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MODEL : 22LD310
CAUTION
22LD310-MA
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ................................................................................. 3 SPECIFICATION ...................................................................................... 6 ADJUSTMENT INSTRUCTION ............................................................... 8 BLOCK DIAGRAM ................................................................................. 12 EXPLODED VIEW .................................................................................. 13 SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-2-
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
0.15 uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
-4-
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
-5-
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec. sheet is applied to LCD TV used LP92A chassis.
3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC
2. Specification
Each part is tested as below without special appointment. 1) Temperature : 25 C 5 C (77 F 9 F), CST : 40 C 5 C 2) Relative Humidity : 65 % 10 % 3) Power Voltage : Standard input voltage(AC 100-240 V~ 50 / 60 Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.
4. Module specification(General)
No. 1 2 3 4 5 6 7 8 Item Screen Size Aspect Ratio LCD Module Operating Environment Storage Environment Input Voltage Power Consumption LDC Module (Maker : LGD) Coating 16:9 55 cm(22 inch) TFT WXGA LCD Temp.: 0 deg ~ 40 deg Humidity : 0 % ~ 85 % Temp.: -20 deg ~ 60 deg Humidity : 0 % ~ 85 % AC 100-240 V~ 50 / 60 Hz 70 W 55 cm(22 inch) 55 cm(22 inch) HD 501(H) x 297(V) x 17.3(D) 116.5 x 349.5 x RGB 2CCFL 3H Outline Dimension, Unit : mm Pixel Pitch, Unit : mm Backlight Assembly Specification 55 cm(22 inch) wide Color Display Module Measurement Remark Resolution : 1366*768
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-6-
Maker
Remark
7. HDMI Input(DTV)
No. 1 2 3 4 5 6 7 8 9 Specification Resolution 720*480 720*480 720*576 720*480 720*480 720*576 1280*720 1280*720 1280*720 H-freq(kHz) 15.73 15.75 15.625 31.47 31.5 31.25 44.96 45 37.5 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 Pixel Clock(MHz) 13.500 13.514 13.500 27 27.027 27 74.176 74.25 74.25 Proposed SDTV, DVD 480I(525I) SDTV, DVD 480I(525I) SDTV, DVD 576I(625I) 50 Hz SDTV 480P SDTV 480P SDTV 576P HDTV 720P HDTV 720P HDTV 720P
LGE Internal Use Only
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-7-
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP92A chassis. (2) Download steps 1) Execute ISP Tool program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the Connect button and confirm Dialog Box
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of 25 C 5 C of temperature and 65 % 10 % of relative humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-220 V~ 50 / 60 Hz. (5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility) 1) Using D/L Jig (2) Input Tool-Option (3) ADC Calibration - Component (4) Check SW Version.
3) Click the Config button and Change speed I2C Speed setting : 350Khz~400Khz
Filexxx.bin
Filexxx.bin
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
5) Click (2)Auto tab and set as below 6) Click (3)Run. 7) After downloading, you can see the (4)Pass message.
(1) EDID D/L method 1) Press the In-start key 2) Move to the System Control2 and Press the OK( ) 3) Move to the EDID D/L and press the right direction key(G) 4) After about a few seconds, appear OK, then complete. 5) Press the OK key( ). 6) Press the EXIT key.
3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select Auto-RGB and press OK( ) key. 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear COMPONENT-OK (3) Confirmation 1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 0x00 0x02 instruction. 2) We confirm whether 0xF3 (offset), 0xF4 (gain) address of EEPROM 0xBC is 0xAA or not. 3) If 0xF3 , 0xF4 address of EEPROM 0xBC isn t 0xAA, we adjust once more. 4) We can confirm the ADC values from 0x06~0x0B addresses in a page 0xBC.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
-9-
(1) Enter the adjustment mode of DDC - 22Set command delay time : 50 ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance - Enter the white balance adjustment mode with aging command (F3, 00, 00) (4) Release the adjust mode of white balance - Release the white balance adjustment mode with aging command(F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
* CASE First adjust the coordinate far away from the target value(x, y). 1) x, y > target i) Decrease the R, G. 2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3) x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4) x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode Cool Medium Warm x y Temp 9,300 K 8,000 K 6,500 K 0.2850.002 0.2930.002 0.2950.002 0.3050.002 0.3130.002 0.3290.002 uv 0.000 0.000 0.000
To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 -
IR & LED (P201) Serial Flash (16MByte) HDMI_SCL/SDA HDMI_DATA IC602 MAIN_SCL/SDA EEPROM for HDCP (8K) DSUB_SCL/SD A SCL/SDA IC601 IC301 EEPROM 24C02
TX
IC603
HDMI (JK301)
TMDS
RGB_PC (JK102)
BLOCK DIAGRAM
TXCE0 TXCE1 TXCE2 TXCE3 TXCLKE TXCLKO TXCO0 TXCO1 TXCO2 TXCO3
AV_LIN/RIN : 500mVrms
IC501 IC502 AUDIO AMP VIF SAW Filter SIF SAW Filter SIF CONTROL (P200) TUNER_SCL/SDA TU_MAIN L_SPK_O UT PANEL_STATUS AUDIO_L/R OUT IIS_OUT AUAMP_SCL/SDA PWM NTP3100L R_CH L_CH R_SPK _OUT
AUDIO_OUT(JK 103)
TV (RF)
LIPS
OPC_OUT RL_ON/I-DIMMING/DISP_EN
HD LVDS connect or
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
(SVC Only )
EEPROM (64K)
- 12 -
COMPONENT (JK100)
E-DIM
COMPONENT_L/R : 500mVr ms
AV(JK101)
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
550
540
800
LV1
200T
530
910
A2 900
200
120
510
122
300
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
301
500
A5
A10
- 13 -
INPUT
JK101
Component/AV In
PPJ228-01
9A 4A 3A 9B 8B 9C
[YL]O-SPRING-L
CVBS_VIN
R110 75 ZD101 SD05 ZD102 SD05
[GN]E-LUG [GN]O-SPRING-S
COMP_Y
R116 75
COMP_PB
D103 SD05 R117 75
[RD]E-LUG_1
5F 6F 8C 9D
[RD]C-LUG-S
COMP_PR
D104 SD05 R118 75
[YL]CONTACT-L
[WH]E-LUG [WH]C-LUG-S
D105 30V R119 220K
CVBS_LIN
READY C106 560pF 50V R101 12K
[WH]C-LUG-L
7G
8D 9E
COMP_L
[RD]E-LUG_2 [RD]O-SPRING-S
D106 30V R120 220K
CVBS_RIN
READY C107 560pF 50V R102 12K
[RD]O-SPRING-L [RD]CONTACT-L
5H 6H
4E 3E
COMP_R
[RD]CONTACT-S
AV Audio Out
HOTEL_OPT
R129 0
HOTEL_OPT
R130 0
HOTEL_OPT
R131 0
AV Video Out
R105 75 JP101
1 2 3 4 5 PPJ200-01 JK102
[RD]1P-CAN
NON_HOTEL_OPT
NON_HOTEL_OPT
[RD]O-SPRING
MNT_ROUT MUTE_LINE
POP NOISE
12V_AUDIO
GAIN X 4
ISA1530AC1 Q101 E B C C E JP102 R106 220 READY R107 402 B R111 470 RT1C3904-T112 Q102 R114 47
[RD]CONTACT
C E B Q103 RT1C3904-T112
NON_HOTEL_OPT
[WH]1P-CAN
MNT_VOUT_T
R112 68
NON_HOTEL_OPT
[WH]C-LUG-L
RT1C3904-T112 Q106
MNT_LOUT MUTE_LINE
POP NOISE
C E B Q104 RT1C3904-T112
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 INPUT
2009/08/20 1 7
LVDS/IR
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-
HD(26/32")
5V_12V_LCD
5V_12V_LCD
1
SMAW200-28C2 19_22inch
P204
HD(19/22")
NON_LGDV5
1 2 3 4 5
2 3 External VBR
OPC_ENABLE
R210 R211
0 0 R224 R222 0 0
TXCE3+
OPC_ENABLE
NON_LGDV5
E_DIM OPC_OUT
OPC_OUTPUT
4 5 6 7 8 9
6 TXCE37 8 TXCLKE+ 9 TXCLKE10 TXCE311 TXCE2+ 12 TXCE213 TXCLKE14 TXCE1+ 15 TXCE116 TXCE217 TXCE0+ 18 TXCE019 TXCE120 21 TXCE0+ 22 TXCE023 24 25 26 27 28 29 30 31 TXCE1+ TXCE2+ TXCLKE+ TXCE3+
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
3.3V_M
VESA R220 0
3.3V_M
OPC_ENABLE
R201 470
OPC_ENABLE RT1C3904-T112
3.3V_M
OPC_ENABLE
Q201
READY OPC_ENABLE
R202 0
C E
R205 1K
CONTROL
SMAW200-03 P200 L204
KEY1
L206 KEY1 8OHM L207 KEY2 8OHM C212 100pF 50V C209 100pF 50V
IR & LED
KEY1
READY ZD204 5.6B
12507WS-08L P201
8OHM L205
KEY2
KEY2
L203 ST_5V 500-ohm C207 0.1uF 50V C208 100pF 50V READY ZD205 5.6B
GND
BG2012B080TF
ST_5V
READY ZD203 5.6B
GND
3.3V_M R206 4.7K R208 LED_B 4.7K B READY R209 0 C READY C203 0.1uF 50V
BG2012B080TF
IR
ZD201 5.6B
E KST3906-MTF Q202
LED_B
L200 8OHM C206 100pF 50V READY ZD202 5.6B
LED_R
READY ZD200 5.6B
8
26inch_GASKET GAS1-*1 26inch_GASKET GAS2-*1
MDS61887701
26inch_GASKET GAS3-*1
MDS61887701
26inch_GASKET GAS4-*1
MDS61887701
9 GND
MDS61887701
BG2012B080TF
L201
8OHM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 LVDS/IR
2009/08/20 2 7
HDMI
HDMI
C R302 1K READY R301 10K E HD_5V R320 4.7K
22
HPDCTL
HDMI_5V_DET
R303
16
10 10
HDMI_SDA HDMI_SCL
R304
15 14 13
R305
12 11
5.6
TXCLK-
R306
10
5.6 5.6
TXCLK+ B_TX0-
R307
9 8
R308
7
5.6 5.6
B_TX0+ G_TX1-
R309
6 5
R310
4
5.6 5.6
G_TX1+ R_TX2-
R311
3 2
R312
1 20 21
5.6
R_TX2+
JK301 QJ41193-CFEE1-7F
P301 KCN-DS-1-0089
6630TGA004K
PC(Control)
MMBD301LT1G D301
IC301 AT24C02BN-10SU-1.8
A0 1 8 VCC
30V
ENKMC2838-T112 D302 A1 C A2 C302 0.1uF 50V R327 10K R329 4.7K R331 4.7K
5V_M HD_5V
6 1 7 11
A1
WP
DDC_CTL
2 8 3 9 4 10 5
12
DSUB_SDA
A2
SCL
HDMI_SCL
BLUE_GND
GND
SDA
HDMI_SDA
13
H_SYNC BLUE NC
14
15
DSUB_SCL
16
SHILED
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 HDMI/RGB
2009/08/20 3 7
TUNER
ONLY_TA TU401 TDTC-G427D
5V_TUNER
D401 R418 100 C413 0.1uF 16V C417 0.1uF 16V R423 30V
1 2 3
NC B1_5V NC
C403 0.01uF 50V C406 10uF 10V R409 0
12K
TU_AGC
5V_M
5V_M
R432 4.7K
R433 4.7K
4 SCL
C411 47pF 50V
R415 47
TUNER_SCL TUNER_SDA
5 6 7 8
SDA
5V_TUNER
C412 47pF 50V
R414 47
B2_5V NC AS
R408 0
VIF_12V R435 330 R402 READY R401 0 L401 820nH R411 680 330 C402 C405 0.01uF 47uF 25V 50V R405 0
9 NC 10 11 12 13 GND
NC AIF AIF
READY R426 0 C401 0.01uF 50V R406 6.8K R404 0 R407 1K READY C410 0.1uF 16V C409 0.01uF 50V R410 1.2K C B E
R413 0 BFS17W Q401 5V_M 5V_M TU_SW_VIF R425 3.3K TU_SW_VIF R417 10K E
OUTPUT1
VIF1
READY L404 2.2uH
SWITCHING_INPUT
5 3
CHIP_CARRIER
OUTPUT2
VIF2
NON_TU_SW R430 0
R424 10K
TU_CTL_VIF
5V_M
ONLY_TA
L402 K9653D 1
4
OUTPUT_1
SIF1
1 2 3 4 5 6 7 8 9 10 11 12 13
ANT_PWR B1[+5V] NC[RF_AGC] SCL SDA B2[+5V] NC[VTU] AS NC_1 NC_2 NC_3 AIF R436 10K TU_SW_SIF R403 10K B 5V_M
SWITCHING_INPUT
OUTPUT_2
SIF2
3 NON_TU_SW R431 0
INPUT-GND/CHIP_CARRIER_GND
TU_CTL_SIF
NTSC-M
INPUT-GND 2 5 OUTPUT_2 CHIP_CARRIER-GND 3 INPUT-GND 2 5 OUTPUT_2 3 CHIP_CARRIER-GND
Low Low
R428 NTSC THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
R429 X O
R430 O X
R431 O X
X O
PAL/MULTI
EAX61462901 TUNER
AUDIO
24V_15V_NTP READY D501 100V R550 18 R516 R518 18 18 C521 1000pF 50V C522 1000pF 50V R551 18 R517 18 R519 18 L503 DA-8580
2S 2F
MLB-201209-0120P-N2
L505 C529 0.1uF 50V C527 0.47uF 50V C530 0.1uF 50V R521 4.7K R520 4.7K C534 0.01uF 50V R522 3.3 120-ohm
SPK_L+
1S
1F
EAP38319001
MLB-201209-0120P-N2
L506 120-ohm
SPK_L-
C520 22000pF 50V C512 22000pF 50V C552 0.1uF 50V C515 0.1uF 50V C523 1uF 25V P501 SMAW250-04
PGND1A_2
PGND1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
PGND1B_2
PGND1B_1
OUT1A_2
OUT1A_1
OUT1B_2
OUT1B_1
BST1B
ST_3.3V
VDR1B
R-SOUND-N
R-SOUND-P
56
55
54
53
52
51
50
49
48
47
46
45
44
R505 10K 3.3V_M R504 10K READY R502 4.7K E READY R503 0 READY R501 22K R506 100 C507 1000pF 50V C509 1uF 25V B C RT1C3904-T112 Q501 HIGH : ACTIVE LOW : RESET
43
L-SOUND-N
SPK_L+
L-SOUND-P
SW_RESET
Main AMP
IC501 NTP-3100L
38 37 36 35 34 33
SPK_R+
I2S_MCLK
3.3V_M
R508 100
CLK_I 7 VDD_IO 8
R530 4.7K
1S
1F
EAP38319001
L502 120-ohm 1.8V_M L501 120-ohm C502 10uF 16V C506 0.1uF 50V C503 10uF 16V C505 0.1uF 50V
L508 120-ohm
SPK_R-
DVDD_PLL 13 TEST0 14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
24V_15V_NTP
WCK
BCK
SDA
DVDD
SDATA
SCL
FAULT
VDR2B
DVSS_2
BST2B
MONITOR_0
MONITOR_1
MONITOR_2
PGND2B_1
100 100 100 100 100 READY C513 33pF 50V READY C514 33pF 50V HOTEL_OPT R514 0 C518 1000pF 50V
R515 0
MULTI_PW_SW
HIGH : ACTIVE LOW : MUTE
AMP_MUTE_HOTEL
AMP:GAIN X 4
12V_AUDIO C544 0.1uF 50V RT1C3904-T112 C Q502 B C546 6800pF 50V HOTEL_OPT R541-*1 15K R538 1K C548 33pF 50V
NON_HOTEL_OPT
IC502
1 OUT1
R541 12K
LM324D
OUT4 14
MNT_LOUT
E R536 4.7K
2 INPUT1R546 6.8K
INPUT4- 13
C551 0.1uF 50V
0 1
MNT_L_AMP
3 INPUT1+
INPUT4+ 12 AUDIO_R
2 HOTEL_OPT R548 0 4 3.3V_M HOTEL_OPT R545 10K HOTEL_OPT R540 200 E 8 C B
HOTEL_OPT RT1C3904-T112
4 VCC
C550 0.01uF 50V
GND 11
SW_RESET
MNT_R_AMP
12V_AUDIO
5 INPUT2+
INPUT3+ 10 AMP_MUTE_HOTEL
6 Q504 7
INPUT3- 9
R544 12K
R547 6.8K
7 OUT2
OUT3 8
SPK_R+_HOTEL SPK_R-_HOTEL
9 10
MNT_ROUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 AUDIO
2009/08/20 5 7
IR 4.7K MUTE_LINE
TXCLK-
SW_RESET
B_TX0+
B_TX0-
TXCLK+
I2S_MCLK
POWER_SW
HDMI_SDA
HPDCTL
G_TX1+
R_TX2-
G_TX1-
HDMI_SCL
4.7K DSUB_SDA
R663
4.7K
AVDDP1
AVDDP2
VDDC
R666
AVDD_ADC
100
R668
100
C656 0.1uF
100
100
100
100
22
R674
4.7K DSUB_SCL
I2S_SCK
I2S_SDO
I_DIM
I2S_WS
HWRESET
E_DIM
MAIN(MARIA8)
ST_3.3V
ST_3.3V
ST_3.3V
0.1uF 0.1uF
SERIAL FLASH 2M
IC603
MX25L1605AM2C-15G
3.3V_M
R670
R657
R671
R669
R665
AVDD_ADC_3
C665
AVDDP_1_7
C659
R684
DDCD_SDA
DDCD_SCL
R667
DDCA_DAT
DDCA_CLK
R675
HOTPLUG
AVDDP_2
VDDC_4
GPIOM1
AUMCKO
WAKEUP
RXA2N
RXA1P
RXA1N
RXA0P
RXA0N
RXACP
RXACN
GND_7
AUSCK
AUSD0
RESET
PWM3
PWM2
AUWS
SAR0
SAR1
SAR2
IRIN
CEC
INT
CS#
SO
SPI_DO
HOLD#
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
100
R_TX2+
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78
124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106
FLASH_WP
AVDDP1
R607 100
WP#
SCLK
SPI_CLK
GND
SI
SPI_DI
EEPROM(A0)
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKEIC601 AT24C64AN-10SU-2.7
A0 1 8 VCC
LVA2P LVA2N LVACLKP LVACLKN LVA3P LVA3N GND_5 AVDDP_1_5 LVB0P LVB0N LVB1P LVB1N LVB2P LVB2N LVBCLKP LVBCLKN LVB3P LVB3N AVDDP_1_4 GND_4 VDDC_3 TXD0/GPIOD0 RXD0/GPIOD1 RXD1/GPIOD2 TXD1/GPIOD3 GPIOD4 GPIOD5 AUMUTE/GPIOD6 GPIOD7 SPI_CK SPI_CZ SPI_DI SPI_DO GPIO/SPI_SIO2 GPIO/SPI_SIO3 GPIO_5 GPIO_4 GPIO_3 GPIO_2 GPIO_1
R664 R678 100 R681 R682 R661 100 R649 R651 100 100 HDMI_5V_DET DDC_CTL 100 100 100 DISP_EN PANEL_ON RL_ON R677 100 R685 100 READY R692 4.7K R693 4.7K MUTE_LINE FLASH_WP SPI_CLK SPI_CZ SPI_DI SPI_DO C657 0.1uF C666 0.1uF C662 0.1uF 16V
3.3V_M 3.3V_M
C602 0.01uF 50V R697 4.7K R696 4.7K
AVDD_ADC
AVDD_ADC_1
C641 0.1uF
HSYNC0
COMP_PB R636 R641 COMP_Y R637 R638 COMP_PR R639 33 68 33 0 33 C621 0.047uF C630 C622 C623 0.047uF 0.047uF 1000pF
A1
WP
A2
SCL
R615 22 R616 22
MAIN_SCL MAIN_SDA
GND
AVDDP1
TXCE0TXCE0+ TXCE1TXCE1+ TXCE2TXCE2+ TXCLKETXCLKE+ TXCE3TXCE3+
SDA
C624 0.047uF
C651 0.1uF
AVDD_ADC
R629 33 READY 33 R630 READY 47 R631 READY 33 R632 68 C616 0.047uF READY C617 0.047uF READY C618 0.047uF READY C619 0.047uF C620 0.047uF
CVBS_VIN
IC604 MARIA8(LGE7871)
HDCP EEPROM(A8)
IC602 CAT24WC08W-T
A0 1 8 VCC
3.3V_M
R633
MNT_VOUT_T
CVBSOUT AVSS_ADC_2
C648 0.1uF 200
R602 4.7K
AVDDP1
A1 2 7 WP
AVDD_MPLL
C612 27pF 14.31818MHz X601 C613 27pF R628 1M R642
R655 100
VDDC
MAIN_SCL MAIN_SDA AUAMP_SDA AUAMP_SCL OPC_EN
A2
SCL
VSS
SDA
AVDD_VIF AVDD_VIF
AVDD_VIF_1
C646 0.1uF
AVDD_VIF_2
C652 0.1uF L606 600
ST_3.3V 3.3V_M
L602 3.3V_M 120-ohm C638 10uF 10V 0 R683 0 R686 0 READY R691 0 R676
VIF2 VIF1
ST_3.3V
AVDDP2
5V_M
L601 120-ohm R639 1uF 10V C607 0.1uF 16V
SIF1 SIF2 R625 5.6K C614 10uF 10V C615 0.1uF 16V C645 C642 0.1uF
ST_3.3V
AVDD_MPLL
AVDD_VIF
TU_AGC
ST_3.3V
R662 0
1.2V_VDDC_M8
L603 120-ohm C640 4.7uF 6.3V C643 10uF 10V C654 0.01uF 50V
VDDC
AVDD_AUSDM
COMP_L COMP_R CVBS_LIN CVBS_RIN C625 C626 C627 C628 2.2uF 2.2uF 2.2uF 2.2uF
JTP-1127WEM SW601 1 3
RESET
R621 100
HWRESET
C604 0.1uF 16V
LINE_IN_2R
LINE_OUT_L
LINE_OUT_R
DAC_OUT_L
DAC_OUT_R
AVDDP_1_1
AVDDP_1_2
AVDDP_1_3
AUCOM
AUVRM
AUVRP
AUVAG
GND_1
GND_2
GPIOD10
GPIOD11
GPIOB13
GPIOB12
GPIOB11
GPIOB10
VDDC_1
GPIOB9
GPIOB8
GPIOB3
GPIOB2
GPIOB1
GPIOB0
VDDC_2
GND_3
AVSS
PWM1
PWM0
D603 KDS181
R624 33K
3.3V_M
ST_5V
100
0.1uF C631
100
100
100
R660
0.01uF
R659
0.1uF
0.01uF
0.1uF
P_24V_SMALL_15V
READY R601 0 KDS181 D601 R609 150 C601 47uF 25V ISA1530AC1 Q601 KDS181 D602 R612 2K R613 10K R619 1K READY C605 2.2uF 16V B E C RT1C3904-T112 Q602 R623 10K
R634
0.1uF
R635
C660
C647
C653
C661
C658
MULTI_PW_SW
1K
1K
R652
R654
R650
R656
R644
R645
R689 1K
VDDC
READY
READY
P_12V_SMALL_15V
R679 4.7K
R687 4.7K
R605 0 R604 1K
R603 1K
19_22inch
AVDDP1
AVDDP1
VDDC
AVDDP1
0.1uF
4.7uF
C633 10uF
C636 0.01uF
C637 0.01uF
1uF
C632
C634
C635
22K
22K
READY R690 1K
R606 10K
R680 4.7K
R643
R646
TUNER_SCL
TUNER_SDA
PANEL_STATUS
TU_CTL_VIF
TU_CTL_SIF
LED_B
MNT_L_AMP
MNT_R_AMP
RL_ON
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 MARIA8
2009/08/20 6 7
Power
P701 FM20020-24
P_5V
BD9130EFJ-E2 IC702
ADJ
19_22inch P703
R726 5V_M 0
ITH VCC
EN
R740 10K
NC GND GND
1 3 5 7 9 11 13 15 17 19 21 23 25
2 4 6 8 10 12 14 16 18 20 22 24
Power ON GND GND 5.2V 5.2V GND 12V GND 24V Inverter ON Error Out PWM Dim
3 1
R719 2.2K
26_32inch 2SC3875S
26_32inch 26_32inch
PVCC
R758 10K
READY
SMAW200-11
Q702 2
RL_ON
15V 1
SW
C716 10uF 10V READY R739 3.3 READY C725 2200pF 50V
GND
PGND
OUT:1.27V
P_5V
P_5V
15V 2
MAX 2A
R1
V0 = 0.8*(1+(R2/R1))
R753 0 IC704 AZ1085S-3.3TR/E1 R738 INPUT 3 MAX 3A 2 OUTPUT C723 0.1uF 50V 1 ADJ/GND AP1117EG-13 IC705 3.3V_M
P_12V_SMALL_15V
12V GND
P_12V_SMALL_15V
19_22inch R723 0
GND
P_24V_SMALL_15V
24V NC A.Dim NC
P_24V_SMALL_15V
GND
4
0
OUT:3.3V
C729 100uF 16V C733 10uF 10V C735 0.1uF 50V
IN
5V
2 MAX 1A 1
OUT
OUT:1.85V
R1 R750
NTP,AUDIO DSP
1.8V_M C742 10uF 10V C744 0.1uF 50V READY C746 1uF 25V
ADJ/GND
120
5V_M 3.3V_M
R712 3K R755 10K R707 2SC3875S Q701 R713 2 10K 3 1 0
5V
R2 R751
56
NC
V0 = 1.25*(1+(R2/R1))
7 8
26_32inch
DISP_EN
NC
MULTI VOLTAGE
Inverter_ON
PWM_Dim
10
A.Dim
11
L705 P_5V 120-ohm READY C718 68uF 35V
1 2 3 4
8 7 6 5
MLB-201209-0120P-N2 L708 5V_12V_LCD C731 0.1uF 50V 120-ohm R747 4.7K R749 4.7K R752 4.7K C745 100uF 16V C748 0.01uF 50V
Non Sharp32
R704 0
Sharp32 R721 0
G1 S2
PANEL
I_DIM
R725 10K
R764 B 10K
G2
PANEL_ON
DC_DIM R709-*1
NON_CMO32
B Q706 E RT1C3904-T112
1K
E_DIM
OPC_DISABLE R715 1K
OPC_DISABLE
R724
Non Sharp32
PANEL_STATUS
R716 6.2K
OPC_OUT
OPC_ENABLE R714 1K
OPC_ENABLE
POWER_SW
RT1C3904-T112 Q704
R717 6.2K
TUNER VOLTAGE
L703 P_5V 120-ohm C705 10uF 16V C709 0.01uF 50V C711 0.01uF 50V ST_5V P_24V_SMALL_15V 500 C703 68uF 35V C707 0.01uF 50V C712 0.1uF 50V L702 24V_15V_NTP
IC706 AP1117EG-13 IN 3 2 OUT 1 ADJ/GND R759 110 READY C749 0.1uF 16V 5V_TUNER
V0 = 0.8*(1+(R1/R2))
26_32inch R741
OUT:6.8V
C732 100uF 16V 5V_M
R757 330
L701 ST_3.3V C710 10uF 10V C713 0.01uF 25V READY C714 1uF 25V P_12V_SMALL_15V 120-ohm C704 47uF 25V C708 0.01uF 50V 12V_AUDIO READY C753 100pF 50V READY C724 560pF 50V
R1
10K
R736 43K FB
MP2212DN IC703 1
MAX 3A
19_22inch R748 10
L710 26_32inch VIF_12V READY C754 10uF 16V 120-ohm 19_22inch R761 0 CIC21J501NE L704 P_12V_SMALL_15V 500 19_22inch D701 50V 26_32inch R731 0
8 EN/SYNC 7 SW_2
26_32inch
R2
R743 2K
2 3 4
Power indicator
ST_5V 5V_M 19_22inch R760 R701 10K R703 1.2K 0 INPUT 1
6 SW_1 5 VCC
C739 0.47uF 50V R742 0 C730 1uF 25V
BS
SAM2333 LD701
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
EAX61462901 POWER
2009/08/20 7 7