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Review of stress-strain relationships

Tensile properties tensile test

Sheet metalworking
Review of Stress-strain Relationships
Chapters: 3.1.1, 3.1.4
Engineering stress = =
1

Gage marks

Applied force Original area of specimen F A0

Engineerin g strain =

L Lo Lo

Stages of tensile test

Maximum load Y = yield strength TS= tensile strength

TS Y

Elastic region - Elastic deformation i.e., material returns to its original length when the load is released
Fracture Necking Uniform elongation localised elongation
Elongation L f Lo = Lo

Plastic region - plastic deformation

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i.e., material does not return to its original length when the load is released.

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Strain-hardening (work-hardening)
TS Y

Shear properties torsion test

Shear involves application of stresses in opposite directions on either side of a thin element.

Shear stress =

F , Shear strain = b A

Metal becomes stronger as the strain increases - this property is called strain hardening or work hardening.

Shear stress and strain are commonly tested in a torsion test.

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Torsion test
L
A

Shear stress-shear strain curve

Shear strength S 0.7 (Tensile strength TS) t R
T Shear strength Fracture

Shear stress =

T 2R 2t

Shear strain = R L
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Overview of metal forming processes

Two main broad classifications: Bulk deformation processes Sheet metalworking processes Rolling

Bulk deformation processes

Slab

Plate, sheet Coil

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Outline of sheet metalworking processes

Coil Plate, sheet
Punching Blanking Fine blanking Stamping Embossing Deburring Cleaning Coating Bending Roll forming Deep drawing Rubber forming Spinning Superplastic forming Explosive forming
Magnetic-pulse forming
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Examples of parts produced by sheet metalworking processes

Sheet Plate

Shearing Cutting Sawing

Rolling

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Cutoff
Cutting line
Scrap Strip Blank

Parting
Nesting - for blanking
Cutting line
Blank Strip

Cutting line
Strip

Waste material

Scrap

Cutting line
Strip Blank

Cutting line
Scrap Strip Scrap

Difference from conventional shearing: 1. Cut edges not necessarily straight 2. Blanks can be nested - avoid scrap

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Punch with 2 cutting edges that match the opposite sides of the blank - irregular shape. Scrap.

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Redrawing
Drawn cup faced upwards on die
Drawn cup

F, v

Effect of Manufacturing Processes

Fh

Fh

Tolerance

Reverse drawing (is a redrawing process)

Drawn cup is placed face down on die Requires lower force than redrawing
Drawn cup
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F, v

Fh

Fh

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Effect of Manufacturing Processes

Surface roughness

Hollow profiles such as tubes, straw Mandrel is used to give hollow shape.

Mandrel Air in
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Air to maintain hollow form during hardening

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Wires and cable coating

Production of sheet and film

Die opening is a narrow slit (as narrow as 0.4 mm). Thermoplastic sheet for thermoforming. Thin film for packaging e.g., grocery & garbage bags, product wrapping.

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Blow molding
Blow molding Produces one-piece hollow parts with thin walls: plastic bottles, hollow containers For thermoplastics only: PE (most common), PP, PVC
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Extrusion blow molding

Extruder barrel Tube die v Parison Mold Blow pin Mold (closed) v Molded part v v

Air in

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Compression molding
Widely used for thermosets (thermosetting plastics) & elastomers - phenolics, melamines, expoxies, urethanes Electric plugs, dinnerware plates (dishes)
Punch Cavity Heated mold Charge Heated mold Ejector pin v, F Molded part v

Compare compression with injection molding Simpler and less expensive mold- no sprue or runner (less scrap material) Limited to simple shape Mold must be heated Longer cycle time - lower production rate

Charge molding material (powder, pellet form)

Curing till part solidified. 0.5 to 5 mins

v
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Transfer molding
Used for thermosets & elastomers Modifed from compression molding Polymer melt enters mold cavity as a fluid
Transfer pot

Transfer molding
Pot transfer molding
v Transfer ram Charge (preform) Cavities Ejector pin v Charge heated until softened
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v, F v Molded part

Cull Sprue

Pressure applied Curing in heated mold

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Compare transfer with compression molding Can form intricate shape as polymer enters the cavity as a fluid Use for encapsulation, molding with metal/ceramic insert
Chip Bonds Lead frame Molded plastic body

Transfer molding with metal/ceramic

Leads

IC package

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