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Note: This 2nd Edition adds information about changing the default sleep mode activiation values.
Fisher Controls International, Inc. 1999-2000. All rights reserved. Printed in the U.S.A. While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor as a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, without notice, to alter or improve the designs or specifications of the products described herein.
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Table of Contents
SECTION 1 GENERAL INFORMATION .......................................................... 1-1
1.1 Manual Overview ........................................................................................................................ 1-1 1.2 Section Contents............................................................................................................ .............. 1-2 1.3 Additional Information ...................................................................................................... .......... 1-2 1.4 Product Overview........................................................................................................................ 1-3 1.5 Installation Requirements ............................................................................................................ 1-8 1.6 Mounting....................................................................................................................................1-13 1.7 Power Consumption Calculation............................................................................................... ..1-15 1.8 Startup and Operation.................................................................................................................1-20
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Table of Contents lists each section and information contained in that section of the document. Section 1 describes this manual and mentions related manuals. This section also provides a summary of the FloBoss hardware, installation requirements, mounting the FloBoss, and power requirements. Section 2 provides information and specifications concerning the use of the FloBoss. Topics covered include the Main Electronics Board, wiring, processes, and troubleshooting. The Main Electronics Board provides the flow sensor input channel, one built-in discrete output channel, a Resistance Temperature Detector (RTD) input, an operator interface port, and a host communications port. Section 3 describes the Dual-Variable Sensor (DVS) included with the FloBoss 553 for sensing static (line) pressure and differential pressure across an orifice. Section 4 provides information and specifications for the optional communications cards. Appendix A shows the intrinsic safety Loop Schematic as approved for the FloBoss 553. Glossary of Terms defines terms used in Fisher Controls documentation. Topical Index alphabetically lists the items contained in this manual, including their page numbers.
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Physically, the FloBoss consists of a printed-circuit Main Electronics Board and a display housed in a compact, weather-tight case. The FloBoss is packaged in a NEMA 4X windowed enclosure that can mount on a wall, a pipestand, or directly to the metering pipe. Refer to Figure 1-1. The plastic enclosure protects the electronics from physical damage and corrosive environments. The enclosure has a hinged and gasketed door secured by a lockable hasp. The enclosure has mounting flanges that allow it to be fastened to a wall or panel, or mounted on a pipestand. In addition, it can be direct-mounted, such as on an integral orifice assembly. The internal structural metal is made from a low-copper aluminum alloy. All exposed metal is stainless steel. The enclosure is fabricated from fiberglass-reinforced plastic. Enclosure external dimensions, including mounting flanges and the Dual-Variable Sensor (DVS), are approximately 16.75 inches high by 10.38 inches wide by 6.69 inches deep (425 mm by 264 mm by 170 mm). The DVS is factorymounted to the bottom of the enclosure. Refer to Figure 1-3 on page 1-14 for further dimensional details.
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Display
DVS
DOC0334P
The Main Electronics Board, displayed in Figure 1-2, mounts on a backplate under a black-anodized aluminum cover. The dimensions of the board are approximately 5 by 7.5 inches. The majority of the components are surface-mounted, with only the top side of the board used for components. The Main Electronics Board provides built-in I/O capabilities, an LCD display, and provisions for an optional communications card. The main electronics board is factory-mounted inside the housing, which provides protection for the electronics. For more information on the Main Electronics Board, refer to Section 2. The built-in Liquid Crystal Display (LCD) provides the ability to look at data and configuration parameters while on site without using the local operator interface (LOI) and a personal computer. The LCD display is factory-mounted directly to the Main Electronics Board and visible through the window on the enclosure door. Through this display, you can view information (defined by configuration) stored in the FloBoss. Up to 16 items can be defined for display. The display automatically cycles through the configured list of items, displaying a new value approximately every three seconds.
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SCALE IS .5
Coupler
A Motorola 32-bit CMOS microprocessor runs at 14.7 MHz and has low-power operating modes, including inactivity and low battery conditions. The FloBoss comes standard with 512K of built-in, supercapacitor-backed static random access memory (SRAM) for storing data and history. The FloBoss also has 512K of programmable read-only memory (flash ROM) for storing operating system firmware, applications firmware, and configuration parameters. The built-in inputs and outputs (I/O) consist of a port for a Dual-Variable Sensor (DVS), a 4-wire Resistance Temperature Detector (RTD) input interface, and a discrete output (DO). Diagnostic inputs are dedicated to monitoring input voltage and enclosure temperature. Connectors located on the Main Electronics Board provide terminations for input power, an RTD input, a discrete output (DO), DualVariable Sensor (P/DP), and operator interface (LOI) communications. Refer to Figure 1-2. The built-in discrete output (DO) is capable of controlling a sampler or odorizer. The DO may be used as a Timed Duration Output (TDO). The Dual-Variable Sensor (DVS) measures differential pressure and absolute or gauge (static) pressure by converting the applied pressure to electrical signals and making the readings available to the Main Electronics Board. The sensor housing screws into a flanged adapter, which in turn mounts with four bolts to the bottom of the enclosure. The DVS cable plugs directly into the Main Electronics Board at the P/DP connector. For more information on the DVS, refer to Section 3. An RTD temperature probe typically mounts in a thermowell on the metering pipe. RTD wires should be protected either by a metal sheath or conduit connected to a liquid-tight conduit fitting on the bottom of the FloBoss enclosure. The RTD wires connect directly to the four-terminal RTD connector on the Main Electronics Board inside the enclosure. The operator interface (LOI) port, located on the bottom left-hand side of the enclosure (refer to Figure 1-1), provides for a local link between the FloBoss and a personal computer through an Operator Interface Cable. With the personal computer running the ROCLINK Configuration Software, you can configure the functionality of the FloBoss and monitor its operation. User-level security can be enabled or disabled for the LOI port. WARNING Do not use the LOI port in a hazardous location (Class I, Division 1 or 2). For a FloBoss 553 in a C1D1 area, you may use the Laptop Computer connectors wired through an intrinsic safety barrier as shown in the Loop Schematic (Appendix A). The host communications port (located at COM1) is available for use with an optional communications card to permit serial communication protocols. User level security can be enabled or disabled for the host communications port. Refer to Section 4 for details on communication cards. The I/O parameters, DVS inputs, flow calculations, security, and FST programmability are configured and accessed using the ROCLINK Configuration Software. Refer to the ROCLINK Configuration Software User Manual for details concerning software capabilities.
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R1 60 J1
NORM RST P1
U2 P3
P5
U6 U8 U7
U9
U11
U12
CR6
CR7
PT2 FL1
PT3
PT1 CR9
MV1 MV2
P8
P10
DOC0380A DOC0331A
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1.4.1 Firmware
The Version 2.x firmware, contained in flash ROM on the electronics board, determines much of the functionality of the FloBoss, such as: Memory logging of 240 alarms and 240 events. Archival of data for up to 15 history points for up to 35 days. American Gas Association (AGA) flow calculations for a single meter run. Logic and sequencing control by means of a user-defined Function Sequence Table (FST). Communications based on either Modbus protocol or ROC protocol. User-level security.
Refer to Section 2.3 for more information about the functionality provided by the firmware.
The FloBoss is powered by a 12-volt dc power supply, typically a solar panel and battery combination. Refer to Section 2, Connecting Power Wiring.
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The FloBoss is designed to operate over a -40 to 75 C (-40 to 167 F) temperature range. The LCD temperature range is -25 to 70 C (-13 to 158 F). When mounting the unit, be aware of external devices that could have an effect on the operating temperature. Operation beyond the recommended temperature range can cause errors and erratic performance. Prolonged operation under extreme conditions can result in premature failure of the unit. In extreme climates, it may be necessary to moderate the temperature in which the unit must operate. Check the installation for mechanical vibration. Ensure that the levels of vibration do not exceed those specified (see Specifications in Section 2).
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Refer to Section 1.7, Power Consumption Calculation, on page 1-15 to plan for total power consumption of the FloBoss.
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On pipelines without cathodic protection, the pipeline itself may provide an adequate earth ground and the FloBoss could mount directly on the meter run. Using a ground system tester, test to make sure the pipeline to earth impedance is less than 25 ohms. If an adequate ground is provided by the pipeline, do not install a separate ground rod or grid system. All grounding should terminate at a single point. If the pipeline to earth impedance is greater than 25 ohms, the FloBoss installation should be electrically isolated and a ground rod or grid grounding system installed. Shields for I/O signal wiring used in the FloBoss should be grounded. A ground bar is provided inside the FloBoss enclosure for terminating shield wires and other connections that require earth ground. Note that shields should be grounded at one end only to prevent ground loops. A lug on the outside of the FloBoss enclosure is provided to connect the enclosure to earth ground. Note that on the FloBoss 550 series, the ground bar is internally connected to the enclosure ground lug; no further connection between these points is needed.
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1.6 MOUNTING
When choosing an installation site, be sure to check all clearances. For dimensions, refer to Figure 1-3. Provide adequate clearance for the enclosure door to be opened for wiring and service. The door is hinged on the left side. The LCD display should be visible and accessible for the on-site operator. When using a solar panel (must not be located in the Class I, Division 1 area with the FloBoss), there should be adequate clearance, and view of the sun should not be obstructed. Allow adequate clearance and an obstructed location for antennas when using radios. The Dual-Variable Sensor (DVS) is factory-mounted directly to the FloBoss enclosure with four bolts. This mounting uses a special coupler to join the threads on the sensor to the four-bolt mounting pattern on the bottom of the FloBoss enclosure. See Section 3 for more information.
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2X .44
6.75
12.50
16.88
DOC0334A
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Table 1-1. Power Consumption of the FloBoss 553 and Powered Devices Device Power Consumption (mW) 12V System
Pmin Main Electronics Board; includes minimum built-in I/O power consumption, RTD, and integral sensor. Built-in Discrete Output (load dependent with a maximum of 5 volts and 25 milliamps). Serial Communications Card 400 Pmax 2000 1 N/A
Quantity
Duty Cycle
Subtotal (mW)
0 30
125
1 N/A
Total
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The panel must face due South (not magnetic South) in the Northern Hemisphere and due North (not magnetic North) in the Southern Hemisphere. The panel must also be tilted at an angle from the horizontal dependent on the latitude to maximize the energy output. The angles for different latitudes are normally included in the solar panel documentation. At most latitudes, the performance can be improved by less of an angle during the summer and more of an angle during the winter. As a site may have additional power requirements for radios, repeaters, and other monitoring devices, power supply and converter accessories may be used to minimize the number of separate power sources required for an installation. Solar arrays are used to generate electrical power from solar radiation. The size and number of solar panels required for a particular installation depends on several factors, including the power consumption of all devices connected to the solar array and the geographic location of the installation, as explained below. To determine solar panel output requirements, first determine the solar insolation for your geographic area. The map in Figure 1-4 shows solar insolation (in hours) for the United States during winter months. Your local Fisher Representative can help you find a map detailing your specific geographic area. Insolation (from map) = _____ hours Next, calculate the amount of current required from the solar array per day using the following equation. ISF is the system current requirement. Refer to Section 1.7.2 on page 1-16. Iarray = [ISF (amps) 24 (hrs)]/Insolation (hrs) = _____ amps
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Finally, the number of solar panels can be determined using the following equation: Number of Panels = Iarray amps/(Ipanel amps/panel) = _____ panels
For example, if Iarray equals 0.54 amps, and Ipanel equals 0.29 amps for a 5-watt panel, then the number of panels required equals 1.86, which would be rounded up to 2 (panels connected in parallel). Alternatively, the next larger solar panel can be used, which in this case would be a 10-watt panel. Table 1-2 gives Ipanel values for solar panels recommended by Fisher Controls. NOTE The I panel value varies depending on the type of solar panel installed. Refer to the vendors specifications for the solar panel being used.
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Table 1-2. Solar Panel Sizing Panel 5 watt 10 watt 11 watt I panel 0.29 amps 0.58 amps 0.7 amps
1.7.4 Batteries
When used in solar installations, the battery provides power for the FloBoss when the solar panels are not generating sufficient output. Note that the solar panel and battery must not be located in a Class I, Division 1 area along with the FloBoss (see Loop Schematic). Typical battery configurations use a 12-volt, sealed (non-venting), rechargeable, gel-cell, lead-acid battery. The amount of battery capacity required for a particular installation depends upon the power requirements of the equipment and days of reserve (autonomy) desired.
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1.8.1 Startup
After observing the above cautions, apply power to the FloBoss. After the FloBoss completes start-up diagnostics (RAM and other internal checks), the LCD displays the date and time to indicate that the FloBoss completed a valid reset sequence. If the LCD does not come on, refer to the Troubleshooting and Repair paragraphs in Section 2 for possible causes. IMPORTANT NOTICE For the FloBoss 553 to operate properly on a 12-volt system with intrinsic safety barriers in place, you must change the activation values for the sleep mode to lower
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values as instructed in Section 1.8.2. If you do not change these values, the FloBoss will readily go into a sleep mode and fail to operate normally.
1.8.2 Operation
Once startup is successful, it is necessary to configure the FloBoss to meet the requirements of the notice above and of the application. The ROCLINK Configuration Software User Manual (Form A6051) details the procedure for configuring the FloBoss and calibrating the I/O. Once the FloBoss is configured and calibrated, it can be placed into operation. WARNING Local configuration or monitoring of the FloBoss through the LOI port on the bottom of the enclosure must be performed only in an area known to be nonhazardous. To set the proper sleep mode activation values (see NOTICE above), connect a computer to the LOI port and run the ROCLINK Configuration Software. In the I/O menu, select AI and page (use F3 key) to the screen for Point E1. In this screen make sure alarming is Enabled, and use the Alarms pushbutton to bring up the Alarms dialog box. In this dialog box, change the Low Alarm value to 5.6 volts, change the LoLo Alarm value to 5.2 volts, and click OK. These values will allow the FloBoss to operate with intrinsic safety barriers without unnecessarily going into sleep mode. Save the new values in the E1 screen (use F8 key). Also save the new values to permanent memory (in case of a cold restart) by selecting Flags in the System menu, turning Write to Internal Config Memory to Yes, and saving (F8 key). During operation, the FloBoss can be monitored (to view or retrieve current and historical data) either locally or remotely. Local monitoring is accomplished either by viewing the LCD panel detailed in Section 2, or by using ROCLINK on a PC connected through the LOI port. Remote monitoring is performed through the host port (COM1) of the FloBoss, using either ROCLINK or host software. Refer to the ROCLINK User Manual for more information on monitoring.
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2-1
Information Built-In Discrete Output RTD Input Diagnostic Inputs Real-Time Clock Automatic Self-Tests Connecting the FloBoss to Wiring Making Wiring Connections Connecting Ground Wiring Connecting Power Wiring RTD Wiring Discrete Output Wiring Connecting Communications Wiring Operator Interface Port Wiring Host Port Wiring Dual-Variable Sensor Wiring Calibration Troubleshooting and Repair Backup Procedure Before Removing Power Resetting the FloBoss Warm Start Cold Start Jumper Reset After Installing Components Specifications
Section Page Number 2.4.5 2-12 2.4.6 2-13 2.4.7 2-13 2.4.8 2-13 2.4.9 2-14 2.5 2-16 2.5.1 2-17 2.5.2 2-19 2.5.3 2-20 2.5.4 2-22 2.5.5 2-24 2.5.6 2-25 2.5.6.1 2-26 2.5.6.2 2-27 2.5.7 2-27 2.6 2-28 2.7 2-29 2.7.1 2-29 2.7.2 2-30 2.7.2.1 2-30 2.7.2.2 2-31 2.7.2.3 2-32 2.7.3 2-33 2.8 2-35
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Flow Time
The differential pressure stored for each second is compared to the configured low flow cutoff. If the differential pressure is less than or equal to the low flow cutoff or the converted static pressure is less than or equal to zero, flow is considered to be zero for that second. Flow time for a recalculation period is defined to be the number of seconds for which the differential pressure exceeded the low flow cutoff.
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Flow Time
The differential pressure stored for each second is compared to the configured low flow cutoff. If the differential pressure is less than or equal to the low flow cutoff or the converted static pressure is less than or equal to zero, flow is considered to be zero for that second. Flow time for a recalculation period is defined to be the number of seconds for which the differential pressure exceeded the low flow cutoff.
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History points 2, 3, 4, and 6 are set up as an Average Archive Type, using one of the following techniques: Flow dependent time-weighted linear averaging. Flow dependent time-weighted formulaic averaging. Flow-weighted linear averaging. Flow-weighted formulaic averaging.
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Event Logs are not stored to flash ROM when the Save Configuration function is issued in the ROCLINK Configuration Software. The Event Log operates in a circular fashion with new entries overwriting the oldest entry when the buffer is full. The Event Log provides an audit trail history of past operation and changes. The Event Log is stored separately to prevent recurring alarms from overwriting configuration audit data.
2.3.3 Security
The FloBoss provides for security within the unit. A maximum of 16 log-on identifiers (IDs) may be stored. In order for the unit to communicate, the log-on ID supplied to the ROCLINK Configuration Software must match one of the IDs stored in the FloBoss. The Operator Interface port (Security on LOI) has security Enabled by default. The host port (Security on COM1) can likewise be configured to have security protection, but is disabled by default. Refer to the ROCLINK Configuration Software User Manual concerning security.
2.3.5 Modbus
The Modbus Protocol Emulation Program is contained within the FloBoss firmware. The Modbus application is designed to allow the FloBoss to emulate the communications protocol used by Modbus devices. The Modbus communications protocol is fully described in the reference guide entitled Modicon Modbus Protocol publication PI-MBUS-300. Although the Modbus protocol can be either a Master or a Slave device, the FloBoss 553 is the Slave device. The Modbus protocol supports two modes of transmission, ASCII and RTU. Both modes of transmission are supported by the FloBoss 553.
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R1 60 J1
NORM RST P1
Reset Jumper
Supercapacitor
C3
U2 P3
P5
U6 U8 U7
U9
U11
Transorbs
U12
CR6
CR7
EMI Filter
FL1 P8
PT2
PT3
MOVs Transorb
P10
P11
DOC0331A
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Table 2-1. Discrete Output Output voltage - ON Output voltage - OFF Output Current 5 volts 0 volts 25 milliamps
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When the Sampler function is Enabled, the FloBoss provides a Time Duration Output (TDO) based on the volume. A control volume and a pulse duration must be specified with the Sampler function. After each flow calculation, an internal volume accumulator is compared to the control volume. If the accumulator exceeds the control volume, a pulse is produced and the accumulator is reduced by the control volume. This output may be used to drive an external totalizer, odorizer, gas sampler, or similar device. Refer to Section 2.5.5, Discrete Output Wiring, on page 2-24.
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The FloBoss operates with 6 to 16 volts of dc power. The LCD becomes active when an input voltage with the proper polarity and startup voltage is applied to the INPUT POWER connector (provided the power input fusing/protection is operational). The battery low and high tests ensure that the FloBoss has the correct voltage to operate in a safe mode. The software watchdog is controlled by the Main Electronics Board. This watchdog checks the software for validity every 1.2 seconds. If necessary, the software is automatically reset. The hardware watchdog is controlled by the Main Electronics Board and monitors the power to the hardware. If this voltage drops below 4.75 volts, the FloBoss is automatically shut down. RTD automatic temperature compensation is tested at approximately every 5 degrees Celsius temperature change of the board temperature. The FloBoss 553 monitors the Dual-Variable Sensor for accurate and continuous operation. Voltage for charging the supercapacitor is checked to ensure that it is continuously applied when the FloBoss is powered. A memory validity self-test is performed to ensure the integrity of memory.
Wake-up from Standby occurs when the FloBoss receives a: Timed / Alarmed interrupt from the Real-Time Clock. Signal from the Operator Interface port LOI. Signal from built-in I/O. Sleep This mode is activated if a low input voltage is detected. The FloBoss input voltage is compared to the low-low alarm (LoLo Alarm) limit in the diagnostic Analog Input (point E1) for the battery/input voltage. This value defaults to 10.6 volts. The Low Alarm for point E1 defaults to 11 volts. For the FloBoss 553 to operate properly on a 12-volt system with intrinsic safety barriers in place, you must change these alarm limits to lower values (typically 5.2 and 5.6 volts, but not lower than 5.2 volts) by using the ROCLINK Configuration Software. Wake-up from Sleep occurs when the FloBoss receives a: Timed / Alarmed interrupt from the Real-Time Clock. Signal from the Operator Interface port LOI. If the battery voltage is less than the low-low alarm limit configured for Analog Input E1, the unit: 1. 2. 3. 4. 5. 6. Writes an alarm message to the Alarm Log. Sets the Real-Time Clock alarm for 55 minutes. Writes the message Low Battery, Sleep Mode to the LCD. Enters the Sleep mode. Shuts down communications. Wakes up by the Real-Time Clock alarm (set in step 2) and rechecks the voltage to see if operation is possible. If the voltage is greater than the LoLo Alarm limit for Analog Input Point Number E1, a normal restart sequence begins.
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CAUTION Always turn the power to the FloBoss off before you attempt any type of wiring.
CAUTION To avoid circuit damage when working with the unit, use appropriate electrostatic discharge precautions, such as wearing a grounded wrist strap. CAUTION It is important to check the input power polarity before turning on the power. Incorrect polarity can damage the FloBoss.
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The following connectors are provided on the Main Electronics Board: Board power MCU PWR (wired by factory). Dual-Variable Sensor P/DP. Operator Interface port LOI. Discrete Output DO. Resistance Temperature Detector RTD. Communications card connector P3 (underneath cover).
The following connector is provided in the upper right corner of the case: Power Input INPUT POWER. The I/O terminals and connectors are arranged on the lower edge of the Main Electronics Board. The terminal designations are printed above on the circuit board cover as shown in Figure 2-2. The recommended cable for I/O signal wiring is an insulated, shielded, twisted pair of 24 AWG. (minimum) copper wire. The twisted pair and the shielding minimize signal errors caused by EMI (electromagnetic interference), RFI (radio frequency interference), and transients. The shield should be grounded on one end only. If the cable passes between different area classifications, it should be grounded on the end in the area with the less hazardous rating. Cable with multiple twisted pairs is acceptable for analog signal wiring, provided there is a shield around all pairs inside the jacket. Discrete signal pairs should be individually shielded. If the cabling is exposed to sunlight, it should have a UV-resistant jacket.
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I.S. Ground
The terminals on the INPUT POWER terminal block are designated, top to bottom, as follows: + signal positive input ground (pre-wired by factory) signal negative input
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To make power connections: 1. Unplug the INPUT POWER connector from its socket. 2. Insert each bared wire end into the clamp beneath its termination screw on the connector. The middle terminator is ground and is wired by the factory to the ground bus. Make sure the polarity (+/-) is correct. 3. Secure the screw. 4. Plug the connector back into the INPUT POWER socket.
As shown in Figure 2-5, the connections at the RTD terminals for the various RTD probes are as follows (typical colors of red and white are used):
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2-Wire RTD Jumper to + Red, Jumper to REF White, Jumper to RET Jumper to
Red Red
Note: If the RTD is located outside the Class I Division 1 area, it must be connected through intrinsic safety barriers as detailed in the Loop Schematic.
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Note: Refer to Loop Schematic for device parameters, as well as to connect DO to a device located outside the Class I Division 1 area.
Discrete Device
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If a 9-pin connector is used to connect to the communications ports on the PC, then pin 2 should connect to RXD, pin 3 to TXD, and pin 5 to common.
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COM
RXD TXD
Note: Refer to Loop Schematic to connect LOI signals to a device located outside the Class I Division 1 area.
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2.6 CALIBRATION
The calibration routines support 5-point calibration, with the three mid-points calibrated in any order. The low-end or zero (Set Zero) reading is calibrated first, followed by the high-end or full-scale (Set Span) reading. The three mid-points can be calibrated next if desired. The diagnostic Analog Inputs input voltage and board temperature are not designed to be calibrated. The inputs that are supported with the 5-point calibration are: Differential pressure located at Analog Input Point A1. Static (line) pressure located at Analog Input Point A2. Temperature (RTD) located at Analog Input Point A3. The calibration procedure for these inputs is described in Section 3.
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1. Launch the ROCLINK Configuration Software. 2. Connect to ROCLINK. 3. Select Collect ROC Data from the File menu. 4. Select All in the Collect ROC Data dialog box. 5. Enter a File Name and click OK.
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Alternately, you can perform a warm start by removing power from the FloBoss and then restoring it. Make sure that jumper P1 on the Main Electronics Board is in the NORM position for a warm start to take place.
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1. Launch the ROCLINK Configuration Software. 2. Perform the Backup Procedure in Section 2.7.1, on page 2-29. 3. Select Flags from the System menu option. 4. Click the Cold Start flag Options. Refer to Figure 2-8. 5. Select the type of Cold Start you desire. Select Restore config and clear all of above to reset all options. 6. Click OK. 7. Press (F8)Save.
P1 NORM RST
DOC0277U
WARNING Power should be removed from outside a hazardous area before working in it. If this is not possible, ensure that steps have been taken (such as ventilation) to make the area non-hazardous before applying or removing power in the classified area.
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CAUTION This type of reset restores the factory configuration defaults. Any user-entered configuration data will be lost; therefore, try to back up any required data before performing this reset. To reset the FloBoss and load the factory default values into all configurable parameters: 1. Perform the Backup Procedure in Section 2.7.1, on page 2-29. 2. Disconnect the INPUT POWER terminal block to remove power. 3. Remove the four phillips-head screws securing the cover over the electronics board. Lift off the cover and move the P1 jumper to the reset (RST) position. To enact a reset, power up the unit with the jumper installed. 4. Apply power by plugging in the INPUT POWER terminal block. 5. Remove the P1 jumper on the Main Electronics Board and install it in the normal (NORM) position. Replace the cover and secure it with the four screws. 6. Refer to Section 2.7.3 and perform the After Installing Components.
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CAUTION To avoid circuit damage when working with the unit, use appropriate electrostatic discharge precautions, such as wearing a grounded wrist strap.
1. Reconnect power to the FloBoss by inserting the INPUT POWER terminal block back into its socket. 2. Launch the ROCLINK Configuration Software, log in, and connect to the FloBoss. 3. Verify that the configuration is correct. If it is not, continue by configuring the needed items. If major portions or the entire configuration needs to be reloaded, perform the remaining steps. 4. Select Download from the File menu, and in the resultant sub-menu. 5. Select Disk Config. to ROC. 6. In the dialog box that appears (see Figure 2-11), select the File Name you entered in step 4 of Section 2.7.1, Backup Procedure Before Removing Power, on page 2-29 and click OK. 7. Select the portions (see Figure 2-12) of the configuration you want to load or restore. 8. Press (F8)Download to restore the FloBoss configuration.
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2.8 SPECIFICATIONS
Refer to the following pages for specifications of the main electronics board.
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Main Specifications
PROCESSOR MEMORY Motorola 32 bit, running at 14.7 MHz. Program: 512 Kbyte flash ROM (electrically programmable) for firmware and configuration. Data: 512 Kbyte SRAM, super capacitor-backed for up to 4 weeks. Memory Reset: A reset jumper enables a cold start initialization when used during power-up. TIME FUNCTIONS Clock Type: 32 kHz crystal oscillator with regulated supply, super capacitor-backed. Year/Month/Day and Hour/Minute/Second, with Daylight Savings Time control. Clock Accuracy: 0.01%. Watchdog Timer: Hardware monitor expires after 1 second and resets the processor. DIAGNOSTICS These conditions are monitored and alarmed: SRAM validity/operation, DVS and RTD point fail, input voltages, and enclosure internal temperature. COMMUNICATIONS PORTS Local Operator Interface: EIA-232 (RS-232D) format. Software configured; 1200 to 19.2K baud selectable. Screw-cap protected connector. Host Interface: Depends on the optional communications card installed (see Spec. Sheet 3:COM). USER INTERFACE 2 line by 16 character LCD. Continually updates approximately every 3 seconds. See Environmental specification for operating temperature. POWER 6.2 to 16 Vdc at 0.2 amp maximum. DVS (BUILT-IN) Interface: High-speed digital interface with power for DVS. Inputs and Physical Characteristics: See DVS Specifications table. WEIGHT 18.0 lb. (8.2 kg) nominal, including DVS and coupler. 2-36 Rev 6/99 RTD INPUT (BUILT-IN) Quantity/Type: Single input for a 2, 3, or 4-wire RTD element. Terminals: Ref current source, + positive signal input, - negative signal input, and Ret return. Sensing Range: -50 to 100 C (-58 to 212 F). Accuracy (includes linearity, hysteresis, repeatability): 0.56 C (1.0 F) over sensing range. Ambient Temperature Effects per 28 C (50 F): 0.50 C (0.90 F) for process temperatures from -40 to 100 C (-40 to 212 F). Filter: Band-pass hardware filter. Resolution: 16 bits. Conversion Time: 100 sec. Sample Period: 1 sec minimum. DISCRETE OUTPUT (BUILT-IN) Quantity/Type: 1 sourced, high-side switched output. Terminals: + positive output, - negative (common). Voltage: Nominal 5 volts. Frequency: 1.5 Hz maximum. Sample Period: 200 ms minimum. Typical Source Current: 25 mA, with auto reset. ENVIRONMENTAL Operating Temperature: -40 to 75 C (-40 to 167 F), excluding LCD display, which is -25 to 70 C (-13 to 158 F). Storage Temperature: -50 to 85 C (-58 to 185 F). Operating Humidity: 5 to 95%, non-condensing. Vibration: Meets SAMA PMC 31.1, Section 5.3, Condition 3. ESD Immunity: Meets IEC 801-2 and EN 50082-2. RFI Immunity: Meets IEC 801-3 and EN 50082-2. EFT Immunity: Designed to meet IEC 801-4 and EN 50082-2. Voltage Surge Immunity: Designed to meet IEC 801-5 and EN 61000-4-5.
Main Specifications
DIMENSIONS Overall: 16.75 in. H by 10.38 in. W by 6.69 in. D (425 mm by 264 mm by 170 mm). Height includes top mounting flange and DVS. Wall Mounting: 2.81 in. W by 12.50 in. H (71 mm by 318 mm) between mounting hole (0.38 in. diameter) centers. Pipestand Mounting: Mounts on 2-inch pipe with U-bolt mounting kit (supplied). Process Connections: See DVS Specifications. CLASSIFICATION FCC Class A and CISPR 22 computing device. ENCLOSURE Construction: Fiberglass-reinforced plastic with lockable hasp and gasketed door. Internal structural metal is low-copper aluminum alloy. All exposed metal is stainless steel. Meets CSA Type 4X rating (NEMA 4X equivalent). Wiring access: Three 0.88 in. pre-punched holes: one in right side, two in bottom. APPROVALS Approved as Model W40076 by CSA for hazardous locations Class I, Division 1, Groups C and D, intrinsically safe.
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3.3 DESCRIPTION
The DVS, which uses Rosemount sensor technology, measures differential pressure and absolute or gauge (static) pressure by converting the applied pressure to electrical signals and making the readings available to the Main Electronics Board. The sensor housing screws into an adapter, which in turn mounts with four bolts to the bottom of the FloBoss enclosure. The DVS cable plugs directly into the Main Electronics Board at the P/DP connector. The readings from the Dual-Variable Sensor are stored in analog inputs on the FloBoss 553. The differential pressure value uses the Analog Input (AI) Point A1 and the static (line) pressure value uses the AI Point A2. If the alarm for either point is Enabled and the sensor fails to communicate, either during initialization or operation, an alarm is entered in the Alarm Log.
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The DVS uses an interrupt to inform the Main Electronics Board that it is ready for an update. This must occur at least once per second. The FloBoss 553 then converts this value and stores it in the proper analog input for access by other functions within the unit. If an update does not occur in the one second interval, the sensor is re-initialized. A point fail alarm is set if the sensor does not respond to the initialization.
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P/DP Connector
The top part of Figure 3-1 displays the FloBoss 553 wiring terminals. The rest of the figure showns how the DVS ribbon cable connects from the P/PD connector to the DVS unit. The ribbon cable is keyed to fit into the P/PD connector in only one direction. The DVS comes installed by the factory.
3.6 CONFIGURATION
Use the ROCLINK Configuration Software, Version 2.1 or later, to configure the DVS for a FloBoss 553 with Version 2.0 or later firmware. Refer to Section 2.3.2 concerning History Points. The differential pressure is configured at Analog Input Point Number A1. The static pressure (gauge or absolute) is configured at Analog Input Point Number A2. The Resistance Temperature Detector (RTD) is configured at Analog Input Point Number A3. The initial pressures are read from the defaults contained within the DVS. The initial range of the differential pressure is 0 to 250 inches of water and the static pressure is either 0 to 800 psi (55.15 bar) or 0 to 3600 psi (250 bar) depending upon the sensor installed. The ranges can be changed through the calibration routines. It is recommended that the turndown on the ranges not be greater than five.
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The Dual-Variable Sensor also supports the conversion of values to Metric units. In Metric mode, both the differential pressure and the static pressure are in kPa. To enter the Metric mode, using ROCLINK Configuration Software: 1. Select the System menu. 2. From the pull-down menu, select Information. 3. On the system information display (see Figure 3-2) under Units, enable the Metric field. 4. Press (F8)Save.
The FloBoss automatically adjusts the units, ranges, alarm limits, and calibration factors of the differential pressure, static pressure, RTD, and enclosure/battery temperature, to the Metric mode. To return to US units, enable the US field and save this change to the FloBoss. The FloBoss adjusts the values to US units for the entire meter run.
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3.7 CALIBRATION
Calibration is performed using the ROCLINK Configuration Software. The procedure allows you to perform a 5-point (minimum, maximum, and up to three intermediate points) calibration of the DVS.
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4. Select the Verify function that is listed under the input to calibrate. This displays the Verify Calibration window as in Figure 3-4.
5. Apply the desired pressure value to the input. 6. If the Tester Value and the Live Reading are to be logged to the Event log as a record of the verification, select the Log Verify pushbutton. 7. Continue this for all pressures/values that need to be verified. 8. When complete, select the Cancel pushbutton to return to the Meter Calibration window. 9. When the verification for a selected point is complete, you have the choice to verify or calibrate another input or to complete the verification or calibration. When complete, connect the DualVariable Sensor back to the process. CAUTION To protect the differential cell of the Dual-Variable Sensor, do not close the by-pass valve on the valve manifold until after process pressure has been reapplied. This will keep one side of the differential sensor from being subjected to high pressure while the other side has no pressure applied. Refer to Figure 3-12 on page 3-11. 10. Select the Done pushbutton to close the calibration window, to cancel the freeze values, and to begin using live readings for the flow calculations.
2. Select the Calibration function from either the Quick Setup menu or the Meter menu. 3. Press the Freeze pushbutton. This displays the Meter Calibration window as in Figure 3-5. The current reading is shown under each meter input as the Freeze Value. These values will be used in the flow calculations while the points are being calibrated.
4. Select the Calibrate pushbutton under the desired input to calibrate Diff Press, Stat Press, or Temperature. This displays the Set Zero calibration window as in Figure 3-6.
5. If you are calibrating a pressure input, read the following Caution, and then isolate the Dual-Variable Sensor from the process. If you are calibrating a temperature input, proceed to Step 7.
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CAUTION To protect the differential cell of the Dual-Variable Sensor, open the by-pass valve on the valve manifold prior to isolating the sensor from the process. This will keep one side of the differential sensor from being subjected to high pressure while the other side has no pressure applied. This should be done whether you are calibrating differential or static pressure. Refer to Figure 3-7 for the recommended sequence.
Bleed
Bleed
Open
Close
Operating
Shutdn2
Shutdown Sequence
6. If you are calibrating a pressure input, set up the pressure calibrator and make the necessary connections to the DVS. 7. If you are calibrating a temperature input, disconnect the RTD sensor and connect a decade box (or comparable equipment) to the RTD terminals of the FloBoss 553. 8. Apply the low (zero) value. For a pressure input, this would typically be open to atmosphere. 9. Enter the applied value in the Dead Weight / Tester Value field of the Set Zero dialog. Refer to Figure 3-6. For static pressure on an absolute-pressure device, remember to enter the actual atmospheric pressure, such as 14.73 psi. 10. When the displayed Live Reading is stable, select the Set Zero pushbutton to calibrate the zero reading. The Set Span window then appears as in Figure 3-8.
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11. Apply the desired high value to the input (the top end of the expected operating range). If you are calibrating the Diff Press input, and the DVS is configured for Downstream operation, be sure to apply the calibrator pressure to the low (labeled L) side of the sensor; the Live Reading will appear as a negative value. Static pressure for Downstream is calibrated the same as for Upstream. 12. Enter the applied value in the Dead Weight / Tester Value field of the Set Span dialog. For static pressure on an absolute-pressure device, remember to add in the actual atmospheric pressure, such as 300 + 14.73. If you are calibrating the Diff Press input, and the DVS is configured for Downstream operation, enter the value as positive, even though the Live Reading is a negative value. The software will automatically compensate. 13. When the Live Reading is stable, select the Set Span pushbutton to calibrate the high reading. The window advances to the Set Midpoint 1 window as in Figure 3-9.
14. If a two-point calibration is to be performed, refer to step 23. 15. If midpoints are to be calibrated, apply the desired pressure or temperature and enter the applied value in the Dead Weight / Tester Value field. Note that the midpoints can be calibrated in any order.
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16. When the Live Reading is stable, select the Set Mid 1 pushbutton to calibrate this reading. The display advances to the Set Midpoint 2 window as in Figure 3-10.
17. If a three-point calibration is being performed, refer to step 23. 18. If additional midpoints are to be calibrated, apply the desired pressure or temperature and enter the applied value in the Dead Weight / Tester Value field. 19. When the Live Reading is stable, select the Set Mid 2 pushbutton to calibrate this reading. The display advances to the Set Midpoint 3 window as in Figure 3-11.
20. If a four-point calibration is being performed, refer to step 23. 21. If a third midpoint is to be calibrated, apply the desired pressure or temperature and enter the applied value in the Dead Weight / Tester Value field. 22. When the Live Reading is stable, select the Set Mid 3 pushbutton to calibrate this reading. The display returns to the Meter Calibration window.
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23. When the calibration for a selected point is complete, you have the choice to calibrate another input or to complete the calibration. If calibration is complete, and you calibrated pressure inputs, read the following Caution and then return the Dual-Variable Sensor to service. CAUTION To protect the differential cell of the Dual-Variable Sensor, do not close the by-pass valve on the valve manifold until after process pressure has been reapplied. This will keep one side of the differential sensor from being subjected to high pressure while the other side has no pressure applied. Refer to Figure 3-12.
1a Close
1b Close
Close
Open
Open
Pre-Startup
start2
Startup Sequence
NOTE If you calibrated the Differential Pressure input, refer to Section 3.7.3, Zero Shift, before completing the last step. 24. Finally, select the Done pushbutton to cause the calibration window to close, freeze values to be canceled (unfrozen), and live readings to resume being used for the flow calculations. All calibration settings that were changed are automatically recorded into the Event Log of the FloBoss.
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4. Check the Reading to determine if a Zero Shift correction needs to be performed. 5. If the reading is not zero, use the Set Zero Shift pushbutton to adjust the Zero Shift. If adjustment is not required, use the Cancel pushbutton. You are returned to the Meter Calibration window, where you can select Done to close the calibration window, cancel the freeze values, and cause the FloBoss to begin using live readings for the flow calculations.
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3.8 SPECIFICATIONS
DVS Specifications
DIFFERENTIAL PRESSURE INPUT Range: 0 - 250 in. H2O (0 - 62.2 kPa). Reference Accuracy: 0.075% of span (includes linearity, hysteresis, and repeatability effects). STATIC PRESSURE INPUT Range*: Either Absolute or Gauge: 0 - 800 psia/psig (0 - 5516 kPa) 0 - 3626 psia/psig (0 - 25,000 kPa) Reference Accuracy: 0.075% of span (includes linearity, hysteresis, and repeatability effects). Stability: 0.1% of upper range limit for 12 months. PROCESS CONNECTIONS 1/4-18 NPT on 2-1/8 in. centers, located on bottom of Coplanar flange. CONSTRUCTION 316 SST*. Wetted O-rings are glass-filled TFE. Coupler is stainless steel (CF8M).
*Consult factory for special ranges and materials that may be available. Note: For other specifications, see the Main Specifications in Section 2.
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3-14
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4-1
P1 C1
Mating Connector
FB1 C2
U1 CR1 DCD R1
C3 C4
R4 Q1 R9 Q2
U2
LEDs
R7
R8
C5 C6 FB2 C7
GND
RXD
DTR
TXD
IN
RTS
TB2
TB3
DOC0274A
STATUS AND ACTIVITY The DCD data carrier detect LED lights when a valid carrier tone is detected. The DTR data terminal ready LED lights when a signal from the processor specifies the modem is ready to answer an incoming call. When the DTR goes off, a connected modem disconnects. The RTS ready to send LED lights when a signal from the processor specifies the modem is ready to transmit. The RXD receive data LED blinks when a data signal is being received by the communications card. The LED is on for a space and off for a mark. The TXD transmit data LED blinks when a data signal data is being sent from the processor. The LED is on for a space and off for a mark.
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4-3
Mating Connector
LEDs
4-4
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4-5
Stand-off Hole
Stand-off Hole
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*Do not use for FloBoss 550-Series, due to requirements of Loop Schematic. For the FloBoss 550-Series, refer to the Loop Schematic in Appendix A for details of using IS barriers with the approved signal lines.
For the FloBoss 550-Series unit, refer to the Loop Schematic in Appendix A for details of using IS barriers with these signal lines.
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4-8
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CAUTION During this procedure, all power will be removed from the FloBoss and devices powered by the FloBoss. Ensure that all connected input devices, output devices, and processes will remain in a safe state when power is removed from the FloBoss and also when power is restored to the FloBoss. 1. Refer to Section 2.7.1 and perform the RAM Backup Procedure. 2. Remove the INPUT POWER connector from its socket. For a FloBoss 550-Series unit, also remove the four Phillips-head screws securing the MCU cover and lift the cover out. 3. Disconnect existing wiring to the communications card, labeling or marking wires as needed. 4. Using a rocking motion, gently disengage the two stand-off connectors located at the bottom of the communications card. 5. Using a rocking motion, gently disengage the stand-off connector located at the top, middle of the communications card. 6. Using a rocking motion, disengage the connectors at P1, pull the card free from the Main Electronics Board at P3. 7. To reinstall a communications card, orient the card with the P1 connectors on the communications card mating with the connectors at P3 on the Main Electronics Board. Plug the card into its mating connectors and gently press until the connectors firmly seat. 8. Using a rocking motion, gently engage the three stand-off connectors. 9. Connect the wiring to the communications card (see Section 4.5). For a FloBoss 550-Series unit, route the wiring through the slot on the left-hand side of the cover, reattaching the cover with the four screws. 10. Reconnect power by plugging in the INPUT POWER connector. 11. Check the configuration data and FSTs, and load or modify them as required. 12. Verify that the FloBoss 500-series performs as required. 13. Perform the After Installing Components detailed in Section 2.7.3. If you changed the configuration, save the configuration data to Flash ROM. If you changed the configuration, history database, or FSTs, save them to disk. See Section 2.7.1 for more information.
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A-2
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GLOSSARY OF TERMS
A
A/D Analog to Digital. AGA American Gas Association. AWG American Wire Gauge. AI Analog Input. AO Analog Output. Analog Analog data is represented by a continuous variable, such as an electrical current signal. AP Absolute Pressure. API American Petroleum Institute. Area A user defined grouping of database entities. ASCII American Standard Code for Information Interchange. Attribute A parameter that provides information about an aspect of a database point. For example, the alarm attribute is an attribute that uniquely identifies the configured value of an alarm.
B
BTU British Thermal Unit, a measure of heat energy. Built-in I/O Input/Output channels that are fabricated into the ROC or FloBoss and do not require a separate module. Also called on-board I/O.
C
C1D1 Shorthand for Class I, Division 1 hazardous area. C1D2 Shorthand for Class I, Division 2 hazardous area. Coil Digital output, a bit to be cleared or set. COM1 Communications port on the ROC364 that may be used for host communications. On the FloBoss 407, this Comm port is built-in for RS-232 serial communications. For the FloBoss 500-series, this is the Host port. COM2 Communications port on the ROC364 or FloBoss 407 that may be used for host communications. COMM Communications port on the ROC306 or ROC312 that may be used for host communications. Configuration Refers either to the process of setting up the software for a given system or the result of performing this process. The configuration activity includes editing the database, building schematic displays and reports, and defining user calculations. Typically, the software setup of a device that can often be defined and changed. Can also mean the hardware assembly scheme. CPU Central Processing Unit. CRC Cyclical Redundancy Check.
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CSA Canadian Standards Association. CTS Clear to Send modem communications signal.
D
D/A Digital to Analog. DB Database. dB Decibel. A unit for expressing the ratio of the magnitudes of two electric signals on a logarithmic scale. DCD Data Carrier Detect modem communications signal. Also, Discrete Control Device A discrete control device energizes a set of discrete outputs for a given setpoint and matches the desired result against a set of discrete inputs. Deadband A value that is an inactive zone above the low limits and below the high limits. The purpose of the deadband is to prevent a value such as an alarm from being set and cleared continuously when the input value is oscillating around the specified limit. This also prevents the logs or data storage location from being over-filled with data. DI Discrete Input. Discrete Input or output that is non-continuous, typically representing two levels such as on/off. DO Discrete Output. DMM Digital multimeter. DP Differential Pressure. DSR Data Set Ready modem communications signal. DTR Data Terminal Ready modem communications signal. Duty Cycle Proportion of time during a cycle that a device is activated. A short duty cycle conserves power for I/O channels, radios, an such. DVM Digital voltmeter. DVS Dual-Variable Sensor. Provides static and differential pressure inputs to certain FloBoss 500-series Flow Managers.
E
EEPROM Electrically Erasable Programmable Read-Only Memory, a form of permanent memory. EDS Electronic Static Discharge. EFM Electronic Flow Metering or Measurement. EIA-232 Serial Communications Protocol using three or more signal lines, intended for short distances. EIA-422 Serial Communications Protocol using four signal lines. EIA-485 Serial Communications Protocol requiring only two signal lines. Can allow up to 32 devices to be connected together in a daisy-chained fashion. EMF Electro-motive force.
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EMI Electro-magnetic interference. ESD Electro-static discharge. EU Engineering Units. Units of measure, such as MCF/DAY.
F
Firmware Internal software that is factory-loaded into a form of ROM. In the ROC or FloBoss, the firmware supplies the software used for gathering input data, converting raw input data calculated values, storing values, and providing control signals. FlashPAC Module ROM and RAM module that contains the operating system, applications firmware, and communications protocol in a ROC300-series unit. Flash ROM A type of read-only memory that can be electrically re-programmed. It is a form of permanent memory (needs no backup power). Also called Flash memory. FloBoss A specialized Remote Operations Controller (ROC), Fisher Controls microprocessorbased unit that provides remote monitoring and control. Force Write an ON/OFF, True/False, or 1/0 value to a coil. FM Factory Mutual. FPV Supercompressibility Factor. FSK Frequency Shift Keyed. FST Function Sequence Table, a type of program that can be written by the user in a high-level language designed by Fisher Controls.
G
GFA Ground Fault Analysis. GND Electrical ground, such as used by the ROC power supply. GP Gauge Pressure. GV101 Configuration software used to configure ROC units to gather data, as well as most other functions. GV110 A host computer system software with one or more DOS-based personal computers that run the GV110 operations software and are linked to the field with a communications system. The host computer system software runs as a real-time operating system, and can monitor and control operations in the field as they actually happen.
H
HART Highway Addressable Remote Transducer. Holding Register Analog output number value to be read. hw Differential pressure.
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I, J
ID Identification. IEC Industrial Electrical Code. IEEE Institute of Electrical and Electronic Engineers. The Open System Interconnection (OSI) reference model and an international standard for the organization of local area networks (LANs) established by the International Standards Organization (ISO) and the IEEE. IMV Integral Multiplier Value. Input Digital input, a bit to be read. Input Register Input numeric value to be read. I/O Input/Output. I/O Module Module that plugs into an I/O slot on a ROC to provide an I/O channel. IRQ Interrupt Request. Hardware address oriented. IS Intrinsic Safety or Intrinsically Safe. IV Integral Value.
K
Kbytes Kilobytes. kHz Kilohertz.
L
LCD Liquid Crystal Display. Display-only device used for reading data. LDP Local Display Panel. A display-only device that plugs into a ROC300-series unit via a parallel interface cable. The LDP consists of a 4-line by 20-character alphanumeric display and four pushbuttons used to access information stored by the ROC. LED Light-emitting diode. LOI Local Operator Interface. Refers to the serial (RS-232) port on the ROC or FloBoss through which local communications are established, typically for configuration software running on a PC. LPM Lighting Protection Module. Use this module to provide lightning and power surge protection for ROCs and FloBoss units. LRC Longitudinal Redundancy Checking error checking.
M
mA Milliamps. MCU Master Controller Unit. Modular I/O I/O channels provided on a ROC using I/O modules. See I/O Module. MMBTU Million British Thermal Units. MPU Microprocessor Unit.
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MVS Multi-Variable Sensor. The MVS provides differential pressure, static pressure, and temperature inputs to the FloBoss 407 for orifice flow calculation. mV Millivolts or 0.001 volt. mW Milliwatts or 0.001 watt.
N
NEC National Electrical Code. NEMA National Electrical Manufacturers Association.
O
OH Off-Hook modem communications signal. Off-line Accomplished while the target device is not connected (by a communications link). For example, off-line configuration is configuring a ROC in a electronic file that is later loaded into the ROC. Ohms Units of electrical resistance. On-line Accomplished while connected (by a communications link) to the target device. For example, on-line configuration is configuring a ROC while connected to it, so that current parameter values are viewed and new values can be loaded immediately. Opcode Type of message protocol used by the ROC to communicate with the configuration software, as well as host computers with ROC driver software.
P, Q
Parameter A property of a point that typically can be configured or set. For example, the Point Tag ID is a parameter of an Analog Input point. Parameters are normally edited by using configuration software running on a PC. PC Personal Computer Pf Flowing pressure. P/DP Pressure/Differential Pressure. PI Pulse Input. PID Proportional, Integral, and Derivative control feedback action. PIT Periodic Timer Interrupt. Point Software-oriented term for an I/O channel or some other function, such as a flow calculation. Points are defined by a collection of parameters. Point Number The rack and number of an I/O point as installed in the ROC system. Point Type The point type attribute defines the database point to be one of the possible types of points available to the system. The point type determines the basic functions of a point. Preset Number value previously determined for an register. PRI Primary PID control loop. PSTN Public switched telephone network.
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PT Process Temperature. PTT Push-to-talk signal. Pulse Transient variation of a signal whose value is normally constant. PV Process variable or process value.
R
Rack For a ROC, a rack is a row of slots into which I/O modules may be plugged. The rack is given a letter to physically identify an I/O channel location, such as A for the first rack. Builtin I/O channels are assigned a rack identifier of A, while diagnostic I/O channels are considered to be in rack E. RAM Random Access Memory. In a ROC or FloBoss, it is used to store history, data, most user programs, and additional configuration data. RBX Report-by-exception. In a ROC or FloBoss, it always refers to spontaneous RBX in which the ROC contacts the host to report an alarm condition. RFI Radio frequency interference. RI Ring Indicator modem communications signal. ROC Remote Operations Controller, Fisher Controls microprocessor-based unit that provides remote monitoring and control. ROCLINK Configuration software used to configure ROC or FloBoss units to gather data, as well as most other functions. ROCPAC Module ROM and RAM module that contains the operating system, applications firmware, and communications protocol in a ROC300-series unit. ROM Read-only memory. Typically used to store firmware. Flash memory. RTC Real-time clock. RTD Resistance Temperature Detector. RTS Ready-to-Send modem communications signal. RTU Remote Terminal Unit. RTV Room Temperature Vulcanizing, typically a sealant or caulk like silicone rubber. RXD Received data communications signal.
S
SAMA Scientific Apparatus Makers Association. Script The program instructions (script) embedded within an object. Soft Points A type of ROC point with generic parameters that can be configured to hold data as desired by the user. SP Setpoint or Static Pressure. SPI Slow Pulse Input. SPK Speaker.
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SRAM Static Random Access Memory. Stores data as long as power is applied; typically backed up by a lithium battery or supercapacitor. SRBX Spontaneous Report-By-Exception. Refer to RBX. SVA Signal Value Analog. SVD Signal Value Discrete.
T-Z
TDI Timed Discrete Input or Time Duration Input. TDO Timed Discrete Output or Time Duration Output. Tf Flowing temperature. TLP Type (of point), Logical (or point) number, and Parameter number. TXD Transmitted data communications signal.
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G-7
G-8
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INDEX
Numerical
1985 AGA Flow Calculations..................................................2-3 1992 AGA Flow Calculation ...................................................2-4 32-bit CMOS Microprocessor ....................................1-5 Class I..................................................................... 1-10 Clock Real-Time........................................................... 2-13 Coil...........................................................................G-1 Cold Start................................................................ 2-31 COM1..............................................................2-12, G-1 COM2.......................................................................G-1 COMM .....................................................................G-1 Comm Port Host.................................................................... 2-12 Operator Interface ............................................... 2-11 Communication Ports .............................................. 2-11 Communications Connectors ......................................................... 2-12 Wiring ................................................................ 2-25 Communications Cards.............................................. 4-1 Descriptions.......................................................... 4-1 EIA-232 ............................................................... 4-2 EIA-485 ............................................................... 4-4 Installation............................................................ 4-5 LED Indicators ..................................................... 4-3 Location ............................................................... 4-6 Replacing ............................................................. 4-8 Specifications ..................................................... 4-10 Troubleshooting.................................................... 4-8 Wiring .................................................................. 4-7 Configuration ............................................................G-1 Dual-Variable Sensor............................................ 3-3 Verify................................................................... 3-5 Contents............................................................. 3-1, 4-1 CPU ..........................................................................G-1 CRC..........................................................................G-1 CSA ..........................................................................G-2 CTS ..........................................................................G-2
A
A/D .......................................................................... G-1 Accessories................................................................1-7 Additional Information...............................................1-2 After Installing Components.....................................2-33 AGA.................................................................. 2-3, G-1 AI See Analog Inputs ................................................ G-1 Alarm Log .................................................................2-7 Analog...................................................................... G-1 Analog Inputs ............................................................3-1 RTD.................................................................... 2-13 Antennas....................................................................1-9 AO See Analog Outputs.............................................. G-1 AP ............................................................................ G-1 API.................................................................... 2-3, G-1 Approvals ................................................................ 1-10 Area.......................................................................... G-1 ASCII ....................................................................... G-1 Attribute.................................................................... G-1 Automatic Self Tests................................................2-14 AWG........................................................................ G-1
B
Backup Procedures .................................................. 2-29 After Installing Components ................................ 2-33 BTU ......................................................................... G-1 Built-in I/O ............................................................... G-1
D
D/A...........................................................................G-2 Daily Historical Logs ................................................ 2-7 dB.............................................................................G-2 DB ............................................................................G-2 DCD .........................................................................G-2 Deadband..................................................................G-2 DI See Discrete Inputs ...............................................G-2 Diagnostic ................................................................. 1-5 Diagnostic Inputs .................................................... 2-13 Differential Pressure.............2-3, 2-6, 2-28, 3-2, 3-3, G-5 Dimensions ...................................................... 1-3, 1-14 Discrete.....................................................................G-2 Discrete Outputs............................................... 1-5, 2-12 I-1
C
C Prime .....................................................................2-6 Calculations 1985 AGA.............................................................2-3 1992 Flow .............................................................2-4 Input and Extension........................................2-4, 2-5 Instantaneous Rate..........................................2-4, 2-5 Calibration............................................................... 2-28 Dual-Variable Sensor ............................................3-5 I/O Channels ....................................................... 1-21 Cathodic Protection................................................... 1-12 Rev 6/99
Wiring................................................................. 2-24 Division 2................................................................ 1-10 DMM ....................................................................... G-2 DO .......................................................... 1-5, 2-12, 2-18 See Discrete Outputs ............................................ G-2 Downstream Usage of DVS .......................................3-2 DP ............................................................................ G-2 DSR.......................................................................... G-2 DTR .................................................................. 4-3, G-2 Dual-Variable Sensor Calibration ............................................................3-5 Configuration ........................................................3-3 Description............................................................3-1 DVS......................................................................3-1 Specifications...................................................... 3-13 Wiring...................................................................3-2 Duty Cycle ...................................................... 1-15, G-2 DVM ........................................................................ G-2 DVS .................................................................. 1-5, G-2 Downstream Usage................................................3-2 Upstream Usage ....................................................3-2
E
EDS.......................................................................... G-2 EEPROM ................................................................. G-2 EFM ..........................................................................1-3 EIA-232.................................................................... G-2 EIA-232 Communications Cards ................................4-2 EIA-422.................................................................... G-2 EIA-485.................................................................... G-2 EIA-485 Communication Cards .................................4-4 Electrical Isolation .................................................... 1-11 Electromagnetic Interference....................................1-12 Electronics Board.......................................................2-9 EMF ......................................................................... G-2 EMI........................................................ 1-12, 2-18, G-3 Enclosure Dimensions ...........................................................1-3 Energy Accumulation .........................................2-4, 2-5 Energy, Instantaneous ................................................2-6 Environmental Requirements ........................................................1-8 ESD.......................................................................... G-3 EU............................................................................ G-3 Event Log..................................................................2-7 Extension Calculation ................................................2-5
F
Figure 1-1. FloBoss 553 Flow Manager.....................1-4 Figure 1-2. Main Electronics Board...........................1-6 Figure 1-3. Outline and Mounting Dimensions ........1-14 Figure 1-4. Solar Insolation in Hours for the United States ..................................................................... 1-18
Figure 2-1. Main Electronics Board ........................ 2-10 Figure 2-2. I/O Terminal......................................... 2-18 Figure 2-3. Earth Ground Connection ..................... 2-20 Figure 2-4. Location of Input Power Connector....... 2-21 Figure 2-5. RTD Wiring Terminal Connections . 2-23 Figure 2-6. Discrete Output Terminal Wiring.......... 2-25 Figure 2-7. Operator Interface Wiring ..................... 2-27 Figure 2-8. ROC System Flags................................ 2-31 Figure 2-9. Cold Start Options ................................ 2-31 Figure 2-10. Reset Jumper Shown in Normal Position ................................................................. 2-32 Figure 2-11. Open Configuration File ..................... 2-34 Figure 2-12. Download Configuration..................... 2-35 Figure 3-1. DVS Wiring ........................................... 3-3 Figure 3-2. System Information ................................ 3-4 Figure 3-3. Meter Calibration Window...................... 3-5 Figure 3-4. Verify Calibration................................... 3-6 Figure 3-5. Meter Calibration.................................... 3-7 Figure 3-6. Set Zero Calibration for Differential Pressure................................................................... 3-7 Figure 3-7. Removing the DVS from Service ............ 3-8 Figure 3-8. Set Span ................................................. 3-9 Figure 3-9. Set Midpoint 1........................................ 3-9 Figure 3-10. Set Midpoint 2.................................... 3-10 Figure 3-11. Set Midpoint 3.................................... 3-10 Figure 3-12. Returning the DVS to Service ............. 3-11 Figure 3-13. Set Zero Shift ..................................... 3-12 Figure 4-1 ................................................................. 4-2 Figure 4-1. EIA-232 Serial Communications Card .... 4-2 Figure 4-2. EIA-485 Serial Communications Card .... 4-4 Figure 4-3. Communications Card Location.............. 4-6 Firmware.....................................................1-7, 2-3, G-3 Flash Memory ........................................................... 2-9 Flash ROM.........................................................1-5, G-3 FlashPAC..................................................................G-3 FloBoss.....................................................................G-3 FloBoss Flow Manager.............................................. 1-1 Flow and Energy Accumulation.......................... 2-4, 2-5 Flow Calculations 1985 AGA ............................................................ 2-3 Flow Measurement.................................................... 2-3 Flow Time.......................................................... 2-4, 2-5 Flow, Instantaneous................................................... 2-6 Flowing Minutes ....................................................... 2-6 FM............................................................................G-3 Force.........................................................................G-3 FPV ..........................................................................G-3 FSK ..........................................................................G-3 FST....................................................................2-8, G-3 Function Sequence Table (FST) User Manual ............ 1-2 Functions .................................................................. 2-3
G
GFA..........................................................................G-3 Rev 6/99
I-2
GND......................................................................... G-3 GP ............................................................................ G-3 Grid Impedance ........................................................ 1-11 Ground Rod.............................................................. 1-11 Grounding Earth Ground ....................................................... 1-11 Wiring Requirements........................................... 1-11 Groups C, and D ...................................................... 1-10 GV101...................................................................... G-3 GV110...................................................................... G-3
Isolation....................................................................1-11 IV .............................................................................G-4
J
Jumper .................................................................... 2-32
K
Kbytes.......................................................................G-4 kHz ...........................................................................G-4
H
Hardware Watchdog ................................................ 2-14 HART....................................................................... G-3 Hazardous Locations................................................ 1-10 History Log ...............................................................2-6 History Points ............................................................2-6 Holding Register....................................................... G-3 Host Port ........................................................ 2-11, 2-12 Wiring................................................................. 2-27 Hourly Historical Log ................................................2-6 hw ............................................................................ G-3
L
LAN..........................................................................G-4 LCD.................................................................2-11, G-4 LDP ..........................................................................G-4 LED..........................................................................G-4 LEDs Communications Cards ......................................... 4-3 Liquid Crystal Display...................................... 1-4, 2-11 Local Operator Interface LOI .......................................................1-5, 1-7, 2-11 LOI Wiring......................................................... 2-26 LOI ..................................................................2-18, G-4 Loop Schematic.........................................................A-1 Low Battery ............................................................ 2-15 Low Power Modes .................................................. 2-14 LPM..........................................................................G-4 LRC..........................................................................G-4
I
I/O............................................................................ G-4 Built-in .................................................................1-5 I/O Channel Power Consumed ................................................ 1-15 I/O Module ............................................................... G-4 I/O Power Requirements .......................................... 1-15 I/O Terminals .......................................................... 2-18 I/O Wiring Requirements ......................................... 1-12 ID............................................................................. G-4 IEC........................................................................... G-4 IEEE......................................................................... G-4 Impedance Grid .................................................................... 1-11 IMV.......................................................................... G-4 Information Additional .............................................................1-2 Input......................................................................... G-4 Input and Extension Calculation..........................2-4, 2-5 INPUT POWER ...................................................... 2-18 Input Register ........................................................... G-4 Installation Communications Cards..........................................4-5 Guidelines.............................................................1-8 Instantaneous Rate Calculations ..........................2-4, 2-5 Integral Multiplier Value............................................2-6 IMV ......................................................................2-5 Integral Value ............................................................2-6 IV .........................................................................2-5 IRQ .......................................................................... G-4 ISO........................................................................... G-4 Rev 6/99
M
mA............................................................................G-4 Main Electronics Board .......................1-4, 1-6, 2-9, 2-10 Specifications ..................................................... 2-35 MCU.........................................................................G-4 MCU Board .............................................................. 2-9 MCU PWR ............................................................. 2-18 Memory .................................................................... 2-9 Metric ....................................................................... 3-4 Microprocessor................................................... 1-5, 2-9 Minute Historical Log ............................................... 2-6 Modbus.................................................................... 2-8 Modular I/O ..............................................................G-4 MOSFET ................................................................ 2-24 Mounting ........................................................1-13, 1-14 MPU .........................................................................G-4 mV............................................................................G-5 MVS ..................................................................3-1, G-5 mW...........................................................................G-5
N
National Electrical Code NEC ................................................................... 1-10 I-3
O
Off-line..................................................................... G-5 OH ........................................................................... G-5 Ohms........................................................................ G-5 On-line ..................................................................... G-5 Opcode ..................................................................... G-5 Operation................................................................. 1-21 Operator Interface Port.................................... 2-11, 2-26 LOI ................................................................1-5, 1-7 Wiring................................................................. 2-26 Options......................................................................1-7 OSI........................................................................... G-4 Outline ......................................................................1-4 Overview...................................................................1-3
Surge Protection ...................................................1-11 Totaling Requirements........................................ 1-16 Wiring ........................................................2-16, 2-20 Power Consumption, Total ...................................... 1-15 Preset ........................................................................G-5 Pressure .............................................................3-2, G-5 Pressure Connections................................................. 3-2 PRI ...........................................................................G-5 Process Connections......................................... 1-13, 3-2 Processor................................................................... 1-5 Product Overview...................................................... 1-3 PSTN ........................................................................G-5 PT.............................................................................G-6 PTT...........................................................................G-6 Pulse .........................................................................G-6 PV.............................................................................G-6
R
Rack .........................................................................G-6 Radio Frequency Interference .................................. 1-12 RAM..................................................................1-5, G-6 Backup Procedure............................................... 2-29 RBX..........................................................................G-6 Real-Time Clock .............................................2-13, 2-15 Rebooting See Resetting the FloBoss ................................... 2-30 Repair ..................................................................... 2-29 Replacing Communications Cards ......................................... 4-8 Report by Exception................................................ 2-12 Reset Jumper........................................................... 2-32 Resetting the FloBoss .............................................. 2-30 RFI .........................................................1-12, 2-18, G-6 RI..............................................................................G-6 ROC..........................................................................G-6 ROC/FloBoss Accessories Instruction Manual ........... 1-2 ROCLINK ................................................................G-6 ROCPAC Module .....................................................G-6 ROM.........................................................................G-6 Flash..................................................................... 1-5 RS232 Communication Card Wiring .................................................................. 4-7 RTC..........................................................................G-6 RTD........................ 1-5, 2-3, 2-13, 2-14, 2-18, 2-28, G-6 Wiring ................................................................ 2-22 RTS ..........................................................2-26, 4-3, G-6 RTU..........................................................................G-6 RXD ..................................................................4-3, G-6
P
P/DP......................................................... 2-18, 3-2, G-5 P1............................................................................ 2-33 P3............................................................................ 2-18 Parameter ................................................................. G-5 PC ............................................................................ G-5 Periodic Timer Interrupt.................................................... 2-14 Periodic Log ..............................................................2-6 Periodic Timer Interrupt............................................ G-5 Pf.............................................................................. G-5 Phase Lock Loop .....................................................2-14 PI See Pulse Inputs ................................................... G-5 PID........................................................................... G-5 Piping...............................................................1-13, 3-2 PIT ........................................................................... G-5 Pmax .......................................................................1-15 Pmin........................................................................1-15 Point......................................................................... G-5 Point Number ........................................................... G-5 Point Type ................................................................ G-5 Polarity .................................................. 1-20, 2-14, 2-17 Power Before Removing ................................................2-29 Consumption....................................................... 1-15 Consumption Table ............................................. 1-16 I/O Requirements ................................................ 1-15 Low Modes ......................................................... 2-14 Operating ............................................................ 2-14 Requirements ...................................................... 1-10 Sleep (Doze) Mode.............................................. 2-15 Solar Power......................................................... 1-17 Standby Mode ..................................................... 2-14
S
SAMA ......................................................................G-6 Sampler................................................................... 2-13 Script ........................................................................G-6
I-4
Rev 6/99
Section Contents .................................................3-1, 4-1 Security ................................... 1-5, 2-8, 2-11, 2-12, 2-30 Site Requirements ......................................................1-9 Sleep Mode.............................................................. 2-15 Soft Points ................................................................ G-6 Software Watchdog.................................................. 2-14 Solar Arrays Refer to Solar Panels ........................................... 1-17 Solar Panels ...............................................................1-9 Power.................................................................. 1-17 Sizing.................................................................. 1-17 SP............................................................................. G-6 Specifications Communications Cards........................................ 4-10 Serial Communications Cards.............................. 4-10 SPI ........................................................................... G-6 SPK .......................................................................... G-6 SRAM ...................................................................... G-7 SRBX ....................................................................... G-7 See RBX .............................................................. G-6 Standby Mode.......................................................... 2-14 Startup.............................................................. 1-20, 3-8 Startup and Operation .............................................. 1-20 Static Pressure .................................... 2-3, 2-6, 2-28, 3-3 Static Random Access Memory SRAM...................................................................2-9 Surge Protection........................................................ 1-11 SVA ......................................................................... G-7 SVD ......................................................................... G-7 System Voltage........................................................ 1-16
Tf..............................................................................G-7 Timer Interrupt.................................................2-14, G-5 TLP...........................................................................G-7 Totaling Power Requirements.................................. 1-16 Troubleshooting ...................................................... 2-29 Communications Cards ......................................... 4-8 Reset .................................................................. 2-30 TXD...................................................................4-3, G-7 Type RL101 ROCLINK Configuration Software User Manual .................................................................... 1-2
U
Units ......................................................................... 3-4
V
Vibration................................................................... 1-9 Voltage ................................................................... 1-16
W
Warm Start.............................................................. 2-30 Watchdog Software and Hardware....................................... 2-14 Wiring Communications................................................. 2-25 Communications Cards ......................................... 4-7 Discrete Outputs ................................................. 2-24 Dual-Variable Sensor............................................ 3-2 EIA-485 Communications Cards........................... 4-7 General............................................................... 2-17 Grounding Requirements .................................... 1-11 I/O Terminals ..................................................... 2-18 I/O Wiring .......................................................... 1-12 LOI .................................................................... 2-26 Power ................................................................. 2-20 RS232 Communications Card ............................... 4-7 RTD ................................................................... 2-22 Wire Gauge ........................................................ 2-20
T
Table 1-1. Power Consumption of the FloBoss 553 and Powered Devices.................................................... 1-16 Table 1-2. Solar Panel Sizing ..................................1-19 Table 2-1. Discrete Output ......................................2-12 Table 4-1. Communications Cards LED Indicators ....4-3 TDI........................................................................... G-7 TDO ................................................................ 2-13, G-7 Temperature .............................. 1-9, 2-3, 2-6, 2-14, 2-28 Terminal Connections ..............................................2-17 Tests Automatic ........................................................... 2-14
Z
Zero Shift................................................................ 3-12
Rev 6/99
I-5
If you have comments or questions regarding this manual, please direct them to your Fisher Representative or contact:
FAS Technical Documentation Fisher Controls International, Inc. 1612 South 17th Avenue Marshalltown, Iowa 50158 FAX: 515-754-3630 I-6 Rev 6/99