Disable Door

To disable
select 3
On vacuum, bond head air (page>9)
Press enter to activate




Process flow Outstanding items Counteractions
Feed in (mode 16)

Bond head will move to
feed in position

Feed in wire


i. Gold wire handling
(do and dont s)
ii. Basic understanding
on wedge tool do and
donts during wire
feed in
iii. Start up waste length
is not given





Feed in process
Process Flow Outstanding items Counteractions
After feed in

Single bond (mode 11)

Adjust Focus (select focus
and use trackball)

Set height (press store
trace)

Bond (press pg up to
create new bond)
i. Focus done manually,
no auto focus.
ii. Tweezers used may
damage tool tip due to
tip is of brittle material
iii. No microscope to
check on bond
condition (during step
bond)

Press store
trace to
search for
height
Adjust using
trackball
Single Bond Condition
Condition Root Cause Counteractions Concerns
No wire is
bonded
Wire kink or not
straight during feed in
i. Feed in again
ii. Set longer single bond
wire length
i. High waste
produced
Surface of lid
contaminated
Bond to other surface i. May damage
wedge tool tip
Wire could not
go through tool
Tool dirty i. Use US motor to clean
tool (mode 15> test
generator 1> store
trace)
ii. Open and clean the
tool with IPA
iii. Clean using smaller
o/d Au wire (17.5)
i. May damage
wedge tool tip
Position of bond
head NG to feed
in wire
Adjust position to 6000 or
9000 (p-axis)
Process Flow Outstanding items Counteractions
Feed in (mode 16)

Open screw using allen
key

Insert wedge tool

Manual align with
transducer height

Lock screw
i. Focus done
manually, no auto
focus.
ii. Wedge tool align
done manually, no
tool to aid with
wedge tool position
iii. Screw lock using
hand tight



Tools used for the
machine

Process Flow Outstanding items Counteractions
Corr Offset (mode 4)

Select position on lid

Store trace

Bond

Adjust position according
to machine crosshair

Process Flow Outstanding Items Counteractions
Press adjust

Align crosshair to pattern
on device

Press auto adjust

Press adjust

Press rebond

Rebond wire no. 1

Check bond 1 and bond 2

Press bond

Check bond wires using
rebond

Off auto adjust

Press home
i. Wire position drift
ii. PR could not be
obtained due to
machine could not
recognize pattern
iii. Second bond lifted or
no wire


i. Rework device
ii. Change device or re
start program
iii. Rework
Position for x
and y
May be
adjusted using
trackball
Reference pic
for patern
recognition
Could be
reviewed back
by pressing
digit video
during adjust
process
Pattern
recognition
parameters
for 1
st
bond
Used to adjust
lighting and Q
limit (400)
Tollerance
during PR
adjust
Typical value
is 20
Set too high
wire position
will drift
Pattern
recognition
parameters
for 2
nd
bond
Used to adjust
lighting and Q
limit (400)
Focus for
image
Use trackball
to adjust
Typical values used for
the parameters
The values may
change depending on
wire bond condition
Do and Dont Wire Handling
Do not touch gold wire with bare hands.
Always use finger coats
For new gold wire feed in from end (red tape)
Always use tweezers to guide the wire during
feed in

Do and dont tool handling
During feed in make sure good tweezers are
used to eliminate Au wire wastage
Do not touch/hit/scratch tool tip with
tweezers during feed in
Do not hold tool using tweezers during
inspection under microscope (place in tool
cap)
TD offset (mode>15)
TD offset value 70-90
Adjust at control panel
Clockwise decrease
Anti clockwise increase

Typical Parameters Used
Parameter Item Value
PRU Q limit 400
Learn chip Diag. tolerance 20
US time Max 150
US power Max 45
Bond force Max 35
Learn chip Bond parameters TD flag 1
Ramp 300
Threshold 25
Overdrive 300
Steps 7
Learn chip Loop parameters Z loop delay 50
Loop speed 1 50
Loop speed 2 50
Loop speed X Y 50
Tune height 2
Tail height 45-65








Bond process
Wire bonded
Visual inspect
No wire
Bond next wire
No wire
Change device
No wire
Check wire at
tool
No wire
Retry feed in
Wire could not
go through
Examine tool
under
microscope
Not damaged
Use 17.5 Au
wire to clean
the wedge tool
Damaged
Scrap
Increase
parameter
Increase US
power
Increase US
time
Increase bond
force
Check bond
surface
Contaminants
on bond pad
Clean use
probe, tweezers
or cocktail stick
Surface thick
(BFM)
Light scratch
(one direction
only)
Wire bonded
Visual inspect
Wire bonded
Visual inspect