Yole ST L3G3250 3-Axis Gyroscope April 2012 Sample

2012 by SYSTEM PLUS CONSULTING, all rights reserved.
STMicro L3G3250A 3-Axis MEMS Gyroscope

1
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France
Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr
April 2012 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A 3-Axis MEMS Gyroscope
2
Table of Contents
Glossary

1. Overview / Introduction............4
Executive Summary
Reverse Costing Methodology

2. STMicroelectronics Company Profile..........6
ST Profile
ST key fabs, assembly and R&D locations
ST MEMS Gyroscopes Portfolio
L3G3250A Characteristics
ST Business Model

3. L3G3250A Physical Analysis..................13
Physical Analysis Methodology
Package Characteristics & Markings
Package Pin-Out
Package X-Ray
Package Cross-Section
Package Opening
ASIC Dimensions
ASIC Markings
ASIC Cross-Section
ASIC Process Characteristics
MEMS Dimensions
MEMS Markings
MEMS Bond Pads Opening
MEMS Bond Pads
MEMS Cap Opening
MEMS Cap
MEMS Sensing Area
MEMS Cross-section
MEMS Process Characteristics
Physical Data Summary

4. Manufacturing Process Flow...59
Global Overview
ASIC Process Flow
Description of the ASIC Wafer Fabrication Unit
MEMS Process Overview
MEMS Sensor Process Flow
MEMS Cap Process Flow
MEMS Wafer Bonding Process Flow
Description of the MEMS Wafer Fabrication Unit

5. Cost Analysis.....75
Synthesis of the Cost Analysis
Main Steps of Economic Analysis
Yields Explanation
Yields Hypotheses
Die per wafer & Probe Test
ASIC Front-End : Hypotheses
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
ASIC Dies Cost
MEMS Front-End : Hypotheses
MEMS Front-End Cost
MEMS Front-End Cost per Process Steps
MEMS Front-End : Equipment Cost per Family
MEMS Front-End : Material Cost per Family
MEMS Back-End 0 : Probe Test & Dicing
MEMS Die Cost (Front End + Back End 0)
Back-End 1 : Packaging Cost
Back-End 1 : Final test & Calibration Cost
L3G3250A Component Cost (FE + BE 0 + BE 1)

6. Estimated Price Analysis..........100
Definition of Prices
Manufacturer Financial Ratios
L3G3250A Estimated Manufacturer Price
L3G3250A Estimated Selling Price

Contact.......107
3
Executive Summary
This full reverse costing study has been conducted to provide insight on technology
data, manufacturing cost and selling price of the STMicroelectronics L3G3250A
component.

The L3G3250A is a 3-axis MEMS gyroscope manufactured using a surface
micromachining process (THELMA process).

It is suitable for further applications:
Gaming and virtual reality input devices
Motion control with MMI (man-machine interface)
GPS navigation systems
Appliances and robotics

Compatible with SMD process, the L3G3250A is provided in a 3.5x3x1.0mm LGA 16-
pin package.
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Reverse Costing Methodology
The reverse costing analysis is conducted in 3 phases:

Package is analyzed and measured.
The dies are extracted in order to get overall data: dimensions, main
blocks, pad number and pin out, die marking
Set up of the manufacturing process.

Setup of the manufacturing environment
Cost simulation of the process steps with different year scenarios

Supply Chain Analysis
Analysis of the selling price

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Packages X-Ray
6
Package Opening SEM view
Package Opening
7
MEMS Cap Opening
MEMS with Cap removed Overview SEM View
8
ST's 3-Axis Gyroscope MEMS Dies Comparison
9
MEMS - Cross-Section
MEMS cap cross-section SEM View
10
Sensor Process Flow
11
Si wafer
Thinning 300m
Isolation oxide
(Oxide1) deposit
Si wafer
Buried Poly (Poly1)
deposition
Ion implantation
Pattern & etch
Si wafer
Sacrificial oxide
(Oxide 2) deposit
Pattern & etch
Si wafer
Structural Layer
(Poly 2) deposit
CMP & ion implant
Sensor Process Flow 1/2
12
ASIC Front-End Cost
Probe Test Cost
Backgrinding & Dicing Cost
We perform the economic analysis of the ASIC with the IC Price+ software.
We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.
Packaging Cost
Final Test & Calibration Cost
Component Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
Main steps of economic analysis
L3G3250A
Back-End 0
Back-End 1
Front-End
13
ASIC Die Cost (Front-End + Back-End 0)
14
MEMS Front-End Cost
15
MEMS FE Cost per Process Steps (1/2)
Sensor Manufacturing Steps Cost (Simulated with MEMS CoSim+Cost Simulation Tool)
16
L3G3250A Component Cost (FE+BE 0+BE 1)
17
L3G3250A Estimated Selling Price (Medium Yield)

Yole ST L3G3250 3-Axis Gyroscope April 2012 Sample

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2012 by SYSTEM PLUS CONSULTING, all rights reserved.

STMicro L3G3250A 3-Axis MEMS Gyroscope

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