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positive phase
negative phase
ambient pressure
partial vacuum
Interfacing the Blast Pressure Transducer Figure 6. Outline drawing of the Pencil Probe in Figure 4.
Of initial concern in the application of modern transducers
to measure air-blast phenomena is the interface between the tion that a sine wave would encounter as it passes at right
blast pressure transducer and the measurand (the blast envi- angles to the axis of symmetry that is perpendicular to the plane
ronment). Figure 4 showed a Model 137A ICP® blast pressure of the circular diaphragm of the transducer. The diaphragm
transducer in a pencil probe configuration for side-on pressure would cause distortion through spatial averaging of the wave,
measurements. In application, its axis must be aligned incident which results in attenuation.
(perpendicular) to the incoming air blast wave. Its size should Analysis of the spatial averaging effect of the diaphragm of
be small relative to the highest frequency of interest in the pressure transducers has been performed. 1 Results are shown
shock front. For example, assume a shock front is moving at in Figure 7. When using these results, the velocity (in/second)
3,300 feet per second. The wavelength l corresponding to a of the gas passing over the transducer must be applied as a
spectral frequency f of 20,000 Hz in the front would be: multiplier to the abscissa (x-axis) to convert its units to Hz. As
an example of the application of Figure 7, at 1100 ft/sec (13,200
l f = c = 3300 (12) inches per second or
in/sec) in dry air, a 0.3-in. diameter diaphragm would nomi-
l = 1.98 inches. nally produce a five-percent amplitude error at 9,200 Hz, and
Looking at the dimensions of the pencil probe in Figure 6 a 0.1-in. diameter diaphragm would produce the same error at
relative to the preceding value of l, it is clear that the probe 24,000 Hz.
has the potential to act as a reflecting body to high frequen- For reflected pressures at a stationary barrier, the averaging
cies in the approaching shock front. effects due to flow at normal incidence are not a consideration.
In order to minimize reflections, the probe is tapered over However, the diaphragm of the transducer should be flush with
approximately its first two-inches of length. It then transitions the reflecting surface. If the diaphragm is flush, the structural
into a cylindrical body with a flat surface on one side. This flat properties of its sensing element control its dynamic perfor-
surface eliminates discontinuities between an embedded, disc- mance. However, in some instances, deviations from flush
shaped, radial facing, quartz sensing element and the trans- mounting might be required.
ducer housing. Ideally, the velocity of the shock front and the These deviations could be needed to isolate the transducer
spatial averaging of the disc as the front traverses across it will from high temperature or some other harsh environment. In this
control the measured rise time. The averaging effect associated situation, the transducer could be coupled to the process by a
with any pressure transducer can be envisioned as the distor- length of tubing or other intermediate fitting. The resultant
2
SOUND AND VIBRATION/DECEMBER 2004 11
T E C H N I C A L I N F O R M AT I O N AR_82
1.2
1.0
0.8
0.6
0.3 in. diameter
Gain, dB
corded data can now be considered to be the appropriate re- 0
10
0
power supplies, are usually already in place at the test facil-
pf
20
0
ity, and these same signal conditioning devices can be applied
30
pf
0
50
pf
directly to MEMS pressure transducers. This interoperability,
0
pf
10
not to mention the ease with which MEMS sensors can be stati-
00
pf
20 00
cally calibrated, certainly encourages their utilization.
00 pf
IC – 1 sensor to available constant current)
30
(Ratio of max output voltage from
pf
This section attempts to objectively compare strengths and
50
00
weaknesses of MEMS and ICP ® type pressure transducers fo- 1.00
10
pf
,0
cused only on their applicability to the air-blast environment.
00
20 ,00
pf
,0
The analysis considers erroneous responses to the undesired
30
00 pf
pf
50
stimuli that accompany air-blasts, which as previously noted,
0
,0
00
10
include as a minimum: thermal transients, light, acceleration/
pf
0,
00
strain, and ionization products of the explosion. In addition,
0
pf
the transducer performance parameters of dynamic range, rug-
gedness/survivability, frequency response, and self-check are 0.10
examined. We will deal with these issues one at a time in what
V
this author considers their order of importance.
Thermal transients. Reference 8 discusses challenges en-
countered due to thermal-transient sensitivity of MEMS pres-
sure transducers. Heat transfer by conduction, convection, and
radiation results in the individual strain-elements of the pres-
sure transducer’s diaphragm encountering spatially distributed
0.010
temperatures. These temperatures change with time and are 1k 10k 100k 300k
different than that of their supporting structure. In addition, Frequency, Hz
thermally induced distortion (e.g., bending) of the diaphragm fmax = Maximum frequency given the following characteristics
can occur. The results of these combined effects are both a zero- C = Cable capacitance (pF)
shift and a change in sensitivity of the transducer. Figure 14 V = Maximum output voltage from sensor (volts)
I = Constant current level from power unit (mA)
shows a pressure-time record acquired from a MEMS trans- 109 = Scalar factor to equate units
ducer in a contained explosive environment. This measurement
was affected by thermal-transient stimuli. Figure 13. Nomograph showing effect of frequency and cable capaci-
tance on ICP ® signal output.
Methods to mitigate thermal-transient response (as described
in reference 8) include (1) a protective or shadowing screen possess a maximum resonant frequency of 100 to 200 kHz at
over the diaphragm, (2) opaque grease in front of the dia- pressures under 100 psi extending to a 1 MHz resonance at
phragm, and (3) the addition of an opaque material that adheres 1,000 psi. Quartz ICP ® transducers possess resonant frequen-
to the diaphragm such as black tape or RTV. Metallic coatings cies of 300 to 400 kHz over this same pressure range. Frequency
can also be added to the front of the diaphragm. All of these tailoring (mentioned previously in this article) extends the
‘fixes’ degrade the frequency response (discussed below) of the useable frequency response of quartz ICP® transducers. In ad-
transducer to some extent as a byproduct of delaying the ther- dition, they do not require screens and are not influenced by
mal transient. the addition of coatings or RTVs to their diaphragms. MEMS
References 9 and 10 describe recent advances using MEMS transducers, in ranges less than 100 psi, typically find their
“silicon-on-insulator” (SOI) pressure transducer technology. frequency response degraded by the addition of thermal pro-
This technology enables steady-state operation at temperatures tective coatings to their diaphragms. This occurs due to the low
to greater than 1000° F, while also enhancing transducer per- density of silicon and the thinner diaphragms necessitated at
formance in thermal-transient environments. the lower pressure-ranges. All quartz ICP ® pressure transduc-
The initial effect of transient temperature on quartz ICP® ers are extremely rigid, so as to be virtually unaffected by coat-
pressure transducers is to cause internal component dimen- ings.
sional changes (see Figure 5), which ultimately result in a par- Acceleration (Strain). As noted earlier, blast loading of the
tial release of the preload within the stack of quartz plates. The housing of a structure in which a pressure transducer is
release of this preload results in an error in the pressure trans- mounted creates motion of the structure and, additionally, in-
ducer output and a false indication of a positive pressure after duces mechanical strain into it. The lower profile of the MEMS
the pressure event is over. A RTV coating is usually placed on silicon diaphragm assembly (< 0.015 in. thick), along with the
the diaphragm of the transducer to provide a barrier to ther- high modulus/density ratio of silicon (approximately 3 times
mal transients. Coatings, placed on either MEMS or ICP ® trans- that of steel), minimizes the acceleration response of MEMS
ducers, typically delay the thermal transient for no more than pressure transducers. In addition, some MEMS SOI technology,
a few 10s of milliseconds. analogous to ICP® technology, incorporates a 2nd transducer
Light. Reference 8 also discusses light-sensitivity of silicon for acceleration compensation. When acceleration compensa-
transducers. This is of interest because light-intensity increases tion is provided, the acceleration sensitivity of ICP ® transduc-
with proximity to the air-blast. Silicon-diaphragm pressure ers is also very small; however, the larger, more complex struc-
transducers absorb short-wavelength electromagnetic radiation ture of their sensing element (Figure 5) makes them more
in the wavelength range between 3,000 to 10,000 A, most of sensitive to strain coupling.
which is in the visible spectrum. The temporary results are Ruggedness (Survivability). MEMS pressure transducers are
photoconduction as well as a photo diode effect in the junc- specified with ranges to 30,000 psi, and, historically, with
tion isolation between the gages and the bulk material. Refer- stated over-range capabilities of 2 or 3 times full-scale, with-
ence 8 concludes, “flash sensitivities of silicon diaphragms out damage. Currently, select MEMS transducers 9 are being
vary widely from unit to unit, and it is rather easy to obtain a fabricated with mechanical over-range stops to increase this
full-scale output from a flash of light.” capability. Quartz ICP ® transducers are specified with ranges
Again, since the publication of Reference 8, more recent SOI to 200,000 psi, with over-range capability in some instances of
technology9,10, used by select manufacturers, has greatly mini- 200 times full-scale.
mized transducer response attributable to light. By compari- Dynamic range. MEMS pressure transducers typically pro-
son, quartz ICP® technology has no sensitivity to light. vide an output signal of 100 to 200 millivolts without amplifi-
Frequency Response. MEMS pressure transducers typically cation. The basic piezoelectric sensing element in ICP ® trans-
6
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T E C H N I C A L I N F O R M AT I O N AR_82
Conclusion
After briefly describing the air-blast environment, some of
the historical challenges associated with its measurement were
presented. Problems associated with interfacing a pressure
transducer to the air-blast environment were next described,
Figure 14. Erroneous blast pressure data (notice the –100 psig reading!).
and analysis procedures were provided to calculate the effects
of any transducer-mounting compromises. Tools for validation
ducers typically has a dynamic range of 100 to 120 dB. Quartz
of data were then discussed, and methods to minimize any
ICP ® pressure transducers can readily provide a 5-volt full-
documented environment-induced noise, if present, were pro-
scale output without amplification. Measuring a 100-psi blast-
vided. The frequency limitations attributable to long cables
pressure wave with a 500-psi MEMS pressure transducer that
runs used in air-blast testing were then described, and some
has a 100 mV full-scale output would result in 20 mV of signal
computational tools were identified. Last, a comparison of dif-
before amplification. The comparable measurement with a 500-
ferent transducer technologies was performed.
psi ICP® transducer could result in 1000 mV of signal before
Measurement of air-blast phenomena is a challenging task for
amplification. This typical 50:1 signal ratio greatly reduces the
the test engineer or technician. Hopefully this work will pro-
number of ranges of ICP ® transducers that have to be invento-
vide comprehensive guidance where a lack of it now exists.
ried at a test facility.
Self-check. End-to-end checks of the integrity on the mea-
References
surement system can be performed both with MEMS and ICP ® 1. Walter, P. L., “Limitations and Corrections in Measuring Dynamic
transducers. With MEMS transducers one can shunt calibrate Characteristics of Structural Systems,” Ph. D. Thesis, Arizona State
the system by paralleling a resistor across one arm of the bridge University, pp. 140-141 and 205-208, Dec. 1978.
2. Morse, P. M., Vibration and Sound, McGraw Hill, NY, ch. 22, pp.
to produce a known voltage change. Calibration is somewhat
221-235, 1948.
of a misnomer, since the values of the transducer’s bridge-re- 3. Shock and Vibration Transducer Selection, Institute of Environmen-
sistors have some dependency on ambient temperature. Nev- tal Sciences and Technology, IEST RP-DTE011.1, Sec. 7.9, Oct. 2004.
ertheless, the signal indicates continuity and provides some 4. Stein, P. K., The Unified Approach to the Engineering of Measure-
ment Systems, Stein Engineering Services, Phoenix, AZ, April 1992.
measure of gain through the circuit, which is important infor-
5. Hilten, John, Vezzetti, Carol, Mayo-Wells, J. Franklin and Lederer,
mation when long runs of cables are involved. The equivalent Paul, “Experimental Investigation of Means for Reducing the Re-
check for an ICP® transducer is the monitoring of the bias volt- sponse of Pressure Transducers to Thermal Transients,” NBS Tech
age associated with the MOSFET inside the transducer. This Note 961, January 1978.
6. Matick, Richard L., “Transmission Lines for Digital and Communi-
bias voltage serves as a continuity check.
cation Networks,” IEEE Press, pp. 31-35, 1995.
Ionization products. MEMS and ICP ® transducers can both 7. Belden CDT Inc., St. Louis, MO.
be mounted with the transducer housing either grounded or 8. Whittier, Robert M., “Reducing Transient Thermal Sensitivity of
ungrounded to a mounting plate. Both devices have low-im- Silicon Diaphragm Pressure Transducers,” Eleventh Transducer
Wo r k s h o p , S e a t t l e , WA , a v a i l a b l e f r o m : S e c r e t a r i a t R a n g e
pedance outputs, and various cable shielding options can be
Commander’s Council, White Sands Missile Range, NM, pp. 292-
provided. Any relative advantage between the two technolo- 301, June 2-4, 1981.
gies would have to be associated with the dynamic range of the 9. Kurtz, A. D., Ainsworth, R. W., Thorpe, S. J. and Ned, A. A., “Fur-
ICP® transducer, which was credited above under “dynamic ther Work on Acceleration Insensitive Semiconductor Pressure
Sensors for High Bandwidth Measurements on Rotating Turbine
range.”
Blades,” NASA 2003 Propulsion Measurement Sensor Development
Transducer cost has not been considered in the preceding Workshop, Huntsville, AL, May 13-15, 2003.
discussion. The cost of lost test data is often priceless. If mul- 10. Kurtz, A. D., Ned, A. A. and Epstein, A. H., “Improved Ruggedized
tiple channels of acceptable strain-gage signal conditioning are SOI Transducers Operational Above 600° C, Twenty-First Trans-
ducer Workshop, Lexington Park, MD, June 22-23, 2004.
in place, the MEMS transducer is the most economical solu-
tion. If these existing and available channels are not in place,
A number of additional reference sources were consulted for this
per channel costs favor the ICP ® solution. work. A few of the more valuable are noted below:
Table 1 recaps the preceding comparison. A (+) indicates the y Hilten, John S., Vezzetti, Carol F., Mayo-Wells, J. Franklin, and
best or highest performance and a (X) lesser but still highly Lederer, Paul S., Experimental Investigation of Means for Reducing
the Response of Pressure Transducers to Thermal Transients, NBS
competitive performance. It should again be noted that the
Technical Note 961, National Bureau of Standards, Washington, DC,
MEMS SOI pressure-transducer technology is currently emerg- January 1978.
ing, and is only available from select manufacturers. The more y Hilten, John S., Vezzetti, Carol F., Mayo-Wells, J. Franklin, and
Lederer, Paul S., A Test Method for Determining the Effect of Ther-
mal Transients on Pressure-Transducer Response, NBS Technical
Table 1. Technical comparison of ICP® vs. MEMS transducers for an Note 905, National Bureau of Standards, Washington, DC, January
air-blast application. 1976.
y Sachs, Donald C., Cole, Eldine, Air Blast Measurement Technology,
Evaluation Parameter ICP® SOI Silicon p-n
Report Defense Nuclear Agency #DNA 4115F, work performed by
Thermal Transients . . . . . . . . . . . . . . . + – – Kaman Sciences Corp. (K-76-38U(R), Colorado Springs, CO, Septem-
Light . . . . . . . . . . . . . . . . . . . . . . . . . . . + x – ber 1976.
Frequency Response . . . . . . . . . . . . . . + + + y A Guide for the Dynamic Calibration of Pressure Transducers, ISA-
Acceleration (Strain) . . . . . . . . . . . . . . x + x 37.16.01-2002, November 21, 2002.
Ruggedness (Survivability) . . . . . . . . . + + –
Dynamic Range . . . . . . . . . . . . . . . . . . + – – The author can be contacted at: p.walter@tcu.edu.
Self-Check . . . . . . . . . . . . . . . . . . . . . . + + +
Ionization Products . . . . . . . . . . . . . . . + + +
(+) is best or highest performance
(x) is lesser but still highly competitive performance
7
16 SOUND AND VIBRATION/DECEMBER 2004