Vishay Siliconix

SUM110P04-05
Document Number: 73493
S-80274-Rev. B, 11-Feb-08
www.vishay.com
1
P-Channel 40-V (D-S) MOSFET
FEATURES
TrenchFET

Power MOSFET
PRODUCT SUMMARY
V
DS
(V) r
DS(on)
()
I
D
(A)
a
Q
g
(Typ.)
- 40 0.005 at V
GS
= - 10 V - 110 185 nC
Ordering Information: SUM110P04-05-E3 (Lead (Pb)-free)
TO-263
S G D
Top View
Drain Connected to Tab
S
G
D
P-Channel MOSFET
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 40 C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
- 40
V
Gate-Source Voltage V
GS
20
Continuous Drain Current (T
J
= 175 C)
T
C
= 25 C
I
D
- 110
a
A
T
C
= 70 C
- 110
a
T
A
= 25 C
39
b, c
T
A
= 70 C
33
b, c
Pulsed Drain Current I
DM
240
Continuous Source-Drain Diode Current
T
C
= 25 C
I
S
110
T
A
= 25 C
10
b, c
Avalanche Current
L = 0.1 mH
I
AS
75
Single-Pulse Avalanche Energy E
AS
281 mJ
Maximum Power Dissipation
T
C
= 25 C
P
D
375
W
T
C
= 70 C 262
T
A
= 25 C
15
b, c
T
A
= 70 C
10.5
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 175
C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s R
thJA
8 10
C/W
Maximum Junction-to-Case (Drain) Steady State R
thJC
0.33 0.4
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 73493
S-80274-Rev. B, 11-Feb-08
Vishay Siliconix
SUM110P04-05
Notes:
a. Pulse test; pulse width 300 s, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= - 250 A - 40 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= - 250 A
- 40
mV/C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 5.5
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= - 250 A - 2 - 3 - 4 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= - 40 V, V
GS
= 0 V - 1
A
V
DS
= - 40 V, V
GS
= 0 V, T
J
= 55 C - 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= - 10 V - 120 A
Drain-Source On-State Resistance
a
r
DS(on)
V
GS
= - 10 V, I
D
= - 20 A 0.0041 0.005
Forward Transconductance
a
g
fs
V
DS
= - 15 V, I
D
= - 20 A 75 S
Dynamic
b
Input Capacitance C
iss
V
DS
= - 25 V, V
GS
= 0 V, f = 1 MHz
11300
pF Output Capacitance C
oss
1510
Reverse Transfer Capacitance C
rss
1000
Total Gate Charge Q
g
V
DS
= - 20 V, V
GS
= - 10 V, I
D
= - 110 A
185 280
nC Gate-Source Charge Q
gs
48
Gate-Drain Charge Q
gd
42
Gate Resistance R
g
f = 1 MHz 4.0
Turn-On Delay Time t
d(on)

V
DD
= - 20 V, R
L
= 0.18
I
D
- 110 A, V
GEN
= - 10 V, R
g
= 1
25 40
ns
Rise Time t
r
290 440
Turn-Off Delay Time t
d(off)
110 165
Fall Time t
f
35 55
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 C - 110
A
Pulse Diode Forward Current
a
I
SM
- 240
Body Diode Voltage V
SD
I
S
= - 20 A - 0.8 - 1.5 V
Body Diode Reverse Recovery Time t
rr
I
F
= - 20 A, di/dt = 100 A/s, T
J
= 25 C
70 105 ns
Body Diode Reverse Recovery Charge Q
rr
130 200 nC
Reverse Recovery Fall Time t
a
37
ns
Reverse Recovery Rise Time t
b
33
Document Number: 73493
S-80274-Rev. B, 11-Feb-08
www.vishay.com
3
Vishay Siliconix
SUM110P04-05
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
40
80
120
160
200
0.0 0.5 1.0 1.5 2.0
V
GS
= 10 thru 7 V
4 V
V
DS
- Drain-to-Source Voltage (V)
-

D
r
a
i
n

C
u
r
r
e
n
t

(
A
)
I
D
5 V
6 V
0 20 40 60 80 100 120
V
GS
= 10 V
I
D
- Drain Current (A)
r
D
S
(
o
n
)

-

O
n
-
R
e
s
i
s
t
a
n
c
e

(

)
0.010
0.008
0.006
0.004
0.002
0.000
0
2
4
6
8
10
0 40 80 120 160 200 240
-

G
a
t
e
-
t
o
-
S
o
u
r
c
e

V
o
l
t
a
g
e

(
V
)
Q
g
- Total Gate Charge (nC)
V
G
S
V
DS
= 32 V
V
DS
= 20 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
10
20
30
40
0 1 2 3 4 5 6
25 C
T
C
= 125 C
- 55 C
V
GS
- Gate-to-Source Voltage (V)
-

D
r
a
i
n

C
u
r
r
e
n
t

(
A
)
I
D
C
rss
0
2000
4000
6000
8000
10000
12000
14000
16000
0 10 20 30 40
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C

-

C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
0.6
0.9
1.2
1.5
1.8
- 50 - 25 0 25 50 75 100 125 150 175
T
J
- Junction Temperature (C)
r
D
S
(
o
n
)

-

O
n
-
R
e
s
i
s
t
a
n
c
e
(
N
o
r
m
a
l
i
z
e
d
)
I
D
= 20 A
V
GS
= 10 V
www.vishay.com
4
Document Number: 73493
S-80274-Rev. B, 11-Feb-08
Vishay Siliconix
SUM110P04-05
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
Source-Drain Diode Forward Voltage
Threshold Voltage
10
0.0 0.3 0.6 0.9 1.2 1.5
T
J
= 150 C
V
SD
- Source-to-Drain Voltage (V)
-

S
o
u
r
c
e

C
u
r
r
e
n
t

(
A
)
I
S
1
100
T
J
= 25 C
- 0.5
- 0.3
- 0.1
0.1
0.3
0.5
0.7
0.9
1.1
- 50 - 25 0 25 50 75 100 125 150 175
I
D
=10 mA
T
J
- Temperature (C)
V
G
S
(
t
h
)

V
a
r
i
a
n
c
e

(
V
)
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power, Junction-to-Ambient
0.00
0.01
0.02
0.03
0.04
0.05
0 1 2 3 4 5 6 7 8 9 10
V
GS
- Gate-to-Source Voltage (V)
r
D
S
(
o
n
)

-

D
r
a
i
n
-
t
o
-
S
o
u
r
c
e

O
n
-
R
e
s
i
s
t
a
n
c
e

(

)
T
A
= 25 C
T
A
= 150 C
0
20
35
5
10
P
o
w
e
r


(
W
)
Time (s)
25
0.1 1000 0.01 0.001 0.0001
15
30
100 1.00 10
T
C
= 25 C
Safe Operating Area, Junction-to-Case
-

D
r
a
i
n

C
u
r
r
e
n
t

(
A
)
I
D
Limited by r
DS(on)*
V
DS
- Drain-to-Source Voltage (V)
*V
GS
> minimum V
GS
at which r
DS(on)
is specified
Single Pulse
T
C
= 25 C
1 ms
10 ms
100 ms
DC
10 s
100 s
1
10
100
1000
0.1 1 10 100
Document Number: 73493
S-80274-Rev. B, 11-Feb-08
www.vishay.com
5
Vishay Siliconix
SUM110P04-05
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
* The power dissipation P
D
is based on T
J(max)
= 175 C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73493.
Max. Avalanche and Drain Current
vs. Case Temperature*
0
30
60
90
120
150
180
210
240
0 25 50 75 100 125 150 175
I
D

-

D
r
a
i
n

C
u
r
r
e
n
t

(
A
)
T
C
- Case Temperature (C)
Package Limited
Power Derating, Junction-to-Case
0
50
100
150
200
250
300
350
400
25 50 75 100 125 150 175
T
C
- Case Temperature (C)
P
o
w
e
r


(
W
)
Normalized Thermal Transient Impedance, Junction-to-Case
0.001 0.01 1 0.1 0.0001
1
0.1
0.01
0.2
0.1
Square Wave Pulse Duration (s)
N
o
r
m
a
l
i
z
e
d

E
f
f
e
c
t
i
v
e

T
r
a
n
s
i
e
n
t
T
h
e
r
m
a
l

I
m
p
e
d
a
n
c
e
Single Pulse
0.5
0.05
0.02

Package Information
www.vishay.com
Vishay Siliconix

Revison: 30-Sep-13
1
Document Number: 71198
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TO-263 (D
2
PAK): 3-LEAD
Notes
1. Plane B includes maximum features of heat sink tab and plastic.
2. No more than 25 % of L1 can fall above seating plane by
max. 8 mils.
3. Pin-to-pin coplanarity max. 4 mils.
4. *: Thin lead is for SUB, SYB.
Thick lead is for SUM, SYM, SQM.
5. Use inches as the primary measurement.
6. This feature is for thick lead.
-A-
-B-
D
1
D
4
A A
e
b2
b
E
A
c2
c
L
2
D
L
3
L
Detail A
E1
E2
K
E3
D
2
D
36
0.010 M A M
2 PL
DETAIL A (ROTATED 90)
SECTION A-A
0

-

5

L1
L
4

M
c
1
c
b1
b
INCHES MILLIMETERS
DIM. MIN. MAX. MIN. MAX.
A 0.160 0.190 4.064 4.826
b 0.020 0.039 0.508 0.990
b1 0.020 0.035 0.508 0.889
b2 0.045 0.055 1.143 1.397
c*
Thin lead 0.013 0.018 0.330 0.457
Thick lead 0.023 0.028 0.584 0.711
c1
Thin lead 0.013 0.017 0.330 0.431
Thick lead 0.023 0.027 0.584 0.685
c2 0.045 0.055 1.143 1.397
D 0.340 0.380 8.636 9.652
D1 0.220 0.240 5.588 6.096
D2 0.038 0.042 0.965 1.067
D3 0.045 0.055 1.143 1.397
D4 0.044 0.052 1.118 1.321
E 0.380 0.410 9.652 10.414
E1 0.245 - 6.223 -
E2 0.355 0.375 9.017 9.525
E3 0.072 0.078 1.829 1.981
e 0.100 BSC 2.54 BSC
K 0.045 0.055 1.143 1.397
L 0.575 0.625 14.605 15.875
L1 0.090 0.110 2.286 2.794
L2 0.040 0.055 1.016 1.397
L3 0.050 0.070 1.270 1.778
L4 0.010 BSC 0.254 BSC
M - 0.002 - 0.050
ECN: T13-0707-Rev. K, 30-Sep-13
DWG: 5843
AN826
Vishay Siliconix
Document Number: 73397
11-Apr-05
www.vishay.com
1
RECOMMENDED MINIMUM PADS FOR D
2
PAK: 3-Lead
0
.
6
3
5
(
1
6
.
1
2
9
)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.420
(10.668)
0
.
3
5
5
(
9
.
0
1
7
)
0.145
(3.683)
0.135
(3.429)
0.200
(5.080)
0.050
(1.257)
Return to Index
Legal Disclaimer Notice
www.vishay.com
Vishay

Revision: 02-Oct-12
1
Document Number: 91000
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
Vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishays knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customers responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customers
technical experts. Product specifications do not expand or otherwise modify Vishays terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.