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Peter Carson

Senior Director, Marketing


Qualcomm Technologies, Inc.

Qualcomm Technologies
and APT700

Disclaimer: Nothing herein constitutes an offer or obligation by Qualcomm Technologies to


develop, make or sell any APT700 products
2014 Qualcomm Technologies, Inc. All Rights Reserved

Qualcomm Technologies and APT700


APT700 support in key Qualcomm Snapdragon and Qualcomm Gobi Products

Supported in latest RFICs and Qualcomm Snapdragon and Gobi chips


Poised to enable APT700 launch in 2014, subject to network readiness
Qualcomm RF360 broadening LTE roaming discussion
APT700 can be supported in both regional and global LTE SKUs
Our APT700 solutions apply to both CA and non-CA configurations

WTR 1625

3rd Gen LTE Adv


World Mode RF
Snapdragon and Gobi are products of Qualcomm Technologies, Inc.
2014 Qualcomm Technologies, Inc. All Rights Reserved

WTR 3925

4th Gen LTE Adv


World Mode RF

3rd and 4th Gen LTE Advanced World Mode solutions


for smartphones, tablets, automotive and other
embedded applications
2

Multimode 3G/LTE is a foundation for successful LTE


Enables consistent
broadband experience
outside LTE coverage

Enables global
roaming for the
foreseeable future

Enables ubiquitous
voice services
even with VoLTE1

Multimode

LTE (FDD/TDD)
Enables blazing fast, low-latency broadband connectivity

3G (and 2G)

LTE FDD/TDD
WCDMA/HSPA+
1X, EV-DO
TD-SCDMA
GSMA/EDGE

Enables ubiquitous broadband coverage, voice services, global roaming


1Fallback

to 3G/2G (CSFB) since 2012; VoLTE with SRVCC ensures virtually seamless voice, but CSFB still needed for roaming

2014 Qualcomm Technologies, Inc. All Rights Reserved

Qualcomm Gobi is a product of Qualcomm Technologies, Inc.

Driving up the number of bands in a mobile device


Number of Bands in Handsets

18
15
12
4G
3G
2G

9
6
3
0
2G

Early 3G

3G Today

Early 4G
Multimode
4G
Multimode

Major impact on smartphone design is on the radio frequency front end


2014 Qualcomm Technologies, Inc. All Rights Reserved

Todays space-constrained Smartphone design


Printed circuit board (PCB) area has become precious real estate
Antenna

Local wireless connectivity


(WiFi/Bluetooth/FM)

RAM

Processor, cellular
modem, memory, power
management, sensors,
etc.

Battery occupies nearly


60% of total area inside
a phone

Processor,
modem,
transceiver

RF
front
end

BATTERY

RF front end needs to be


packed into ~15% of total
area
(30-40% of PCB area)

PCB left with only


40% of total area
inside a phone
One example of typical smartphone design.
Source: Qualcomm Technologies Inc. analysis

Global LTE devices need 2 - 3 times the number of RF bands as 3G, in the same PCB area

2014 Qualcomm Technologies, Inc. All Rights Reserved

Qualcomm RF360 front end solution


First truly global RF solution for LTE Devices
Advantages
Global design
Power

Multiband, Multimode

One Solution
Designed For:
All Modes All Bands

Performance
Size
Reduced development time

Enabled by
System-level solution and performance
RF CMOS integration advantages

Antenna
matching
tuner

Envelope
power
tracker

Power amp
& antenna
switch

RF POP

Processor
Modem
RFIC
PMIC

Innovative 3D packaging - RF POP

50+ designs across 15 OEMs, 10 launched


*As compared to the previous Qualcomm RF solution
Qualcomm RF360 is a product of Qualcomm Technologies, Inc.
2014 Qualcomm Technologies, Inc. All Rights Reserved

Point solutions fail to exploit global nature of LTE


Conventional radio solutions require multiple design versions (SKUs) of same phone globally
Japan

China
Europe
North America

B1
B4

B1
B2

B8
B19

B38
B41

SKU #3
SKU #2

South Korea

SKU #1
Australia

SKU #4

SKU #6

B3
B5

B1
B8

SKU #5

A SKU (Stock-keeping Unit) is a numbering system that identifies each


unique version of a product in order to manage inventory
2014 Qualcomm Technologies, Inc. All Rights Reserved

Single SKU drives economies of scale


Multiple SKU Design

Single SKU design will help drive volume/cost curve to make LTE available to the masses
Band 1
Band 1

Band M

$$$$

Multiplies NRE(1)
Fragmented BOM(2)

Band L

Band 1

Higher Inventories

Single SKU Design

Band K

Reduces NRE(1)

Band 1

Consolidated BOM(2)
Lower Inventories

Band N

2014 Qualcomm Technologies, Inc. All Rights Reserved

1.
2.

NRE: Non-recurring Engineering costs


BOM: Bill of Materials

$
8

Qualcomm Technologies platforms for global LTE design


Global LTE devices benefit to ecosystem

Operators

OEMs

Users

Facilitate global harmonization of


LTE bands for roaming

Establish common platform for


global LTE devices

Enable 4G LTE user experience


for the masses

Accessibility to mainstream LTE


devices

Qualcomm RF360 sets the stage for alignment


on number of bands for LTE similar to quadband GSM and penta-band UMTS

2014 Qualcomm Technologies, Inc. All Rights Reserved

Lower NRE as compared to multiple


SKU for each region
Global launch of devices based on
single LTE design

Economies of scale enabled by a common


LTE platform will allow OEMs to design global
devices at lower cost

Make possible virtually seamless


LTE roaming experience
Accelerate global LTE adoption

Users can enjoy the benefits of truly global


LTE roaming based on a single SKU LTE
design

Single SKU A catalyst for growth


Historical perspective on 2G and 3G adoption
First Quad-band
GSM Phone Launch

First Multimode Quad-band


UMTS Phone Launch

900

840
772

800

700

GSM / GPRS / EDGE

UMTS

726

727

LTE

600
500

463

543

400

249

300

217
241

200
100

92

1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Source: Strategy Analytics August 2013 (M units)

2014 Qualcomm Technologies, Inc. All Rights Reserved

Qualcomm Proprietary and Confidential

10

Carrier aggregation adding to device RF complexity


Driven by global adoption of carrier aggregation
Bandspecific RF
components

China

Americas

RF

33

22

11

32

21

10

20MHz

31

20

15MHz

41

30

19

10MHz

40

29

18

20MHz

39

28

17

15MHz

38

27

16

26

15

36

25

14

35

24

13

34

23

12

2014 Qualcomm Technologies, Inc. All Rights Reserved

10MHz

37

Source: 3GPP

LTE Modem

5MHz
20MHz

40MHz TDD

30 MHz TDD

225
Mbps

40 MHz FDD

300
Mbps
(Cat 6)

+
+

30 MHz FDD

225
Mbps

+
+

25 MHz FDD

185
Mbps

10MHz

+
+
+
+

5MHz

15MHz

EU

300
Mbps
(Cat 6)

150 Mbps
20 MHz FDD
15 MHz FDD
10 MHz FDD

100
Mbps
75 Mbps

APAC
FDD

TDD

Inter-band CA

11

Intra-band CA

Fourth generation LTE


New Gobi LTE Advanced modem and RF solution

Wired Broadband performance,


seamless mobility
Up to 2x faster* LTE Advanced to 300 Mbps
Dynamically adapts for superior performance
4th generation LTE modem

1st 20nm modem

One chip, all 3GPP


approved carrier
aggregation combinations
Supports next gen LTE Advanced wideband CA
4th generation LTE transceiver
1st 28nm RF
~3x* more CA band combinations

4th Gen LTE chips designed to support all 3GPP approved carrier aggregation band combinations currently
in deployment
Note: *Compared to previous generation QCT solutions
Qualcomm Gobi is a product of Qualcomm Technologies, Inc.
Qualcomm WTR 3925 is a product of Qualcomm Atheros, Inc.
2014 Qualcomm Technologies, Inc. All Rights Reserved

12

Qualcomm Technologies and APT700


Frequency band proliferation and CA challenges have been addressed
Single SKU LTE design requires many more bands than single SKU 2G/3G
APT700 is a key candidate

Our RF solutions help broaden the global LTE band harmonization discussion
APT700 is already part of this discussion

Carrier Aggregation adds significant benefits as well as complexity and needs to be


considered in any spectrum harmonization discussion
APT700 is supported in the Qualcomm Technologies roadmap for both CA and non-CA SKUs

Our solutions are poised to enable Band 28 launch in 2014*


2014 Qualcomm Technologies, Inc. All Rights Reserved

*subject to network readiness

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Thank you
All data and information contained in or disclosed by this document is confidential and proprietary
information of Qualcomm Technologies, Incorporated and all rights therein are expressly reserved. By
accepting this material the recipient agrees that this material and the information contained therein is to
be held in confidence and in trust and will not be used, copied, reproduced in whole or in part, nor its
contents revealed in any manner to others without the express written permission of Qualcomm
Technologies, Inc.
2014 Qualcomm Technologies, Inc. All Rights Reserved. Qualcomm, Gobi, RF360, and Snapdragon are trademarks of
Qualcomm, Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are
used with permission. Other products and brand names may be trademarks or registered trademarks of their respective
owners.
Disclaimer: Nothing herein constitutes an offer or obligation by Qualcomm Technologies to develop, make or
sell any APT700 products
2014 Qualcomm Technologies, Inc. All Rights Reserved

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