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Description
The MC10E/100E156 contains three 4:1 multiplexers followed by transparent latches with differential outputs. When both Latch Enables (LEN1, LEN2) are LOW, the latch is transparent, and output date is controlled by the multiplexer select controls (SEL0, SEL1). A logic HIGH on either LEN1 or LEN2 (or both) latches the outputs. The Master Reset (MR) overrides all other controls to set the Q outputs LOW. The 100 Series contains temperature compensation.
Features
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950 ps Max. D to Output 850 ps Max. LEN to Output Differential Outputs Asynchronous Master Reset Dual Latch-Enables PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC= 0 V with VEE = 4.2 V to 5.7 V Internal Input 50 kW Pulldown Resistors ESD Protection: Human Body Model; > 2 kV, Machine Model; > 200 V Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test Moisture Sensitivity Level: Pb = 1 PbFree = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 271 devices PbFree Packages are Available*
MARKING DIAGRAM*
1
MCxxxE156FNG AWLYYWW
xxx A WL YY WW G
= 10 or 100 = Assembly Location = Wafer Lot = Year = Work Week = PbFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2006
MC10E156, MC100E156
D1b D1a D2d 25 SEL0 SEL1 MR VEE LEN1 LEN2 D1c 26 27 28
1
D2c 22
D2b 21
24
23
4:1 MUX
D EN R
Q0 Q0
4:1 MUX
D EN R
Q1 Q1
2 3 4 5 D1d
15 14 13 12
4:1 MUX
D EN R
Q2 Q2
6 D0a
7 D0b
8 D0c
10
11
D0d VCCO Q0
* All VCC and VCCO pins are tied together on the die. Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation.
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MC10E156, MC100E156
Table 3. MAXIMUM RATINGS
Symbol VCC VI Iout TA Tstg qJA qJC Tsol Parameter PECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current Operating Temperature Range Storage Temperature Range Thermal Resistance (JunctiontoAmbient) Thermal Resistance (JunctiontoCase) Wave Solder Pb PbFree 0 lfpm 500 lfpm Standard Board PLCC28 PLCC28 PLCC28 Condition 1 VEE = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI v VCC VI w VEE Condition 2 Rating 8 6 6 50 100 0 to +85 65 to +150 63.5 43.5 22 to 26 265 265 Unit V V V mA mA C C C/W C/W C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 4. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V, VEE = 0.0 V (Note 1)
0C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current 0.5 0.3 3980 3050 3830 3050 Min Typ 75 4070 3210 3995 3285 Max 90 4160 3370 4160 3520 150 0.5 0.25 4020 3050 3870 3050 Min 25C Typ 75 4105 3210 4030 3285 Max 90 4190 3370 4190 3520 150 0.3 0.2 4090 3050 3940 3050 Min 85C Typ 75 4185 3227 4110 3302 Max 90 4280 3405 4280 3555 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
Table 5. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = 5.0 V (Note 3)
0C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 4) Output LOW Voltage (Note 4) Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current 0.5 0.3 1020 1950 1170 1950 Min Typ 75 930 1790 1005 1715 Max 90 840 1630 840 1480 150 0.5 0.065 980 1950 1130 1950 Min 25C Typ 75 895 1790 970 1715 Max 90 810 1630 810 1480 150 0.3 0.2 910 1950 1060 1950 Min 85C Typ 75 815 1773 890 1698 Max 90 720 1595 720 1445 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.06 V. 4. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
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MC10E156, MC100E156
Table 6. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 5)
0C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 6) Output LOW Voltage (Note 6) Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current 0.5 0.3 3975 3190 3835 3190 Min Typ 75 4050 3295 3975 3355 Max 90 4120 3380 4120 3525 150 0.5 0.25 3975 3190 3835 3190 Min 25C Typ 75 4050 3255 3975 3355 Max 90 4120 3380 4120 3525 150 0.5 0.2 3975 3190 3835 3190 Min 85C Typ 86 4050 3260 3975 3355 Max 103 4120 3380 4120 3525 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.8 V. 6. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.8 V. 8. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
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MC10E156, MC100E156
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = 5.0 V (Note 9)
0C Symbol fMAX tPLH tPHL Characteristic Maximum Toggle Frequency Propagation Delay to Output D SEL0 SEL1 LEN MR D SEL0 SEL1 D SEL0 SEL1 Min 700 400 550 450 350 350 400 700 600 300 100 200 800 MR 400 50 <1 275 475 700 275 Typ 1100 600 775 650 500 600 275 300 400 275 300 400 600 900 1050 900 800 825 Max Min 700 400 550 450 350 350 400 700 600 300 100 200 800 400 50 <1 475 700 275 25C Typ 1100 600 775 650 500 600 275 300 400 275 300 400 600 900 1050 900 800 825 Max Min 700 400 550 450 350 350 400 700 600 300 100 200 800 400 50 <1 475 700 85C Typ 1100 600 775 650 500 600 275 300 400 275 300 400 600 900 1050 900 800 825 Max Unit MHz ps
ts
Setup Time
ps
th
Hold Time
ps
Reset Recovery Time Minimum Pulse Width Within-Device Skew (Note 10) Random Clock Jitter (RMS) Rise/Fall Time (20 - 80%)
ps ps ps ps ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary 0.46 V / +0.06 V. 100 Series: VEE can vary 0.46 V / +0.8 V. 10. Within-device skew is defined as identical transitions on similar paths through a device.
Q Driver Device Q
Zo = 50 W
D Receiver Device
Zo = 50 W 50 W 50 W
Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D Termination of ECL Logic Devices.)
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MC10E156, MC100E156
ORDERING INFORMATION
Device MC10E156FN MC10E156FNG MC10E156FNR2 MC10E156FNR2G MC100E156FN Package PLCC28 PLCC28 (PbFree) PLCC28 PLCC28 (PbFree) PLCC28 Shipping 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 37 Units / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC10E156, MC100E156
PACKAGE DIMENSIONS
PLCC28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 77602 ISSUE E
Y BRK D Z L M B 0.007 (0.180) U
M
T LM
M
S S
0.007 (0.180)
T LM
W
28 1
X VIEW DD
G1
0.010 (0.250)
T LM
A Z R E G G1 0.010 (0.250)
S
M M
T LM T LM
S S
N N
S S
0.007 (0.180)
T LM
VIEW S T LM
S
T LM
NOTES: 1. DATUMS L, M, AND N DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM T, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 0.025 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 0.020 2_ 10_ 0.410 0.430 0.040
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 0.64 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 0.50 2_ 10_ 10.42 10.92 1.02
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MC10E156, MC100E156
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MC10E156/D