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Coating Technology
surfaces
Coating of technical
components
Our areas of expertise include plating a
wide variety of metallic materials both
with precious metals such as gold, silver, palladium and rhodium as well as
with base metals such as tin, tin/lead,
chemically applied and electrolytic nickel
coating and electrolytic copper plating.
In addition to the conventional substrate
materials of copper and copper alloys,
we can also apply strongly bonded coatings to aluminum, high-alloy steels as
well as to more specialized materials.
Plating of metal
strips
Strips can be solid, pre-stamped or beltlinked. Strips and stamped parts made
of copper and copper alloys, nickel and
nickel alloys, stainless steel or beryllium/bronze and can be coated additionally hardened or annealed.
Electroplating is used for fine and hard
gold, silver, palladium/nickel, copper and
nickel as well as pure tin and tin/lead
alloys. In addition, metal strips can also
be hot-dip tinned.
Special
coatings
These include plating with special materials such as molybdenum, molybdenum/copper, tungsten, tungsten/copper,
AlSiC and die-cast zinc as well as our
activities in the area of selective plating,
which represents a low-cost solution
since it enables the amount of precious
metal deposited to be reduced to that
needed to coat the required surface
only.
The selective deposition of precious
metal on to individual parts is achieved
by using special masks and masking
techniques.
Coatings
for PCBs
For the coating of printed circuit boards,
both our proven processes and new ones
are used:
Electroless
Electroless nickel/gold plating
DODUCHEM
Electroless nickel/palladium/gold
plating DODUBOND
Immersion tin plating
DODUSTAN
Immersion Silver
ARGOL IS
Cyanid free galvanic Silverbath
ARGOL CF
Electroplating
Fine gold for bonding applications, hard
gold, silver and hard silver, bright and matt
tin plating.
Coating of ceramic
substrates
For ceramic substrates, DODUCO offers
future-ready coating technologies in
which metallic conductive pastes in
tungsten, pure silver, silver/palladium or
silver/gold are applied to ceramic substrates to give a final surface of electroless
nickel/immersion gold, electroless
nickel/immersion gold/reductive gold or
electroless nickel/palladium/immersion
gold.
The technological focus is on the combined use of gold and aluminum wire
bonds.
PVD coatings
As the perfect complement to and extension of our electroplating services, we
also offer PVD coating services. This
process enables even non-conductive
substrates such as plastic, ceramic,
glass and titanium based materials to be
coated. In addition to silver, hard gold,
palladium, platinum, copper, nickel and
chromium, coatings can also be made of
materials which cannot be deposited by
means of electrolysis, such as tungsten,
titanium, aluminum, titanium nitride, alloys
and composites.
Product Development
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Development
DODUCOs development goals are
based on the dictated of the market and
the requirements of our customers.
Here the main focus is on the search for
innovative, environmentallyfriendly solutions and simpler, more stable processes.
Our experienced development team
optimizes and develops electrolytic and
chemical products in the light of current
and future market demands. Even specialized customer requirements are
incorporated into our development work.
Development projects also draw on the
expertise of our own analytical and
materials labs. A distinct advantage of this
is the gradual testing of the products
under development from laboratory scale
and pilot plant to full implementation
under production conditions in our own
electroplating plants. This means that it is
not left up to the customer to acquire the
experience that must be gained prior to
commencing series production, but that
this is done in our own production department. This is a significant advantage
for our customers.
Product Delivery
Once the first parts have been coated,
the properties of the layers are assessed
and measured for the first time. There are
a variety of measurement techniques that
can be used for this, depending on the
parameters specified. These methods
range from the non-destructive measurement of the brightness or reflectivity of the
X-Ray thickness
measurement system
SEMscanning microscopy
Electroplating products
DODUCO offers a wide range of
electroplating products for the production
and treatment of innovative surfaces. This
includes precious metal baths, salts,
concentrates and preparations as well as
non-precious metal baths, products and
processes for PCB technology and
surface treatment products such as
metal strippers, cleaning solutions and
silver antitarnish protection.
PVD coating
DODUCO has a variety of sputtering
plants to suit different workpiece
geometries.
Barrel plating
Bulk items can be plated with many
different combinations of layers of varying
thicknesses. In each case, the most
suitable electroplating unit and production
line are chosen to match the geometry of
the parts and the batch size.
Rack plating
New products and parts with complex
geometries impose special demands on
the production of workpiece racks and
jigs to ensure that the required layer
thickness is deposited even on less
accessible areas of the product. To meet
this requirement, DODUCO has its own
rack and jig construction department.
PCB technology
DODUCO offers customers from the
PCB industry a comprehensive range of
surfaces for printed circuit boards. Highly
efficient plants are available which ensure
consistent quality and short delivery times
for the externally electroless and
electrolytic plating of rigid, semirigid and
flexible circuit boards. Each process can
handle all common formats up to
610 x 605 mm. Maximum flexibility in
Quality Management
Benefitting Our Customers
Comprehensive
ICP-OES spectrometer
for measuring elements
Metal Recycling
Precious
for the World of Tomorrow
costeffectiveness and on-time delivery
underscores the key quality factors in
development projects. In order to verify
that the customers specifications are
adhered to right from the development
stage, a number of labs are available
which have at their disposal a variety of
testing and analysis facilities. This means
that the following methods can be used
or taken advantage of:
REM/EDX analysis
Metallographic studies (crossselection
preparation, structure inspection, etc.)
Mechanical and physical
measurements (hardness tests,
electrical conductivity, contact
resistance, ultrasonic testing, etc.)
Adhesion tests
Corrosion tests according to DIN
standards
Soldering tests
Wetting tests
Bonding tests
(thick wire and gold wire)
AAS
(atomic absorption spectroscopy)
ICP (inductively coupled plasma)
XRF analysis
Numerous methods of chemical
analysis
Various methods of non-destructive
layer thickness measurement
Reversed bending strength
Stress-strain testing
But these techniques are also used
during the product treatment process,
beginning with the goods inwards
inspection, carryng over into specific
tests during production and finally
ending in the pre-delivery tests.
The intelligent and customer-oriented
use of the methods described ensures
that the products are supplied in the
quality exepted by the customer and at
the rigth time.
Electrical Industry
plated strip and stamping scrap
semi-finished product and alloy
residues
Electronics
connectors
ICs and transistors
PCB waste
We offer a full range of services from
enquiry to billing, including feasibility tests
and proposals for solutions in case of
environmental protection and hazardous
goods. A transparent billing system and
reimbursement options according to
industry standard for the recovered
precious metal complete the spectrum of
services offered by our precious metal
refinery.
All this enables the DODUCO technology
group to close the precious metal cycle
and exploit many significant synergy
effects whilst remaining faithful for our
slogan everything from a single source
for the benefit of our customers.
http://www. doduco.net
Mail: info@doduco.net
DODUCO GmbH
im Altgefll 12
75181 Pforzheim
Germany
Phone +49 7231 602-0
Fax
+49 7231 602-517