P2X-X-X LED

APPLICATION NOTE

This application note is for P2 series products:

P2XXX

This application note describes the handling,

measurement, and testing methods for P2XA

LEDproducts.

TableofContent
RecommendedSolderPadDesign.................................................................................................1
Cleaningandtorage..........................................................................................................................2
Handling............................................................................................................................................3
AssemblyStorageandHandling.....................................................................................................5
RecommendedSolderingrofile.........................................................................................................6
LightUpTest................................................................................................................................7
Measurementandalibration............................................................................................................8

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ApplicationNote

RecommendedSolderPadDesign
TheheatsinkoftheP2XALEDispositivepolarity.Dontconnectittothecathodelead.

Figure1.TheLeadPolarityoftheP2LED

The heat sink of the P2XA should be isolated from the metal substrate of the MCPCB. The recommend
solderpaddesigncanbefoundbelowinFigure2A:

Figure2A.RecommendedSolderPadDesign

Figure2B.CrossSectionofMCPCBwithP2

MetalSubstrate
DielectricLayer
SolderMask
CopperFoil
Solder

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CleaningandStorage
CleaningP2XALEDs
1. KeepingthelensoftheP2cleanisveryimportant.Excessivedustmaycauseadramaticdecrease
inopticaloutput.
2. Ifanemitterrequirescleaning,firsttryagentleswabbingwithalintfreeswab.
3. Ifneeded,thegentleuseofalintfreeswabandisopropylalcoholcanremovedirtfromthelens.
4. Dontpressorscrewthelens.

StorageofP2XALEDs
PleasestoreP2XALEDsinadrybox.Therecommendedstorageconditionsare:5~30RH<50%
Afteropeningthepackage:
1. TheLEDsshouldbesolderedwithinoneday.
2. If unused LEDs remain, they should be stored in moisture proof packages or in a dry box.
Thestorageconditionsare:5~40RH<30%
3. If unused LEDs are stored for more than one week, baking treatment should be performed
withthefollowingconditions:
Bakingcondition:morethan4hoursat605

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Handling
Recommendedhandling
P2EmitterisaSMTtypedeviceandisstronglyrecommendedtodothepickandplaceontothe
PCBbyautomachines.Thematerialofpickupheadisbettertobeplasticorsiliconetoavoiddamagethe
emittersduringpickandplace.
Recommendedpickupheaddimensions

Figure3.Recommendedpickuptoolingdimensions

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PickuptheLEDbygrippingthewhiteplasticbody(asshowninFigure3A).Avoidpressingorpuncturingthe
silicone lens. When stress is applied on the silicone lens, it may damage optical properties and the wire
bond.

Figure4A.Gripthewhiteplasticbody Figure4B.Gripthewhiteplasticbodywithtweezers

WhenmanuallymountingtheP2XALEDontotheMCPCB,gentlypressthewhiteplasticbodyorthelead.

Figure5.Gripthewhiteplasticbodyandpresstheleadwithtweezers

Mishandling

Figure6A.Pressonthelens Figure6B.Gripthelens

AvoidstrikingthelensoftheLEDswithtoolsusedintheassemblyprocess.Thismaydamagetheemitters.

Figure7.ThescrewdriverstrikestheLED

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AssemblyStorageandHandling
Recommendations

DonotstackPCBsorassembliescontainingP2emitters.

Figure8.CorrectStorageMethod

Figure9.IncorrectStorageMethod:StackingthePCBwithP2LEDs.

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RecommendedSolderingProfile
The LEDs can be soldered using the parameter listed below. As a general guideline, the users are
suggestedtofollowtherecommendedsolderingprofileprovidedbythemanufacturerofthesolderpaste.
Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest
possibletemperatureispreferredfortheLEDs.

ProfileFeature
AverageRampupRate
(TsmaxtoTp)
Preheat
- TemperatureMin(Tsmin)
- TemperatureMax(Tsmax)
- Time(tsmintotsmax)
Timemaintainedabove:
- Temperature(TL)
- Time(tL)
Peak/classificationTemperature(Tp)
Time within 5 of actual Peak
Temperature(tp)
RampDownRate
Time25 toPeakTemperature

SnPbEutecticAssembly

PbFreeAssembly

3/secondmax.

3/secondmax.

183
60150seconds
215

150
200
60180seconds

217
60150seconds
240

1030seconds

2040seconds

6/secondmax.
6minutesmax.

6/secondmax.
8minutesmax.

100
150
60120seconds

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LightUpTest
1. When using a power supply to light up the LEDs, the voltage should be limited. The voltage cant
exceed4VforeachLED. Whenthevoltageis4V,thecurrentwillbeinexcessof1500mA. Thiswill
damagetheemitter.
ExampleIfthereisamodulewith3LEDsinseries,themaximumvoltageofthepowersupplyshouldbe
lowerthan12V.

Figure10.TheIVCurveComparingMetalSubstrateLEDsandConventionalLEDs

2. Checkthepolarityoftheemitter. Appliedreversevoltageandcurrentmaydamagetheemitter.

Figure11.P2LEDIVcurve

3. IfusingaconstantcurrentlimitedvoltagedrivertolightuptheLEDmodule,pleaseconnectthepower
supply and the LED module before plugging the power supply into the AC power cord. This can
reducetheprobabilityofsurgecurrentdamagingtheLEDmodules.

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MeasurementandCalibration
TherearetwocauseswhichcanresultinLEDmeasurementerrors.

TypesofIntegratedSphere
In nonstandard LED measurements, the emitter is measured at the bottom and not the inside of the
integrated sphere. Part of the light emitting from the LED transmits into the integrated sphere from the
bottom glass window. The light pattern of the emitter affects the measurement results. There is a huge
measurementerrorwhenthetesterisnotcalibratedwiththecorrectgoldensamples.

Figure12:NonstandardLEDMeasurement

Figure13A:P2OLightPattern

RecommendedLEDmeasurement.

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IntegrationTime
AlongintegrationtimewillinducethermalissuesinLEDmeasurements.Figure14showstheplotofTjvs.
RelativeIntensity.Iftheintegrationtimeis1sec,theTjmayreach50,whichresultsinthelightoutput
dropping 5%. It is recommended that the integration time is shorter than 25ms in high power LED
measurements.

Figure14:Tjvs.RelativeIntensity

RecommendedMethod
1. Use measurement instruments which follow CIE 127 standards. The integration time should be
shorterthan15ms.
2. Iftheoperatorusesnonstandardtesters,calibratethetesterwiththegoldensamplebefore
measurement.ThegoldensampleshouldbemeasuredbytheinstrumentfollowingCIE127standards
(Example:ISCAS140B).

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AboutUs
SemiLEDs Corporation is a US based manufacturer of ultrahigh brightness LED chips with
stateoftheartfabricationfacilitiesinHsinchuSciencePark,Taiwan.SemiLEDsspecializesinthe
development and manufacturing of vertical LED chips in blue (white), green, and UV using a
patentedcopperalloybase.Thisuniquedesignallowsforhigherperformanceandlongerlumen
maintenance. In December 2008, The World Economic Forum recognized SemiLEDs innovations
withthe2009TechnologyPioneerAward. SemiLEDsisfullyISO9001:2008Certified

SemiLEDsisapubliclytradedcompanyonNASDAQGlobalSelectMarket(stocksymbolLEDS).
Forinvestorinformation,pleasecontactusatinvestors@semileds.com.

For further company or product information, please visit us at www.semileds.com or please

contactsales@semileds.com.

www.semileds.com
ASIAPACIFIC
3F,No.11,KeJungRd.
ChuNanSite
HsinchuSciencePark
ChuNan350,MiaoLiCounty
Taiwan,ROC
Tel:+88637586788
Fax:+88637582688

sales@semileds.com

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