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VNQ860 / VNQ860SP
QUAD CHANNEL HIGH SIDE DRIVER
IOUT 0.25A
VCC 36V
CMOS COMPATIBLE I/Os I UNDERVOLTAGE & OVERVOLTAGE nSHUT- DOWN I SHORTED LOAD PROTECTION I THERMAL SHUTDOWN I VERY LOW STAND-BY CURRENT I PROTECTION AGAINST LOSS OF GROUND
I
10
SO-20
PowerSO-10
DESCRIPTION The VNQ860, VNQ860SP are monolithic devices made using| STMicroelectronics VIPower M0-3 Technology, intended for driving any kind load with one side connected to ground. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. This device is BLOCK DIAGRAM
especially suitable for industrial applications in norms conformity with IEC1131 (Programmable Controllers International Standard).
VCC VCC CLAMP GND OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION Power CLAMP I/O 1 OVERTEMP I/O 2 CURRENT LIMITER Power CLAMP OVERTEMP LOGIC I/O 4 OVERTEMP STATUS Power CLAMP OVERTEMP CURRENT LIMITER OUTPUT4 Power CLAMP CURRENT LIMITER OUTPUT3 CURRENT LIMITER OUTPUT2 OUTPUT1
I/O 3
January 2003
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VNQ860 / VNQ860SP
ABSOLUTE MAXIMUM RATING
Symbol VCC - VCC - IGND IOUT - IOUT IIN VIN VSTAT VESD Ptot Tj Tc Tstg Parameter DC supply voltage Reverse DC supply voltage DC reverse ground pin current DC output current Reverse DC output current DC Input current Input voltage range DC Status voltage Electrostatic discharge (R=1.5 K; C=100 pF) Power dissipation TC=25 C Junction operating temperature Case operating temperature Storage temperature SO-20 Value PowerSO-10 41 - 0.3 - 200 Internally Limited -2 +/- 10 -3/+VCC + VCC 2000 16 90 Internally Limited - 40 to 150 - 55 to 150 Unit V V mA A A mA V V V W C C C
CONNECTION DIAGRAM
I/O 4 OUTPUT 4 N.C. VCC VCC VCC VCC OUTPUT 1 I/O 1 STATUS
20
GROUND I/O 3 OUTPUT 3 VCC VCC VCC VCC N.C. OUTPUT 2 VCC OUTPUT 3 I/O 3 GND I/O 4 OUTPUT 4
6 7 8 9 10
TAB
5 4 3 2 1
10
11
I/O 2
VSTAT
IGND
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THERMAL DATA
Symbol Rtj-amb Rtj-case Rtj-pin Parameter Thermal resistance junction-pins Thermal resistance junction-ambient (*) Thermal resistance junction-case (MAX) (MAX) (MAX) SO-20 8 58 Value PowerSO-10 50 1.4 Unit
oC/W oC/W oC/W
(*) When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 thick) connected to all VCC pins.
IOUT=0.25A; Tj=25oC IOUT=0.25A Off state; VCC=24V; Tc=25oC On state (all channels on) VCC-VSTAT=VIN=VGND=24V VOUT=0V VIN=VOUT=0V VIN=VGND=0V; VCC=VOUT=24V; Tamb=25oC VIN=VGND=0V; VCC=24V; VOUT=10V; Tamb=25oC 70 5
200
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VNQ860 / VNQ860SP
STATUS PIN
Symbol VSTAT ILSTAT CSTAT Parameter Status low output voltage Status leakage current Status pin input capacitance Test conditions ISTAT=5mA (Fault condition) Normal operation; VSTAT=VCC=36V Normal operation; VSTAT=5V Min Typ Max 1 10 100 Unit V A pF
TRUTH TABLE
CONDITIONS Normal operation Current limitation Overtemperature Undervoltage Overvoltage MCOUTn L H L H L H L H L H I/On L H L H L Driven low L H L H OUTPUTn L H L X L L L L L L STATUS H H H H L L X X H H
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VNQ860 / VNQ860SP
SWITCHING CHARACTERISTICS
VOUT
80% (dVOUT/dt)on
tr 10%
90%
(dVOUT/dt)off
tf t
td(on) VIN
td(off)
MCOUTn MCINn
I/On
OUTPUTn
MCU
VNQ860
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VNQ860 / VNQ860SP
Figure 1: Waveforms
NORMAL OPERATION
VI/On VOUTn VSTAT
UNDERVOLTAGE
V USDhyst V USD VI/On VOUTn VSTAT undefined
VCC
OVERVOLTAGE
VOV VCC VI/On VOUTn VSTAT VCC>VUSD VOVhyst
OVERTEMPERATURE
TTSD TR
Tj
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VNQ860 / VNQ860SP
mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232
inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8
0.10 A B
10
E2
E4
SEATING PLANE e
0.25
DETAIL "A"
C D = D1 = = = SEATING PLANE
A F A1
A1
L DETAIL "A"
P095A
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PowerSO-10 SUGGESTED PAD LAYOUT
14.6 - 14.9
B
10.8- 11 6.30
A A
9.5
All dimensions are in mm. Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
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VNQ860 / VNQ860SP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics 2003 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com
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