Chapter 4: Heat Transfer

Chapter 4 [Heat Transfer]

Chapter 4: Heat Transfer

4.1 Introduction to heat conduction

4.2 Finite element for heat transfer

4.3 Thermal analysis for fin with chip with ANSYS

4.4 Unsteady thermal analyses of fin with ANSYS

4.5 Thermal analysis of a thermal storage with ANSYS

Problems

112
4.1 Introduction to heat conduction

Whenever a temperature gradient exits in a solid medium, heat will flow from
the high‐temperature to low‐temperature region. The basic governing heat
conduction equations are obtained by considering a plate with a surface area A
and a thickness ∆x, as shown in Figure 4.1. One side is maintained at a
temperature T1, and the other side at temperature T2. Experimental observation
indicates that the rate of heat flow is directly proportional to the area and
temperature difference, but inversely proportional to the plate thickness. The
proportionality is replaced by an equal sign by introducing the constant k, as
follows:

(4.1)

where k is the thermal conductivity of the plate. This property depends on the
type of the plate’s material. The equation (4.1) is also called the Fourier’s law.
The Fourier’s law can also be expressed in differential form in the direction of
the normal displacement:

(4.2)

t
A T2
T1

Figure 4.1, heat transfer through a plate.

Also, the Fourier’s law can be expressed for multi‐dimensional heat flux flow:

(4.3)

An energy balance can be applied to a differential volume, dx dy dz, for
conduction analysis in Cartesian coordinate, as shown in Figure 4.2. The
objective of this energy balance is to obtain the temperature distribution within
113
the solid. The temperature distribution can be used to determine the heat flow at
a certain surface, or to study the thermal stress.
The heat flux perpendicular to the surface of the control volume is indicated by
the terms, , , and . The heat flux at the opposite surfaces can be then
expressed using the Taylor series expansion of the first order, as follows:

(4.4)

(4.5)

(4.6)

Q y+dy
Q z+dz
Egen dy
Qx Q x+dx
Est
Qz dz
dx
Qy

Figure 4.2, Differential control volume for energy balance

Energy can be generated in the medium. Electrical resistance in the medium is
considered as the heat generation, or the heat source. The expression of the heat
generation is:

(4.7)

where is the generated heat per unit volume, W/m3. If the heating process is
unsteady, the total energy of the control volume can be increased or decreased.
The energy storage term is represented as:

(4.8)
114
The sum of the energy generation in the control volume, and net heat flow
should be equal to the energy stored in the control volume. The energy
conservation can be expressed in the following mathematical form:

(4.9)

Substituting expressions (4.4), (4.5), (4.6), (4.7), and (4.8) into (4.9), the energy
conservation equation becomes:

(4.10)

The , , and can be obtained from the Fourier’s law, (4.2), as follows:

(4.11)

(4.12)

(4.13)

Finally, the conduction energy equation per unit volume, in Cartesian coordinate,
can be expressed, as follows:

(4.14)

When the system reaches the steady state condition, the term is
eliminated. If the thermal conductivity is independent of the direction, the
conduction energy equation can be written in a simpler form:

(4.15)

The energy equation is a partial differential equation with second order in space
and first order in time. The boundary conditions along its surface, as well as the
initial condition must be specified. For the initial condition, the temperature
distribution in the system must be provided. In heat transfer problems, there are
three types of boundary conditions: temperature, heat flux, and convection.

The constant temperature, also called the Dirichlet condition, corresponds to a
situation for which the surface is maintained at a fix temperature all the time.
The mathematical expression for this boundary condition is as follows:

(4.16)

The second boundary condition, also called the Neumann condition, corresponds
to a constant heat flux applied to a surface. The heat flux is related to
temperature gradient at the surface by Fourier’s law, as follows:
115
(4.17)

A special case of this condition is an insulated boundary condition, and the heat
flux should be zero:

(4.18)

The third boundary condition corresponds to convection at a surface. The
conduction‐convection heat balance at the wall surface must be satisfied. The
heat transfer coefficient (h) should be known, as well as the fluid bulk
temperature (T∞):

(4.19)

116

4.2 Finite element method for heat transfer

The finite element method is an efficient way to solve conduction heat transfer.
The heat transfer solution can be used to estimate the heat flow at the system’s
boundary, or to determine the temperature distribution for thermal‐stress
analysis. The first step in the finite element formulation for conduction heat
transfer is to select the element type. A linear triangular element is selected
because it is the simplest form of element for two‐dimensional analysis. The
selected element is shown in Figure 4.3. The temperature at the nodes, Ti, Tj, and
Tm, are expressed in the following matrix form:

(4.20)

where N’s are linear shape functions given by:

(4.21)

(4.22)

(4.23)

The expression for α’s, β’s, and γ’s are defined as follows:

(4.24)

The temperature gradient matrix is equivalent to the strain matrix used in the
stress analysis problem:

(4.25)

The heat flux and temperature gradient are related to each other using the
thermal conductivity matrix [D], as follows:

(4.26)

and the thermal conductivity matrix [D] is defined as:
117
(4.27)

Using equation(4.20) in equation (4.25), we have:

(4.28)

The temperature gradient matrix can also be written in a compact form:

(4.29)

The [B] matrix is defined as:

(4.30)

The stiffness matrix is obtained from the potential energy theory as:

(4.31)

Where the first term is the contribution of the conduction, while the second term
contributes for convection. The element equation should be formulated in the
form of , and the force matrix represents heat flow at the element’s
boundary, and it is defined as:

(4.32)

where P is the perimeter of the element, A is the area perpendicular to heat flow,
Q is heat generation in the element, q* is the heat flux, and L is the element’s side
length.

118
4.3 Thermal analysis of fin with chip using ANSYS

Examine the performance of the straight fin for electronic chip by determining
the maximum operating temperature of the chip at the steady state condition.
The fin is made of pure Aluminum, while the chip is made of epoxy. Free
convection boundary condition is imposed at the fin with h = 5 W/m2‐oC, To = 25
oC, while the chip is well insulated. Power of 15 Watts is generated in the chip.
Let kchip = 0.2 W/m‐oC, kAl = 237 W/m‐oC. Solve the problem using ANSYS.

0.0025 m 0.0025 m
Convection
0.02 m
0.005 m Heat generation
Insulated
0.0175 m

Double clicks on the ANSYS icon

Main Menu > Preferences

A select the Thermal
OK

119
This example is limited to thermal analysis. Hence, select Thermal. The Solid
element is used, and its shape is Triangle with 6 nodes.

Main Menu > Preprocessor > Element type > Add/Edit/Delete

Add…

B
A

A select Solid
B select Triangle 6node
OK

120

Close

The unit of this problem is given in SI units, and Celsius scale for temperature is
used. For the material properties, only the thermal conductivity is required to
solve the problem. Note that he chip has a different thermal conductivity than
the fin. First, the thermal conductivity of the chip is assigned, then the thermal
conductivity of the fin. This order is not important.

Main Menu > Material Props > Temperature Units

A Select Celsius
OK

121
Main Menu > Material Props > Material Models

Double click on Thermal > Conductivity > Isotropic

A enter 0.2 in KXX
OK

In the Define Material Models Behavior: Material > New Model

A enter 2 in Define Material ID
OK

122


A enter 237 in KXX
OK

The geometry is created using the ANSYS Graphics. Setting up the work space is
done using the WP Setting. Enabling snap is required to allow the mouse‐click on
the ANSYS Graphics with a snap increment. Spacing is the distance between the
vertical or horizontal grids. The size of the grid is specified in the Minimum and
Maximum.
The next step is to setup the grids for ANSYS windows. The space is divided into
squares with length of 0.0025 m. The width and height of the grids is 0.025 m.
This setup will make the modeling task easy by creating keypoints on the ANSYS
graphics.
123
Utility Menu > WorkPlane > WP Setting

A select Grid only
B enter 0.0025in Snap Incr
C enter 0.0025 in spacing
D enter 0 in minimum
E enter 0.025 in maximum
OK

ANSYS Utility Menu > WorkPlane > Display Working Plane

ANSYS Utility Menu > PlotCtrls > Pan, Zoom, Rotate

click on zoom in and out, moving curser button until the ANSYS graphics shows
all grids.

The keypoints are created first, and then lines between keypoints are drawn.
Areas that are surrounded by close lines are drawn. Finally, the thermal
conductivity of the chip and fin are assigned using element attribute.

124
ANSYS Main Menu > Preprocessor > Modeling > Create > Keypoints > On
Working Plane

By using the mouse, click on the ANSYS graphics window at the location
Keypoints, as shown in figure below.

ANSYS Graphics will show the grid and keypoints

ANSYS Main Menu > Preprocessor > Modeling > Create > Lines > Lines >
Straight Line

Click on Keypoints to connect two Keypoints with one straight line

ANSYS graphics shows lines

125
ANSYS Main Menu > Preprocessor > Modeling > Create > Areas > Arbitrary
> By Lines

Click on lines to create rectangles for the chip and fins

ANSYS graphics shows areas

Main Menu > Preprocessor > Meshing > Mesh Tool

A B

A select Area
B click on set

Using mouse, select all the fins
OK

126
The following windows will show. By selecting number two, the properties
number two in the material model are assigned to the fins. The chip is by default
has the properties of the number one in the material model.

A select 2 in Material number
OK

To ensure that thermal conductivity of the fin and chip are assigned correctly,
the chip and fin are colored according to their material number. This step has no
effect on the solution. The geometry is meshed with Triangular 6‐nodes
elements. A free mesh is generated using the smart mesh option. The mesh
refinement is 1. Finer mesh can be generated with a mapped mesh.

Utility Menu > PlotCtrls > Numbering ….

A select material number
B select Colors only
OK

127

ANSYS graphics shows the fin and chip with different color


A
B

A select smart size
B set the level to 1
C mesh
Click on Pick All
Close

128

ANSYS Graphics shows the mesh

Boundary conditions are applied in the solution task. Convection boundary
condition is applied at the fin surface. The external surface of the chip is well
insulated, and the zero heat flux simulates the insulation boundary condition. No
boundary condition is applied at common line between the chip and the fin.
Finally, a volumetric heat generation is applied at the chip.

Main Menu > Solution > Define Load > Apply > Thermal > Convection > On
Lines

Click on fins surfaces where convection boundary condition is applied

A enter 5 in Film Coefficient
B enter 25 in Bulk temperature
OK

129
Main Menu > Solution > Define Load > Apply > Thermal > Heat Flux > On
Lines

Click on chip surface where insulation boundary condition is applied

A enter 0 in Load HFLUX value
OK

The heat generation must be per unit volume. The applied heat generation is
divided by the area of the chip because the problem is two‐dimensional. The chip
volumetric heat generation is calculated as follows:

15
Q& = = 171428 .57 W / m 2
0.0175 × 0.005

Main Menu > Solution > Define Load > Apply > Thermal > Heat Generat >
On Area

Click on the chip area, where heat generation is applied

A enter 171428.57 in Load HGEN value
OK

The preprocessor task is now completed, and the solution is the following:
130
Main Menu > Solution > Solve > Current LS

OK

Close

The solution is completed successfully, and no error message is posted. In the
post processor, the contours of the temperature should be carefully inspected to
discover any mistake done in the preprocessor, such as wrong input of the
material properties or boundary conditions.

Main Menu > General Postproc > Plot Results > Contour Plot > Nodal Solu

A select Nodal Temperature
OK

131

ANSYS Graphics shows temperature contours

The temperature contours indicates that the maximum temperature is located at
the bottom of the chip. The contours lines are in general irregular, indicating that
more elements are required. The default number of contours is nine, and this
number can be increased to a higher value for better data analysis. First the
graphics device must be changes to win32C, and the number of contours can be
increase up to 114 contours. Note that increasing the number contours does not
mean that the accuracy of the results has been improved.

The following is the vector plot shown the heat flow from the chip to the fins. The
red arrow is for high value of the heat flux.

132
Main Menu > General Postproc > Plot Results > Vector Plot > Predefined

A select Thermal flux TF
OK

ANSYS Graphics shows the direction of heat flux

133
4.4 Unsteady thermal analyses of fin with ANSYS

For the fin shown below, solve the problem as an unsteady and determine the
temperature distribution of the fin at 100 sec. and 200 sec. if the initial
temperature of the fin is 25 oC. Plot the temperature history at the center of the
fin. Also, create temperature animation file for the heating process. The total
duration is 200 sec. and the time step 2 sec. The fin is made of Nickel‐Steel (10%)
with the following properties: ρ = 7945 kg/m2, k = 26 W/moC, Cp = 4600 J/kg
oC. The base of the fin is maintained at 100 oC, and the surface is subjected to free
convection with h = 5 W/moC and 25 oC

0.004 m 0.004 m
Convection
0.012 m
0.004 m
Temperature
0.028 m



OK

134

Add…

B
A

A select Solid
OK

Close

135
The unit of this problem is given in SI units, and Celsius scale for temperature is
used. For the material properties, thermal conductivity, specific heat, and the
density are required to solve the problem because the problem is unsteady.



A enter 26 in KXX
OK

136
Double click on Thermal > Specific Heat

A enter 4600 in C
OK

Double click on Thermal > Density

A enter 7945 in DENS
OK

137
Utility Menu > WorkPlane > WP Setting

A select Grid only
B enter 0.004 in Snap Incr
C enter 0.004 in spacing
D enter 0 in minimum
E enter 0.028 in maximum
OK

ANSYS Utility Menu > WorkPlane > Display Working Plane

ANSYS Utility Menu > PlotCtrls > Pan, Zoom, Rotate

Click on zoom in and zoom out, and the curser buttons until the ANSYS graphics
shows all grids.

138
ANSYS Main Menu > Preprocessor > Modeling > Create > Keypoints > On
Working Plane

By using the mouse, click at the location Keypoints.

ANSYS Main Menu > Preprocessor > Modeling > Create > Lines > Lines >
Straight Line

Click on Keypoints to connect two Keypoints to form one straight line.

ANSYS Main Menu > Preprocessor > Modeling > Create > Areas > Arbitrary
> By Lines

Click on lines to create area for fins

ANSYS graphics shows area

139

A
B

A select smart size
C mesh
Click on Pick All
Close


140
The type of the analysis is changed to Transient, and a Full solution method is
selected. This solution method imposes the boundary conditions at time zero.
DB/ Result File is used to control the number of output data to be stored for the
post processor. Data will be stored at each time step during the solution with
Every subset option. Total during for the simulation and time step are specified
in the Time/Frequency command. In the time‐time step windows, make sure that
stepped is selected.

Main Menu > Solution > Analysis Type > New Analysis

A select Transient
OK

OK

Main Menu > Solution > Load Step Opts > Output Ctrls > DB/ Results File

A select Every subset
OK

141
Main Menu > Solution > Load Step Opts > Time/Frequenc > Time –Time
Step

A enter 200 in the Time at end of load step
B enter 2 in Time step size
C select Stepped
OK

Boundary conditions are applied in the solution task. Temperature and
convection boundary conditions are applied at the external surface. The upper
surfaces are subjected to convection, and a zero heat flux that simulates the
insulation boundary condition is applies left and right surfaces of the base. The
lower surface is maintained at a constant temperature. The initial temperature of
the fin is also specified.

142
Main Menu > Solution > Define Load > Apply > Thermal > Temperature >
On Lines

Click on fin bottom surface where temperature boundary condition is applied

C

A select TEMP
B enter 100 in Load TEMP value
C select Yes
OK

Lines

Click on fin surfaces where convective boundary condition is applied.

OK

143
Lines

Click on chip surfaces where insulation boundary condition is applied

OK

Imposing the boundary conditions is now completed. The final condition is the
initial temperature of the fin. The initial condition is specified as follows:

Main Menu > Solution > Define Load > Apply > Initial Condit’n > Define

Pick All

A select TEMP in the DOF to be specified
B enter 25 in Initial value of DOF
OK

144
The solution task is now completed, and the model is now ready for running.
During the solution task, ANSYS output windows will show the progress of the
solution. Carefully monitor the run.


OK

ANSYS output windows shows transient solution progress

Close

The temperature contours will be presented at two different time steps, 100 and
200 second. First the time step is loaded, then the temperature contours is
requested.

145
Main Menu > General Postproc > Read Results > Last Set


A select Temperature
OK

ANSYS Graphics shows temperature contours at time =200 sec

146
Main Menu > General Postproc > Read Results > By Pick

A select Time 100.00
OK


OK

ANSYS Graphics shows temperature contours at time =100 sec

Determining the temperature history at a specific location in the domain is
important. Here, the temperature history at the center of the base is presented in
graphical form and data list. The steps are shown below:

147
Main Menu > TimeHist Postpro

A Click on the green X

A select Nodal Temperature
OK

Using the mouse, click at the center of the base of the fin. ANSYS will not accept
double click, an error message will be shown. The results can either be presented
in graphical or list form. The graphical presentation is selected for this exercise.
Carefully watch the temperature curve. It starts from the specified initial
condition to reach the steady state condition.

148

A click on the center location of the base
OK

A Click on the graph
OK

149

ANSYS Graphics shows temperature history of the selected location

Animation of the temperature contours from time = 0 to 200 sec. can be easily
accomplished using Animate command in the PlotCtrol options. The Number of
the frame in the animate over time windows is the number of pictures in the avi
file, while the Animation time delay is the display period between the pictures.

Main Menu > General Postproc

Utility Menu > PlotCtrls > Animate > Over time …

A enter 25 in Number of animation frames
B enter 1 in Animation time delay
C select temperature
OK

150
4.5 Thermal analyses of a thermal storage with ANSYS
A heat storage device has temperature dependent thermo‐physical properties. It
consists of n‐Eicosane wax and a container. Solve the problem as an unsteady
heat transfer problem. The initial temperature for the entire system is 25 oC. Find
the temperature history at the center of the wax container during the interval 0 <
time < 500. The properties of the n‐Eicosane is temperature dependent. The base
of the fin is maintained at 100 oC, the top surface is subjected to forced
convection with h = 15 W/m‐ oC and 25 oC, and sides are well insulated.

Container nEicosane wax
ρ = 1200 kg/m 3 ρ = 1000 kg/m3
k = 50 W/kg‐ C o
Cp = 900 J/kg‐ oC

k
(W/kg K)
Cp
(kJ/kg K)

0.5 1200

0.25
0.1 1000

20 50 100 20 50 100
o
Temperature ( C)
o
Temperature ( C)

Convection
R 0.05 m
R 0.02 m
n-Eicosane wax
0.1 m
Container
Temperature
0.1 m

151


A

OK


Add…

152
A B

A select Solid
OK

Close


153
In this example, the thermal conductivity and specific heat of the wax are
function of temperature. The value of the property and the corresponding
temperature value can also be plotted.


A

A enter 50 in KXX
OK


A

A enter 900 in C
OK

154

A

OK

In the Define Material Models Behavior: Material > New Model

A

A enter 2 in Define Material ID
OK


A

A click on Add temperature two times
155
A
B
C

A enter 20, 50, and 100 in Temperature
B enter 0.1, 0.25, and 0.5 in KXX
C click on Graph
OK

By clicking on Graph, a plot thermal conductivity versus temperature will be
shown in ANSYS graphics, as shown below. Carefully examine the graph to avoid
any wrong input.

ANSYS Graphics shows thermal conductivity versus temperature

156
A similar procedure is done for the specific heat. The density of the wax is
independent of temperature.


A
B

A enter 20, 50, and 100 in Temperature
B enter 1000, 1000, and 1200 in C
OK


A

OK

The modeling task is started here. First, a rectangle representing the container
body is created. Then a large circle. These two areas are added to form the
container. A small circles are created for the wax. The circle and the container
are overlapped.

157
Main Menu > Preprocessor > Modeling > Create > Area > Rectangle > By 2
Corners

A
B
C
D

A enter 0 in WP X
B enter 0 in WP Y
C enter 0.1 in width
D enter 0.1 in the height
OK

Main Menu > Preprocessor > Modeling > Create > Area > Circle > Solid
Circle

A
B
C

A enter 0.05 in WP X
B enter 0.1 in WP Y
C enter 0.05 in Radius
OK

158
Main Menu > Preprocessor > Modeling > Operate > Booleans > Add > Areas

Pick All
OK

Main Menu > Preprocessor > Modeling > Create > Area > Circle > Solid
Circle

A
B
C

A enter 0.05 in WP X
B enter 0.1 in WP Y
C enter 0.02 in Radius
OK

Main Menu > Preprocessor > Modeling > Operate > Booleans > Overlap >
Areas

Pick All
OK

159

A B

A select Area
B click on set

By using mouse, select wax, as shown below. Area attribute windows will appear.
Select number 2, corresponding to material number for the wax

OK
160
A

A select 2 in Material number
OK

Utility Menu > PlotCtrls > Numbering ….

A
B

A select Material number
B select Colors only
OK

ANSYS graphics shows the fin and chip with different color

161

A
B
C

A select smart size
C mesh
Click on Pick All
Close


162
Main Menu > Solution > Analysis Type > New Analysis

A

A select Transient
OK

OK

Main Menu > Solution > Define Load > Apply > Thermal > Temperature >
On Lines

Click on the bottom surface where temperature boundary condition is applied

A

A enter 100 in Load TEMP value
OK

163
Lines

Click on the top surfaces where convection boundary condition is applied

A
B

OK

Lines

Click on the right and left sides where insulation boundary condition is applied

A

OK

164
Main Menu > Solution > Define Load > Apply > Initial Condit’n > Define

Pick All

A
B

A select TEMP in the DOF to be specified
B enter 25 in Initial value of DOF
OK

Main Menu > Solution > Load Step Opts > Output Ctrls > DB/ Results File

A

A select Every subset
OK

165
Main Menu > Solution > Load Step Opts > Time/Frequenc

A
B

A enter 500 in the Time at end of load step
B enter 5 in Time step size
OK


OK

166

ANSYS output windows shows transient solution progress

ANSYS Graphics shows nonlinear transient solution progress

Close

167
Main Menu > General Postproc > Read Results > Last Set


A

OK

ANSYS Graphics shows temperature contours

168
Problem 4.1

Study the performance of the straight fin for electronic chip by determining the
maximum operating temperature of the chip. The fin is made of pure Aluminum.
Forced convection boundary condition is imposed at the fin with h = 25 W/m2‐
oC, T = 23.5 oC, and the convection is also applied at the chip vertical surfaces,
o
but its base is insulated. Power of 35 Watts is generated in the chip. Let kchip =
0.15 W/m‐ oC, kAl = 237 W/m‐ oC. Solve the problem using ANSYS as steady state.

0.005 m 0.005 m
0.04 m
0.015 m
0.035 m

Problem 4.2

Study the performance of the straight fin for electronic chip. The fin is made of
pure Aluminum. Forced convection boundary condition is imposed at the fin
with h = 15 W/m2‐oC, To = 22 oC, and the convection is also applied at the chip
surfaces, but its base is insulated. Power of 20 Watts is generated in the chip. Let
kchip = 0.15 W/m‐oC, kAl = 230 W/m‐oC. Solve the problem using ANSYS as steady
state. Determine:
a. Maximum operating temperature
b. Temperature at point B
c. Temperature distribution along path A‐A
d. Average temperature along path A‐A

0.005 m 0.005 m
0.04 m
0.005 m
B
0.015 m
A A
0.045 m

169
Problem 4.3

For the fin shown below, determine the average temperature along its surface.
Given that k = 75 W/m‐oC

T = 20+2/x
h = 15+5/x
0.05 m 100 C T = 33.3 C

2
h = 48.3 W/m-C
T = 20+2/x
h = 15+5/x
0.15 m

Problem 4.4

Study the performance of the straight fin for electronic chip. The fin is made of
pure Aluminum. Forced convection boundary condition is imposed at the fin
with h = 15 W/m2‐oC, To = 22 oC, and the convection is also applied at the chip
surfaces, but its base is insulated. Power of 15 Watts is generated in the heat
source only. Let kchip = 0.2 W/m‐oC, kAl = 230 W/m‐oC. Solve the problem using
ANSYS as steady state. Determine:
e. Maximum operating temperature
f. Temperature at center of the heat source
g. Temperature distribution along path A‐A
h. Average temperature along path A‐A

0.005 m 0.005 m
0.03 m
0.005 m
A A
0.01 m 0.02 m
0.015 m

170
Problem 4.5

Heat transfer from a transistor may be enhanced by using an aluminum sleeve,
having 12 integrally machined longitudinal fins on its outer surface. Air at 25 oC
and 20 W/m2‐oC flowing around the fins. The inner surface of the fin is
maintained at 50oC. Draw the temperature distribution in the along one of the
fins, and calculate the average temperature.

0.02 m
0.0125 m
0.002 m
0.01 m

Problem 4.6

For the electronic board with mounted macro‐processor and thermally inactive
memory, determine the maximum operating temperature of the processor. Also,
printout the temperature contours and heat flux distribution. The applied heat
generation at the processor is 12 Watts. Convection boundary condition is
imposed (h = 7.5 W/m2‐oC, T∞ = 25 oC) at the top surface, while it is insulated at
the bottom surface and at the sides of the IC board.

0.005 m 0.005 m
Fin
80 W/m-C
Memory
0.02 m 5.5 W/m-C
Processor IC board
0.5 W/m-C 8.5 W/m-C
0.005 m
0.01 m
0.005 m
0.0025 m
0.015 m 0.025 m 0.03 m 0.015 m 0.015 m

171
Problem 4.7
A metallic fin is attached to a high power heat source to increase heat dissipation
form the heat source. The fin has constant thermo‐physical properties, but the
heat source has temperature dependent thermo‐physical properties, as shown
below. The initial temperature of the system is 25 oC, and 25 watts is generated
in the heat source. Determine:
a. Heat source temperature at 25 sec.
b. Printout the temperature distribution at 30 sec.
c. Required time to reach the steady stare condition.
d. Plot the temperature history at the center of the heat source showing the
temperature approaching the steady state condition.

25 C 25 C
5 W/m-C 15+100/y W/m-C
heat Fin
source 95 W/m-C
25 C 1.5 W/m-C
15+0.1/x W/m-C 0.025 m
25 C 0.01 m
Insulated 10 W/m-C
25 C 0.025 m
15+0.1/x W/m-C y
25 C x
15+100/y W/m-C
0.01 m 0.05 m
25 C
5 W/m-C 0.01 m

Fin Heat source:
ρ = 1500 kg/m3 ρ = 1000 kg/m3
k = 25 W/kJ K
Cp = 850 J/kg k

k
Cp W/m-C
J/kg-C
1.5
1200
1.25
1100
1000 1
1 30 70 100 1 30 70 100
Temperature C Temperature C

172
Problem 4.8
The radial thermal insulation has a small eccentricity. Determine the effect of the
eccentricity on the overall thermal resistance of the insulation material. The
thermal conductivity of the insulation material is 0.5 W/m.K. Create a X‐Y plot
shown the eccentricity in the x‐axis and the resistance in y‐axis. Consider
eccentricity between 0 and 0.025.

25 C

0.05 m

e
75 C

0.025 m

Problem 4.9
For the fin and chip shown in problem 4.1, solve the problem as an unsteady and
determine the maximum temperature of the device at 100 sec. and 200 sec. if the
initial temperature of the fin and chip is 25 oC. Also, create temperature
animation file for the heating process. The total duration is 200 sec. and the time
step 2 sec. The fin is made of Nickel‐Steel (10%) with the following properties: ρ
= 7945 kg/m2, k = 26 W/m‐oC, Cp = 4600 J/kg‐oC. The chip is made of epoxy with
the following properties: ρ = 1200 kg/m2, k = 0.25 W/m‐oC, Cp = 1000 J/kg‐oC.

Problem 4.10
For the fin and chip shown in problem 4.4, solve the problem as an unsteady. If
the initial temperature of the fin and chip is 25 oC. The total duration is 1000 sec.
and the time step 10 sec. The fin is made of Nickel‐Steel (10%) with the following
properties: ρ = 7945 kg/m2, k = 26 W/m‐oC, Cp = 4600 J/kg‐oC. The chip is made
of epoxy with the following properties: ρ = 1100 kg/m2, k = 0.15 W/m‐oC, Cp =
900 J/kg‐oC. Determine:
a. the maximum temperature of the device at 100 sec. and 1000 sec.
b. Temperature distribution and its average along path A‐A at 500 sec., and
at 750 sec. Plot both curves in one plot.
c. Temperature history at the center of the heat source.
d. Does the system reaches the steady state condition.
e. create temperature animation file for the heating process.
173

Chapter 4: Heat Transfer

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Chapter 4: Heat Transfer

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Chapter 4 [Heat Transfer]

0.005 m Heat generation

0.05 m 100 C T = 33.3 C

0.015 m 0.025 m 0.03 m 0.015 m 0.015 m

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