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Week_2_2
Reading Assignment: 3.1 3.4
Objectives:
1. 2. 3. 4. 5. 1-D Heat Conduction in a Plane Wall Electrical Resistance Analogy Interface Resistance 1-D Heat Flow in Cylindrical/ Spherical Coordinates Electrical Resistance Analogy in Cylindrical Coords.
Steady State Temperature Distribution in a Plane Wall System 1.With Uniform Volumetric Energy Generation; Assumptions ?
2
x2
y2
z2
q k
1 T t
T x2
q k
Solution:
T ( x) q 2 x C1x C2 2k
Note: The form of the equation giving the steady state temperature distribution is independent of boundary conditions. However, the Temperature magnitude does depend on B.C.s.
dT k dx
hT
T4
4 Tsur
Example: What is the 1-D temperature distribution in a Plane Wall with no energy generation subjected convection on both surfaces? Assume that the thermal conductivity, k, is constant, no heat generation uniform, fluid temperature and convective heat transfer coefficient , T and h, respectively. T1 h, T K T2 h, T
q
0
0
L x
We may also use an electrical resistance analogy to help solve heat conduction problems. Electrical Analog of Heat Conduction
V
T1 R I I = V/R Electrical resistance:
qx kA T L
T2
V= T I = qx
qx
T Rth
Thermal resistance:
L A
Rth
L kA
In order to develop the electrical resistance for each mode of heat transfer, we must look at the linear heat transport coefficients:
1. Conduction: 2. Convection: q
q kA T L Rth L kA
hA T
th
1 hA
1 hr A
3. Radiation:
hr A T
Rth
T ,1, h1
Ts ,1
Hot Fluid
Cold Fluid
Ts,2 T
,2 , h2
T,1 qx
R 1 1 hA 1
Ts,1
R 2 L kA
Ts,2
R 3
T,2
1 h A 2
qx
(T
,1
,2 )
( R1 R2 R3 )
Thermal Circuits
qx T Rtot , where Rtot 1 h1 A L kA
1
qx UA T , where U
( Rtot A)
Rt ,c
TA TB q"x
Unit Area
TA TB qx
Rt ,c
[m 2 K/W]
Rt ,c / A
Contact resistance values range from 10 6 10 3 m2K/W, depending on (1) materials, (2) surface roughness, and (3) contact pressure.
/ Rt ,c
Example: A composite wall with contact resistance R .c What is the heat flux if the temperatures T1 and T2 are known.
T1
qx
T1
LA / k A
TA
Rc
TB
LB / kB
T2
T2
A LA kA B LB kB
Answer: qx
T1 T2 Rtot T1 T2 LA / k A Rc LB / k B
How to improve Contact Resistance ?? Apply Pressure Use filler material Soft metal (indium, lead, tin, silver) Thermal grease Epoxy materials
Soldering
Very active research area
Some Comments Regarding Contact Resistance Tables 3-1 and 3-2 give values for some solid-solid contact resistance. Types of contact: metal-metal, metal-insulators, etc.
Interfacial materials: vacuum, air, soft metal, solder, grease, plastic, etc.
Contact resistance is often important in practice but only empirical theories exist.
TA
TB q"x
Unit Area
Thermal contact resistance gives rise to a temperature discontinuity at the interface. A surface energy balance would be: qx is continuous =
dT ka dx
dT kb dx
Temperature is discontinuous =
q R
" x
" t ,c
TA
TB
T (r )
qr qr
C1 ln r C2
dT k (2 rL) dr k dT dr
dT kAc dr qr / Ac
T1 C1 ln(r 1) C2
T2 C1 ln(r2 ) C2
(1)
(2)
T2
T1
r1
T (r )
T1 T2 r ln r r2 ln 1 r2
T2
The temperature distributions What about temperature gradient? q= k = constant A and dT/dr not constant
r2
T2
T1
r1
T T1
T1 > T2
T1 < T2 T1
T2
T2 r1 r2 r
r1
r2
r2
r1
qr
dT kA dr
dT 2k rL dr
T1 T2 2k L ln r2 / r1
Constant
Heat flux:
qr A
dT dr
k T1 T2 r ln r2 / r1
Thermal Resistance:
qr
T1 T2 2k L ln r2 / r1
T2 T1
r2
r1
qr
T2 T1 ln r2 / r1 2k L
1 T ln r2 / r1 2k L
Rt ,cond
ln r2 / r1 2k L
The cross-sectional areas are different (inner radius vs. outer radius)
qr
T Rtot
UA
UA U1 (2 r1L) U 2 (2 r2 L) ...
Different overall heat transfer coefficients.
Spherical shell
r2
qr
dT 2 dT kA 4 kr dr dr qr dr dT 2 4 kr
r2 r1
r r1
T2
T1
r1
qr 4 k
dr r
2
T2 T1
dT
T T1
qr
4 k (T1 T2 ) 1/ r1 1/ r2
qr 4 k (T1 T ) 1/ r1 1/ r
T Rt
qr 4 k
dr r
2
dT
T (r ) T1
1/ r1 1/ r (T1 T2 ) 1/ r1 1/ r2