of the power supply. Power supply (health/fault) status shall be indicated on its faceplate and be externally communicated via discrete alarm contacts (or data communications link) to an alarm display and printer. 7.3.5 ESD Status During Power up and Power Down. The ESD system shall be designed such that output modules deenergize when power is cycled to the ESD system (i.e., applied, removed, or restored to the logic solver or I/O modules). Power to output circuits shall not be restored until the power to inputs and the logic is established, all application logic permissives have been met, and the logic has been reset. 7.4 ESD System Diagnostics 7.4.1 The ESD system shall be designed with automatic test or diagnostic circuits which continuously monitor its own health and operational status. ESD system diagnostics or status indicators shall be capable of being viewed on a local graphic display panel or bezel and well as being communicated via a data port to an external computer or printer.

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

7.4.2

Should an overt ESD component or module failure occur, the outputs shall either freeze in their present state ('fail-steady') or de-energize, as specified in the material requisition or specification. At least two sets of isolated contacts for a remote common alarm shall be provided. ESD system self-diagnostics shall include, but not be limited to, the following: a) b) c) d) e) Open or short-circuited semiconductors Interrupted I/O wiring, relay coils, and connections to terminals, contacts, or connectors Failures in I/O modules Loss of individual power supplies, power supply regulation, or auctioneering diode failure Removal of any subsystem component or printed circuit board.

7.4.3

7.4.3

Each output driver shall have a lamp test input that energizes the driver's indicator. Lamp test inputs for control panel mounted indicating lights shall be wired and combined into two common terminals. Other lamp test inputs shall not be wired, but properly terminated for maximum noise immunity.

7.5

ESD Event Logging/Recording/Discrimination 7.5.1 Unless otherwise specified, transitions of discrete ESD input devices, including bypass switches, shutdown push/pull-buttons, manual reset push buttons, or of equivalent analog signal converters used as trip switches, shall be time-tagged and discriminated by device tag number, using a first-out event-logging recorder or equivalent historian device which includes the facility for local or remote printout of time tagged event data. The event logger may be external to or resident within the ESD system. The minimum resolution of all ESD event transitions, after filtering and/or buffering of input signals shall be 10 milli-seconds or less.

7.5.2

ESD System Construction and Spares 8.1 ESD cabinet construction shall be as per 34-SAMSS-820/34-SAMSS-821 except as amended by paragraphs 8.1.1 - 8.1.3. Front access, swing-frame type cabinets are preferred.

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

8.1.1

ESD cabinets shall be NEMA 12, with allowances made for ensuring adequate convection ventilation, following the guidelines of NEMA ICS 6. ESD cabinet layout and equipment spacing shall be designed for heat dissipation by convection ventilation. Ventilation inlet/outlet crosssectional area requirements shall be determined by 'cabinet' heat rise calculations using internal component or module heat generation data. Based on a given convection ventilation layout/spacing as determined by the calculations of paragraph 8.1.2, fans may be installed within cabinets or ESD power supplies to assist in heat removal, provided that they are installed in a redundant manner with fan-failure or overtemperature detection circuitry, including local alarm status indication and contacts for external alarm annunciation.

8.1.2

8.1.3

8.2

The ESD system design and configuration shall include the following minimum spares to allow for future system design modifications: a) b) d) 20% spare terminals for each type of terminal used, 10% installed spare I/O modules and logic modules of each type used, 10% spare output isolation devices.

Quality Control 9.1 Quality Control Procedures 9.1.1 Vendor's QA/QC program shall conform to the guidelines of ISO 9001, quality systems - Model for quality assurance in design/development, production, installation, and servicing. Sampling techniques shall be applied where practical, but never used for final acceptance and burn-in of system components. Where statistical inspections are applied, the plan shall conform to the guidelines of ISO 9001.

9.1.2

9.2

Qualification Tests Vendor's ESD system (cabinet configuration) and component/modules shall be capable of meeting the following minimum parameters. All testing techniques shall be in compliance with IEC 61000-4-1: a) Vibration - Per axis sinusoidal (Sinusoidal Sweep) 55 to 200 Hz 1.5 G

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

b)

Shock Non-Operating : Operating : 15 G for 11 msec 6 G for 11 msec

c) d) e) f)

Temperature Operating: 0 to 50C (external cabinet temperature) Thermal Stress: 70C (represents storage temp.) Humidity: 0 - 95% relative, non-condensing Electrostatic Discharge Immunity: IEC-61000-4-2, Level 3. Severity levels are 8 kV for air discharge, and 6 kV for direct contact discharge.

g)

EMI/RFI Interference (Radiated Susceptibility): IEC-61000-4-3, Level 3, (at a 10 V/m power level), with cabinet doors open.

h)

Conducted Electromagnetic Susceptibility ESD system modules shall be protected against susceptibility to conducted electromagnetic fields and transients in accordance with IEC-61000-4-4, Class 3, Fast Transient/Burst. Severity levels are 2 kV for power lines and 1 kV for I/O lines

i) j) 9.3

Surge Immunity: ESD modules shall be protected against surge impulses in supply lines to 1 kV per IEC-61000-4-5. Hipot & Ground Continuity: Per CSA C22.2 No. 0 (or equal)

Burn-In Testing Vendor's production testing of all ESD system active component parts, inclusive of all component modules, shall include a burn-in test period of no less than 48 hours. This testing shall be conducted in a controlled environment, with a heat input to the chamber ramped up and down with a minimum 44 hour heat soak period at a temperature of 60C.

10

Documentation Requirements 10.1 Required Vendor's Documentation Prior to commencement of a Factory Acceptance Test (FAT), the Vendor shall provide the following Non-Material Requirements (NMR's) to designated Company representatives, preferably in electronic format or via media which utilizes a Vendor's engineering workstation printer support utilities:
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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

a) b)

A listing of the ESD system configuration identifying each module type, location, and tag name; Annotated Printout or drawing of all ESD logic in logic element or function block format including all pertinent embedded comments describing logic functionality. Descriptors for logic element/blocks shall include completed I/O addresses and tag numbers, set points, logic element parameter identification, and logic execution sequence so as to facilitate ESD system troubleshooting; An index of all I/O points correlating individual tag name(s) to ESD logic blocks/pages; I/O and internal element cross reference where logic is shown on different logic sheets; Event log configuration file/record (if so specified); A narrative describing the operation and sequence of the logic system (based on the buyer's original logic and or narrative description); A fault finding/troubleshooting guide for the ESD system including all integrated components. Preferred format is an "IF - THEN" cause and effect diagram. Installation and maintenance manuals containing: Module circuit schematics/diagrams (where repair and fault-finding can realistically be performed) w/parts lists, assembly and interconnecting wiring diagrams, field device/input-output termination/wire number/ I/O module indexes, cabinet construction, assembly and interconnecting wiring diagrams; and cabinet arrangement drawings showing front and rear views of enclosure with a hidden view of installed equipment. Operations/programming manual, describing operating modes, program editing elements, parameters, guidelines and instructions.

c) d) e) f) g)

h)

i) 10.2

Quick-Reference Charts Quick-reference charts shall be capable of being attached to, or enclosed within, ESD cabinet doors or enclosures. The charts shall clarify proper module or PCB placement and assist in the interpretation of ESD status indicators.

11

ESD System Testing Saudi Aramco testing and inspection form 175-344200, logic or cause and effect diagrams, in conjunction with ESD system functional narrative, attached to the material requisition or ESD specification, shall be used as the basis for a Factory Acceptance Test (FAT) of all vendor supplied ESD equipment.

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

11.1

Factory Acceptance Testing (FAT) 11.1.1 During the FAT test the complete ESD system including all cabinets, termination-marshaling panels or assemblies, and associated equipment will be checked and verified against approved construction drawings and wiring diagrams. ESD components and logic (including all interconnecting wiring) shall be subject to both structured and unstructured functional tests. These tests shall demonstrate the functionality of each individual input and output point and associated logic elements making up the logic structure of the integrated ESD system. This includes all discrete, analog or timer/counter elements, sub-assemblies, or modules. During the time of testing the vendor shall make available to Buyers representatives (i.e., FAT team members), testing and calibration equipment (e.g., VOM meters, portable calibrators, data loggers, etc.) capable of simulating all specified input signals, measuring output signals, verifying event log function and discrimination, and faultfinding system problems. Facilities to simulate each and every input condition, vary the power supply voltage, simulate overloads on inputs and outputs, shall also be made available. Wire tagging and terminations shall be checked against wiring diagrams and "Tug" tested. (A tug test involves physically stressing a wire termination to determine whether it has been crimped and terminated properly. The intent is not to break wiring or stress insulation or components but to test the integrity of the termination). All ESD logic functionality shall be checked against logic drawings and dynamically tested and verified for proper ESD sequence and functionality. The dynamic test will involve physically simulating all inputs and outputs in their proper operational sequence, and verifying that specified ESD application program logic is executed properly. Fail safe output states will be tested in response to simulated input/output module failures and loss of ESD module power. All diagnostic routines shall be tested by simulating I/O module-individual point failures; power supply failure, communications interface failures, card replacement induced failures. Fault histories/summaries, if specified shall be logged and annunciated both on an external printer and an operators workstation or console. All event logging functions shall be demonstrated by randomly generating input event cycles, with the specified point resolution being demonstrated. Where practical, all communications interfaces shall be functionally tested using actual cable types and intended cable lengths.
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11.1.2

11.1.3

11.1.4

11.1.5

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34-SAMSS-621 ESD Systems Hard-Wired Solid-State (Nonprogrammable)

11.1.6

ESD Cabinet heat load and heat dissipation calculations shall be checked against the vendor's calculation method and procedure. ESD cabinet temperatures shall be monitored throughout FAT tests to verify and validate that normal ESD cabinet temperatures are consistent with vendor's design calculations and the specified parameters listed in this document. If fans are used to assist in ESD cabinet ventilation, cabinet temperatures shall be verified to be within design limits when all fans are deenergized for a period not less than 8 hours. All discrepancies noted in the FAT shall be resolved to the satisfaction of the Buyer. Results of the FAT test shall be documented by a written report, supported by the FAT procedure used.

11.1.7

30 November 2005

Revision Summary Revised the "Next Planned Update. Reaffirmed the contents of the document, and reissued with editiorial changes.

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