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Internal Use Only

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LCD TV SERVICE MANUAL


CHASSIS : LP92A

MODEL : 22LD310
CAUTION

22LD310-MA

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL63284502 (1003-REV00)

Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2 PRODUCT SAFETY ................................................................................. 3 SPECIFICATION ...................................................................................... 6 ADJUSTMENT INSTRUCTION ............................................................... 8 BLOCK DIAGRAM ................................................................................. 12 EXPLODED VIEW .................................................................................. 13 SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB. Keep wires away from high voltage or high temperature parts.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit


AC Volt-meter

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 M and 5.2 M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

To Instruments exposed METALLIC PARTS

0.15 uF

Good Earth Ground such as WATER PIPE, CONDUIT etc.

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

-3-

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

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LGE Internal Use Only

IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range
This spec. sheet is applied to LCD TV used LP92A chassis.

3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC

2. Specification
Each part is tested as below without special appointment. 1) Temperature : 25 C 5 C (77 F 9 F), CST : 40 C 5 C 2) Relative Humidity : 65 % 10 % 3) Power Voltage : Standard input voltage(AC 100-240 V~ 50 / 60 Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.

4. Module specification(General)
No. 1 2 3 4 5 6 7 8 Item Screen Size Aspect Ratio LCD Module Operating Environment Storage Environment Input Voltage Power Consumption LDC Module (Maker : LGD) Coating 16:9 55 cm(22 inch) TFT WXGA LCD Temp.: 0 deg ~ 40 deg Humidity : 0 % ~ 85 % Temp.: -20 deg ~ 60 deg Humidity : 0 % ~ 85 % AC 100-240 V~ 50 / 60 Hz 70 W 55 cm(22 inch) 55 cm(22 inch) HD 501(H) x 297(V) x 17.3(D) 116.5 x 349.5 x RGB 2CCFL 3H Outline Dimension, Unit : mm Pixel Pitch, Unit : mm Backlight Assembly Specification 55 cm(22 inch) wide Color Display Module Measurement Remark Resolution : 1366*768

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

-6-

LGE Internal Use Only

5. Chroma& Brightness (Optical)


(1) LCD Module
The Color Coordinates check condition - 50 cm from the surface, Full White Pattern - Picture mode Vivid No. 1. 2. 3. Luminance (W/O PC mode) VIew angle (R/L, U/D) Color Coordinates White RED Green Blue 4. 5. Contrast ratio Luminance Variation X Y X Y X Y X Y 700:1 Typ -0.03 170/155 0.285 0.293 0.642 0.333 0.295 0.608 0.147 0.063 1000:1 1.3 Typ +0.03 degree CR > 10 Item Min. 280 Typ. 350 Max. Unit cd/m
2

Maker

Remark

6. Component Video Input (Y, PB, PR)


No. 1 2 3 4 5 6 7 8 9 Specification Resolution 720*480 720*480 720*576 720*480 720*480 720*576 1280*720 1280*720 1280*720 H-freq(kHz) 15.73 15.75 15.625 31.47 31.50 31.25 44.96 45.00 37.50 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 Pixel Clock(MHz) 13.500 13.514 13.500 27.000 27.027 27.000 74.176 74.250 74.25 Proposed SDTV, DVD 480I(525I) SDTV, DVD 480I(525I) SDTV, DVD 576I(625I) 50 Hz SDTV 480P SDTV 480P SDTV 576P 50 Hz HDTV 720P HDTV 720P HDTV 720P 50 Hz

7. HDMI Input(DTV)
No. 1 2 3 4 5 6 7 8 9 Specification Resolution 720*480 720*480 720*576 720*480 720*480 720*576 1280*720 1280*720 1280*720 H-freq(kHz) 15.73 15.75 15.625 31.47 31.5 31.25 44.96 45 37.5 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 Pixel Clock(MHz) 13.500 13.514 13.500 27 27.027 27 74.176 74.25 74.25 Proposed SDTV, DVD 480I(525I) SDTV, DVD 480I(525I) SDTV, DVD 576I(625I) 50 Hz SDTV 480P SDTV 480P SDTV 576P HDTV 720P HDTV 720P HDTV 720P
LGE Internal Use Only

Remarks Spec. out but display

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

-7-

ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP92A chassis. (2) Download steps 1) Execute ISP Tool program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the Connect button and confirm Dialog Box

2. Specification
(1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of 25 C 5 C of temperature and 65 % 10 % of relative humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-220 V~ 50 / 60 Hz. (5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility) 1) Using D/L Jig (2) Input Tool-Option (3) ADC Calibration - Component (4) Check SW Version.

3.2. SET assembly adjustment items


(1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Preset CH information (5) Factoring Option Data input

3) Click the Config button and Change speed I2C Speed setting : 350Khz~400Khz

4. PCB assembly adjustment method


4.1. Mstar Main S/W program download
- Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack 4) Read and write bin file. Click (1)Read tab, and then load download file (XXXX.bin) by clicking Read.

Filexxx.bin

Filexxx.bin

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LGE Internal Use Only

5) Click (2)Auto tab and set as below 6) Click (3)Run. 7) After downloading, you can see the (4)Pass message.

(1) EDID D/L method 1) Press the In-start key 2) Move to the System Control2 and Press the OK( ) 3) Move to the EDID D/L and press the right direction key(G) 4) After about a few seconds, appear OK, then complete. 5) Press the OK key( ). 6) Press the EXIT key.

* If TV is Turn On, Check the updated SW Version and Tool Option.

4.2. Input tool option.


Adjust tool option refer to the BOM. - Tool Option Input : PCBA Check Process - Area Option Input : Set Assembly Process After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally) (1) Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market (2) Equipment : adjustment remote control. (3) Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.) (If not changed the option, the input menu can differ the model spec.) Refer to Job Expression of each main chassis ass y (EBTxxxxxxxx) for Option value [Caution] - Dont Press IN-STOP key after completing the function inspection. - Dont connect HDMI cable when downloading the EDID. If the cables are connected, Downloading of EDID could be failed.

4.4. ADC Calibration-Component


- Using External pattern (1) Required Equipments - Remote control for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component mode. 2) Input the Component 720P@60 Hz 100 % Color Bar YPbPr signal into Component (MSPG-925F Model: 217 / Pattern: 65)

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select Auto-RGB and press OK( ) key. 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear COMPONENT-OK (3) Confirmation 1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 0x00 0x02 instruction. 2) We confirm whether 0xF3 (offset), 0xF4 (gain) address of EEPROM 0xBC is 0xAA or not. 3) If 0xF3 , 0xF4 address of EEPROM 0xBC isn t 0xAA, we adjust once more. 4) We can confirm the ADC values from 0x06~0x0B addresses in a page 0xBC.

4.3. EDID Data


* 22LD310<HDMI : 256 Byte>

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

-9-

LGE Internal Use Only

4.5. Check SW Version


(1) Method 1) Push In-star key on Adjust remote control. 2) SW Version check Check Main : Vx.xx - LD310

(1) Enter the adjustment mode of DDC - 22Set command delay time : 50 ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance - Enter the white balance adjustment mode with aging command (F3, 00, 00) (4) Release the adjust mode of white balance - Release the white balance adjustment mode with aging command(F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)

5. SET assembly adjustment method


5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because being different of each Countrys Language and signal Condition. (2) Equipment : adjustment remote control. (3) Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.) Refer to Job Expression of each main chassis ass y (EBTxxxxxxxx) for Option value.

5.3. Adjustment of White Balance


(for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing POWER ON key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push Exit key. 3) Change to the AV mode by remote control. 4) Input external pattern (85 % white pattern) 5) Push the ADJ key -> Enter 0000 (Password) 6) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the one of R/G/B gain and change the others 9) When adjustment is completed, Enter COPY ALL. 10) Exit adjustment mode using EXIT key on R/C.

5.2. Adjustment of White Balance


- Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. - Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. - Adjustment mode : Three modes - Cool / Medium / Warm (Medium data is automatically calibrated by the Cool data) - Required Equipment 1) Remote control for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product LCD TV(ch : 9) (should be used in the calibrated ch by CS-1000) 3) Auto W/B adjustment instrument(only for auto adjustment) 5.2.1. Connecting diagram of equipment for measuring (For Automatic Adjustment)

* LP92A Support I2C Interface For ADC/DDC Adjustment.

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 10 -

LGE Internal Use Only

* CASE First adjust the coordinate far away from the target value(x, y). 1) x, y > target i) Decrease the R, G. 2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3) x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4) x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode Cool Medium Warm x y Temp 9,300 K 8,000 K 6,500 K 0.2850.002 0.2930.002 0.2950.002 0.3050.002 0.3130.002 0.3290.002 uv 0.000 0.000 0.000

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 11 -

LGE Internal Use Only

IR & LED (P201) Serial Flash (16MByte) HDMI_SCL/SDA HDMI_DATA IC602 MAIN_SCL/SDA EEPROM for HDCP (8K) DSUB_SCL/SD A SCL/SDA IC601 IC301 EEPROM 24C02

TX

IC603

HDMI (JK301)

TMDS

RGB_PC (JK102)

BLOCK DIAGRAM

AV_VIN : 1Vpp AV_VIN AV_LIN/RIN

TXCE0 TXCE1 TXCE2 TXCE3 TXCLKE TXCLKO TXCO0 TXCO1 TXCO2 TXCO3

AV_LIN/RIN : 500mVrms

IC501 IC502 AUDIO AMP VIF SAW Filter SIF SAW Filter SIF CONTROL (P200) TUNER_SCL/SDA TU_MAIN L_SPK_O UT PANEL_STATUS AUDIO_L/R OUT IIS_OUT AUAMP_SCL/SDA PWM NTP3100L R_CH L_CH R_SPK _OUT

AUDIO_LOUT/ROUT : 500mVr ms m TU401 IF TUNER

AUDIO_OUT(JK 103)

TV (RF)

LIPS
OPC_OUT RL_ON/I-DIMMING/DISP_EN

HD LVDS connect or

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

(SVC Only )

MAIN SCLAER Mi 8 LG7871 aria8MAIN_SCL/SDA (IC604)

EEPROM (64K)

COMPONENT_Y/Pb/Pr : 1/0.7Vpp COMP_Y/Pb/Pr MNT_OUT COMP_LIN/RIN

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COMPONENT (JK100)

E-DIM

COMPONENT_L/R : 500mVr ms

P202 P203 P204

AV(JK101)

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

550

540

800

LV1

200T

530

910

A2 900

200

120

510

122

300

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

301

500

A5

A10

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LGE Internal Use Only

INPUT
JK101

Component/AV In

PPJ228-01

9A 4A 3A 9B 8B 9C
[YL]O-SPRING-L
CVBS_VIN
R110 75 ZD101 SD05 ZD102 SD05

[GN]E-LUG [GN]O-SPRING-S
COMP_Y

[GN]CONTACT-S [BL]E-LUG [BL]C-LUG-S

ZD103 SD05 ZD104 SD05

R116 75

COMP_PB
D103 SD05 R117 75

[RD]E-LUG_1

5F 6F 8C 9D
[RD]C-LUG-S
COMP_PR
D104 SD05 R118 75

[YL]CONTACT-L

[WH]E-LUG [WH]C-LUG-S
D105 30V R119 220K

CVBS_LIN
READY C106 560pF 50V R101 12K

R103 10K R108 220K D101 30V

[WH]C-LUG-L

7G

8D 9E

R121 10K R123 12K READY C108 560pF 50V

COMP_L

[RD]E-LUG_2 [RD]O-SPRING-S
D106 30V R120 220K

CVBS_RIN
READY C107 560pF 50V R102 12K

R104 10K R109 220K D102 30V

[RD]O-SPRING-L [RD]CONTACT-L

5H 6H

4E 3E

R122 10K R124 12K READY C109 560pF 50V

COMP_R

[RD]CONTACT-S

AV Audio Out

HOTEL_OPT

R129 0

HOTEL_OPT

R130 0

HOTEL_OPT

R131 0

SPK_R+_HOTEL SPK_R-_HOTEL AUDIO_R

AV Video Out
R105 75 JP101

1 2 3 4 5 PPJ200-01 JK102

[RD]1P-CAN
NON_HOTEL_OPT

NON_HOTEL_OPT

[RD]O-SPRING

R128 1K D107 30V C102 5.6nF 50V R125 0 C E B RT1C3904-T112 Q105

C104 10uF 16V

MNT_ROUT MUTE_LINE
POP NOISE

12V_AUDIO

GAIN X 4
ISA1530AC1 Q101 E B C C E JP102 R106 220 READY R107 402 B R111 470 RT1C3904-T112 Q102 R114 47

[RD]CONTACT
C E B Q103 RT1C3904-T112
NON_HOTEL_OPT

[WH]1P-CAN

MNT_VOUT_T
R112 68

NON_HOTEL_OPT

[WH]C-LUG-L

R127 1K D108 30V C103 5.6nF 50V R126 0 C B E

RT1C3904-T112 Q106

C105 10uF 16V

MNT_LOUT MUTE_LINE
POP NOISE

C E B Q104 RT1C3904-T112

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 INPUT

2009/08/20 1 7

LGE Internal Use Only

LVDS/IR
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

HD(26/32")

P203 FF10001-30 26_32inch

5V_12V_LCD

5V_12V_LCD
1

SMAW200-28C2 19_22inch

P204

HD(19/22")

NON_LGDV5

1 2 3 4 5

2 3 External VBR
OPC_ENABLE

R210 R211

0 0 R224 R222 0 0
TXCE3+
OPC_ENABLE

NON_LGDV5

E_DIM OPC_OUT
OPC_OUTPUT

4 5 6 7 8 9

6 TXCE37 8 TXCLKE+ 9 TXCLKE10 TXCE311 TXCE2+ 12 TXCE213 TXCLKE14 TXCE1+ 15 TXCE116 TXCE217 TXCE0+ 18 TXCE019 TXCE120 21 TXCE0+ 22 TXCE023 24 25 26 27 28 29 30 31 TXCE1+ TXCE2+ TXCLKE+ TXCE3+

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

3.3V_M

JEIDA R221 4.7K

VESA R220 0

3.3V_M

OPC_ENABLE

R201 470
OPC_ENABLE RT1C3904-T112

3.3V_M
OPC_ENABLE

Q201
READY OPC_ENABLE

R213 4.7K OPC_EN

R202 0

C E

R205 1K

CONTROL
SMAW200-03 P200 L204
KEY1

L206 KEY1 8OHM L207 KEY2 8OHM C212 100pF 50V C209 100pF 50V

IR & LED
KEY1
READY ZD204 5.6B

12507WS-08L P201

8OHM L205
KEY2

8OHM C210 100pF 50V C211 100pF 50V


3
MBW3216-501TF

KEY2
L203 ST_5V 500-ohm C207 0.1uF 50V C208 100pF 50V READY ZD205 5.6B

GND

BG2012B080TF

L202 IR READY C202 0.1uF 50V 8OHM C205 47pF 50V

ST_5V
READY ZD203 5.6B

GASKET for ESD Improvement


32inch_GASKET GAS1 MDS61887706 32inch_GASKET GAS2 MDS61887706 32inch_GASKET GAS3 MDS61887706 32inch_GASKET GAS4 MDS61887706

GND

3.3V_M R206 4.7K R208 LED_B 4.7K B READY R209 0 C READY C203 0.1uF 50V
BG2012B080TF

IR
ZD201 5.6B

E KST3906-MTF Q202

LED_B
L200 8OHM C206 100pF 50V READY ZD202 5.6B

LED_R
READY ZD200 5.6B

8
26inch_GASKET GAS1-*1 26inch_GASKET GAS2-*1
MDS61887701

ST_3.3V R204 4.7K R203 10K C R212 LED_R 10K B Q204


RT1C3904-T112

26inch_GASKET GAS3-*1
MDS61887701

26inch_GASKET GAS4-*1
MDS61887701

9 GND

MDS61887701

BG2012B080TF

L201

READY C201 0.1uF 50V

8OHM

C204 100pF 50V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 LVDS/IR

2009/08/20 2 7

LGE Internal Use Only

HDMI

HDMI
C R302 1K READY R301 10K E HD_5V R320 4.7K
22

2SC3052 Q301 R313 B 10K

HPDCTL

R323 10K R321 10K


19 18 17

HDMI_5V_DET

R303
16

10 10

HDMI_SDA HDMI_SCL

R304
15 14 13

R305
12 11

5.6

TXCLK-

R306
10

5.6 5.6

TXCLK+ B_TX0-

R307
9 8

R308
7

5.6 5.6

B_TX0+ G_TX1-

R309
6 5

R310
4

5.6 5.6

G_TX1+ R_TX2-

R311
3 2

R312
1 20 21

5.6

R_TX2+

JK301 QJ41193-CFEE1-7F

P301 KCN-DS-1-0089
6630TGA004K

PC(Control)

MMBD301LT1G D301

IC301 AT24C02BN-10SU-1.8
A0 1 8 VCC

30V

ENKMC2838-T112 D302 A1 C A2 C302 0.1uF 50V R327 10K R329 4.7K R331 4.7K

5V_M HD_5V

6 1 7 11

RED_GND GND_2 RED GREEN_GND

A1

WP

R322 100 R324 100 R325 100 READY R328 0

DDC_CTL

2 8 3 9 4 10 5

12

DDC_DATA GREEN D303 30V

DSUB_SDA

A2

SCL

HDMI_SCL

BLUE_GND

GND

SDA

HDMI_SDA

13

H_SYNC BLUE NC

14

V_SYNC GND_1 SYNC_GND

15

DDC_CLOCK DDC_GND D304 30V

DSUB_SCL

16

SHILED

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 HDMI/RGB

2009/08/20 3 7

LGE Internal Use Only

TUNER
ONLY_TA TU401 TDTC-G427D
5V_TUNER
D401 R418 100 C413 0.1uF 16V C417 0.1uF 16V R423 30V

1 2 3

NC B1_5V NC
C403 0.01uF 50V C406 10uF 10V R409 0

12K

TU_AGC

5V_M

5V_M

R432 4.7K

R433 4.7K

4 SCL
C411 47pF 50V

R415 47

TUNER_SCL TUNER_SDA

5 6 7 8

SDA
5V_TUNER
C412 47pF 50V

R414 47

B2_5V NC AS

Near the pin


C404 0.01uF 50V C407 10uF 10V

R408 0

VIF_12V R435 330 R402 READY R401 0 L401 820nH R411 680 330 C402 C405 0.01uF 47uF 25V 50V R405 0

9 NC 10 11 12 13 GND

NC AIF AIF
READY R426 0 C401 0.01uF 50V R406 6.8K R404 0 R407 1K READY C410 0.1uF 16V C409 0.01uF 50V R410 1.2K C B E

READY C755 22pF 50V

5V_M TU_SW_VIF R419 6.8K

Layout placement Close to Mstar IC


ONLY_TA L403 K7257M
INPUT

R413 0 BFS17W Q401 5V_M 5V_M TU_SW_VIF R425 3.3K TU_SW_VIF R417 10K E

C414 0.01uF 50V

OUTPUT1

VIF1
READY L404 2.2uH

TU_SW_VIF R420 6.8K

TU_SW_VIF D403 KDS114E(KEC) 35V TU_SW_VIF R429 0

SWITCHING_INPUT

5 3
CHIP_CARRIER

OUTPUT2

VIF2

READY R412 R427 22 22

NON_TU_SW R430 0

R424 10K

Layout placement Close to Tuner

TU_CTL_VIF

C TU_SW_VIF 2SC3875S(ALY) Q403

5V_M
ONLY_TA

ONLY_MA TU401-*1 TDVH-H426F

C415 0.01uF 50V

TU_SW_SIF R421 6.8K


INPUT

L402 K9653D 1
4
OUTPUT_1

SIF1

TU_SW_SIF R422 6.8K

1 2 3 4 5 6 7 8 9 10 11 12 13

ANT_PWR B1[+5V] NC[RF_AGC] SCL SDA B2[+5V] NC[VTU] AS NC_1 NC_2 NC_3 AIF R436 10K TU_SW_SIF R403 10K B 5V_M

5V_M TU_SW_SIF R416 3.3K C TU_SW_SIF 2SC3875S(ALY) Q402 E

TU_SW_SIF D402 KDS114E(KEC) 35V TU_SW_SIF R428 0

SWITCHING_INPUT

OUTPUT_2

SIF2

3 NON_TU_SW R431 0

INPUT-GND/CHIP_CARRIER_GND

TU_CTL_SIF

ONLY_MA L403-*1 M3953M INPUT 1 SHIELD 4 OUTPUT_1 INPUT 1

ONLY_MA L402-*1 M9370M 4 OUTPUT_1

PAL-BG,DK,I TU_CTL_VIF TU_CTL_SIF High High

NTSC-M
INPUT-GND 2 5 OUTPUT_2 CHIP_CARRIER-GND 3 INPUT-GND 2 5 OUTPUT_2 3 CHIP_CARRIER-GND

Low Low

R428 NTSC THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

R429 X O

R430 O X

R431 O X

L403 M3953 K7257

L402 M9370 K9653 2009/08/20 4 7

X O

PAL/MULTI

EAX61462901 TUNER

LGE Internal Use Only

AUDIO
24V_15V_NTP READY D501 100V R550 18 R516 R518 18 18 C521 1000pF 50V C522 1000pF 50V R551 18 R517 18 R519 18 L503 DA-8580
2S 2F

MLB-201209-0120P-N2

L505 C529 0.1uF 50V C527 0.47uF 50V C530 0.1uF 50V R521 4.7K R520 4.7K C534 0.01uF 50V R522 3.3 120-ohm

SPK_L+

C516 0.1uF 50V

C517 10uF 35V

1S

1F

READY D502 100V

EAP38319001

R523 3.3 C535 0.01uF 50V

MLB-201209-0120P-N2

L506 120-ohm

SPK_L-

C520 22000pF 50V C512 22000pF 50V C552 0.1uF 50V C515 0.1uF 50V C523 1uF 25V P501 SMAW250-04

PGND1A_2

PGND1A_1

PVDD1A_2

PVDD1A_1

PVDD1B_2

PVDD1B_1

PGND1B_2

PGND1B_1

OUT1A_2

OUT1A_1

OUT1B_2

OUT1B_1

BST1B

ST_3.3V

VDR1B

SPK_RSPK_R+ SPK_L42 41 40 39 NC VDR2A BST2A PGND2A_2 PGND2A_1


MLB-201209-0120P-N2

R-SOUND-N

R-SOUND-P

56

55

54

53

52

51

50

49

48

47

46

45

44

R505 10K 3.3V_M R504 10K READY R502 4.7K E READY R503 0 READY R501 22K R506 100 C507 1000pF 50V C509 1uF 25V B C RT1C3904-T112 Q501 HIGH : ACTIVE LOW : RESET

43

L-SOUND-N

BST1A 1 VDR1A 2 RESET 3 AD 4 DVSS_1 5 VSS_IO 6

SPK_L+

L-SOUND-P

SW_RESET

C526 22000pF 50V

C525 1uF 25V

Main AMP
IC501 NTP-3100L

38 37 36 35 34 33

OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2


C528 0.1uF 50V READY D504 100V C531 0.1uF 50V READY D503 100V R534 R524 18 18 C536 1000pF 50V C537 1000pF 50V R535 R525 18 18 R527 18 R526 18 L504 DA-8580
2S 2F

L507 C542 0.01uF 50V R532 3.3 120-ohm

SPK_R+

I2S_MCLK
3.3V_M

R508 100

CLK_I 7 VDD_IO 8

C540 0.1uF 50V C539 0.47uF 50V C541 0.1uF 50V

R530 4.7K

C501 100pF 50V

C504 1000pF 50V R507 3.3K

C508 0.1uF 50V

DGND_PLL 9 AGND_PLL 10 LFM 11 AVDD_PLL 12

1S

1F

EAP38319001

R533 3.3 R531 4.7K C543 0.01uF 50V


MLB-201209-0120P-N2

32 PVDD2B_1 31 OUT2B_2 30 OUT2B_1 29 PGND2B_2

L502 120-ohm 1.8V_M L501 120-ohm C502 10uF 16V C506 0.1uF 50V C503 10uF 16V C505 0.1uF 50V

L508 120-ohm

SPK_R-

DVDD_PLL 13 TEST0 14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

24V_15V_NTP

WCK

BCK

SDA

DVDD

SDATA

SCL

FAULT

VDR2B

DVSS_2

BST2B

MONITOR_0

MONITOR_1

MONITOR_2

PGND2B_1

C510 1uF 10V

C511 0.1uF 50V

C519 1uF 25V

C524 22000pF 50V

READY C532 0.1uF 50V

C533 0.1uF 50V

C538 10uF 35V

I2S_SDO I2S_WS I2S_SCK AUAMP_SDA AUAMP_SCL


R528 4.7K 3.3V_M R529 4.7K

R509 R510 R511 R512 R513

100 100 100 100 100 READY C513 33pF 50V READY C514 33pF 50V HOTEL_OPT R514 0 C518 1000pF 50V

R515 0

MULTI_PW_SW
HIGH : ACTIVE LOW : MUTE

AMP_MUTE_HOTEL

AMP:GAIN X 4
12V_AUDIO C544 0.1uF 50V RT1C3904-T112 C Q502 B C546 6800pF 50V HOTEL_OPT R541-*1 15K R538 1K C548 33pF 50V
NON_HOTEL_OPT

IC502

1 OUT1
R541 12K

LM324D

OUT4 14

MNT_LOUT

Chinese Hotel Option


24V_15V_NTP HOTEL_OPT R549
HOTEL_OPT

E R536 4.7K

2 INPUT1R546 6.8K

INPUT4- 13
C551 0.1uF 50V

HOTEL_OPT P502 12505WS-09A00

0 1

MNT_L_AMP

R542 5.6K 12V_AUDIO

3 INPUT1+

INPUT4+ 12 AUDIO_R
2 HOTEL_OPT R548 0 4 3.3V_M HOTEL_OPT R545 10K HOTEL_OPT R540 200 E 8 C B
HOTEL_OPT RT1C3904-T112

4 VCC
C550 0.01uF 50V

GND 11

SW_RESET

MNT_R_AMP
12V_AUDIO

R543 5.6K HOTEL_OPT R544-*1 15K

5 INPUT2+

INPUT3+ 10 AMP_MUTE_HOTEL

6 Q504 7

6 INPUT2C549 33pF 50V


NON_HOTEL_OPT

INPUT3- 9

R544 12K

R547 6.8K

C545 0.1uF 50V

RT1C3904-T112 Q503 B E R537 4.7K C547 6800pF 50V R539 1K

7 OUT2

OUT3 8

SPK_R+_HOTEL SPK_R-_HOTEL

9 10

MNT_ROUT

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 AUDIO

2009/08/20 5 7

LGE Internal Use Only

IR 4.7K MUTE_LINE

TXCLK-

SW_RESET

B_TX0+

B_TX0-

TXCLK+

I2S_MCLK

POWER_SW

HDMI_SDA

HPDCTL

G_TX1+

R_TX2-

G_TX1-

HDMI_SCL

4.7K DSUB_SDA

R663

4.7K

AVDDP1

AVDDP2

VDDC

READY R648 R647 100 READY R672 R673 22

R666

AVDD_ADC

100

R668

100

C667 0.1uF READY

C656 0.1uF

100

100

100

100

22

R674

4.7K DSUB_SCL

I2S_SCK

I2S_SDO

I_DIM

I2S_WS

HWRESET

E_DIM

KEY2 4.7K KEY1 4.7K LED_R

MAIN(MARIA8)

ST_3.3V

ST_3.3V

ST_3.3V

0.1uF 0.1uF

SERIAL FLASH 2M
IC603
MX25L1605AM2C-15G

3.3V_M

R670

R657

R671

R669

R665

AVDD_ADC_3

C665

AVDDP_1_7

C659

R684

DDCD_SDA

DDCD_SCL

R667

DDCA_DAT

DDCA_CLK

R675

HOTPLUG

AVDDP_2

VDDC_4

GPIOM1

AUMCKO

WAKEUP

RXA2N

RXA1P

RXA1N

RXA0P

RXA0N

RXACP

RXACN

GND_7

AUSCK

AUSD0

RESET

PWM3

PWM2

AUWS

SAR0

SAR1

SAR2

IRIN

R608 10K SPI_CZ

CEC

INT

R610 100 R611

CS#

VCC C606 0.1uF 16V R620 100 R622 100

SO

SPI_DO

HOLD#

156

155

154

153

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

100

R_TX2+

RXA2P AVSS_ADC_1 BIN1 SOGIN1 GIN1


R640 68 C629 0.047uF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78

124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106

AVDDP_1_6 GND_6 LVA0P LVA0N LVA1P LVA1N


C644 0.1uF

FLASH_WP

AVDDP1

R607 100

WP#

SCLK

SPI_CLK

GND

SI

SPI_DI

GIN1M RIN1 VSYNC1

EEPROM(A0)
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKEIC601 AT24C64AN-10SU-2.7
A0 1 8 VCC

LVA2P LVA2N LVACLKP LVACLKN LVA3P LVA3N GND_5 AVDDP_1_5 LVB0P LVB0N LVB1P LVB1N LVB2P LVB2N LVBCLKP LVBCLKN LVB3P LVB3N AVDDP_1_4 GND_4 VDDC_3 TXD0/GPIOD0 RXD0/GPIOD1 RXD1/GPIOD2 TXD1/GPIOD3 GPIOD4 GPIOD5 AUMUTE/GPIOD6 GPIOD7 SPI_CK SPI_CZ SPI_DI SPI_DO GPIO/SPI_SIO2 GPIO/SPI_SIO3 GPIO_5 GPIO_4 GPIO_3 GPIO_2 GPIO_1
R664 R678 100 R681 R682 R661 100 R649 R651 100 100 HDMI_5V_DET DDC_CTL 100 100 100 DISP_EN PANEL_ON RL_ON R677 100 R685 100 READY R692 4.7K R693 4.7K MUTE_LINE FLASH_WP SPI_CLK SPI_CZ SPI_DI SPI_DO C657 0.1uF C666 0.1uF C662 0.1uF 16V

3.3V_M 3.3V_M
C602 0.01uF 50V R697 4.7K R696 4.7K

AVDD_ADC

AVDD_ADC_1
C641 0.1uF

HSYNC0
COMP_PB R636 R641 COMP_Y R637 R638 COMP_PR R639 33 68 33 0 33 C621 0.047uF C630 C622 C623 0.047uF 0.047uF 1000pF

BIN0 GIN0M GIN0 SOGIN0 RIN0 VSYNC0

A1

WP

A2

SCL

R615 22 R616 22

MAIN_SCL MAIN_SDA

GND

AVDDP1
TXCE0TXCE0+ TXCE1TXCE1+ TXCE2TXCE2+ TXCLKETXCLKE+ TXCE3TXCE3+

SDA

C624 0.047uF

C651 0.1uF

AVDD_ADC
R629 33 READY 33 R630 READY 47 R631 READY 33 R632 68 C616 0.047uF READY C617 0.047uF READY C618 0.047uF READY C619 0.047uF C620 0.047uF

AVDD_ADC_2 CVBS3/C1 CVBS2/Y1 CVBS1/C0 CVBS0/Y0 VCOM0 CVBSOUT2

CVBS_VIN

IC604 MARIA8(LGE7871)

105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79

HDCP EEPROM(A8)
IC602 CAT24WC08W-T
A0 1 8 VCC

3.3V_M

R633

MNT_VOUT_T

CVBSOUT AVSS_ADC_2
C648 0.1uF 200

R602 4.7K

C603 0.1uF 16V

AVDDP1
A1 2 7 WP

AVDD_MPLL
C612 27pF 14.31818MHz X601 C613 27pF R628 1M R642

AVDD_MPLL XTAL_OUT XTAL_IN AVSS_MPLL

R655 100

R614 4.7K READY R653 0 R617 22

DDC_CTL MAIN_SCL MAIN_SDA

VDDC
MAIN_SCL MAIN_SDA AUAMP_SDA AUAMP_SCL OPC_EN

A2

SCL

VSS

SDA

R618 22 READY R658 0

Seperate with IC ground

AVDD_VIF AVDD_VIF

AVDD_VIF_1
C646 0.1uF

AVDD_VIF_2
C652 0.1uF L606 600

ST_3.3V 3.3V_M
L602 3.3V_M 120-ohm C638 10uF 10V 0 R683 0 R686 0 READY R691 0 R676

AVSS_VIF_1 VIFIP VIFIM SIFIM SIFIP AVSS_VIF_2

VIF2 VIF1

AVDDP1 AVDD_ADC AVDD_VIF AVDD_AUSDM

ST_3.3V

L604 120-ohm C650 10uF 10V C664 0.01uF 50V

AVDDP2

5V_M
L601 120-ohm R639 1uF 10V C607 0.1uF 16V

SIF1 SIF2 R625 5.6K C614 10uF 10V C615 0.1uF 16V C645 C642 0.1uF

ST_3.3V

L605 120-ohm C649 10uF 10V C663 0.01uF 50V

AVDD_MPLL

C608 0.1uF 16V

C610 100pF 50V

VR27 AVDD_VIF_3 TAGC


0.1uF

AVDD_VIF
TU_AGC

ST_3.3V

R662 0

1.2V_VDDC_M8

L603 120-ohm C640 4.7uF 6.3V C643 10uF 10V C654 0.01uF 50V

VDDC

AVDD_AUSDM
COMP_L COMP_R CVBS_LIN CVBS_RIN C625 C626 C627 C628 2.2uF 2.2uF 2.2uF 2.2uF

AVDD_AUSDM LINE_IN_0L LINE_IN_0R LINE_IN_1L LINE_IN_1R LINE_IN_2L

ST_5V C611 4.7uF 10V

JTP-1127WEM SW601 1 3

RESET
R621 100

HWRESET
C604 0.1uF 16V

LINE_IN_2R

LINE_OUT_L

LINE_OUT_R

DAC_OUT_L

DAC_OUT_R

AVDDP_1_1

AVDDP_1_2

AVDDP_1_3

AUCOM

AUVRM

AUVRP

AUVAG

GND_1

GND_2

GPIOD10

GPIOD11

GPIOB13

GPIOB12

GPIOB11

GPIOB10

VDDC_1

GPIOB9

GPIOB8

GPIOB3

GPIOB2

GPIOB1

GPIOB0

VDDC_2

GND_3

AVSS

PWM1

PWM0

D603 KDS181

R624 33K

3.3V_M
ST_5V

100

0.1uF C631

100

100

100

R660

0.01uF

R659

0.1uF

0.01uF

0.1uF

P_24V_SMALL_15V

READY R601 0 KDS181 D601 R609 150 C601 47uF 25V ISA1530AC1 Q601 KDS181 D602 R612 2K R613 10K R619 1K READY C605 2.2uF 16V B E C RT1C3904-T112 Q602 R623 10K

R634

0.1uF

R635

C660

C647

C653

C661

C658

MULTI_PW_SW

1K

1K

R652

R654

R650

R656

R644

R645

R689 1K

VDDC

R698 1K READY R699 1K

READY

READY

P_12V_SMALL_15V

R679 4.7K

R687 4.7K

R605 0 R604 1K

R603 1K
19_22inch

AVDDP1

AVDDP1

VDDC

AVDDP1

0.1uF

4.7uF

C633 10uF

C636 0.01uF

C637 0.01uF

1uF

C632

C634

C635

22K

22K

READY R690 1K

R606 10K

R680 4.7K

R688 4.7K 26_32inch R606-*1

R643

R646

TUNER_SCL

TUNER_SDA

PANEL_STATUS

TU_CTL_VIF

TU_CTL_SIF

LED_B

MNT_L_AMP

MNT_R_AMP

20K 26_32inch Q603 C RT1C3904-T112 B E

Close to IC as close as possible

RL_ON

26_32inch R627 0 READY C609 4.7uF 10V

26_32inch R626 33K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 MARIA8

2009/08/20 6 7

LGE Internal Use Only

Power
P701 FM20020-24
P_5V

STAND_BY VOLTAGE 5V_M -> 1.2V_VDDC_M8, 3.3V_M, 1.8V_M

BD9130EFJ-E2 IC702
ADJ

ST_3.3V READY R702 0


26_32inch

19_22inch P703
R726 5V_M 0
ITH VCC

EN

R740 10K

NC GND GND

1 3 5 7 9 11 13 15 17 19 21 23 25

2 4 6 8 10 12 14 16 18 20 22 24

Power ON GND GND 5.2V 5.2V GND 12V GND 24V Inverter ON Error Out PWM Dim
3 1

R719 2.2K
26_32inch 2SC3875S

26_32inch 26_32inch

PVCC

R758 10K
READY

SMAW200-11

Q702 2

R763 47K R762 10K

RL_ON
15V 1

C715 10uF 10V

SW

C716 10uF 10V READY R739 3.3 READY C725 2200pF 50V

L707 2.2uH C726 0.1uF 16V READY C747 1uF 25V


R2

1.2V_VDDC_M8 R744 2K R745 3.3K

R730 12K C717 560pF 50V

GND

PGND

C727 10uF 10V

C728 10uF 10V

OUT:1.27V

P_5V

5.2V 5.2V GND

P_5V
15V 2

MAX 2A

R1

V0 = 0.8*(1+(R2/R1))
R753 0 IC704 AZ1085S-3.3TR/E1 R738 INPUT 3 MAX 3A 2 OUTPUT C723 0.1uF 50V 1 ADJ/GND AP1117EG-13 IC705 3.3V_M

P_12V_SMALL_15V

12V GND

P_12V_SMALL_15V
19_22inch R723 0

GND

P_24V_SMALL_15V

24V NC A.Dim NC

P_24V_SMALL_15V

GND

4
0

OUT:3.3V
C729 100uF 16V C733 10uF 10V C735 0.1uF 50V

IN

5V

2 MAX 1A 1

OUT

OUT:1.85V
R1 R750

NTP,AUDIO DSP

1.8V_M C742 10uF 10V C744 0.1uF 50V READY C746 1uF 25V

ADJ/GND

120

5V_M 3.3V_M
R712 3K R755 10K R707 2SC3875S Q701 R713 2 10K 3 1 0

5V

R2 R751

56

NC

V0 = 1.25*(1+(R2/R1))
7 8

26_32inch

DISP_EN

NC

MULTI VOLTAGE

Inverter_ON

**Switch 12V:P12V, P5V -> 5V_12V_LCD


26_32inch L706 P_12V_SMALL_15V 120-ohm
19_22inch 19_22inch/Sharp32

**Switch 5V:P5V -> 5V_M

PWM_Dim

10

A.Dim

11
L705 P_5V 120-ohm READY C718 68uF 35V

Q705 SI4925BDY EBK32753101 S1


C721 1uF 25V

R733-*1 10K R732 33K


26_32inch

1 2 3 4

8 7 6 5

D1_2 D1_1 D2_2 D2_1

MLB-201209-0120P-N2 L708 5V_12V_LCD C731 0.1uF 50V 120-ohm R747 4.7K R749 4.7K R752 4.7K C745 100uF 16V C748 0.01uF 50V

Non Sharp32

R722 0 READY R706 0 C706 2.2uF 16V

R704 0

Sharp32 R721 0

G1 S2

PANEL

I_DIM

R725 10K

ST_3.3V R756 10K R765 10K C

R764 B 10K

R733 33K C RT1C3904-T112 Q703 E

C719 1uF 25V

G2

PANEL_ON
DC_DIM R709-*1
NON_CMO32

R729 READY R727 10K 10K

B Q706 E RT1C3904-T112

1K

R705 0 CMO32 R708 0 READY C701 2.2uF 16V


19_22inch/Sharp32

E_DIM

OPC_DISABLE R715 1K
OPC_DISABLE

PWM_DIM R709 100

Non Sharp32 R711 4.7K R710 0 C702 0.47uF 25V

R724
Non Sharp32

PANEL_STATUS

P_5V R734 22K R735 1.6K C R728 10K


E

5V_M C734 10uF 10V C737 0.01uF 50V

R716 6.2K

OPC_OUT

OPC_ENABLE R714 1K
OPC_ENABLE

POWER_SW

RT1C3904-T112 Q704

R717 6.2K

TUNER VOLTAGE
L703 P_5V 120-ohm C705 10uF 16V C709 0.01uF 50V C711 0.01uF 50V ST_5V P_24V_SMALL_15V 500 C703 68uF 35V C707 0.01uF 50V C712 0.1uF 50V L702 24V_15V_NTP

**DC-DC CONVERTER 12V->5V_TUNER


C740 10uF 16V C741 10uF 16V C743 0.1uF 16V

IC706 AP1117EG-13 IN 3 2 OUT 1 ADJ/GND R759 110 READY C749 0.1uF 16V 5V_TUNER

V0 = 0.8*(1+(R1/R2))
26_32inch R741

OUT:6.8V
C732 100uF 16V 5V_M

R757 330

AP2121N-3.3TRE1 IC701 R718 ST_5V 0


VIN 3 2 MAX 300mA 1 GND VOUT

L701 ST_3.3V C710 10uF 10V C713 0.01uF 25V READY C714 1uF 25V P_12V_SMALL_15V 120-ohm C704 47uF 25V C708 0.01uF 50V 12V_AUDIO READY C753 100pF 50V READY C724 560pF 50V
R1

10K

R736 43K FB

MP2212DN IC703 1
MAX 3A

19_22inch R748 10

L710 26_32inch VIF_12V READY C754 10uF 16V 120-ohm 19_22inch R761 0 CIC21J501NE L704 P_12V_SMALL_15V 500 19_22inch D701 50V 26_32inch R731 0

8 EN/SYNC 7 SW_2

26_32inch

R2

R737 5.6K GND

R743 2K

19_22inch C738 0.1uF 50V 5V_M

2 3 4

Power indicator
ST_5V 5V_M 19_22inch R760 R701 10K R703 1.2K 0 INPUT 1

IN C720 10uF 25V C722 10uF 25V

6 SW_1 5 VCC
C739 0.47uF 50V R742 0 C730 1uF 25V

L709 3.6uH R746 10

19_22inch AS7812ADTR-E1 IC707 3 OUTPUT 2 GND


19_22inch 19_22inch

BS

C752 1uF 25V

C751 0.1uF 50V

C736 0.1uF 50V

SAM2333 LD701

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

EAX61462901 POWER

2009/08/20 7 7

LGE Internal Use Only

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